JPH0583582B2 - - Google Patents

Info

Publication number
JPH0583582B2
JPH0583582B2 JP2132644A JP13264490A JPH0583582B2 JP H0583582 B2 JPH0583582 B2 JP H0583582B2 JP 2132644 A JP2132644 A JP 2132644A JP 13264490 A JP13264490 A JP 13264490A JP H0583582 B2 JPH0583582 B2 JP H0583582B2
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
laser
copper oxalate
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2132644A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0428759A (ja
Inventor
Shoji Sasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Sumitomo Durez Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Sumitomo Durez Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd, Sumitomo Durez Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2132644A priority Critical patent/JPH0428759A/ja
Publication of JPH0428759A publication Critical patent/JPH0428759A/ja
Publication of JPH0583582B2 publication Critical patent/JPH0583582B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2132644A 1990-05-24 1990-05-24 レーザー印字に適したエポキシ樹脂組成物 Granted JPH0428759A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2132644A JPH0428759A (ja) 1990-05-24 1990-05-24 レーザー印字に適したエポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2132644A JPH0428759A (ja) 1990-05-24 1990-05-24 レーザー印字に適したエポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPH0428759A JPH0428759A (ja) 1992-01-31
JPH0583582B2 true JPH0583582B2 (fr) 1993-11-26

Family

ID=15086144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2132644A Granted JPH0428759A (ja) 1990-05-24 1990-05-24 レーザー印字に適したエポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPH0428759A (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63239059A (ja) * 1986-11-14 1988-10-05 Mitsubishi Electric Corp レ−ザマ−キング方法
JP2734087B2 (ja) * 1988-05-31 1998-03-30 大日本インキ化学工業株式会社 レーザーマーキング方法およびレーザーマーキング用樹脂組成物
JPH0211438A (ja) * 1988-06-27 1990-01-16 Clarion Co Ltd 車外情報読取装置

Also Published As

Publication number Publication date
JPH0428759A (ja) 1992-01-31

Similar Documents

Publication Publication Date Title
JPH0618987B2 (ja) レーザー印字用エポキシ樹脂組成物
JPS6250360A (ja) レ−ザ−印字に適したエポキシ樹脂組成物
JPH0583582B2 (fr)
JP2600029B2 (ja) 炭酸ガスレーザー印字に適したエポキシ樹脂組成物
JPH0575783B2 (fr)
JP2740616B2 (ja) レーザー印字に適したエポキシ樹脂組成物
JP2834540B2 (ja) レーザー印字に適したエポキシ樹脂組成物
JP2740615B2 (ja) レーザー印字に適したエポキシ樹脂組成物
JP2740617B2 (ja) レーザー印字に適したエポキシ樹脂組成物
JPH0618990B2 (ja) レーザー印字用エポキシ樹脂組成物
JPH0583581B2 (fr)
JPH0428756A (ja) レーザー印字用エポキシ樹脂組成物
JPH0575784B2 (fr)
JP2882851B2 (ja) レーザー印字用エポキシ樹脂組成物
JPH0428757A (ja) レーザー印字に適したエポキシ樹脂組成物
JPH0359062A (ja) レーザー印字用エポキシ樹脂組成物
JPH0647647B2 (ja) レーザー印字用エポキシ樹脂組成物
JP2600033B2 (ja) 炭酸ガスレーザー印字に適したエポキシ樹脂組成物
JPH021374B2 (fr)
JPH0618989B2 (ja) レーザー印字用エポキシ樹脂組成物
JPH0359065A (ja) レーザー印字用エポキシ樹脂組成物
JP2802557B2 (ja) 耐熱変色性に優れた電子部品封止用エポキシ樹脂組成物
JPH04183743A (ja) 炭酸ガスレーザー印字に適したエポキシ樹脂組成物
JPH04183742A (ja) レーザー印字用エポキシ樹脂組成物
JPH06305258A (ja) レーザー印字に適したエポキシ樹脂組成物