JP2603473Y2 - Solid-state imaging device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device, and more particularly to a solid-state image pickup device capable of increasing the tilting accuracy when it is mounted on a lens barrel or the like.

[0002]

2. Description of the Related Art When a solid-state image pickup device is used in an apparatus such as a video camera, it is combined with a lens via a lens barrel or the like. That is, the degree of parallelism between the plane perpendicular to the optical axis and the surface of the solid-state imaging device, that is, the imaging surface is higher than a certain level. And when the both sides are displaced from the completely parallel state, the deviation is called tilt error,
The smaller the value, the higher the tilt accuracy. by the way,
The solid-state imaging device maker sets an alignment reference plane on the package in order to increase the tilt accuracy, and specifies that the parallelism between the alignment reference plane and the surface of the solid-state imaging device, that is, the imaging plane, is high. Must be guaranteed.

A description will be given of how a positioning reference plane is conventionally set for a solid-state imaging device. 2A and 2B are cross-sectional views showing an example of a conventional solid-state imaging device in which a tilt error is exaggerated. FIG. 2A shows the solid-state imaging device itself, and FIG. 2 shows a state in which members are assembled. In the drawings, a is a solid-state imaging device, and A is an imaging surface of the solid-state imaging device a. b denotes an adhesive for fixing the back surface of the solid-state imaging device a to the inner bottom surface B of the package c made of ceramic. C is an alignment reference plane, which corresponds to the back surface (outer bottom surface) of the package c in this conventional example. e is a seal glass.

In such a solid-state imaging device, as shown in FIG. 2B, unless it is combined with a mounting member d, the orientation of a lens-side mounting surface such as a lens barrel is the same as the orientation of a positioning reference surface C. The mounting member d is indispensable because it is oriented so that it cannot be mounted, and the lens-side surface D of the member d is the mounting surface to be mounted on the lens side. According to this solid-state imaging device, between the imaging surface A and the mounting surface D,
Tilt error AVS between imaging surface A and bottom surface B in the package
B, the tilt error BVSC between the package inner bottom surface B and the package outer bottom surface C, and the package outer bottom surface C and the mounting surface D
And a tilt error CVSD between them. That is, the tilt error is AVSB + BVSC + CVSD.

FIG. 3 is a cross-sectional view showing another example of the conventional solid-state imaging device in which the tilt error is exaggerated. The solid-state imaging device has a seal glass holder g on the front side of the package c.
Are bonded by an adhesive f, and the surface on the front side of the holder g is used as an alignment reference surface C. According to this solid-state imaging device, a tilt error AVSB between the imaging surface A and the bottom surface B in the package and the bottom surface B in the package are located between the imaging surface A and the alignment reference surface (also a mounting surface) C. A tilt error BVSC is present between the alignment reference plane C and the alignment reference plane C.

FIG. 4 is a cross-sectional view showing still another example of the conventional solid-state imaging device, exaggerating the tilt error. This solid-state imaging device is a device in which a solid-state imaging device a is bonded to a tab of a lead frame h, and the solid-state imaging device a is sealed with a sardip package c. This is exposed outside the package c. According to such a solid-state imaging device, the tilt error AVSB between the imaging surface A and the bottom surface B in the package and the lead frame are provided between the imaging surface A and the alignment reference surface (also a mounting surface) C. h plastic deformation of mounting surface C
Intervenes.

[0007]

However, according to the conventional solid-state imaging device, it has been difficult to sufficiently reduce the tilt accuracy between the imaging surface A and the mounting surface C or D. This is because there is a strong demand for miniaturization of a device using a solid-state imaging device, for example, a video camera and the like, and accordingly, a demand for miniaturization of the solid-state imaging device itself and a lens system combined therewith is increasing. As the lens becomes smaller and its aperture becomes smaller, the depth of focus becomes smaller. As a result, the parallelism between the lens and the surface perpendicular to the optical axis is required to be extremely high. High parallelism between the plane and the alignment reference plane has been required. Therefore, it is difficult to meet such demands. In particular, in the case of the solid-state imaging device shown in FIG. 4, the strength of the lead frame h is weakened due to the reduction in thickness, and the lead frame h is easily deformed plastically. And there is a problem that flare occurs due to reflection because it is composed of GaN.

The present invention has been made to solve such a problem, and an object of the present invention is to improve the tilting accuracy.

[0009]

The solid-state imaging device according to the present invention comprises:
Surface of the solid-state imaging device mounted on a portion of a flat substrate having a flatness of about polished maximum 5 [mu] m, a package for covering the solid-state imaging device, the planar surface is exposed to the outside as a positioning reference surface As described above.

[0010]

According to the solid-state imaging device of the present invention, the flat surface of the substrate to which the solid-state imaging device is fixed has a flatness of about 5 .mu.m at maximum , which is used as it is as the alignment reference surface. The mounting surface can be a member, for example, a lens barrel or the like. Then, only one tilt error AVSB due to the inclination of the solid-state imaging device exists between the imaging surface and the mounting surface. Therefore, tilting accuracy can be improved.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The solid-state imaging device according to the present invention will be described below in detail with reference to the drawings. 1A and 1B show one embodiment of the solid-state imaging device of the present invention, wherein FIG. 1A is a perspective view, and FIG. 1B is a cross-sectional view taken along line BB of FIG. In the drawings, reference numeral 1 denotes a substrate made of ceramic, which is rigid and whose surface is polished to form a flat surface 2 having a flatness of about 5 μm at the maximum.

Reference numeral 3 denotes a solid-state image sensing device adhered to the center of the substrate 1 via an adhesive 4, reference numeral 5 denotes a window frame package made of ceramics for shielding the solid-state image sensing device 3 from the outside, and reference numeral 6 denotes a package for the package 5. .. Are fixed leads, and 8 is a lens barrel to be attached later. The package 5 includes both ends 2a, 2a of the surface 2 of the substrate 1 made of ceramic and having great rigidity.
Are fixed to the surface 2 so as to protrude outside and become the positioning reference surface and the mounting surface B.

According to such a solid-state imaging device, the imaging surface A of the solid-state imaging device 3 is aligned with the positioning reference surface and mounting surface 2a.
The tilt error interposed between (B) and the solid-state imaging device 3
2 is only the tilt error AVSB caused by the inclination of
4, the tilt error can be reduced, that is, the tilt accuracy can be increased, and only the variation in the thickness of the adhesive layer 4 is only a factor of lowering the back focus accuracy. Focus accuracy can be increased. Moreover, since the substrate 1 is made of ceramic, FIG.
The optical noise due to reflection can be reduced as compared with the prior art shown in FIG. Of course, since the positioning reference surface 2 faces upward, the positioning reference surface 2 faces the mounting surface 8a of the member 8 on the lens side. Therefore, the mounting member d is not required as in the embodiment shown in FIG.

[0014]

[Effect of the Invention] The solid-state imaging device of the present invention has a polished surface.
A package in which a solid-state imaging device is mounted on a part of a flat substrate having a flatness of about 5 μm at the maximum , and the solid-state imaging device is shielded from the outside and the surface of the substrate is partially exposed on the substrate. And a portion protruding from the package on the flat surface of the substrate is used as an alignment reference plane. Therefore, according to the solid-state imaging device of the present invention, a maximum of 5 μm
A flat surface having a flatness of about m can be used as it is as an alignment reference surface, and the alignment reference surface can be used as a mounting surface for attaching a lens-side member, for example, a lens barrel or the like. Then, only one tilt error AVSB due to the inclination of the solid-state imaging device exists between the imaging surface and the mounting surface. Therefore, tilting accuracy can be improved.

[Brief description of the drawings]

FIGS. 1A and 1B show one embodiment of the solid-state imaging device of the present invention, wherein FIG. 1A is a perspective view and FIG.
FIG. 3 is a sectional view taken along line BB of FIG.

2A and 2B are cross-sectional views showing one conventional example, in which FIG. 2A shows only a solid-state imaging device, and FIG. 2B shows a state in which a mounting member is attached to the solid-state imaging device.

FIG. 3 is a sectional view showing another conventional example.

FIG. 4 is a sectional view showing still another conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate which has rigidity 2 Flat surface 2a Portion where package of flat surface protruded (alignment reference surface) 3 Solid-state image sensor 5 Package

Continuation of front page (56) References JP-A-58-140156 (JP, A) JP-A-1-238056 (JP, A) JP-A-55-159677 (JP, A) JP-A-1-228178 (JP, A) , A) Japanese Utility Model Showa 64-51373 (JP, U) Japanese Utility Model Showa Sho 62-89146 (JP, U)

Claims (1)

(57) [Scope of request for utility model registration] 1. The surface is polished and has a flatness of about 5 μm at the maximum.
Mounting a solid-state imaging device on a part of a flat substrate having: a package on the substrate so as to block the solid-state imaging device from the outside and partially expose the surface of the substrate; A solid-state imaging device, wherein a portion of the flat surface protruding from the package serves as an alignment reference plane.