JP2609779B2 - Cover tape for packaging chip-type electronic components - Google Patents
Cover tape for packaging chip-type electronic componentsInfo
- Publication number
- JP2609779B2 JP2609779B2 JP3289639A JP28963991A JP2609779B2 JP 2609779 B2 JP2609779 B2 JP 2609779B2 JP 3289639 A JP3289639 A JP 3289639A JP 28963991 A JP28963991 A JP 28963991A JP 2609779 B2 JP2609779 B2 JP 2609779B2
- Authority
- JP
- Japan
- Prior art keywords
- cover tape
- weight
- tape
- adhesive layer
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 6
- 239000010410 layer Substances 0.000 claims description 45
- 239000012790 adhesive layer Substances 0.000 claims description 43
- 238000007789 sealing Methods 0.000 claims description 27
- 239000000843 powder Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 8
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 8
- 229920005992 thermoplastic resin Polymers 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 7
- 229920000573 polyethylene Polymers 0.000 claims description 6
- 239000004800 polyvinyl chloride Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- -1 polypropylene Polymers 0.000 claims description 5
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 5
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
- 238000002834 transmittance Methods 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims description 3
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 3
- 150000002894 organic compounds Chemical class 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 3
- 239000004677 Nylon Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 229920001778 nylon Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 238000009751 slip forming Methods 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims 1
- 229920002725 thermoplastic elastomer Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 230000005611 electricity Effects 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 150000001336 alkenes Chemical class 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000009191 jumping Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はチップ型電子部品の保
管、輸送、装着に際し、チップ型電子部品を汚染から保
護し、電子回路基板に実装するために整列させ、取り出
せる機能を有する包装体のうち、収納ポケットを形成し
たプラスチック製キャリアテープに熱シールされ得るカ
バーテープに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package having a function of protecting chip-type electronic components from contamination, and aligning and taking out the chip-type electronic components for mounting on electronic circuit boards when storing, transporting and mounting the chip-type electronic components. The present invention relates to a cover tape which can be heat-sealed to a plastic carrier tape having a storage pocket.
【０００２】[0002]
【従来の技術】近年、ＩＣを始めとして、トランジスタ
ー、ダイオード、コンデンサー、圧電素子レジスター、
などの表面実装用チップ型電子部品は、電子部品の形状
に合わせて、収納しうるエンボス成形されたポケットを
連続的に形成したプラスチック製キャリアテープとキャ
リアテープに熱シールし得るカバーテープとからなる包
装体に包装されて供給されている。内容物の電子部品は
該包装体のカバーテープを剥離した後、自動的に取り出
され電子回路基板に表面実装されている。2. Description of the Related Art In recent years, transistors such as ICs, transistors, diodes, capacitors, piezoelectric element resistors,
A chip-type electronic component for surface mounting, for example, comprises a plastic carrier tape formed continuously with embossed pockets that can be accommodated according to the shape of the electronic component, and a cover tape that can be heat-sealed to the carrier tape. It is supplied in a package. After peeling off the cover tape of the package, the electronic components of the contents are automatically taken out and surface-mounted on the electronic circuit board.
【０００３】カバーテープがキャリアテープから剥離さ
れる際の強度をピールオフ強度と呼ぶが、この強度が低
すぎると包装体移送時に、カバーテープが外れ、内容物
である電子部品が脱落するという問題があった。逆に、
強すぎると、カバーテープを剥離する際キャリアテープ
が振動し、電子部品が装着される直前に収納ポケットか
ら飛び出す現象、即ちジャンピングトラブルを起してい
た。[0003] The strength at which the cover tape is peeled off from the carrier tape is called peel-off strength. If the strength is too low, the cover tape comes off when the package is transported, and the electronic components as contents fall off. there were. vice versa,
If it is too strong, the carrier tape vibrates when the cover tape is peeled off, causing a phenomenon of jumping out of the storage pocket immediately before the electronic component is mounted, that is, a jumping trouble.
【０００４】従来、キャリアテープに用いられる材質
は、シート成形が容易なポリ塩化ビニル（ＰＶＣ）もし
くはポリスチロール、ポリエステル（ＰＥＴ）、ポリカ
ーボネート、アクリル系シートが用いられているが、キ
ャリアテープに熱シールされるカバーテープには一般
に、二軸延伸ポリエステルフィルム、ＰＶＣまたはスチ
ロール系シートに熱シールを可能にするポリエチレン変
性もしくはエチレン酢酸ビニル共重合体（ＥＶＡ）変性
フィルムをラミネートした複合フィルムが用いられてい
た。しかし、これら従来のカバーテープは、ピールオフ
強度のシール温度、シール圧力等の条件依存性が大き
く、シール条件のバラツキにより、既述の適性ピールオ
フ強度範囲にコントロールすることが難しかった。Conventionally, as a material used for a carrier tape, polyvinyl chloride (PVC) or polystyrene, polyester (PET), polycarbonate, or an acrylic sheet, which is easy to form a sheet, is used. As the cover tape to be used, a biaxially stretched polyester film, a composite film obtained by laminating a polyethylene-modified or ethylene-vinyl acetate copolymer (EVA) -modified film capable of heat sealing to a PVC or styrene-based sheet were generally used. . However, in these conventional cover tapes, the peel-off strength largely depends on conditions such as the sealing temperature and the sealing pressure, and it is difficult to control the peel-off strength within the above-described suitable peel-off strength range due to variations in the sealing conditions.
【０００５】これらのカバーテープは、その剥離機構に
より界面剥離タイプと凝集剥離タイプの二種類がある。
界面剥離タイプの場合シール面と剥離面は同じ界面のた
めカバーテープに本来要求される『強接着−易剥離』と
いう相反する二つの特性を同時に満足することが難し
く、キャリアテープのシールされる表面の状態にも影響
を受けるためにピールオフ強度がばらついて既述の適性
範囲にコントロールすることが難しく、又、カバーテー
プの保管あるいはシール後の保管環境によっても温度・
湿度の影響を受けて、経時的にピールオフ強度が上昇あ
るいは低下して適性範囲から外れる場合があった。一
方、凝集剥離タイプの場合、特公昭６１−１２９３６号
公報に開示されている様なフィルムを用いると、シール
面と剥離面が分離されたピールオフ強度が接着層の凝集
力によって得られるカバーテープが作成でき、この系の
カバーテープは経時的にも安定した優れた特性を示し
た。[0005] These cover tapes are classified into two types, an interface peeling type and a cohesive peeling type, depending on the peeling mechanism.
In the case of the interfacial peeling type, the sealing surface and the peeling surface are the same interface, so it is difficult to simultaneously satisfy the two contradictory characteristics of "strong adhesion-easy peeling" originally required for the cover tape, and the surface of the carrier tape to be sealed is difficult. It is difficult to control the peel-off strength to the above-mentioned suitable range because it is also affected by the condition of the cover tape.
In some cases, the peel-off strength increased or decreased over time under the influence of humidity, and the peel-off strength was out of the proper range. On the other hand, in the case of the cohesive peeling type, when a film as disclosed in Japanese Patent Publication No. 61-12936 is used, a cover tape in which the peel-off strength in which the sealing surface and the peeling surface are separated can be obtained by the cohesive force of the adhesive layer is obtained. It could be made and the cover tape of this system showed excellent properties that were stable over time.
【０００６】しかしながら、接着層の凝集力がさほど強
くないためにカバーテープが製品として巻かれた状態で
保管された時、特に夏場など高温下で保管された場合、
巻き芯部が二軸延伸フィルムとブロッキングを起こしシ
ール不良あるいは透明性の大幅な低下などのトラブルが
発生していた。又、『強接着−易剥離』のうち易剥離に
ついては凝集剥離によって到達できたが、強接着につい
ては接着層がキャリアテープに強固には接着しておらず
キャリアテープのシール面の表面状態やシール幅に大き
く影響を受けるために依然として課題を残していた。[0006] However, when the cover tape is stored in a wound state as a product because the cohesive force of the adhesive layer is not so strong, particularly when the cover tape is stored at a high temperature such as in summer,
The core portion was blocked with the biaxially stretched film, and troubles such as poor sealing or a significant decrease in transparency occurred. In the case of "strong adhesion-easy peeling", easy peeling could be achieved by cohesive peeling, but for strong bonding, the adhesive layer was not firmly adhered to the carrier tape and the surface condition of the sealing surface of the carrier tape and The problem still remains because it is greatly affected by the seal width.
【０００７】又、近年の表面実装技術の大幅な向上に伴
い、より高性能で小型化された電子部品のチップ化が進
む中で、包装体移送時に振動により電子部品が、キャリ
アテープエンボス内表面、或いはカバーテープの内側表
面と接触し、その際の摩擦により発生する静電気、及び
カバーテープをキャリアテープから剥離する際に発生す
る静電気のスパークにより電子部品が破壊・劣化を起こ
すといった静電気障害も発生しており、キャリアテー
プ、カバーテープといった包装体への静電対策が最重要
課題とされていた。Further, with the recent remarkable improvement in surface mounting technology, the chip formation of electronic components having higher performance and smaller size has been progressing. Or electrostatic damage caused by friction caused by friction with the inner surface of the cover tape and sparks generated when the cover tape is peeled off from the carrier tape, causing electronic components to break down or deteriorate. Therefore, countermeasures against static electricity on packages such as carrier tapes and cover tapes have been regarded as the most important issue.
【０００８】従来、キャリアテープの静電処理について
は、用いられる材質へのカーボンブラックの練り込み、
或いはコーティングにより行われており、その効果も満
足されるものが得られていた。しかし、カバーテープの
静電処理については未だ充分な対策が取られておらず、
現状では、カバーテープの外層への帯電防止剤或いは導
電性材料のコーティング等が行われているに過ぎない。
しかし、その処理効果は封入される電子部品の保護とし
てはカバーテープ外側の処理のため充分でなく、特にカ
バーテープの内側表面と電子部品の接触により発生する
静電気に対してはその効果はなかった。Conventionally, for the electrostatic treatment of a carrier tape, kneading of carbon black into a material to be used is performed.
Alternatively, it is performed by coating, and an effect that satisfies the effect has been obtained. However, sufficient measures have not yet been taken for the electrostatic treatment of the cover tape.
At present, the outer layer of the cover tape is merely coated with an antistatic agent or a conductive material.
However, the processing effect was not sufficient for the protection of the enclosed electronic components due to the processing on the outside of the cover tape, and was not particularly effective against static electricity generated by the contact between the inside surface of the cover tape and the electronic components. .
【０００９】又、カバーテープ内側表面つまり接着層へ
の静電処理については帯電防止剤のコーティングあるい
は接着層への練り込みにより行うことが可能であるが、
この場合接着層へ練り込まれる帯電防止剤がカバーテー
プの内側表面へのブリードを越こし、シール性が不安定
になりシール不良のトラブルが多発し、又静電効果も経
時的に低下し、或いは包装体の使用される環境の温度・
湿度、特に湿度に対する依存性が強く、１０％ＲＨとい
った低湿度下では静電効果が著しく低下するなど充分な
効果が得らていなかった。The electrostatic treatment of the inner surface of the cover tape, that is, the adhesive layer, can be performed by coating with an antistatic agent or kneading the adhesive layer.
In this case, the antistatic agent kneaded into the adhesive layer passes through the bleed to the inner surface of the cover tape, the sealing property becomes unstable, troubles of poor sealing occur frequently, and the electrostatic effect also decreases with time, Or the temperature of the environment where the package is used
Humidity, in particular, is highly dependent on humidity, and at a low humidity of 10% RH, sufficient effects such as a remarkable decrease in electrostatic effect have not been obtained.
【００１０】一方、導電性材料の接着層への練り込みに
ついては、従来接着層の形成方法が押出フィルムなどの
ラミネートであったため技術的に困難であり、透明性が
著しく低下するためカバーテープとしての使用は難しか
った。又、コーティングについてはキャリアテープに安
定して接着可能なバインダーの選定が難しく、本来の接
着層が覆い隠されるために行われていなかった。On the other hand, the kneading of the conductive material into the adhesive layer is technically difficult because the method of forming the adhesive layer has conventionally been a laminate of an extruded film or the like, and the transparency is significantly reduced. The use of was difficult. In addition, it has been difficult to select a binder that can be stably adhered to a carrier tape for coating, and the coating has not been performed because the original adhesive layer is covered.
【００１１】[0011]
【発明が解決しようとする課題】本発明は前述の様な問
題を解決すべく、接着層の静電気対策が施され、且つピ
ールオフ強度のシール条件依存性、経時変化の小さくシ
ール性の安定したカバーテープを得んとして鋭意研究し
た結果、外層として二軸延伸フィルムを使用し、外層と
接着層の間の中間層としてキャリアテープにシールされ
たカバーテープを剥離する際、中間層自体の凝集破壊に
よって剥離が行われるオレフィン系フィルムを使用し、
接着層として導電性微粉末を分散したヒートシールラッ
カータイプの熱可塑性接着剤をコーティングした複合フ
イルムが透明であり、良好な特性を持つカバーテープと
なり得るとの知見を得て、本発明を完成するに至ったも
のである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a cover in which a countermeasure against static electricity in the adhesive layer is applied, the peel-off strength is dependent on the sealing conditions, and the sealing with a small change over time is stable. As a result of earnest research on obtaining the tape, as a result of using a biaxially stretched film as the outer layer and peeling off the cover tape sealed with the carrier tape as the intermediate layer between the outer layer and the adhesive layer, the cohesive failure of the intermediate layer itself Using an olefin film that is peeled,
Completion of the present invention by obtaining the knowledge that a composite film coated with a heat-sealable lacquer-type thermoplastic adhesive in which conductive fine powder is dispersed as an adhesive layer is transparent and can be a cover tape having good properties. It has been reached.
【００１２】[0012]
【課題を解決するための手段】本発明は、チップ型電子
部品を収納するポケットを連続的に形成したプラスチッ
ク製キャリアテープに、熱シールし得るカバーテープで
あって、該カバーテープは、外層はポリエステル、ポリ
プロピレン、ナイロンのいずれかである二軸延伸フィル
ムであり、外層と接着層の間の中間層は０.９１〜０.９
３ｇ／ｃｍ3 までの密度を有するポリエチレンと多くと
も１０重量％の酢酸ビニルを含むエチレン−酢酸ビニル
コポリマーから選ばれる５５〜９５重量％までの少なく
とも１つのエチレンポリマー、５〜３０重量％までのポ
リスチレン及び０〜２０重量％までの熱可塑性エラスト
マー状スチレン−ブタジエン−スチレンもしくはスチレ
ン−イソプレン−スチレンブロックコポリマーから成り
キャリアテープにシールされたカバーテープを剥離する
際、中間層自体の凝集破壊によって剥離が行われるオレ
フィン系フィルムであり、接着層はポリウレタン系樹
脂、アクリル系樹脂、ポリ塩化ビニル系樹脂、エチレン
ビニルアセテート系樹脂、ポリエステル系樹脂のいずれ
か又はこれらの組合せから成る熱可塑性樹脂に酸化錫、
酸化亜鉛、酸化チタン、カーボンブラック、Ｓｉ系有機
化合物のいずれか又はこれらの組合せによる導電性微粉
末を分散させて成ることを特徴とするチップ型電子部品
包装用カバーテープである。SUMMARY OF THE INVENTION The present invention is a cover tape that can be heat-sealed to a plastic carrier tape in which pockets for accommodating chip-type electronic components are continuously formed. A biaxially stretched film of any of polyester, polypropylene, and nylon, wherein the intermediate layer between the outer layer and the adhesive layer is 0.91 to 0.9.
Up to 55 to 95% by weight of at least one ethylene polymer selected from polyethylene having a density of up to 3 g / cm 3 and ethylene-vinyl acetate copolymer containing at most 10% by weight of vinyl acetate, up to 5 to 30% by weight of polystyrene When a cover tape made of thermoplastic elastomeric styrene-butadiene-styrene or styrene-isoprene-styrene block copolymer and sealed to a carrier tape in an amount of 0 to 20% by weight is peeled off, peeling is performed due to cohesive failure of the intermediate layer itself. The adhesive layer is a polyurethane resin, an acrylic resin, a polyvinyl chloride resin, an ethylene vinyl acetate resin, a polyester resin, or a thermoplastic resin composed of a combination thereof, tin oxide,
A cover tape for packaging a chip-type electronic component, characterized by dispersing conductive fine powder of any one of zinc oxide, titanium oxide, carbon black, and Si-based organic compound or a combination thereof.
【００１３】本発明の好ましい態様は導電性微粉末の添
加量が接着層の熱可塑性樹脂１００重量部に対して１０
〜１０００重量部であり、該カバーテープの接着層と該
キャリアテープのシール面の接着力が該カバーテープの
中間層の凝集力よりも大きく、該カバーテープの中間層
の凝集力がシール幅１mm当り１０〜１２０ｇｒであり、
該カバーテープの可視光線透過率が１０％以上であるこ
とを特徴とするチップ型電子部品包装用カバーテープで
ある。In a preferred embodiment of the present invention, the conductive fine powder is added in an amount of 10 to 100 parts by weight of the thermoplastic resin in the adhesive layer.
The adhesive strength between the adhesive layer of the cover tape and the sealing surface of the carrier tape is larger than the cohesive force of the intermediate layer of the cover tape, and the cohesive force of the intermediate layer of the cover tape is 1 mm in seal width. 10 to 120 gr per
A cover tape for packaging a chip-type electronic component, wherein the visible light transmittance of the cover tape is 10% or more.
【００１４】[0014]
【作用】本発明のカバーテープ１の構成要素を図１で説
明すると、外層２は二軸延伸ポリエステルフィルム、二
軸延伸ポリプロピレンフィルム、二軸延伸ナイロンフィ
ルムのいずれかの二軸延伸フィルムであり、厚みが６〜
１００μｍの透明で剛性の高いフィルムである。６μｍ
以下では剛性がなくなり、１００μｍを越えると硬すぎ
てシールが不安定となる。外層２の接着剤層３に接する
側は、必要に応じてコロナ処理、プラズマ処理、サンド
ブラスト処理等の表面処理を施して接着剤層３への密着
力を向上させることが出来る。又外層２の表面を静電処
理の目的で界面活性剤、導電性粉末などをコーティング
してもよい。The components of the cover tape 1 of the present invention will be described with reference to FIG. 1. The outer layer 2 is any one of a biaxially oriented polyester film, a biaxially oriented polypropylene film, and a biaxially oriented nylon film. 6 ~
It is a transparent and highly rigid film of 100 μm. 6 μm
Below, rigidity is lost, and if it exceeds 100 μm, it is too hard and the seal becomes unstable. The side of the outer layer 2 that is in contact with the adhesive layer 3 can be subjected to a surface treatment such as a corona treatment, a plasma treatment, or a sand blast treatment as necessary, to improve the adhesion to the adhesive layer 3. Further, the surface of the outer layer 2 may be coated with a surfactant, a conductive powder or the like for the purpose of electrostatic treatment.
【００１５】中間層４は０.９１〜０.９３ｇ／ｃｍ3 ま
での密度を有するポリエチレンと多くとも１０重量％の
酢酸ビニルを含むエチレン−酢酸ビニルコポリマーから
選ばれる５５〜９５重量％までの少なくとも１つのエチ
レンポリマー、５〜３０重量％までのポリスチレン及び
０〜２０重量％までの熱可塑性エラストマー状スチレン
−ブタジエン−スチレンもしくはスチレン−イソプレン
−スチレンブロックコポリマーから成りキャリアテープ
にシールされたカバーテープを剥離する際、中間層自体
の凝集破壊によって剥離が行われるオレフィン系フィル
ムである。尚、中間層４と接着層５との密着力を向上さ
せるために中間層４の接着層５に接する側は、必要に応
じてコロナ処理、プラズマ処理、サンドブラスト処理等
の表面処理を施しても良い。The intermediate layer 4 has a density of at least 55 to 95% by weight selected from polyethylene having a density of from 0.91 to 0.93 g / cm 3 and an ethylene-vinyl acetate copolymer containing at most 10% by weight of vinyl acetate. Peel off a cover tape consisting of one ethylene polymer, up to 5 to 30% by weight of polystyrene and up to 0 to 20% by weight of a thermoplastic elastomeric styrene-butadiene-styrene or styrene-isoprene-styrene block copolymer and sealed to a carrier tape In this case, the olefin film is peeled off by cohesive failure of the intermediate layer itself. In order to improve the adhesion between the intermediate layer 4 and the adhesive layer 5, the side of the intermediate layer 4 which is in contact with the adhesive layer 5 may be subjected to a surface treatment such as a corona treatment, a plasma treatment, or a sandblast treatment, if necessary. good.
【００１６】接着層５は透明性を有する熱可塑性樹脂
（例えばポリウレタン系樹脂、アクリル系樹脂、エチレ
ンビニルアセテート系樹脂、ポリ塩化ビニル系樹脂、ポ
リエステル系樹脂など）のヒートシールラッカータイプ
のものであって、各単体又はその組合せによって、相手
材のプラスチック製キャリアテープ６に熱シールし得る
特性を有するものが選定される。これにより凝集剥離層
はヒートシール接着層により被覆されるため高温保管時
の二軸延伸フィルム側へのブロッキングが防がれ同時に
キャリアテープへの密着性も向上される。The adhesive layer 5 is a heat-seal lacquer type of a thermoplastic resin having transparency (for example, polyurethane resin, acrylic resin, ethylene vinyl acetate resin, polyvinyl chloride resin, polyester resin, etc.). Then, one having a characteristic capable of being heat-sealed to the plastic carrier tape 6 of the mating material is selected by each unit or a combination thereof. As a result, the cohesive release layer is covered with the heat seal adhesive layer, so that blocking on the biaxially stretched film side during high-temperature storage is prevented, and at the same time, adhesion to the carrier tape is improved.
【００１７】且つ、接着層中に酸化錫、酸化亜鉛、酸化
チタン、カーボンブラック、Ｓｉ系有機化合物のいずれ
かの導電性微粉末が均一に分散されており、その際、製
膜後の接着層の表面抵抗値は少なくとも１０13Ω／□以
下が必要であり、更に好ましくは１０6 Ω／□〜１０9
Ω／□の範囲が良い。１０13Ω／□より大きくなると、
静電効果が極端に悪くなり目的とする性能が得られな
い。又、その添加量は上記表面抵抗特性により接着層の
熱可塑性樹脂１００重量部に対して１０〜１０００重量
部であり更に好ましくは１００〜４００重量部が良い。
１０重量部より少ないと静電効果は発現せず、１０００
重量部より多いと接着層の熱可塑性樹脂への分散性が著
しく悪くなり、かつ中間層４との密着性、透明性が大幅
に低下し、コストも高くなるため生産性が悪くなる。Further, conductive fine powder of any one of tin oxide, zinc oxide, titanium oxide, carbon black, and Si-based organic compound is uniformly dispersed in the adhesive layer. Must have a surface resistance of at least 10 13 Ω / □ or less, more preferably 10 6 Ω / □ to 10 9 Ω / □.
The range of Ω / □ is good. When it exceeds 10 13 Ω / □,
The electrostatic effect becomes extremely poor, and the desired performance cannot be obtained. The addition amount is 10 to 1000 parts by weight, more preferably 100 to 400 parts by weight, based on 100 parts by weight of the thermoplastic resin of the adhesive layer, depending on the surface resistance characteristics.
If the amount is less than 10 parts by weight, no electrostatic effect is exhibited,
If the amount is more than the weight part, the dispersibility of the adhesive layer in the thermoplastic resin is significantly deteriorated, the adhesion to the intermediate layer 4 and the transparency are significantly reduced, and the cost is increased, so that the productivity is deteriorated.
【００１８】又、静電処理材料自身が導電性を有するた
め半永久的に静電効果があり、ブリード等を起こさない
ためシール性にも影響は及ぼさず、接着層の表面抵抗値
が１０13Ω／□以下に調整されているため、該キャリア
テープ６に電子部品を該カバーテープ１で封入したもの
は運搬途上で電子部品が該カバーテープ１と接触して
も、あるいは該カバーテープ１を剥離して電子部品をピ
ックアップする際においても静電気は発生せず電子部品
を静電気障害から保護することができる。Further, since the electrostatic treatment material itself has conductivity, it has a semi-permanent electrostatic effect, does not cause bleeding or the like, does not affect the sealing property, and the surface resistance of the adhesive layer is 10 13 Ω. Since the carrier tape 6 is adjusted to not more than / □, the electronic component encapsulated in the carrier tape 6 with the cover tape 1 can be used even if the electronic component comes into contact with the cover tape 1 during transportation or the cover tape 1 is peeled off. Even when the electronic component is picked up, static electricity is not generated, and the electronic component can be protected from electrostatic disturbance.
【００１９】なお、静電効果を更に上げるために外層側
つまり二軸延伸フィルムの表裏面に帯電防止処理層ある
いは導電層を設けてもよい。又、ヒートシール型接着層
の形成方法については溶融製膜法と溶液製膜法のどちら
でも良いが好ましくは溶液製膜が導電性微粉末の分散性
の点から望ましい。又、接着層の膜厚は５μｍ以下が好
ましく、更に好ましくは２μｍ以下がよい。膜厚が５μ
ｍ以上では溶液製膜法ではその製法上作成が難しい。In order to further enhance the electrostatic effect, an antistatic treatment layer or a conductive layer may be provided on the outer layer side, that is, on the front and back surfaces of the biaxially stretched film. The method for forming the heat-sealable adhesive layer may be either a melt film forming method or a solution film forming method, but is preferably a solution film forming method from the viewpoint of dispersibility of the conductive fine powder. The thickness of the adhesive layer is preferably 5 μm or less, more preferably 2 μm or less. 5μ thickness
If it is more than m, it is difficult to prepare by the solution casting method due to the manufacturing method.
【００２０】尚、外層と中間層とのラミネート強度を向
上させる目的でイソシアネート系、イミン系等の乾燥固
化硬化させて用いるラッカー型の接着剤層を介して両者
をラミネートしてもよい。For the purpose of improving the lamination strength of the outer layer and the intermediate layer, both may be laminated via a lacquer type adhesive layer which is dried, solidified and hardened, such as an isocyanate type or an imine type.
【００２１】又、カバーテープのシール−ピール過程に
おいて、まず、該カバーテープ１は該キャリアテープ６
の両サイドに片方で１mm前後の幅でレール状に連続的に
シールされる（図２）。次にピール時に該カバーテープ
１を該キャリアテープ６から引き剥す際、該カバーテー
プ１の接着層５と該キャリアテープ６のシール面の接着
力が中間層４の凝集力よりも小さいと、ピールオフ強度
は該カバーテープ１の接着層５と該キャリアテープ６の
シール面の接着力と対応し、現在最も一般的な剥離機構
である界面剥離によりピールが行われる。この場合、カ
バーテープをキャリアテープに強くシールするとピール
が難しくなり、逆に弱くシールすると剥がれてしまうと
いうように、本来カバーテープに要求されるキャリアテ
ープに対する強力なシール性と剥離時の容易なピール性
という相反する特性を同時に満足する充分な性能が得ら
れなかった。In the sealing and peeling process of the cover tape, first, the cover tape 1 is attached to the carrier tape 6.
Is continuously sealed in a rail shape on either side with a width of about 1 mm (Fig. 2). Next, when peeling the cover tape 1 from the carrier tape 6 at the time of peeling, if the adhesive force between the adhesive layer 5 of the cover tape 1 and the sealing surface of the carrier tape 6 is smaller than the cohesive force of the intermediate layer 4, the peel-off is performed. The strength corresponds to the adhesive strength between the adhesive layer 5 of the cover tape 1 and the sealing surface of the carrier tape 6, and peeling is performed by interfacial peeling, which is the most common peeling mechanism at present. In this case, if the cover tape is strongly sealed to the carrier tape, peeling will be difficult, and if it is weakly sealed, it will peel off. Satisfactory performance satisfying the conflicting properties at the same time could not be obtained.
【００２２】一方、本発明の様に該カバーテープ１の接
着層５と該キャリアテープ６のシール面の接着力が該カ
バーテープ１の中間層４の凝集力よりも大きいと、製膜
された接着層５及び中間層４のうちヒートシールされた
部分７のみが中間層４の層内からキャリアテープに残り
（図３）、引き剥された後のカバーテープ（図４）は接
着層５及び中間層のヒートシールされた部分７のみが中
間層４の層内から破壊する凝集剥離によりピールが行わ
れる。On the other hand, when the adhesive force between the adhesive layer 5 of the cover tape 1 and the sealing surface of the carrier tape 6 is larger than the cohesive force of the intermediate layer 4 of the cover tape 1 as in the present invention, a film was formed. Only the heat-sealed portion 7 of the adhesive layer 5 and the intermediate layer 4 remains on the carrier tape from inside the layer of the intermediate layer 4 (FIG. 3), and the cover tape after peeling off (FIG. 4) includes the adhesive layer 5 and Only the heat-sealed portion 7 of the intermediate layer is peeled by cohesive peeling that breaks from within the layer of the intermediate layer 4.
【００２３】即ち、ピールオフ強度は中間層４の凝集力
に対応するものとなっており、シール／ピール面は完全
に分離でき、該カバーテープ１のシールはキャリアテー
プ６に強固に行えると同時に該カバーテープ１のピール
はできるだけ容易に行えるよう設計できる。つまり、剥
離面は該カバーテープ１内に設計されておりその中間層
の凝集力をキャリアテープ６の材質に依らず任意に設定
できる。又、該カバーテープ１のシール面は該キャリア
テープ６に強固にシール可能な接着剤の選定ができ安定
したシール・ピール機構が得られる。That is, the peel-off strength corresponds to the cohesive force of the intermediate layer 4, the seal / peel surface can be completely separated, and the sealing of the cover tape 1 can be performed firmly on the carrier tape 6 and at the same time. The peeling of the cover tape 1 can be designed to be as easy as possible. That is, the release surface is designed in the cover tape 1, and the cohesive force of the intermediate layer can be set arbitrarily regardless of the material of the carrier tape 6. In addition, an adhesive capable of firmly sealing the carrier tape 6 can be selected for the sealing surface of the cover tape 1, and a stable seal / peel mechanism can be obtained.
【００２４】この場合、該カバーテープ１の中間層４の
凝集力はシール幅１mm当り１０〜１２０ｇｒ更に好まし
くは１０〜７０ｇｒなるようオレフィン系フィルムが選
定される。ピール強度が１０ｇｒより低いと包装体移送
時に、カバーテープが外れ、内容物である電子部品が脱
落するという問題がある。逆に、１２０ｇｒよりも高い
と、カバーテープを剥離する際キャリアテープが振動
し、電子部品装着される直前に収納ポケットから飛び出
す現象、即ちジャンピングトラブルを起こす。本発明の
凝集剥離機構によれば、従来の界面剥離に比較してより
シール条件の依存性が低く、且つ、保管環境によるピー
ルオフ強度の経時変化が少ない目的とする性能を得るこ
とが出来る。In this case, the olefin-based film is selected so that the cohesive force of the intermediate layer 4 of the cover tape 1 is 10 to 120 gr, more preferably 10 to 70 gr per 1 mm of the seal width. If the peel strength is lower than 10 gr, there is a problem that the cover tape comes off when the package is transported, and the electronic components as contents fall off. Conversely, if it is higher than 120 gr, the carrier tape will vibrate when the cover tape is peeled off, causing a phenomenon of jumping out of the storage pocket immediately before mounting the electronic component, that is, a jumping trouble. ADVANTAGE OF THE INVENTION According to the cohesion peeling mechanism of this invention, compared with the conventional interfacial peeling, the target performance which is less dependent on a sealing condition, and whose peel-off intensity | strength changes with time by storage environment with time can be obtained.
【００２５】又、カバーテープの可視光線透過率が１０
％以上好ましくは５０％以上になる様に構成されている
ために、キャリアテープに封入された内部の電子部品が
目視あるいは機械によって確認できる。１０％より低い
と内部の電子部品の確認が難しい。The visible light transmittance of the cover tape is 10
%, And preferably 50% or more, so that the internal electronic components sealed in the carrier tape can be visually or mechanically confirmed. If it is lower than 10%, it is difficult to confirm the internal electronic components.
【００２６】[0026]
【実施例】本発明の実施例及び比較例を以下に示すがこ
れらの実施例によって本発明は何ら限定されるものでは
ない。 《実施例１，２，３，４，５，比較例１，２，３，４，
５》二軸延伸フィルムとオレフィンフィルムのラミネー
ト品のオレフィンフィルム側に、酢酸エチル溶剤に熱可
塑性樹脂及び導電性微粉末の混合物を希釈溶解させた接
着層をグラビアコーターにより膜厚２μｍに溶液製膜
し、表１及び表２に示した層構成のカバーテープを得
た。得られたカバーテープを５.５mm 幅にスリット後、
８mm幅のＰＶＣ製キャリアテープとヒートシールを行
い、ピール強度を測定した。又、接着層側の表面抵抗値
及びカバーテープ試作品の可視光線透過率の測定を行い
その特性評価結果を表３及び表４に示した。EXAMPLES Examples and comparative examples of the present invention are shown below, but the present invention is not limited by these examples. << Examples 1, 2, 3, 4, 5, Comparative Examples 1, 2, 3, 4,
5 >> An adhesive layer obtained by diluting and dissolving a mixture of a thermoplastic resin and a conductive fine powder in an ethyl acetate solvent is formed on the olefin film side of a laminate of a biaxially stretched film and an olefin film to a thickness of 2 μm using a gravure coater. Then, cover tapes having the layer configurations shown in Tables 1 and 2 were obtained. After slitting the obtained cover tape to 5.5 mm width,
Heat sealing was performed with an 8 mm wide PVC carrier tape, and the peel strength was measured. Further, the surface resistance value of the adhesive layer side and the visible light transmittance of the cover tape prototype were measured, and the characteristic evaluation results are shown in Tables 3 and 4.
【００２７】《実施例６，７，８，９，10》実施例１の
うち接着層の導電性微粉末ＳｎＯ2 の添加量を下記のよ
うに変えた以外は、実施例１と同様の方法により試料を
作成し、同様に特性を評価した。その結果を表５に示し
た。 （塩化ビニル系樹脂１００重量部に対してＳｎＯ2 の添
加量） 実施例６： ２０重量部 実施例７： ５０重量部 実施例８：５００重量部 実施例９：７５０重量部 実施例10：９００重量部<< Examples 6, 7, 8, 9, 10 >> A method similar to that of Example 1 except that the addition amount of the conductive fine powder SnO 2 of the adhesive layer was changed as follows. , A sample was prepared, and the characteristics were similarly evaluated. Table 5 shows the results. (Amount of SnO 2 added to 100 parts by weight of vinyl chloride resin) Example 6: 20 parts by weight Example 7: 50 parts by weight Example 8: 500 parts by weight Example 9: 750 parts by weight Example 10: 900 Parts by weight
【００２８】[0028]
【表１】 [Table 1]
【００２９】[0029]
【表２】 [Table 2]
【００３０】[0030]
【表３】 [Table 3]
【００３１】[0031]
【表４】 [Table 4]
【００３２】[0032]
【表５】 [Table 5]
【００３３】[0033]
【発明の効果】本発明は、接着層が静電処理されてお
り、電子部品とカバーテープとの接触あるいは、カバー
テープの剥離時に発生する静電気が抑えられ、且つ、そ
の静電効果が使用環境や経時変化にも安定でありシール
性にも影響を及ぼさない点、中間層の凝集力と接着層の
キャリアテープへの接着力の組合せにより、ピールオフ
強度を１mm当り１０〜１２０ｇｒの範囲で任意に設定し
うる点、又、ピールオフ強度がカバーテープ内の中間層
の凝集力により決定されるため、キャリアテープとのシ
ール条件に影響を受けない点、という３点により、従来
の問題点である電子部品とカバーテープとの接触、ある
いはカバーテープの剥離時に発生する静電気の問題、ピ
ールオフ強度のシール条件に対する依存性が大きいとい
う問題、及び保管環境により経時的に変化する問題を解
決することができ、安定したピールオフ強度を得ること
が出来る。According to the present invention, the adhesive layer is electrostatically treated, the static electricity generated when the electronic component comes into contact with the cover tape or when the cover tape is peeled off is suppressed, and the electrostatic effect is used in the environment of use. The peel-off strength can be arbitrarily set within the range of 10 to 120 gr per 1 mm by the combination of the cohesive force of the intermediate layer and the adhesive force of the adhesive layer to the carrier tape, in that it is stable to changes over time and does not affect the sealing property. There are three problems, which are the conventional problems, in that they can be set and that the peel-off strength is determined by the cohesive force of the intermediate layer in the cover tape and is not affected by the sealing conditions with the carrier tape. The problem of static electricity that occurs when parts come into contact with the cover tape or when the cover tape is peeled off, the problem that the peel-off strength greatly depends on the sealing conditions, and the storage environment Makes it possible to solve the time-varying problems, it is possible to obtain a stable peel-off strength.
【図１】本発明のカバーテープの層構成の１例を示す断
面図。FIG. 1 is a sectional view showing an example of a layer configuration of a cover tape of the present invention.
【図２】本発明のカバーテープをキャリアテープに接着
した使用状態を示す断面図。FIG. 2 is a sectional view showing a use state in which the cover tape of the present invention is adhered to a carrier tape.
【図３】本発明のカバーテープをキャリアテープに接着
した使用状態を示す断面図。FIG. 3 is a sectional view showing a use state in which the cover tape of the present invention is adhered to a carrier tape.
【図４】本発明のカバーテープをキャリアテープに接着
した使用状態を示す断面図。FIG. 4 is a sectional view showing a use state in which the cover tape of the present invention is adhered to a carrier tape.
Claims (3)
トを連続的に形成したプラスチック製キャリアテープに
熱シールし得るカバーテープであって、外層がポリエス
テル、ポリプロピレン、ナイロンのいずれかである二軸
延伸フィルムであり、中間層はキャリアテープにシール
されたカバーテープを剥離する際、中間層自体の凝集破
壊によって剥離が行われ、０．９１〜０．９３ｇ／ｃｍ
3までの密度を有するポリエチレンと多くとも１０重量
％の酢酸ビニルを含むエチレン−酢酸ビニルコポリマー
から選ばれる５５〜９５重量％までの少なくとも１つの
エチレンポリマー、５〜３０重量％までのポリスチレン
及び０〜２０重量％までの熱可塑性エラストマー状のス
チレン−ブタジエン−スチレンもしくはスチレン−イソ
プレン−スチレンコポリマーからなるオレフィン系フィ
ルムであり、接着層は熱可塑性樹脂に酸化錫、酸化亜
鉛、酸化チタン、カーボンブラック、Ｓｉ系有機化合物
のいずれか又はこれらの組合せからなる導電性微粉末を
分散させてなり、導電性微粉末の添加量が接着層の熱可
塑性樹脂１００重量部に対して１０〜１０００重量部で
あり、接着層の表面抵抗値が１０13Ω／□以下であり、
かつカバーテープの接着層とキャリアテープのシール面
の接着力がカバーテープの中間層の凝集力よりも大き
く、カバーテープの中間層の凝集力がシール幅１mm当り
１０〜１２０ｇｒであることを特徴とするチップ型電子
部品包装用カバーテープ。1. A cover tape which can be heat-sealed to a plastic carrier tape in which storage pockets for storing chip-type electronic components are continuously formed, wherein an outer layer is made of any one of polyester, polypropylene and nylon. When the intermediate layer is peeled off from the cover tape sealed with the carrier tape, the intermediate layer is peeled off by cohesive failure of the intermediate layer itself.
From 55 to 95% by weight of at least one ethylene polymer selected from polyethylene having a density of up to 3 and an ethylene-vinyl acetate copolymer containing at most 10% by weight of vinyl acetate, from 5 to 30% by weight of polystyrene and from 0 to Up to 20% by weight of an olefinic film composed of styrene-butadiene-styrene or styrene-isoprene-styrene copolymer in the form of a thermoplastic elastomer. Conductive fine powder composed of any of these organic compounds or a combination thereof is dispersed, the amount of the conductive fine powder is 10 to 1000 parts by weight with respect to 100 parts by weight of the thermoplastic resin of the adhesive layer, The surface resistance of the adhesive layer is 10 13 Ω / □ or less;
The adhesive force between the adhesive layer of the cover tape and the sealing surface of the carrier tape is larger than the cohesive force of the intermediate layer of the cover tape, and the cohesive force of the intermediate layer of the cover tape is 10 to 120 gr per 1 mm of the seal width. Chip-type electronic component packaging cover tape.
樹脂、アクリル系樹脂、ポリ塩化ビニル系樹脂、エチレ
ンビニルアセテート系樹脂、ポリエステル系樹脂のいず
れか又はこれらを組み合わせてなる請求項１記載のチッ
プ型電子部品包装用カバーテープ。2. The chip according to claim 1, wherein the thermoplastic resin of the adhesive layer is any one of a polyurethane resin, an acrylic resin, a polyvinyl chloride resin, an ethylene vinyl acetate resin, and a polyester resin, or a combination thereof. Cover tape for packaging electronic parts.
以上である請求項１又は２記載のチップ型電子部品包装
用カバーテープ。3. The visible light transmittance of the cover tape is 10%.
The cover tape for packaging chip-type electronic components according to claim 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3289639A JP2609779B2 (en) | 1991-02-28 | 1991-11-06 | Cover tape for packaging chip-type electronic components |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3-117090 | 1991-02-28 | ||
| JP11709091 | 1991-02-28 | ||
| JP3289639A JP2609779B2 (en) | 1991-02-28 | 1991-11-06 | Cover tape for packaging chip-type electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0532288A JPH0532288A (en) | 1993-02-09 |
| JP2609779B2 true JP2609779B2 (en) | 1997-05-14 |
Family
ID=26455271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3289639A Expired - Lifetime JP2609779B2 (en) | 1991-02-28 | 1991-11-06 | Cover tape for packaging chip-type electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2609779B2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3582859B2 (en) * | 1993-08-04 | 2004-10-27 | 大日本印刷株式会社 | Lid material |
| KR100484229B1 (en) * | 2002-03-14 | 2005-04-20 | 서광석 | Cover Tape for carrier tape |
| JP4002131B2 (en) * | 2002-04-09 | 2007-10-31 | 旭化成テクノプラス株式会社 | Cover tape |
| JP2006232405A (en) * | 2005-01-28 | 2006-09-07 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component |
| JP4899593B2 (en) * | 2005-04-07 | 2012-03-21 | 住友ベークライト株式会社 | Cover tape for packaging electronic parts |
| JP2012030897A (en) * | 2005-04-07 | 2012-02-16 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component |
| JP5683096B2 (en) * | 2009-12-09 | 2015-03-11 | 電気化学工業株式会社 | Method for reducing the amount of electrification of carrier tape |
| MY190586A (en) * | 2010-12-17 | 2022-04-27 | 3M Innovative Properties Co | Heat-sealing film and cover tape for packaging electronic components |
| IN2014CN03520A (en) * | 2011-11-14 | 2015-10-09 | Lg Chemical Ltd | |
| JP2013193786A (en) * | 2012-03-22 | 2013-09-30 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component and electronic component package |
| JP2014051599A (en) * | 2012-09-07 | 2014-03-20 | Osaka Sealing Printing Co Ltd | Adhesive tape |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61178878A (en) * | 1985-01-25 | 1986-08-11 | 川島 弘至 | Carrier tape |
| JPH057161Y2 (en) * | 1987-03-24 | 1993-02-23 | ||
| JPH046159Y2 (en) * | 1988-01-26 | 1992-02-20 | ||
| JPH024670A (en) * | 1988-06-13 | 1990-01-09 | Nec Corp | Cover tape for embossing packaging |
| JP2855444B2 (en) * | 1989-04-25 | 1999-02-10 | 大日本印刷株式会社 | Electronic component carrier |
| JPH0330295A (en) * | 1989-06-28 | 1991-02-08 | Asahi Kasei Porifuretsukusu Kk | Antistatic cover film |
| JP3078768U (en) * | 2000-03-10 | 2001-07-19 | 有限会社井上商会 | Spatula |
| JP3126870U (en) * | 2006-08-31 | 2006-11-09 | 株式会社芝川製作所 | Light emitting device |
-
1991
- 1991-11-06 JP JP3289639A patent/JP2609779B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0532288A (en) | 1993-02-09 |
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