JP2677760B2 - はんだ - Google Patents

はんだ

Info

Publication number
JP2677760B2
JP2677760B2 JP6053489A JP5348994A JP2677760B2 JP 2677760 B2 JP2677760 B2 JP 2677760B2 JP 6053489 A JP6053489 A JP 6053489A JP 5348994 A JP5348994 A JP 5348994A JP 2677760 B2 JP2677760 B2 JP 2677760B2
Authority
JP
Japan
Prior art keywords
solder
weight
lead
tin
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6053489A
Other languages
English (en)
Japanese (ja)
Other versions
JPH07178587A (ja
Inventor
泰司 川島
貴志 長嶋
昭彦 松生
赳 目黒
薫 志水
英雄 茶木
利明 小倉
Original Assignee
松下電器産業 株式会社
株式会社 ニホンゲンマ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業 株式会社, 株式会社 ニホンゲンマ filed Critical 松下電器産業 株式会社
Priority to EP94117259A priority Critical patent/EP0652072A1/en
Priority to US08/334,236 priority patent/US5690890A/en
Priority to KR1019940029134A priority patent/KR100259311B1/ko
Priority to CN94120102A priority patent/CN1049379C/zh
Priority to MYPI94002985A priority patent/MY115159A/en
Priority to TW083110447A priority patent/TW291455B/zh
Publication of JPH07178587A publication Critical patent/JPH07178587A/ja
Priority to TW084110970A priority patent/TW305899B/zh
Application granted granted Critical
Publication of JP2677760B2 publication Critical patent/JP2677760B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Paper (AREA)
JP6053489A 1993-11-09 1994-03-24 はんだ Expired - Lifetime JP2677760B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
EP94117259A EP0652072A1 (en) 1993-11-09 1994-11-02 Solder
US08/334,236 US5690890A (en) 1993-11-09 1994-11-04 Solder
KR1019940029134A KR100259311B1 (ko) 1993-11-09 1994-11-08 주석-납 합금 솔더
MYPI94002985A MY115159A (en) 1993-11-09 1994-11-09 Solder.
CN94120102A CN1049379C (zh) 1993-11-09 1994-11-09 钎料
TW083110447A TW291455B (mo) 1993-11-09 1994-11-11
TW084110970A TW305899B (mo) 1993-11-09 1995-10-18

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5-279381 1993-11-09
JP27938193 1993-11-09

Publications (2)

Publication Number Publication Date
JPH07178587A JPH07178587A (ja) 1995-07-18
JP2677760B2 true JP2677760B2 (ja) 1997-11-17

Family

ID=17610354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6053489A Expired - Lifetime JP2677760B2 (ja) 1993-11-09 1994-03-24 はんだ

Country Status (4)

Country Link
JP (1) JP2677760B2 (mo)
KR (1) KR100259311B1 (mo)
MY (1) MY115159A (mo)
TW (2) TW291455B (mo)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6033488A (en) * 1996-11-05 2000-03-07 Samsung Electronics Co., Ltd. Solder alloy
KR100230269B1 (ko) * 1996-12-31 1999-11-15 윤종용 납땜용 솔더 합금
JP2002153990A (ja) 2000-11-21 2002-05-28 Senju Metal Ind Co Ltd はんだボール用合金
JP3599101B2 (ja) * 2000-12-11 2004-12-08 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
CN100413633C (zh) * 2003-09-05 2008-08-27 中国科学院金属研究所 一种抗氧化的锡铅系合金焊料
US8128868B2 (en) 2009-02-12 2012-03-06 International Business Machines Corporation Grain refinement by precipitate formation in PB-free alloys of tin
US8493746B2 (en) 2009-02-12 2013-07-23 International Business Machines Corporation Additives for grain fragmentation in Pb-free Sn-based solder
CN101920405B (zh) * 2010-08-23 2013-07-31 中国电力科学研究院 一种镀锌钢接地网用锡铅基复合钎料及其制备方法
CN115781100B (zh) * 2023-01-29 2023-05-02 河北钢研德凯科技有限公司 一种镁合金焊丝及其制备方法和应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59153857A (ja) * 1983-02-21 1984-09-01 Taruchin Kk 接合部形成用合金
JPS61273296A (ja) * 1985-05-29 1986-12-03 Taruchin Kk 耐食性はんだ合金
JPH02101132A (ja) * 1988-10-11 1990-04-12 Ichiro Kawakatsu 低融点ハンダ合金
JP2731277B2 (ja) * 1990-02-28 1998-03-25 株式会社東芝 ダイボンディング用半田

Also Published As

Publication number Publication date
TW291455B (mo) 1996-11-21
KR950014341A (ko) 1995-06-15
JPH07178587A (ja) 1995-07-18
TW305899B (mo) 1997-05-21
MY115159A (en) 2003-04-30
KR100259311B1 (ko) 2000-06-15

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