JP2882102B2 - Electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, in which two TAB chips having leads in two directions are stacked,
This is an electronic component having leads in the directions.

[0002]

2. Description of the Related Art As an electronic component, as shown in FIG. 4, an electronic component P1 (generally called an SOP) in which leads 102 extend from a molded body 101 in two directions, or as shown in FIG. There is known an electronic component P2 (generally referred to as QFP) having leads extending in four directions.

[0003]

The QFP has a higher degree of integration than the SOP. Therefore, the SOP is disadvantageous to the QFP in terms of the higher integration of the substrate.

Accordingly, an object of the present invention is to provide means for obtaining an electronic component having the same four-way leads as a QFP using a chip having two-way leads.

[0005]

For this purpose, the present invention provides a method for producing
Two TAB chips having leads in the directions are turned upside down and rotated horizontally by 90 ° to be stacked, and these TAB chips are integrated by molding in a mold.

[0006]

According to the above construction, two TAB chips having leads in two directions can be integrated to form an electronic component having leads in four directions.

[0007]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows an electronic component P according to the present invention. FIGS. 2 (a) and 2 (b) show cross sections taken along line XX and YY of FIG. This electronic component P is obtained by stacking two TAB chips 1A and 2A, molding them with a mold body 5, and integrating them.

The TAB chips 1A, 2A are similar to SOPs having leads 1C, 2C in two directions from the semiconductor chips 1B, 2B.
B, 2B and leads 1C, 2C are connected by leads 1D, 2D formed by punching a film carrier. This electronic component P is the same electronic component as a QFP having leads 1C and 2C in four directions by stacking two TAB chips 1A and 2A by means described later. a and b are circuit forming surfaces of the respective semiconductor chips 1B and 2B.

FIG. 3 shows a method of manufacturing the electronic component P. In FIG. 3A, first, one TAB chip 2
The lead 2D of A is landed on the lead frame 2C ', and the lead 2D is thermally welded to the lead frame 2C'. As the thermal welding means, there are known means for pressing a thermocompressor against the lead 2D and means for irradiating the lead 2D with a laser beam.

Next, the TAB chip 2A is turned 180 ° in the vertical direction to be turned upside down and turned 90 ° horizontally (FIG. 3B).

Next, as shown in FIG. 3C, the other TAB chip 1A is stacked from above the TAB chip 2A, and the lead 1D is thermally welded to the lead frame 1C '. When the two TAB chips 1A and 2A are stacked in this way, the molded body 5 is formed by the mold pressing means, and the lead frames 1C 'and 2 are formed.
By punching C 'and forming the leads 1C and 2C, the electronic component P shown in FIGS. 1 and 2 is obtained.

In other words, the present means integrates a TAB chip having leads in two directions into one electronic component P having leads in four directions. It suffices to mount the electronic components P, so that the substrate can be made smaller and highly integrated, and the mounting time can be reduced by half.

By the way, ordinary electronic components other than the TAB chip are formed by connecting electrodes of a semiconductor chip and electrodes of a lead frame with wires. This connection (wiring) uses the capillary tool of the wire bonder to US
This is performed by pressing the wire against the electrode while vibrating. In this case, in order to effectively use the US vibration, the lead frame must be backed up from below. However, even if a normal chip that is not a TAB chip is stacked and wired as shown in FIG. 3B, the lead frame cannot be backed up due to the presence of the lower chip, so that the US vibration of the capillary tool is effectively reduced. It doesn't work and wiring is not possible.

On the other hand, if a TAB chip is used as the chip as in the present invention, the leads 1D, 2D and the lead frames 1C ', 2C' can be connected by heat welding means or laser means which does not require US vibration. , The electronic component P
Can be manufactured.

[0016]

As described above, according to the present invention, two TAB chips having leads in two directions are turned upside down and horizontally rotated by 90 ° to be stacked, and these TAB chips are molded. Since the electronic components are integrated by molding with the above, an electronic component having leads in four directions can be obtained by a TAB chip having leads in two directions, and substantial high integration can be achieved.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component according to the present invention.

FIG. 2 is a sectional view of an electronic component according to the present invention.

FIG. 3 is a manufacturing process diagram of an electronic component according to the present invention.

FIG. 4 is a plan view of a conventional SOP.

FIG. 5 is a plan view of a conventional QFP.

[Explanation of symbols]

 1A TAB chip 2A TAB chip 1C lead 2C lead 5 Molded body P Electronic component

Claims (1)

(57) [Claims] 1. A method in which two TAB chips having leads in two directions are turned upside down and rotated by 90 ° horizontally to be stacked, and these TAB chips are integrated by molding in a mold. Electronic components characterized by the following.