JP3148316B2 - Silver-silver chloride electrode and method for producing the same - Google Patents
Silver-silver chloride electrode and method for producing the sameInfo
- Publication number
- JP3148316B2 JP3148316B2 JP34623691A JP34623691A JP3148316B2 JP 3148316 B2 JP3148316 B2 JP 3148316B2 JP 34623691 A JP34623691 A JP 34623691A JP 34623691 A JP34623691 A JP 34623691A JP 3148316 B2 JP3148316 B2 JP 3148316B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- silver chloride
- powder
- chloride electrode
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- GTKRFUAGOKINCA-UHFFFAOYSA-M chlorosilver;silver Chemical compound [Ag].[Ag]Cl GTKRFUAGOKINCA-UHFFFAOYSA-M 0.000 title claims description 47
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 51
- 239000011812 mixed powder Substances 0.000 claims description 24
- 229910021607 Silver chloride Inorganic materials 0.000 claims description 14
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 14
- 239000004332 silver Substances 0.000 description 13
- 229910052709 silver Inorganic materials 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000008151 electrolyte solution Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000012466 permeate Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Ceramic Products (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、診療で用いられる心電
図，筋電図，脳波計等で微弱な生体電気信号を検出する
ための銀−塩化銀電極およびその製造方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silver-silver chloride electrode for detecting a weak bioelectric signal with an electrocardiogram, an electromyogram, an electroencephalograph or the like used in medical treatment and a method for producing the same.
【０００２】[0002]
【従来の技術】図３は生体電極用の従来の銀−塩化銀電
極を示す側面図で、１は銀−塩化銀混合粉焼結体、２は
リード線、３は銀ペーストであり、従来の銀−塩化銀電
極の製造方法は、所定の比率に混合された銀と塩化銀の
混合粉を所定の形に成形，焼成して銀−塩化銀混合粉焼
結体１を形成し、その裏面に、直接リード線２の線端を
銀ペースト３にて固定して銀−塩化銀電極を形成するも
のである。2. Description of the Related Art FIG. 3 is a side view showing a conventional silver-silver chloride electrode for a living body electrode, 1 is a silver-silver chloride mixed powder sintered body, 2 is a lead wire, and 3 is a silver paste. The method for producing a silver-silver chloride electrode comprises forming a mixed powder of silver and silver chloride mixed in a predetermined ratio into a predetermined shape and firing to form a silver-silver chloride mixed powder sintered body 1. A wire end of the lead wire 2 is directly fixed to the back surface with a silver paste 3 to form a silver-silver chloride electrode.
【０００３】図４はその他の従来の銀−塩化銀電極を示
す側面図で、４は銀−塩化銀混合粉焼結体、５は銀ペー
スト、６はリード線、７はハンダであり、このその他の
従来の銀−塩化銀電極の製造方法は、所定の比率に混合
された銀と塩化銀の混合粉を所定の形に成形，焼成して
銀−塩化銀混合粉焼結体１を形成し、その裏面に、銀ペ
ースト５にて半田付け用のランドを形成後、このランド
にリード線６の線端をハンダ７にて半田付けして固定し
て銀−塩化銀電極を形成するものである。FIG. 4 is a side view showing another conventional silver-silver chloride electrode. 4 is a silver-silver chloride mixed powder sintered body, 5 is a silver paste, 6 is a lead wire, and 7 is solder. Another conventional method of manufacturing a silver-silver chloride electrode is to form a mixed powder of silver and silver chloride mixed in a predetermined ratio into a predetermined shape and fire it to form a silver-silver chloride mixed powder sintered body 1. Then, a land for soldering is formed on the back surface with a silver paste 5, and a wire end of a lead wire 6 is soldered to the land with a solder 7 to form a silver-silver chloride electrode. It is.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記し
た従来の銀−塩化銀電極で、直接リード線端を銀ペース
トにて銀−塩化銀の混合粉の焼結体に固定する銀−塩化
銀電極では、銀−塩化銀の混合粉の焼結体はポーラス
（海綿のように多孔質）であり、測定時に使用する電解
液が銀−塩化銀の混合焼結体に浸透してペーストまで達
するとペーストとの界面強度が弱まってしまうので、リ
ード線の取り付け強度が低いという問題があり、現在で
は実際に使用されていることは稀である。However, in the above-mentioned conventional silver-silver chloride electrode, the end of the lead wire is directly fixed to the sintered body of the mixed powder of silver-silver chloride with silver paste. Then, the sintered body of the silver-silver chloride mixed powder is porous (porous like sponge), and when the electrolytic solution used at the time of measurement permeates the silver-silver chloride mixed sintered body and reaches the paste. Since the interface strength with the paste is weakened, there is a problem that the strength of attaching the lead wire is low, and it is rarely actually used at present.
【０００５】また、銀−塩化銀の混合粉の焼結体に銀ペ
ーストにてランドを形成し、このランドにリード線端を
半田付けする銀−塩化銀電極では、ポーラスな銀−塩化
銀の混合粉の焼結体に電解液が浸透してハンダと接する
と局部電池が形成され、局部電池が形成されると、微弱
な生体電気信号を検出するための電極としては使えなく
なるという問題がある。局部電池を形成しないようにす
るためには、リード線の線端と銀−塩化銀電極を接合す
るハンダに電解液が接しないように絶縁する半田付け箇
所の完全な封入が必要であるが、従来考えられる手段で
は困難かつ作業も容易でなく、また、リード線の取り付
け強度はまだ十分ではなく、この点でも完全な封入の困
難さを増していた。A silver-silver chloride electrode for forming a land with a silver paste on a sintered body of a mixed powder of silver-silver chloride and soldering a lead wire end to the land has a porous silver-silver chloride electrode. When the electrolytic solution permeates the sintered body of the mixed powder and comes into contact with the solder, a local battery is formed, and when the local battery is formed, there is a problem that it cannot be used as an electrode for detecting a weak bioelectric signal. . In order not to form a local battery, it is necessary to completely enclose a soldering portion that insulates the solder that joins the wire end of the lead wire and the silver-silver chloride electrode so that the electrolyte does not contact the solder. Conventionally conceived means are difficult and not easy to work, and the strength of mounting the lead wire is not yet sufficient, which also increases the difficulty of complete encapsulation.
【０００６】本発明は、このような問題を解決するため
になされたもので、銀−塩化銀の混合粉の焼結体に浸透
する電解液がリード線を取り付けるハンダに接しないよ
うにして局部電池が形成されないようにするとともに、
リード線の取り付け強度の増加を図ることのできる銀−
塩化銀電極およびその製造方法を提供する。SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and it has been proposed that an electrolytic solution penetrating into a sintered body of a silver-silver chloride mixed powder is prevented from coming into contact with a solder for attaching a lead wire. To prevent batteries from forming,
Silver that can increase the mounting strength of lead wires-
A silver chloride electrode and a method for producing the same are provided.
【０００７】[0007]
【課題を解決するための手段】本発明者らは上記した局
部電池の形成の防止およびリード線の取り付け強度の増
加を目的に種々試作研究した結果、銀と塩化銀の混合粉
の片面に銀板を張り合わせて、この銀板の裏面にリード
線を取り付けることとすれば、ポーラスな銀と塩化銀の
混合粉の焼結体を貫通して浸透してきた電解液を銀板で
阻止できて局部電池が形成されなくなり、リード線の取
り付け強度も増加することがわかった。The inventors of the present invention have conducted various trials and researches for the purpose of preventing the formation of the above-mentioned local battery and increasing the mounting strength of the lead wire. As a result, the silver powder was mixed on one side of the mixed powder of silver and silver chloride. By bonding the plates and attaching the lead wires to the back of the silver plate, the electrolyte that has penetrated through the sintered body of the mixed powder of porous silver and silver chloride can be blocked by the silver plate, and It was found that the battery was not formed, and the strength of attaching the lead wire was also increased.
【０００８】しかしながら、銀と塩化銀の混合粉と平滑
な面をもった銀板とを十分な強度で張り合わせるには約
５００℃以上の温度が必要で、この温度では融点が約４
５５℃の塩化銀が溶融してしまうため、表面安定性のた
め必要なポーラスな組織が破壊されてしまい、あまり好
ましい銀−塩化銀電極が得られなかった。そこで、さら
に試作研究した結果、銀板に予め銀粉を焼成して優れた
アンカー面とした後、この面上に銀と塩化銀の混合粉を
塗布後焼成することで、塩化銀の溶融温度以下の焼成温
度で十分な接合強度を持ち、理想に近いポーラスな組織
を持たせることができた。However, in order to bond the mixed powder of silver and silver chloride to a silver plate having a smooth surface with sufficient strength, a temperature of about 500 ° C. or more is required.
Since the silver chloride melted at 55 ° C., the porous structure required for surface stability was destroyed, so that a very favorable silver-silver chloride electrode could not be obtained. Therefore, as a result of further research on trial production, after firing silver powder in advance on a silver plate to obtain an excellent anchor surface, applying a mixed powder of silver and silver chloride on this surface and firing it, the melting temperature of silver chloride or less It has a sufficient bonding strength at the sintering temperature, and a porous structure close to the ideal can be obtained.
【０００９】すなわち、本発明は銀板の片面に銀粉を塗
布して焼成し、この銀粉を焼成した銀板の面に、銀粉と
塩化銀粉を所定の比率で混合した粉を塗布して焼成し、
銀−塩化銀電極を製造するものである。That is, according to the present invention, silver powder is applied to one side of a silver plate and baked, and a powder obtained by mixing silver powder and silver chloride powder at a predetermined ratio is applied to the surface of the silver plate where the silver powder is baked. ,
A silver-silver chloride electrode is manufactured.
【００１０】[0010]
【実施例】以下、本発明の実施例を図面を用いて説明す
る。図１は本発明の一実施例を示す銀−塩化銀電極の側
面図である。図において、８は銀板、９は銀板８の片面
に張り合わされている銀−塩化銀混合粉焼結体、１０は
銀板８の片面に銀粉を塗布して焼成することで形成され
るアンカー面である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side view of a silver-silver chloride electrode showing one embodiment of the present invention. In the drawing, 8 is a silver plate, 9 is a silver-silver chloride mixed powder sintered body bonded to one surface of the silver plate 8, and 10 is formed by applying silver powder to one surface of the silver plate 8 and firing it. Anchor surface.
【００１１】以下、本実施例の銀−塩化銀電極の製造方
法を説明する。厚さ０．１ｍｍ，巾６０ｍｍの銀板の片
面に、平均粒度２０メッシュの銀粉をドクターブレード
法により塗布した後、焼成して厚さ０．１５ｍｍの片面
にアンカー面１０をもった銀板８を製作した。次に重量
で１：１の比率の銀−塩化銀の混合粉をこの銀板８のア
ンカー面１０上に塗布し、３５０℃，３０分で焼成して
銀−塩化銀混合粉焼結体９を形成し、厚さ０．７ｍｍの
銀板／銀−塩化銀の複合体構造をもった銀−塩化銀電極
材料を製作した。Hereinafter, a method for manufacturing the silver-silver chloride electrode of this embodiment will be described. A silver powder having an average particle size of 20 mesh is applied to one surface of a silver plate having a thickness of 0.1 mm and a width of 60 mm by a doctor blade method, and then baked to form a silver plate 8 having an anchor surface 10 on one side having a thickness of 0.15 mm. Was made. Next, a silver-silver chloride mixed powder having a 1: 1 ratio by weight is applied on the anchor surface 10 of the silver plate 8 and fired at 350 ° C. for 30 minutes to obtain a silver-silver chloride mixed powder sintered body 9. Was formed to produce a silver-silver chloride electrode material having a 0.7 mm thick silver plate / silver-silver chloride composite structure.
【００１２】図２は、上記本実施例と比較のための銀−
塩化銀電極で、圧延上がりの面のままでアンカー面を持
たない銀板１１上で上記と同じ銀−塩化銀の混合粉を同
じ条件で塗布，焼成して銀−塩化銀混合粉焼結体１２を
形成し、厚さ０．７ｍｍの同様の複合体構造をもった銀
−塩化銀電極材料を作った。これを比較例とし本実施例
と同じφ１０ｍｍのプレス打ち抜きをして、プレス打ち
抜き加工の剪断状態をもって比較とした。FIG. 2 is a cross-sectional view of a silver alloy for comparison with this embodiment.
The same silver-silver chloride mixed powder is applied and baked under the same conditions on a silver plate 11 that has been rolled and does not have an anchor surface at the silver chloride electrode, and has a silver-silver chloride mixed powder sintered body. 12 to form a silver-silver chloride electrode material having a similar composite structure having a thickness of 0.7 mm. Using this as a comparative example, the same press punching of φ10 mm as in the present embodiment was performed, and the shearing state of the press punching was used for comparison.
【００１３】[0013]
【表１】 [Table 1]
【００１４】[0014]
【発明の効果】以上説明したように、本発明は、銀板の
片面に銀粉を塗布して焼成し、この銀粉を焼成した銀板
の面に、銀粉と塩化銀粉を所定の比率で混合した粉を塗
布した後、焼成して銀−塩化銀電極を製造するものであ
る。このような銀−塩化銀電極の製造方法によれば、銀
板と銀−塩化銀の混合焼結体との接合界面の機械的強度
を高めることができ、接合界面の機械的強度が高められ
ることで、生体電極用として供された場合、接合界面の
電気的な安定性をもつことができ、安定した電極特性を
示す電極を製造できるようになった。As described above, according to the present invention, silver powder is applied to one side of a silver plate and fired, and silver powder and silver chloride powder are mixed at a predetermined ratio on the surface of the silver plate fired with the silver powder. After applying the powder, it is baked to produce a silver-silver chloride electrode. According to such a method for manufacturing a silver-silver chloride electrode, the mechanical strength of the bonding interface between the silver plate and the mixed sintered body of silver-silver chloride can be increased, and the mechanical strength of the bonding interface can be increased. As a result, when used as a biological electrode, the electrical stability of the bonding interface can be maintained, and an electrode exhibiting stable electrode characteristics can be manufactured.
【００１５】同様な理由から繰り返し使用に耐え、長寿
命をもった電極を供せられるようになった。また、この
ように製造された銀−塩化銀電極は、銀板の片面に銀−
塩化銀の混合粉が焼成されているので、銀−塩化銀の混
合粉焼結体に浸透する電解液をこの銀板で阻止すること
ができ、リード線の剥離やリード線との接合箇所に局部
電池が形成されることが防止できる。For the same reason, it has become possible to provide an electrode which can withstand repeated use and has a long life. The silver-silver chloride electrode manufactured in this manner has a silver-silver chloride electrode on one side of a silver plate.
Since the silver chloride mixed powder has been calcined, the electrolytic solution that permeates the silver-silver chloride mixed powder sintered body can be blocked by this silver plate, and the peeling of the lead wire and the joint with the lead wire can be prevented. The formation of a local battery can be prevented.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明の一実施例を示す銀−塩化銀電極を示す
側面図である。FIG. 1 is a side view showing a silver-silver chloride electrode showing one embodiment of the present invention.
【図２】本実施例と比較のための銀−塩化銀電極を示す
側面図である。FIG. 2 is a side view showing a silver-silver chloride electrode for comparison with the present embodiment.
【図３】従来の銀−塩化銀電極を示す側面図である。FIG. 3 is a side view showing a conventional silver-silver chloride electrode.
【図４】その他の従来の銀−塩化銀電極を示す側面図で
ある。FIG. 4 is a side view showing another conventional silver-silver chloride electrode.
８ 銀板 ９ 銀−塩化銀混合粉焼結体 １０ アンカー面 8 Silver plate 9 Silver-silver chloride mixed powder sintered body 10 Anchor surface
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大矢 誠 東京都千代田区鍛冶町二丁目９番12号 株式会社徳力本店内 (56)参考文献 特開 昭50−108781（ＪＰ，Ａ) 特公 昭56−48173（ＪＰ，Ｂ２) 特公 昭63−17447（ＪＰ，Ｂ２) (58)調査した分野(Int.Cl.7，ＤＢ名) A61B 5/0408 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Makoto Oya 2-9-1, Kaji-cho, Chiyoda-ku, Tokyo Inside Tokuriki Co., Ltd. (56) References JP-A-50-108781 (JP, A) Akira Tokubo 56-48173 (JP, B2) JP-B 63-17447 (JP, B2) (58) Fields investigated (Int. Cl. 7 , DB name) A61B 5/0408
Claims (2)
と、この銀板の粗面側に一体に張り合わされた銀−塩化
銀の混合粉の焼結体とから構成されていることを特徴と
する銀−塩化銀電極。1. A silver plate having a roughened surface made of silver powder on one side, and a sintered body of a silver-silver chloride mixed powder integrally adhered to the roughened side of the silver plate. A silver-silver chloride electrode, characterized in that:
の銀粉を焼成した銀板の面に、銀粉と塩化銀粉を所定の
比率で混合した粉を塗布して焼成することを特徴とする
銀−塩化銀電極の製造方法。2. A method in which silver powder is applied to one side of a silver plate and fired, and a powder obtained by mixing silver powder and silver chloride powder in a predetermined ratio is applied to the surface of the silver plate fired with the silver powder and fired. A method for producing a silver-silver chloride electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34623691A JP3148316B2 (en) | 1991-12-27 | 1991-12-27 | Silver-silver chloride electrode and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34623691A JP3148316B2 (en) | 1991-12-27 | 1991-12-27 | Silver-silver chloride electrode and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05176903A JPH05176903A (en) | 1993-07-20 |
| JP3148316B2 true JP3148316B2 (en) | 2001-03-19 |
Family
ID=18382038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34623691A Expired - Lifetime JP3148316B2 (en) | 1991-12-27 | 1991-12-27 | Silver-silver chloride electrode and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3148316B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4624160B2 (en) * | 2005-04-01 | 2011-02-02 | 石福金属興業株式会社 | Biological electrode |
| JP4596957B2 (en) * | 2005-04-01 | 2010-12-15 | 石福金属興業株式会社 | Silver-based biological electrode and method for producing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5648173B2 (en) | 2008-03-31 | 2015-01-07 | 日本電産サンキョー株式会社 | Card reader and processing method thereof |
| JP6317447B2 (en) | 2013-08-28 | 2018-04-25 | アップンライド ロボティクス リミテッド | Standing wheelchair |
-
1991
- 1991-12-27 JP JP34623691A patent/JP3148316B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5648173B2 (en) | 2008-03-31 | 2015-01-07 | 日本電産サンキョー株式会社 | Card reader and processing method thereof |
| JP6317447B2 (en) | 2013-08-28 | 2018-04-25 | アップンライド ロボティクス リミテッド | Standing wheelchair |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05176903A (en) | 1993-07-20 |
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