JP3150077B2 - Bonding apparatus for resin-coated wire and bonding method using the same - Google Patents

Bonding apparatus for resin-coated wire and bonding method using the same

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Publication number
JP3150077B2
JP3150077B2 JP04403997A JP4403997A JP3150077B2 JP 3150077 B2 JP3150077 B2 JP 3150077B2 JP 04403997 A JP04403997 A JP 04403997A JP 4403997 A JP4403997 A JP 4403997A JP 3150077 B2 JP3150077 B2 JP 3150077B2
Authority
JP
Japan
Prior art keywords
wire
ultraviolet
curing
bonding
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP04403997A
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Japanese (ja)
Other versions
JPH10242197A (en
Inventor
忠之 新谷
Original Assignee
九州日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 九州日本電気株式会社 filed Critical 九州日本電気株式会社
Priority to JP04403997A priority Critical patent/JP3150077B2/en
Publication of JPH10242197A publication Critical patent/JPH10242197A/en
Application granted granted Critical
Publication of JP3150077B2 publication Critical patent/JP3150077B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/553—Materials of bond wires not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は樹脂被覆ワイヤのボ
ンディング装置及びそれを用いたボンディング方法に関
する。The present invention relates to a resin-coated wire bonding apparatus and a bonding method using the same.

【０００２】[0002]

【従来の技術】従来のボンディング用ワイヤ及びワイヤ
ボンディング方法は、特開平１−１２８４４１号公報に
開示されている。この公報によれば、図３に示すよう
に、紫外線硬化樹脂塗布機構３において、紫外線硬化樹
脂を収容した液漕３ａ，供給パイプ３ｂ及び上下の塗布
ローラ３ｃ，３ｄを介してワイヤ１に紫外線硬化樹脂を
塗布する。この塗布された紫外線硬化樹脂被覆層５は半
硬化状態とする被覆硬化手段４すなわち紫外線ランプ４
ａとこの対向位置に配置された反射ミラー４ｂにより、
ワイヤ１の全周に塗布された紫外線硬化樹脂層５を半硬
化の状態とする。このように構成することにより、ワイ
ヤ５の弾性を失うことがなく、ワイヤ１の取り扱いに支
障を生じることがない。またワイヤ１の捩れやだれ等に
よる接触では、半硬化状態の樹脂ははがれることがな
く、ワイヤ１の紫外線硬化樹脂被覆層５の機能を果すこ
とができるとされている。2. Description of the Related Art A conventional bonding wire and a wire bonding method are disclosed in Japanese Patent Application Laid-Open No. 1-128441. According to this publication, as shown in FIG. 3, in the ultraviolet curing resin application mechanism 3, the wire 1 is ultraviolet cured through a liquid tank 3a containing the ultraviolet curing resin, a supply pipe 3b, and upper and lower application rollers 3c and 3d. Apply resin. The applied UV-curable resin coating layer 5 is brought into a semi-cured state by coating-curing means 4, that is, an ultraviolet lamp 4.
a and the reflecting mirror 4b disposed at the opposing position,
The ultraviolet curable resin layer 5 applied to the entire circumference of the wire 1 is in a semi-cured state. With this configuration, the elasticity of the wire 5 is not lost and the handling of the wire 1 is not hindered. Further, it is stated that the resin in the semi-cured state does not come off when the wire 1 is touched by twisting or dripping, and the function of the ultraviolet-curable resin coating layer 5 of the wire 1 can be achieved.

【０００３】[0003]

【発明が解決しようとする課題】第１の問題点は、従来
の技術において、紫外線硬化樹脂に塗布むらやだれ気泡
等が発生しやすいからである。その理由は、紫外線硬化
樹脂を半硬化しているからである。The first problem is that, in the prior art, uneven coating and dripping bubbles are easily generated on the ultraviolet curable resin. The reason is that the ultraviolet curable resin is semi-cured.

【０００４】第２の問題点は、ワイヤ間隔が狭い製品に
対してワイヤがショートしやすい。その理由は、ワイヤ
間隔が狭い為に半硬化された紫外線硬化樹脂どうしが接
触した時に剥がれやすいからである。[0004] The second problem is that a wire is apt to short-circuit with a product having a small wire interval. The reason for this is that the semi-cured ultraviolet curable resins are easily peeled off when they come into contact with each other due to the small wire spacing.

【０００５】本発明の目的は、ワイヤを紫外線硬化樹脂
にて保護し、ショートを防止することでの信頼性向上す
ることである。An object of the present invention is to improve reliability by protecting a wire with an ultraviolet curable resin and preventing a short circuit.

【０００６】[0006]

【課題を解決するための手段】 本発明の樹脂被覆ワイ
ヤのボンディング装置は、キャピラリィと、このキャピ
ラリィのワイヤ導入口側に設けられ紫外線硬化樹脂被覆
層を形成する紫外線硬化樹脂塗布機構と、ワイヤのボー
ルを形成する可動電極と、キャピラリィのワイヤ導出口
側に設けられボンディング直前に紫外線硬化樹脂被覆層
を完全硬化させる被覆硬化手段を備えたことを特徴とす
る。Means for Solving the Problems A resin-coated wire bonding apparatus according to the present invention includes a capillary, an ultraviolet-curable resin coating mechanism provided on a wire inlet side of the capillary to form an ultraviolet-curable resin coating layer, A movable electrode for forming a ball and a coating and curing means provided on the wire outlet side of the capillary for completely curing the ultraviolet-curable resin coating layer immediately before bonding are provided.

【０００７】 本発明の樹脂被覆ワイヤのボンディング
方法は、キャピラリィと、このキャピラリィのワイヤ導
入口側に設けられ紫外線硬化樹脂被覆層を形成する紫外
線硬化樹脂塗布機構と、ワイヤのボールを形成する可動
電極と、キャピラリィのワイヤ導出口側に設けられボン
ディング直前に紫外線硬化樹脂被覆層を硬化させる被覆
硬化手段を備える樹脂被覆ワイヤのボンディング装置を
用い、ボンディングの直前に被覆硬化手段により紫外線
硬化樹脂被覆層を完全硬化させることを特徴とする。A method for bonding a resin-coated wire according to the present invention includes a capillary, an ultraviolet-curing resin coating mechanism provided on the wire introduction port side of the capillary to form an ultraviolet-curing resin coating layer, and a movable electrode for forming a ball of wire. And a resin-coated wire bonding apparatus provided on the wire outlet side of the capillary and provided with a coating and curing means for curing the ultraviolet-curable resin coating layer immediately before bonding. It is characterized in that the cured resin coating layer is completely cured.

【０００８】本発明によれば、紫外線硬化樹脂が塗布さ
れたワイヤがキャピラリィを通して、ボンディング直前
で硬化させるので、紫外線硬化樹脂層がだれたりするこ
とは無く又、紫外線硬化樹脂被覆層は完全硬化させるこ
とで剥がれることは無い。According to the present invention, since the wire coated with the ultraviolet curable resin is cured immediately before bonding through the capillary, the ultraviolet curable resin layer does not drip and the ultraviolet curable resin coating layer is completely cured. It does not come off.

【０００９】[0009]

【発明の実施の形態】次に本発明の実施の形態について
図面を参照して説明する。Embodiments of the present invention will now be described with reference to the drawings.

【００１０】図１は本発明の一実施の形態の樹脂被覆ワ
イヤのボンディング装置の構成を示す断面図である。本
発明の一実施の形態の樹脂被覆ワイヤのボンディング装
置の構成は、図１に示すように、キャピラリィ２と、こ
のキャピラリィ２の導入口側に設けられ紫外線硬化樹脂
被覆層５を形成する紫外線硬化樹脂塗布機構３と、ワイ
ヤ１のボンディングボールを形成する可動電極６と、ワ
イヤ１がキャピラリィ２を通った後紫外線硬化樹脂被覆
層５を硬化させる被覆硬化手段とによって構成される。FIG. 1 is a sectional view showing the structure of a resin-coated wire bonding apparatus according to an embodiment of the present invention. As shown in FIG. 1, a resin-coated wire bonding apparatus according to an embodiment of the present invention has a capillary 2 and an ultraviolet-curing resin coating layer 5 provided on the inlet side of the capillary 2 to form an ultraviolet-curing resin coating layer 5. The resin coating mechanism 3 includes a movable electrode 6 that forms a bonding ball for the wire 1, and a coating and curing unit that cures the ultraviolet curable resin coating layer 5 after the wire 1 passes through the capillary 2.

【００１１】図２は本発明の一実施の形態のワイヤボン
ディング方法を説明するリード部の断面図である。本発
明の一実施の形態のワイヤボンディング方法は、まず、
図１に示すように、ワイヤ１が紫外線硬化樹脂塗布機構
３を通ることで紫外線硬化樹脂被覆層５が形成される。
次に、キャピラリィ２を通った後で被覆硬化手段４によ
り完全に硬化されボンディングされる。FIG. 2 is a sectional view of a lead portion for explaining a wire bonding method according to an embodiment of the present invention. First, a wire bonding method according to an embodiment of the present invention
As shown in FIG. 1, the ultraviolet curable resin coating layer 5 is formed by passing the wire 1 through the ultraviolet curable resin coating mechanism 3.
Next, after passing through the capillary 2, it is completely cured and bonded by the coating curing means 4.

【００１２】一方、リード側では、図２に示すように、
リード７に紫外線硬化樹脂被覆層５を塗布したワイヤ１
をボンディングする際には、紫外線硬化樹脂塗布機構３
にて紫外線硬化樹脂被覆層５の塗布量を調整し、被覆硬
化手段４で光源ランプのパワーを押さえ、かつワイヤ１
の長さを制御して紫外線硬化樹脂被覆層５のないワイヤ
１の部分のみでリード７へ接合する。On the other hand, on the lead side, as shown in FIG.
Wire 1 with UV curable resin coating layer 5 applied to lead 7
When bonding, the ultraviolet curing resin coating mechanism 3
The coating amount of the ultraviolet curable resin coating layer 5 is adjusted by the above, the power of the light source lamp is suppressed by the coating
And the length of the wire 1 is joined to the lead 7 only at the portion of the wire 1 without the ultraviolet curable resin coating layer 5.

【００１３】[0013]

【発明の効果】第１の効果は、ボンディング直前に紫外
線硬化樹脂を硬化したことである。これにより、樹脂だ
れ等が無くなる。その理由は、紫外線硬化樹脂被覆層を
完全に硬化することにより、固定するからである。The first effect is that the ultraviolet curable resin is cured immediately before bonding. This eliminates resin dripping and the like. The reason is that the ultraviolet curable resin coating layer is completely cured to be fixed.

【００１４】第２の効果は、ワイヤ間隔が狭い製品にワ
イヤショートが無く、使用できることである。その理由
は、紫外線硬化樹脂被覆層が完全に硬化しているので、
ワイヤどうし接触しても剥がれることが無いからであ
る。The second effect is that a product having a small wire interval can be used without a wire short. The reason is that the UV curable resin coating layer is completely cured,
This is because the wires do not come off even if they come into contact with each other.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施の形態の樹脂被覆ワイヤのボン
ディング装置の構成を示す断面図である。FIG. 1 is a cross-sectional view showing a configuration of a resin-coated wire bonding apparatus according to an embodiment of the present invention.

【図２】本発明の一実施の形態のワイヤボンディング方
法を説明するリード部の断面図である。FIG. 2 is a cross-sectional view of a lead portion for explaining a wire bonding method according to one embodiment of the present invention.

【図３】従来の樹脂被覆ワイヤのボンディング装置の一
例の断面図である。FIG. 3 is a cross-sectional view of an example of a conventional resin-coated wire bonding apparatus.

【符号の説明】[Explanation of symbols]

１ ワイヤ ２ キャピラリィ ３ 紫外線硬化樹脂塗布機構 ４ 被覆硬化手段 ５ 紫外線硬化樹脂被覆層 ６ 可動電極 ７ リード DESCRIPTION OF SYMBOLS 1 Wire 2 Capillary 3 UV curable resin coating mechanism 4 Coating and curing means 5 UV curable resin coating layer 6 Movable electrode 7 Lead

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 キャピラリィと、このキャピラリィのワ
イヤ導入口側に設けられ紫外線硬化樹脂被覆層を形成す
る紫外線硬化樹脂塗布機構と、前記ワイヤのボールを形
成する可動電極と、前記キャピラリィのワイヤ導出口側
に設けられボンディング直前に前記紫外線硬化樹脂被覆
層を完全硬化させる被覆硬化手段を備えたことを特徴と
する樹脂被覆ワイヤのボンディング装置。1. A capillary, an ultraviolet curable resin coating mechanism provided on a wire inlet side of the capillary to form an ultraviolet curable resin coating layer, a movable electrode for forming a ball of the wire, and a wire outlet of the capillary. A bonding apparatus for a resin-coated wire, comprising: a coating-curing means provided on the side and completely curing the ultraviolet-curing resin coating layer immediately before bonding. 【請求項２】 キャピラリィと、このキャピラリィのワ
イヤ導入口側に設けられ紫外線硬化樹脂被覆層を形成す
る紫外線硬化樹脂塗布機構と、前記ワイヤのボールを形
成する可動電極と、前記キャピラリィのワイヤ導出口側
に設けられボンディング直前に前記紫外線硬化樹脂被覆
層を硬化させる被覆硬化手段を備える樹脂被覆ワイヤの
ボンディング装置を用い、該ボンディングの直前に前記
被覆硬化手段により前記紫外線硬化樹脂被覆層を完全硬
化させることを特徴とする樹脂被覆ワイヤのボンディン
グ方法。2. A capillary, an ultraviolet curing resin coating mechanism provided on the wire introduction port side of the capillary to form an ultraviolet curing resin coating layer, a movable electrode forming a ball of the wire, and a wire outlet of the capillary. ~ side
Using a resin-coated wire bonding apparatus provided with a coating and curing means for curing the ultraviolet-curable resin coating layer immediately before bonding, and completely curing the ultraviolet-curable resin coating layer by the coating and curing means immediately before the bonding. A method for bonding a resin-coated wire, comprising:
JP04403997A 1997-02-27 1997-02-27 Bonding apparatus for resin-coated wire and bonding method using the same Expired - Fee Related JP3150077B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04403997A JP3150077B2 (en) 1997-02-27 1997-02-27 Bonding apparatus for resin-coated wire and bonding method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04403997A JP3150077B2 (en) 1997-02-27 1997-02-27 Bonding apparatus for resin-coated wire and bonding method using the same

Publications (2)

Publication Number Publication Date
JPH10242197A JPH10242197A (en) 1998-09-11
JP3150077B2 true JP3150077B2 (en) 2001-03-26

Family

ID=12680489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04403997A Expired - Fee Related JP3150077B2 (en) 1997-02-27 1997-02-27 Bonding apparatus for resin-coated wire and bonding method using the same

Country Status (1)

Country Link
JP (1) JP3150077B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9500192B2 (en) 2013-02-06 2016-11-22 Mitsubishi Heavy Industries, Ltd. Compressed air supply apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9500192B2 (en) 2013-02-06 2016-11-22 Mitsubishi Heavy Industries, Ltd. Compressed air supply apparatus

Also Published As

Publication number Publication date
JPH10242197A (en) 1998-09-11

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