JP3473205B2 - Method for forming edge electrode of square chip component - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming an end face electrode of a rectangular chip component used for various electronic circuits. 2. Description of the Related Art In recent years, with downsizing of electronic devices, there has been an increasing demand for downsizing of electronic components to be mounted in order to increase the mounting density on circuit boards.
Along with the miniaturization of square chip resistors, product development is being promoted to meet various requirements. Conventional methods for forming an end face electrode of a rectangular chip component include a method of applying a conductive paste to an end face portion by a roller transfer method and baking or curing, a method of vacuum deposition, and the like.
A method of forming an end face electrode with a metal thin film by a thin film technique such as sputtering has been used. Hereinafter, a conventional method for forming an end face electrode of a rectangular chip component will be described with reference to the drawings. FIG. 4A is a perspective view of a strip-shaped rectangular chip resistor, and FIG. 4B is a sectional view taken along the line AA. FIG. 4 (a)
In (b), 1 is a substrate made of alumina or the like.
Reference numerals 2 and 3 denote an upper surface electrode and a rear surface electrode provided on the upper surface and the rear surface side of the substrate 1, respectively. Reference numeral 4 denotes a resistor provided so as to be electrically connected to the upper electrode 2 provided on each side of the upper surface of the substrate 1. 5 is a protective film provided so as to cover at least the resistor 4. A method of forming an end face electrode of the rectangular chip resistor configured as described above will be described below with reference to the drawings. FIG. 5 is a process chart for explaining the formation of the end face electrodes of the conventional rectangular chip resistor. Conventionally, as shown in FIG. 5, a plurality of strip-shaped rectangular chip resistors 12 are arranged so that the end faces thereof are parallel to a target surface 11 made of a metal thin film material, and a parallel plate magnetron sputtering method is used. An end surface electrode (not shown) was formed on each side of the rectangular chip resistor 12. However, in the above-described conventional method for forming an end face electrode of a rectangular chip resistor, the end electrodes are formed on the strip-shaped square chip resistor 12 one by one. In this case, there is a problem that the time required for evacuation is longer than the time for actually forming the metal thin film, the time required for forming the end face electrodes on both sides is extremely long, and the man-hour is deteriorated. Was. Further, since the surface on which the end surface electrode is formed is arranged parallel to the target surface, even if a plurality of strip-shaped alumina substrates are collectively processed as shown in FIG. Since there is a gap therebetween, the metal thin film material invades, and the end face electrode 32 of the metal thin film is formed up to the upper surface of the protective film 31 as shown in FIG. There is a method in which a resist is previously formed on an unnecessary portion so that a metal thin film is not formed on a surface other than the surface, and lift-off is performed after formation of the end face electrode. However, there has been a problem that the process is complicated and the cost is increased. SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems and provides a method for forming an end face electrode of a square chip component, which can form an end face electrode having a uniform film thickness and can be obtained at low cost when forming an end face electrode. The purpose is to do so. In order to achieve the above object, a method for forming an end face electrode of a rectangular chip component according to the present invention comprises stacking two or more rectangular rectangular chip components in which the rectangular chip components are connected. pairs were prepared plural sets, in parallel spaced apart from each other the plurality of sets of strip-like rectangular chip components, and that the surface and the target surface to be formed to the end surface electrode disposed so as to be perpendicular, a plurality of sets of strip At the same time forms the end face electrode of a metal thin film by a thin film technique to an end face of the Jo chip parts
When the height of the stacked rectangular chip components is parallel
Spacing between a plurality of arranged rectangular rectangular chip components
Angle of incidence (from the target surface
Is larger than 45 degrees . [0012] According to the present invention, rectangular chip component prepared plural sets a strip Chip two or more stacked pairs of parts comprising continuous, together the plurality of sets of strip-like rectangular chip components
A plurality of sets of short-circuit electrodes are arranged in parallel at intervals and arranged so that the surface on which the end face electrode is to be formed is perpendicular to the target surface.
Metallic thin film by thin film technology on the end face of book-shaped square chip component
When simultaneously forming the end face electrodes, stacked strips
Multiple sets of strips in which the height of square chip parts are arranged in parallel
So that they are larger than the distance between the square chip components
The incident angle (angle from the target surface) is 45 degrees
Since a large jig is used, it is possible to limit the thin-film metal material that enters from the target surface to the surface on which the end face electrode is to be formed, thereby forming an end face electrode having a uniform thickness and a resistor. To the protective film located on the top side of the
Unnecessary wraparound of thin film metal material can be prevented, and
A rectangular rectangular chip component consisting of a series of rectangular chip components
Prepare multiple sets of two or more stacked sets,
Place rectangular chip components parallel to each other at intervals
The surface on which the end electrode is to be formed is perpendicular to the target surface
With this arrangement, the end electrodes can be formed on both end surfaces of a plurality of sets of rectangular chip components at the same time, so that the number of steps can be reduced and the steps can be simplified and the cost can be reduced. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for forming an end face electrode of a rectangular chip component according to an embodiment of the present invention will be described below with reference to the drawings, taking a rectangular chip resistor as an example. FIG. 1 is a process chart of a method of forming an end face electrode of a rectangular chip resistor according to an embodiment of the present invention. In FIG. 1, reference numeral 40 denotes a strip-shaped rectangular chip resistor. As in the conventional case, an upper electrode 42 and a lower electrode (not shown) provided on the upper and lower sides of a substrate 41, respectively, and the upper electrode 42 And a protective film 43 provided so as to cover at least the resistor (not shown). Reference numeral 45 denotes a target surface of a metal thin film material, which has a Ni: Cr alloy in which Ni: Cr for forming an end face electrode described later is 50:50 wt%. When forming the end face electrodes on the above-described rectangular chip resistor 40, the surface of the target surface 45 and the surface on which the end electrodes of the rectangular chip resistor 40 are to be formed are arranged to be perpendicular to each other, The end face electrode is formed by a flat plate magnetron sputtering method. FIG. 2 is a perspective view showing a state in which a plurality of strip-shaped rectangular chip resistors are filled in a jig used for forming an end face electrode in one embodiment of the present invention. The jig 51 holds a plurality of strip-shaped square chip resistors 52 in a stacked state.
2 are provided so that the end face portions on both sides are exposed.
The strip-shaped rectangular chip resistors 52 stacked in the jig 51 are tightly overlapped and fixed so as not to shift. With the jig 51 filled in this way,
As shown in FIG. 1, an end face electrode made of a metal thin film is formed on the lower surface (bottom surface) of the jig 51 by sputtering from a vertical direction. In this state, the metal sheet material protrudes from the target surface in all directions upward, but the gap between the rectangular rectangular chip resistors 52 is increased by the weight of the rectangular rectangular chip resistors 52 stacked. Therefore, only the thickness of the protective film is generated, so that it is possible to prevent the thin film metal material from flowing to the upper surface (protective film) of the rectangular chip resistor. In addition, although the sputtering is also performed on the bottom surface of the jig 51, the other thin metal film is formed as the end face electrode, so that it is not formed excessively concentrated on the end face electrode as in the related art, and is stable and uniform. A simple end face electrode can be formed. Further, by mounting a dummy of the same size on the strip-shaped rectangular chip resistor 52 at the uppermost stage, it is possible to prevent the metal thin film material from being formed on the upper surface (protective film) (not shown). . FIG. 3A is a perspective view of a jig for holding a plurality of square chip resistors according to an embodiment of the present invention.
(B) is the same sectional view. In the case where the end face electrode is formed only by one jig 51 for forming the end face electrode shown in FIG. 2, when the size of the target face 45 is large to some extent, the target face 45
In some cases, the incident angle of the metal thin film material from the surface becomes nearly parallel. Therefore, it is necessary to forcibly regulate the incident angle. For this purpose, an end face electrode is formed using a jig 61 shown in FIG. As shown in the sectional view of FIG.
Height A in which a plurality of strip-shaped square chip resistors 62 are stacked
Sets of strip-shaped rectangular chip resistors 6 arranged in parallel
2 are greater than each other's spacing B, ie,
Incident angle (angle from target surface 45) is greater than 45 degrees
A large jig 61 was designed. Thereby, the film thickness of the end face electrode formed on the end face of the strip-shaped rectangular chip resistor 62 filled in the jig 61 can be made uniform, and the amount of wrap around to the upper surface portion can be limited. Was. In this case, as in FIG. 2, the rectangular chip resistor 6 at the uppermost stage is also used.
A dummy of the same size was placed on 2 so that the metal thin film material was not formed on the upper surface (protective film) (not shown). In this embodiment, the embodiment using the parallel plate magnetron sputtering method has been described. However, the sputtering method is not limited, and a carousel method may be used. Other thin film technologies (vacuum deposition, ion plating, thermal spraying, etc.) , Etc.), it goes without saying that the same effect can be obtained by arranging the target surface and the end face electrode formation surface vertically as in the present embodiment. The sputtering direction is not limited to the direction from the lower surface, and the same effect can be obtained if the sputtering direction is from a direction parallel to the surface on which the end face electrodes are formed. Further, a plurality of jigs 51 shown in FIG. 2 are used and arranged in parallel.
The same effect can be obtained even if the setting is made in the same manner. In this embodiment, the method for forming the end face electrodes of the square chip resistor has been described. However, the present invention is not limited to this, and the same effect can be obtained by applying the present invention to the method for forming the end face electrodes of other square chip components. According to the present invention as described above, according to the present invention, rectangular chip component prepared plural sets a strip Chip two or more stacked pairs of parts comprising continuous, the plurality of sets of strip-shaped rectangular distribution chip parts in parallel at a distance from one another, and as the surface and the target surface to be formed the edge electrode is perpendicular
And place thin film technology on the end faces of multiple sets of rectangular
When simultaneously forming the end face electrodes by metal thin film
The height of the stacked rectangular chip components is parallel.
The distance between the plural sets of rectangular rectangular chip parts
Angle (incident from the target surface)
(Angle) is larger than 45 degrees, so that the thin-film metal material entering from the target surface to the surface on which the end face electrode is formed can be limited, thereby forming the end face electrode having a uniform film thickness. Along with the top of the resistor
Unnecessary sneaking of the thin film metal material into the protective film is also prevented. <br/> Also , a rectangular shape with a series of square chip components
Prepare multiple sets of stacked two or more square chip parts
Then, the plural sets of strip-shaped rectangular chip parts are spaced from each other.
Parallel to the surface where the end face electrode is to be formed
Since the electrodes are arranged perpendicular to the contact surface, it is possible to simultaneously form end electrodes on both end surfaces of a plurality of sets of rectangular chip components, thereby reducing man-hours and simplifying the process and reducing costs. It has an excellent effect that it can be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a process diagram of a method of forming an end face electrode of a square chip resistor according to one embodiment of the present invention. FIG. FIG. 3 (a) is a perspective view showing a state in which a strip-shaped rectangular chip resistor is filled in a connected end face electrode forming jig which is a main part of the same; FIG. FIG. 4 (a) is a perspective view of a strip-shaped rectangular chip resistor in which rectangular chip resistors are connected, and FIG. 4 (b) is a cross-sectional view taken along the line AA. FIG. 5 shows a conventional method for forming an end face electrode of a rectangular chip resistor. Process drawing [FIG. 6] A perspective view for explaining a problem of a method of forming an end face electrode of a square chip resistor [Description of symbols] 40 Strip-shaped square chip resistor 45 Target surface

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-7-86012 (JP, A) JP-A-6-204100 (JP, A) JP-A-3-180016 (JP, A) 171303 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01C ^7/ 00-17/30

Claims (1)

(57) [Claims 1] A plurality of sets in which two or more strip-shaped rectangular chip parts in which rectangular chip parts are connected are prepared.
The plurality of sets of rectangular chip parts are spaced from each other.
In parallel, and arranged so that the surface on which the end surface electrode is to be formed and the target surface are perpendicular to each other, when simultaneously forming the end surface electrodes of a metal thin film by the thin film technology on the end surfaces of a plurality of sets of rectangular chip components , Stacked rectangular square chips
Multiple sets of rectangular rectangular chips with component heights arranged in parallel
Angle of incidence so that the distance between
A jig whose (angle from the target surface) is larger than 45 degrees
A method for forming an end face electrode of a square chip component used .