JP3564112B2 - How to collect spacers - Google Patents

Description

【０３７６】
［実施例７−１］
図３３（ａ）は本発明のフラットディスプレイの一態様を模式的に示した断面図、図３３（ｂ）は図３３（ａ）に示したフラットディスプレイの一部を切り欠いて見た平面図である。本発明のフラットディスプレイは、ガラス基体上に多数の電子放出素子２２１が配置されたリアプレート２２２と、該リアプレート２２２に対向して配置され画像表示部２２３が設けられたフェースプレート２２４と、支持枠２２５と、該リアプレート２２２と該フェースプレート２２４との間隔を大気圧に対して保持するためのスペーサ２２６とを少なくとも有し、かつこれらをフリットガラスを用いて気密接合することにより構成されている。
【０３７７】
本実施例においては、３００ｍｍ×２５０ｍｍ×２．８ｍｍのソーダライムガラスからなるリアプレート２２２に、２５枚のスペーサ２２６が溶着されたディスプレイを作製した。またスペーサは、高さ２．８ｍｍ、板厚２００μｍ、長さ４０ｍｍのソーダライムガラス基材上に導電膜として窒化アルミニウムが約１００ｎｍ成膜されているものを用いた。
【０３７８】
スペーサ２２６とリアプレート２２２間のフリットガラス２２７としては表１−ＩＩＩ （軟化温度４１０℃）を用いた。またリアプレート２２２と支持枠２２５間のフリットガラス２２８には表１−ＩＩ（軟化温度３９０℃）、フェースプレート２２４と支持枠２２５間のフリットガラス２２９には表１−Ｉ（軟化温度３６５℃）のフリットガラス２２９を用いた。
【０３７９】
また電子放出素子２２１として、図３７に示したタイプの表面伝導型電子放出素子を作製した。
【０３８０】
次に本実施例におけるフラットディスプレイの製造方法を図３３、図３７、図３８を用いて説明する。
▲１▼まずリアプレートとしてソーダライムガラスを用い、該基板上にＰｔを用いて素子電極２３５，２３６を作製した。この時、素子電極間隔Ｌ１を１０μｍ、素子電極幅Ｗ１を５００μｍ、素子電極の厚さｄを１００ｎｍとした。次に素子電極上を含む所望の位置に有機パラジウム含有溶液を塗布した後、３００℃で１０分間の加熱処理を行い、酸化パラジウム（ＰｄＯ）微粒子（平均粒径７ｎｍ）からなる微粒子膜２３４を形成した。
【０３８１】
以上のようにして基板上に複数の電子放出素子２２１を作製してリアプレート２２２を得た。またフェースプレートはガラス基板に画像形成部材２２３として蛍光体を塗布したものを用いた。
▲２▼次に本実施例における封着方法を説明する。まず、スペーサ２２６をフリットガラスＩＩＩ （軟化温度４１０℃）でリアプレート２２２に溶着した（図３８（ａ））。
▲３▼次にフリットガラスＩＩ（軟化温度３９０℃）をリアプレート２２２上の外周部分（図３３（ｂ）のフリット塗布箇所２４０の部分）に塗布し、またフェースプレート２２４上の同部分にフリットガラスＩ（軟化温度３６５℃）を塗布した後、フェースプレート２２４、支持枠２２５、リアプレート２２２を精密な位置合わせを行いながら重ね合わせた（図３８（ｂ））。フェースプレート２２４とリアプレート２２２が動かないように治具を用いて固定し、炉の中で４００℃で１０分以上焼成した。
【０３８２】
このようにして、フェースプレート、リアプレート、支持枠を接合した（図３８（ｃ））。
▲４▼次に、上記工程で作製された容器内を真空状態にするために、封着処理後支持枠２２５等に設けられた排気管（不図示）により真空に引き、その後排気管を封止した。
【０３８３】
［実施例７−２］
本実施例では実施例７−１と同じ構成のディスプレイを作製した。本実施例においてはスペーサはリアプレートに接合されており、その接合にはフリットガラスＩＩＩ（軟化温度４１０℃）を用いた。またリアプレート２２２と支持枠２２５の接合にはフリットガラスＩ（軟化温度３６５℃）、フェースプレート２２４と支持枠２２５の接合にはフリットガラスＩＩ（軟化温度３９０℃）を用いた。
【０３８４】
本実施例におけるフラットディスプレイの製造は実施例７−１と同様の方法を用いた。
【０３８５】
［実施例７−３］
本実施例では実施例７−１と同じ構成のディスプレイを作製した。本実施例においてはスペーサ２２６はリアプレート２２２に接合されており、その接合にはフリットガラスＩＶ（軟化温度４５０℃）を用いた。またリアプレート２２２と支持枠２２５の接合にはフリットガラスＩＩＩ （軟化温度４１０℃）、フェースプレート２２４と支持枠２２５の接合にはフリットガラスＩＩ（軟化温度３９０℃）を用いた。
【０３８６】
本実施例のフラットディスプレイにおけるリアプレート２２２及びフェースプレート２２４の製造は実施例７−１の▲１▼と同様の方法を用いた。
▲２▼次に本実施例における封着方法を説明する。まず、スペーサ２２６をフリットガラスＩＶ（軟化温度４５０℃）でリアプレート２２２に溶着した（図３８（ａ））。
▲３▼次にフリットガラスＩＩＩ（軟化温度４１０℃）をリアプレート２２２上の外周部分（図３３（ｂ）２４０の部分）に塗布し、またフェースプレート２２４上の同部分にフリットガラスＩＩ（軟化温度３９０℃）を塗布した後、フェースプレート２２４、支持リアプレート２２２を精密な位置合わせを行いながら重ね合わせた（図３８（ｂ））。フェースプレート２２４とリアプレート２２２が動かないように治具を用いて固定し、炉の中で４２０℃で１０分以上焼成した。
【０３８７】
このようにして、フェースプレート２２４、リアプレート２２２、支持枠２２５を接合した（図３８（ｃ））。
▲４▼次に、上記工程で作製された容器内を真空状態にするために、封着処理後支持枠２２５等に設けられた排気管（不図示）により真空に引き、その後排気管を封止した。
【０３８８】
［実施例７−４］
本実施例では実施例７−１と同じ構成のディスプレイを作製した。本実施例においては、スペーサ２２６はフェースプレート２２４に接合されており、その接合にはフリットガラスＩＩＩ （軟化温度４１０℃）を用いた。またリアプレート２２２と支持枠２２５の接合にはフリットガラスＩＩ（軟化温度３９０℃）、フェースプレート２２４と支持枠２２５の接合にはフリットガラスＩ（軟化温度３６５℃）を用いた。
【０３８９】
本実施例のフラットディスプレイにおけるリアプレート２２２及びフェースプレート２２４の製造は実施例７−１の▲１▼と同様の方法を用いた。
▲２▼次に本実施例における封着方法を、図３９を用いて説明する。まず、スペーサ２２６をフリットガラスＩＩＩ （軟化温度４１０℃）でフェースプレート２２４に溶着した（図３９（ａ））。
▲３▼次にフリットガラスＩＩ（軟化温度３９０℃）をリアプレート２２２上の外周部分に塗布し、またフェースプレート上の同部分にフリットガラスＩ（軟化温度３６５℃）を塗布した後、フェースプレート２２４、支持枠２２５、リアプレート２２２を精密な位置合わせを行いながら重ね合わせた（図３９（ｂ））。フェースプレート２２４とリアプレート２２２が動かないように治具を用いて固定し、炉の中で４２０℃で１０分以上焼成した。
【０３９０】
このようにしてフェースプレート２２４、リアプレート２２２、支持枠２２５を接合した（図３９（ｃ））。
▲４▼次に、上記工程で作製された容器内を真空状態にするために、封着処理後支持枠２２５等に設けられた排気管（不図示）により真空に引き、その後排気管を封止した。
【０３９１】
［実施例７−５］
本実施例では実施例７−１と同じ構成のディスプレイを作製した。本実施例においては、スペーサ２２６はリアプレート２２２に接合されており、その接合にはフリットガラスＩＩ（軟化温度３９０℃）を用いた。またリアプレート２２２と支持枠２２５の接合にもフリットガラスＩＩ（軟化温度３９０℃）、フェースプレート２２４と支持枠２２５の接合にはフリットガラスＩ（軟化温度３６５℃）を用いた。
【０３９２】
本実施例のフラットディスプレイにおけるリアプレート２２２及びフェースプレート２２４の製造は実施例７−１の▲１▼と同様の方法を用いた。
▲２▼次に本実施例における封着方法を、図４０を用いて説明する。まず、スペーサ２２６と支持枠２２５をフリットガラスＩＩ（軟化温度３９０℃）でリアプレート２２２に溶着した（図４０（ａ））。
▲３▼次にフリットガラスＩ（軟化温度３６５℃）をフェースプレート２２４上の外周部分に塗布した後、フェースプレート２２４と支持枠２２５を精密な位置合わせを行いながら重ね合わせた（図４０（ｂ））。フェースプレート２２４と支持枠が動かないように治具を用いて固定し、炉の中で４２０℃で１０分以上焼成した。
【０３９３】
このようにしてフェースプレート２２４と支持枠２２５を接合した（図４０（ｃ））。
▲４▼次に、上記工程で作製された容器内を真空状態にするために、封着処理後支持枠２２５等に設けられた排気管（不図示）により真空に引き、その後排気管を封止した。
【０３９４】
［実施例７−６］
本実施例では、実施例７−１に示したフラットディスプレイの解体方法について述べる。図３４を用いて解体方法を説明する。
▲１▼まず排気管の封止箇所を破って空気を導入し、容器内の真空を解除した（不図示）。
▲２▼次にディスプレイを加熱炉の中に入れ、リアプレート２２２及びフェースプレート２２４を適当な治具で保持した後、３８０℃に加熱した。３６５℃を越えたところでフェースプレート２２４と支持枠２２５を接合していたフリットガラスＩが徐々に溶融し、フェースプレート２２４を保持している治具を上部に引き上げることで両者を分離した（図３４（ａ），（ｂ））。
▲３▼次に、支持枠２２５を適当な治具で保持した後、加熱温度を４００℃に上昇させた。３９０℃を越えたところでリアプレート２２２と支持枠２２５を接合していたフリットガラスＩＩが徐々に溶融し、支持枠２２５を保持している治具を上部に引き上げることで両者を分離した（図３４（ｃ））。
▲４▼引き続き各スペーサ２２６を適当な治具で保持した後、加熱温度を４５０℃に上昇させた。４１０℃を越えたところでリアプレート２２２とスペーサ２２６を接合していたフリットガラスＩＩＩが徐々に溶融し、スペーサ２２６を保持している治具を上部に引き上げることで両者を分離した（図３４（ｄ））。
【０３９５】
回収後の各部材は０．２規定硝酸液で洗浄し残留フリットガラスを除去した後、洗浄、乾燥を行った。その後、スペーサ及び支持枠は検査工程を経て選別され、損傷のなかったものはそのまま再利用工程へと進んだ。またリアプレート及びフェースプレートは、該基板上に形成された各資源の回収工程、さらに基板自体の再利用工程等へと進んだ。本実施例に従って解体を行ったフラットディスプレイにおいては、工程中でのフェースプレート２２２、リアプレート２２４、支持枠及びスペーサ２２６の破損はほとんどなかった。
【０３９６】
［実施例７−７］
本実施例では、実施例７−２に示したフラットディスプレイの解体方法について述べる。図３６を用いて解体方法を説明する。
▲１▼まず排気管の封止箇所を破って空気を導入し、容器内の真空を解除した（不図示）。
▲２▼次にディスプレイを加熱炉の中に入れ、リアプレート２２２及びフェースプレート２２４を適当な治具で保持した後、３８０℃に加熱した。３６５℃を越えたところでリアプレート２２２と支持枠２２５を接合していたフリットガラスＩが徐々に溶融し、フェースプレート２２４を保持している治具を上部に引き上げることでフェースプレート２２４と支持枠２２５及びリアプレート２２２とスペーサ２２６の２つの部分に分離した（図３６（ａ），（ｂ），（ｃ））。
▲３▼分離した２つの部分のうち、フェースプレート２２４と支持枠２２５については実施例７−５の方法と同様に炉を４１０℃まで加熱させてフリットガラスＩＩを徐々に溶融し、支持枠２２５を保持している治具を上部に引き上げることで両者を分離した（図３６（ｅ））。
▲４▼一方、リアプレート２２２とスペーサ２２６の分離は実施例７−５の▲４▼と同様の方法で行った（図３６（ｄ））。回収後の各部材は０．２規定硝酸液で洗浄し残留フリットガラスを除去し、洗浄、乾燥を行った。その後、スペーサ２２６及び支持枠は検査工程を経て選別され、損傷のなかったものはそのまま再利用工程へと進んだ。またリアプレート２２２及びフェースプレート２２４は、該基板上に形成された各資源の回収工程、さらに基板自体の再利用工程等へと進んだ。本実施例に従って解体を行ったフラットディスプレイにおいては、工程中でのフェースプレート、リアプレート、支持枠及びスペーサの破損はほとんどなかった。
【０３９７】
［実施例７−８］
本実施例では、実施例７−３に示したフラットディスプレイの解体方法について述べる。図３４，図３５を用いて解体方法を説明する。
【０３９８】
まず実施例７−６の▲１▼〜▲３▼の方法で、ディスプレイからフェースプレート２２４および支持枠２２５を図３４（ｃ）の状態まで分離した。
▲４▼次にリアプレートを適当な治具で保持し、リアプレート２２２とスペーサ２２６の接合部を０．２規定の硝酸液２３９が入った液槽２３７に浸漬した（図３５（ａ））。硝酸液槽２３７はその内部に網目状のテフロン（登録商標）製の容器２３８を有している。接合部を硝酸液２３９に浸漬するとフリットガラスＩＶが溶解しスペーサ２２６は容器２３８中に回収された。全てのスペーサ２２６が分離したのを確認した後、リアプレート２２２を引き上げた（図３５（ｂ））。またスペーサ２２６も容器２３８ごと硝酸液２３９から引き上げた。
【０３９９】
回収後の各部材は残留フリットガラスを除去し、洗浄、乾燥を行った。その後、部材毎に検査工程を経て選別され、再利用工程あるいはより細かな回収工程へと進んだ。本実施例に従って解体を行ったフラットディスプレイにおいては、工程中でのフェースプレート、リアプレート、支持枠及びスペーサの破損はほとんどなかった。
【０４００】
［実施例７−９］
本実施例では、実施例７−４に示したフラットディスプレイの解体方法について述べる。まず実施例７−７の▲１▼〜▲２▼と同様の方法でディスプレイを３６０℃に加熱し、リアプレート２２２と支持枠２２５及びフェースプレート２２４とスペーサ２２６の２つの部分に分離した。
【０４０１】
次に分離した２つの部分のうち、リアプレート２２２と支持枠２２５は実施例７−７の▲３▼と同様の方法で分離した。
【０４０２】
一方、フェースプレート２２４とスペーサ２２６の分離は実施例７−６の▲４▼と同様の方法で行った。
【０４０３】
本実施例に従って解体を行ったフラットディスプレイにおいては、工程中でのフェースプレート２２４、リアプレート２２２、支持枠２２５及びスペーサ２２６の破損はほとんどなかった。
【０４０４】
［実施例７−１０］
本実施例では、実施例７−５に示したフラットディスプレイの解体方法について述べる。まず実施例７−６の▲１▼〜▲２▼と同様の方法で、ディスプレイからフェースプレート２２４を図３４（ｂ）の状態まで分離した。
▲３▼次に支持枠２２５及びスペーサ２２６を同時に適当な治具で保持した後、加熱温度を４１０℃に上昇させた。３９０℃を越えたところでリアプレート２２２と支持枠２２５及びリアプレート２２２とスペーサ２２６を接合していたフリットガラスＩＩが徐々に溶融し、支持枠２２５及びスペーサ２２６を保持している治具を上部に引き上げることで各部材を分離した。
【０４０５】
本実施例に従って解体を行ったフラットディスプレイにおいては、工程中でのフェースプレート２２４、リアプレート２２２、支持枠２２５及びスペーサ２２６の破損はほとんどなかった。
【０４０６】
［比較例７−１］
本比較例において解体されるフラットディスプレイは、スペーサ２２６とリアプレート２２２、リアプレート２２２と支持枠２２５及びフェースプレート２２４と支持枠２２５の接合にいずれもフリットガラスＩＩ（軟化温度３９０℃）が用いられていること以外は実施例７−１と同様の方法を用いて作製されたディスプレイである。
【０４０７】
該フラットディスプレイの解体は以下のように行った。まず容器内の真空を解除した後、加熱炉中に入れ、リアプレート２２２及びフェースプレート２２４、支持枠２２５を適当な治具で保持した後、４１０℃に加熱した。３９０℃を越えたところでフリットガラスＩＩが溶融し始めた。リアプレート、枠、フェースプレートの接合部が同時に溶融し分離することから治具で保持はしているものの安定性に欠け、時には部材同士や治具と部材との接触により部材が破損してしまうことがあった。特に薄い板状に形成されているスペーサには破損が多く見られた。
【０４０８】
［実施形態８］
以下、本発明にかかる残留有害金属量の検査装置の実施形態を添付図面に基づいて説明する。
【０４０９】
図４１は、本発明の一実施形態を示し、残留有害金属量の検査装置の構成図である。
【０４１０】
この検査装置は、図４１に示すように、リサイクルするため解体して分別した部材及び廃棄物などの検査対象Ｘに含まれる鉛等の有害金属量を検査するものであり、主に鉛の溶出及び回収を行う鉛溶出回収部１３０と、洗浄部１３１と、残留鉛溶出部１３２と、残留鉛定量部１３３とを備えて構成されている。
【０４１１】
検査対象Ｘとしては、図４３に示すリアプレート１と、フェースプレート２と、枠３と、スペーサ４とから構成されるフラットパネルディスプレイや、ブラウン管など、ガラス部材を主要な構成材料とするものを解体して分別した部材及びその廃棄物が挙げられる。しかし、後述するように、この検査装置は硝酸液に鉛を溶出させる構成であり、従って、硝酸液に不溶解なものであれば検査を行うことができ、検査対象Ｘはガラス部材には限らない。
【０４１２】
図４１において、鉛溶出回収部１３０は、検査対象Ｘを浸す浸漬浴槽１００に、酸性液Ａを満たしていて、当該検査対象Ｘに含まれる有害金属（鉛）を溶出させるようになっている。つまり、浸漬浴槽１００には、配管１０１を介して回収浴槽１０２が連結されており、その配管１０１の途中に設けた開閉バルブ１０３，液送ポンプ１０４を中継して鉛の溶出液が回収浴槽１０２に送られる構成とされている。
【０４１３】
そして、浸漬浴槽１００の上縁部には、搬送コンベア１０５の搬送出口部が配置され、図示しない解体処理部から分別部材等の検査対象Ｘが送り込まれる。浸漬浴槽１００の内部には、網かご１０６がセットされていて、検査対象Ｘは搬送コンベア１０５から網かご１０６内に落下し、所定の溶出時間が経過した後に網かご１０６の取っ手を持って引き上げて取り出す。
【０４１４】
洗浄部１３１は、検査対象Ｘを浸す洗浄浴槽１１０に、純水Ｂを満たしていて、鉛溶出回収部１３０により溶出させた後の検査対象Ｘを洗浄するようになっている。つまり、浸漬浴槽１００から引き上げた網かご１０６を、今度は洗浄浴槽１１０にセットする。
【０４１５】
残留鉛溶出部１３２は、検査対象Ｘを浸す浸漬浴槽１２０に、酸性液Ｃを満たしていて、洗浄部１３１により洗浄した後の検査対象Ｘに残留している鉛を溶出させるようになっている。つまり、浸漬浴槽１２０には、適宜な配管１２１により開閉バルブ１２２，液送ポンプ１２３，切替えバルブ１２４が接続されていて、残留鉛の溶出液が残留鉛定量部１３３に送られる構成とされている。浸漬浴槽１２０の下部には、超音波振動子１２５が設けられており、浸漬浴槽１２０内の酸性液Ｃへ超音波振動を与えて溶出を促進するようになっている。
【０４１６】
また、切替えバルブ１２４の他方には、浸漬浴槽１００に延びる配管１２６が接続され、浸漬浴槽１２０に満たした酸性液Ｃの残り分を浸漬浴槽１００に送って再利用する構成とされている。酸性液Ｃそしてこれを再利用する酸性液Ａとしては、例えば硝酸液が挙げられ、硝酸液の濃度は０．１Ｎ（規定）から１Ｎの範囲が好ましい。
【０４１７】
残留鉛定量部１３３は、後述する定量検出のための適切な構成を採り、送り込まれた溶出液から鉛を定量的に検出するようになっている。
【０４１８】
各浴槽１００，１０２，１１０，１２０の材質は、テフロン（登録商標）等の樹脂、あるいは鉛を含まないガラスなどが好ましく、収容して満たす酸性液Ａ，Ｃに侵されない材質とすることは言うまでもない。そして、網かご１０６の材質も同様であり、これが漬かる酸性液Ａ，Ｃに侵されない材質とされ、例えばテフロン（登録商標）等の樹脂が好ましい。
【０４１９】
即ち、この検査装置では、まず検査対象Ｘを浸漬浴槽１００の酸性液Ａ（硝酸液）に浸漬して、それが含有する鉛成分を溶解させた後に、洗浄浴槽１１０の純水Ｂにより洗浄し、この後に浸漬浴槽１２０の酸性液Ｃ（新硝酸液）に浸漬して残留鉛を溶解させ、残留鉛定量部１３３で定量することにより、残留鉛量を検査する。
【０４２０】
図４２は、図４１に示す残留有害金属量の検査装置による検査処理を順に説明するフローチャートであり、ここでは、前述した図４３に示すフラットパネルディスプレイを解体する場合を例にして説明する。
【０４２１】
まず解体の前処理工程（１）〜（３）を行う。つまり、フラットパネルディスプレイ機器の筐体から端子等の接続を外して［工程（１）］、ディスプレイ本体のみを取り出す［工程（２）］。そして、そのディスプレイ本体をなす真空容器内の真空を解除して大気圧に戻す［工程（３）］。
【０４２２】
この後、ディスプレイ本体を、適切な手段により解体して分別するものであり、分別した部材及びその残りの廃棄物などが、検査対象Ｘとなる。
【０４２３】
そうした検査対象Ｘを、搬送コンベア１０５により鉛溶出回収部１３０に搬送し、浸漬浴槽１００の酸性液Ａ（硝酸液）に浸漬させる［工程（４）］。
【０４２４】
所定の時間が経過した後、網かご１０６を引き上げ、フリットガラスによる固着が剥離した部材を取り出す［工程（５）］。
【０４２５】
次に、引き上げた網かご１０６を、洗浄部１３１へ運んで洗浄浴槽１１０に入れ、検査対象Ｘに付着している硝酸液を純水により洗浄する［工程（６）］。
【０４２６】
洗浄した後に、網かご１０６を、残留鉛溶出部１３２へ運んで浸漬浴槽１２０に入れ、硝酸液Ｃに浸し漬ける［工程（７）］。このとき、超音波振動子１２５を起動させて浸漬浴槽１２０に振動を与え、溶出効率を上げる。
【０４２７】
この後、開閉バルブ１２２を操作し、浸漬浴槽１２０内の溶出液を残留鉛定量部１３３に送って取り出す［工程（８）］。この取り出し量は、数十ｃｃで十分である。
【０４２８】
残留鉛定量部１３３では、送られた溶出液にヨウ化物を添加して発色させ、吸光度を測定する［工程（９）］。測定波長は分析精度を高く得るため３４０ｎｍ付近で行なうことが好ましい。そして、測定した吸光度から鉛イオン濃度を求める。
【０４２９】
鉛イオン濃度の求め方は、予め、標準試料の鉛イオン濃度と吸光度の関係（検量線）を求めておき、その検量線に吸光度を照らして鉛イオン濃度を求める。ただしその際、使用している硝酸液中の鉛の定量値をブランク値に用いる。
【０４３０】
また、送られた溶出液を、そのままプラズマ発光分光分析（ＩＣＰ）測定し、鉛イオンの濃度を検出してもよい。その際の測定波長は２２０．４ｎｍが感度的に好ましい。
【０４３１】
そして、吸光度法による鉛の定量下限は１ｐｐｍ程度であり、ＩＣＰ法による鉛の定量下限は０．０５ｐｐｍ程度である。
【０４３２】
なお、ここで検査用に取り出した溶出液の残りの硝酸液は、切替えバルブ１２４を操作し、浸漬浴槽１００に送って再利用する。これにより、むだな廃棄物を減らすことができて好ましい。
【０４３３】
このようにして求めた鉛イオン濃度値が、所定の許容値（例えば数十ｐｐｍ）以下であるなら、検査対象Ｘには残留鉛が付着していなと見ることができる。許容値を越える鉛イオン濃度では、工程（７）に戻って再度新しい硝酸液に浸漬させて工程（８）〜（１０）を繰り返す［工程（１０）］。このとき、工程（８）の硝酸液を全て排出した後に、その浸漬浴槽１２０に新たな硝酸液を入れてもよいが、他にも複数の浸漬浴槽１２０を準備して使用することでもよい。ただし、鉛イオン濃度は溶液量の増減により変化する対比量なので、浸漬浴槽１２０に用意する新たな硝酸液は液量，濃度値の定常性を保つ必要があることは言うまでもない。
【０４３４】
ところで一方、工程（４）を行った後に、浸漬浴槽１００の硝酸液は開閉バルブ１０３を操作して回収浴槽１０２に送りる［工程（１１）］。そして、その回収浴槽１０２に、硫酸イオンを過剰に添加して硝酸溶液中の鉛を反応させ、硫酸鉛として沈殿させるものであり、これをろ過して回収し、鉛を含む有害物質として適切な廃棄処分を行う。
【０４３５】
以上の構成により本実施形態の残留有害金属量の検査装置は、まず鉛溶出回収部１３０の浸漬浴槽１００に検査対象Ｘを浸すと、その浸漬浴槽１００の硝酸液（酸性液Ａ）により当該検査対象Ｘに含まれる鉛（有害金属）が溶出させられる。次に、その検査対象Ｘを洗浄部１３１に送って洗浄し、この後、残留鉛溶出部１３２の浸漬浴槽１２０に浸すと、浸漬浴槽１２０の硝酸液（酸性液Ｃ）により当該検査対象Ｘに残留している鉛（有害金属）が溶出させられる。そして、この溶出液を残留鉛定量部１３３に送り込めば、その残留鉛定量部１３３が溶出液中に含まれている鉛イオン濃度（有害金属量）を定量的に検出する。
【０４３６】
従って、フラットパネルディスプレイなどの解体，分別処理に際して、ガラスからなる分別部材及び廃棄物等の検査対象Ｘに残留した鉛等の有害金属量を定量的に検出することができる。この場合、酸性液Ａ，Ｃを満たした浸漬浴槽１００，１２０に検査対象Ｘを単に浸し漬けるだけなので容易であり、即ち、その定量検出を手間なく容易に行うことができる。そして、検査対象Ｘとしては、酸性液Ａ，Ｃに不溶解であれば、それが含む鉛等の有害金属を溶出させることができ、その材質，形状等には特に制限がなく、各種の部材を検査できる。
【０４３７】
［実施形態９］
以下、本発明にかかるフラットパネルディスプレイの解体装置の実施形態を添付図面に基づいて説明する。
【０４３８】
（実施形態９−１）
図４４〜図４９は、本発明の第１実施形態を示し、図４４（ａ）はフラットパネルディスプレイの解体装置の構成を示す斜視図、図４４（ｂ）はその平面図、図４５は図４４の保持台及び支持手段を示す側面図、図４６（ａ）は図４４の搬送手段を示す正面図、そして図４６（ｂ）はその搬送手段の側面図、図４７（ａ）は図４４の搬送手段の他例を示す正面図、そして図４７（ｂ）はその他例の側面図、図４８は図４４のスペーサ回収治具を示す側面図、図４９は図４４のスペーサ回収治具の他例を示す側面図である。
【０４３９】
図中、５０はフラットパネルディスプレイ、５７はフラットパネルディスプレイ５０を載せる保持台、５４はフラットパネルディスプレイ５０の上面に引上力を加えて支持する支持手段、５５は支持手段５４に引上力を発生させる制御部、７１（７２）はスペーサ回収治具、３００は搬送手段である。
【０４４０】
解体するフラットパネルディスプレイ５０は、前述したのと同様な構成を有する図４３に示す構成を採り、スペーサ４と固着状態にある側のプレート部材を上にして保持台５７に載置し、その上面に支持手段５４を接面させ、所定の引上力を作用させて固定するようになっている。図４５には、スペーサ４が少なくともフェースプレート２側に固着されたものを例にして示している。保持台５７は、フラットパネルディスプレイ５０を載置した状態で上下に昇降させることができるようになっている。
【０４４１】
支持手段５４は、制御部５５に接続されている。制御部５５はフラットパネルディスプレイ５０の型番を入力することにより上面の重量を支える引上力を所定に発生させるようになっている。
【０４４２】
この支持手段５４が引上力を発揮する構成としては、真空排気装置の吸引力により引上力を発揮して支持を行う吸引手段とした構成、あるいは吸盤の吸着力により引上力を発揮して支持を行う吸着手段とした構成が採られる。本実施形態では吸引手段の構成を採り、支持手段５４が真空排気装置５６に接続されている。なお、支持手段５４の引上力は、保持台５７上に載置したフラットパネルディスプレイ５０の全重量を支持し得る値ではなく、フラットパネルディスプレイ５０から枠部材３を分離させたものの重量、つまりスペーサ４と固着状態にある側のプレート部材を支持し得る値程度に設定され、例えばその重量よりも１キログラム程度大きく設定することが好ましい。
【０４４３】
搬送手段３００は、フラットパネルディスプレイ５０から枠部材３を分離させた後に、スペーサ４と固着状態にある側のプレート部材をスペーサ回収部７３（７４）に搬送するものであり、ガイドレール１００に沿って移動して搬送を行うようになっている。図４６（ａ），（ｂ）に示す構成はスペーサ４が両プレート１，２の何れか一方に固着されたディスプレイ用であり、図４７（ａ），（ｂ）に示す構成はスペーサ４が両プレート１，２の両方に固着されたディスプレイ用となっている。
【０４４４】
搬送手段３００の柱６１は、ステージ６０上で前後及び左右へ移動できるようになっている。柱６１にはアーム６３が取り付けられており、そのアーム６３は高さ位置を調整できるようになっている。そして、アーム６３には押さえ治具６２が取り付けられている。
【０４４５】
押さえ治具６２は、スペーサ４と固着状態にあるプレート部材を両側から挟み込むことにより保持する構成とされていて、つまり、アーム６３の前後に、左右一対の吊り棒３２１Ｒ，３２１Ｌ及び３２２Ｒ，３２２Ｌが取り付けられ、各吊り棒３２１Ｒ，３２１Ｌ及び３２２Ｒ，３２２Ｌには、縦間隔ｄ１離れたツメ部３２１Ｒ１，３２１Ｒ２及び３２１Ｌ１，３２１Ｌ２そして３２２Ｒ１，３２２Ｒ２及び３２２Ｌ１，３２２Ｌ２が設けられている。この縦間隔ｄ１は、リアプレート１またはフェースプレート２を載置し得る間隔に設定されている。そして、アーム６３に取り付けられた押さえ治具６２は、左右の開き角度、及び前後の位置を調整できるようになっている。
【０４４６】
スペーサ回収治具７１（７２）は、枠部材３を分離した後に、スペーサ４と固着状態にある側のプレート縁部を受け支持するものであり、図４８に示す構成はスペーサ４が両プレート１，２の何れか一方に固着されたディスプレイ用７１であり、図４９に示す構成はスペーサ４が両プレート１，２の両方に固着されたディスプレイ用７２となっている。
【０４４７】
このスペーサ回収治具７１（７２）は、プレート部材を受け支持した状態のものが、スペーサ回収部７３（７４）に収容され、そこでスペーサ４の分離，回収が行われる。
【０４４８】
スペーサ回収治具７１については、溝部深さｄ２がスペーサ４の高さ以上に設定され、溝部幅ｄ３はスペーサ４の領域以上の距離に設定され、受け開口ｄ４はこれへ受け支持させるプレート部材の幅以上に設定されている。また、スペーサ回収治具７２については、下段溝部深さｄ５がプレート部材の厚さ以上に設定され、棚部厚さｄ６はリアプレート１とフェースプレート２との間隔つまり前工程で分離させた枠部材３の厚さ以下に設定されている。そして、スペーサ回収治具７２の溝底部には、負荷回避治具７０が設けられていて、受け支持状態にあるプレート部材においてスペーサ４に荷重がかかることを回避できるようになっている。
【０４４９】
スペーサ回収部７３（７４）は、プレート部材を受け支持した状態のスペーサ回収治具７１（７２）を収容し、スペーサ４の分離及び回収を行うようになっている。
【０４５０】
スペーサ４を分離させて回収するには、硝酸液などの酸性液に浸漬する構成や加熱する構成を採ればよく、つまり、スペーサ回収部として酸性液浸漬槽７３を備えて、スペーサ回収治具７１（７２）をその酸性液に浸し漬けることにより受け支持状態のプレート部材からスペーサ４を取り出して、それの溝部底に溜まっているスペーサ４を回収する。また、スペーサ回収部として熱処理炉７４を備えて、スペーサ回収治具７１（７２）を加熱することにより受け支持状態のプレート部材からスペーサ４を分離させ、この後、スペーサ回収治具７１（７２）を取り出して、それの溝部底に溜まっているスペーサ４を回収する。
【０４５１】
なお、酸性液には、例えば０．２規定の硝酸液が用いられる。また、スペーサ回収部として酸性液に浸漬する構成を採る場合は、スペーサ回収治具７１（７２）をプラスチック等の耐酸性材料から形成し、加熱する構成を採る場合はスペーサ回収治具７１（７２）を金属等の耐熱材料から形成する。
【０４５２】
図５０は、図４４に示すフラットパネルディスプレイの解体装置による解体工程を順に説明するフローチャートである。
【０４５３】
まず解体の前処理工程（１）〜（５）を行う。つまり、フラットパネルディスプレイ機器の筐体からフラットパネルディスプレイ５０を取り外して［工程（１）］、スペーサ４と固着状態にある側のプレート部材を上にして保持台５７に載置し［工程（２）］、付設されている配線や端子を取り外して［工程（３）］、排気管の取り付け部の封止を破るなどの適切な処理により当該真空容器内の真空を解除して大気圧に戻し［工程（４）］、そして排気管を取り外す［工程（５）］。
【０４５４】
次に、図４５に示すように、保持台５７上のフラットパネルディスプレイ５０上面に支持手段５４を接面させ、所定の引上力を作用させて固定する［工程（６）］。
【０４５５】
この後、フラットパネルディスプレイ５０から枠部材３を分離させる［工程（７）］。この分離には、単に切断する、枠部材３と両プレート１，２との接合部にくさび刃工具を押し込んで剥離させる、硝酸液を噴霧する等の適宜な方法を採ればよい。
【０４５６】
工程（７）で分離させた枠部材３は［工程（８）］、破砕すると共に鉛成分を除去して、再生新規のガラス材料として再利用する［工程（９）］。
【０４５７】
次に、スペーサ４と固着状態にある側のプレート部材を、図４６で示した搬送手段３００に保持させ［工程（１０）］、そしてガイドレール１００に沿つて移動させてスペーサ回収治具７１（７２）に移す［工程（１１）］。つまり、吊り棒３２１Ｌ，３２１Ｒ及び３２２Ｌ，３２２Ｒの開き角度を調整しながらツメ部３２１Ｌ１，３２１Ｌ２及び３２１Ｒ１，３２１Ｒ２そして３２２Ｌ１，３２２Ｌ２及び３２２Ｒ１，３２２Ｒ２でプレート部材を挟んで吊り支持し、ステージ６０をガイドレール１００に沿つて移動させて、吊り支持手順と逆の手順動作によりスペーサ回収治具７１（７２）に移す。
【０４５８】
この後、スペーサ４を回収する［工程（１２）］。これには、スペーサ４と固着状態にある側のプレート部材を受け支持しているスペーサ回収治具７１（７２）を、スペーサ回収部７３（７４）へ収容させ、そこでスペーサ４の分離，回収を行わせる。
【０４５９】
スペーサ４を回収できた後は、当該プレート部材がフェースプレート２の場合は［工程（１３）］、そのフェースプレート２から蛍光体を回収し［工程（１４）］、破砕すると共に鉛成分を除去して、再生新規のガラス材料として再利用する［工程（１５）］。
【０４６０】
また、当該プレート部材がリアプレート１の場合は［工程（１６）］、そのリアプレート１から配線を取り外し［工程（１７）］、破砕すると共に鉛成分を除去して、再生新規のガラス材料として再利用する［工程（１８）］。
【０４６１】
以上の構成により本実施形態のフラットパネルディスプレイの解体装置は、ディスプレイ本体（真空容器）から枠部材３を分離させる工程に際して、スペーサ４と固着状態にある側のプレート部材を、支持手段５４により引上力を加えて支持するので、スペーサ４は吊り下げ状態になり、これと固着しているプレート部材の重量が加わらなく、枠部材３の分離をスペーサ４に負担なく行える。従って、スペーサ４の損傷を防止することができる。
【０４６２】
枠部材３を分離した後は、スペーサ回収治具７１（７２）により、スペーサ４と固着状態にある側のプレート縁部を受け支持するので、このときもスペーサ４は吊り下げ状態になり、これと固着しているプレート部材の重量が加わらない。そして、このスペーサ回収治具７１（７２）により受け支持されたプレート部材からスペーサ４を分離させる工程は、スペーサ回収部７３（７４）が、その受け支持している状態そのままで行うので、スペーサ４の分離，回収工程においてもスペーサ４には余分な重量が加わらなく、その損傷を防ぐことができる。
【０４６３】
即ち、解体処理を適切な工程により行えるものであり、そのまま再利用し得るスペーサ４等の構成部材を破損することなく回収することができる。その結果、再資源化を好ましく図ることができる。
【０４６４】
（実施形態９−２）
図５１は、本発明の実施形態９−２を示し、図５１（ａ）はそのフラットパネルディスプレイの解体装置の構成を示す斜視図、図５１（ｂ）はその平面図である。
【０４６５】
実施形態９−２は、フラットパネルディスプレイ５０の上面に引上力を加えて支持する支持手段を、吸盤の吸着力により引上力を発揮して支持を行う吸着手段２４０とし、そして搬送手段３０１は、柱６１を回転軸にしてその上部のアーム６３を回転させる構成としてあり、そのアーム６３の回転範囲内に、保持台５７，スペーサ回収部７３（７４），スペーサ回収治具７１（７２）を配置した構成を採る。なお、前述した実施形態９−１と同様な各部には同一符号を付してその説明を省略する。
【０４６６】
この場合の解体工程も、実施形態９−１と同様であり、各工程においてスペーサ４を吊り下げ状態にすることができ、重量負担なくスペーサ４の分離，回収を行うことができ、その損傷を防止できる。そして、各部材を解体して再生新規のガラス材料として再利用することができ、即ち、解体処理を適切な工程により行えるものであり、その結果、再資源化を好ましく図ることができる。
【０４６７】
［実施形態１０］
以下に本発明の実施の形態を図面を用いて詳細に説明する。ここでは、図４３、図３２に模式的に示すような、内部にスペーサを有しフェースプレート内面に蛍光面を有するＦＰＤを解体処理する場合を一例として説明を行う。
【０４６８】
図４３（ａ）はＦＰＤの一部を切り欠いた斜視図であり、図４３（ｂ）は断面図である。図４３中、１はリアプレート、２はフェースプレート、３は枠、４はスペーサである。また図４３に黒色で示す接合部には、鉛含有のフリットガラス５が使用されている。
【０４６９】
リアプレート１、フェースプレート２、枠３は、石英ガラス、Ｎａ等の不純物含有量を減少したガラス、青板ガラス、青板ガラスにシリカ層を積層したもの等が用いられる。
【０４７０】
フェースプレート２は、ガラス基板２ａの内側に蛍光膜２ｂが形成され、その蛍光膜２ｂの内面にＡｌを含むメタルバック２ｃが形成されて構成されている。
【０４７１】
スペーサ４はフェースプレート側、リアプレート側のどちらか一方、あるいはその両側に接着されるが、ここではフェースプレート側のみの場合を示している。スペーサ４の材質も基本的にはガラスからなり、帯電防止のためその表面に導電性膜がコーティングされている場合がある。
【０４７２】
以上の他に一般にＦＰＤには内部を真空に排気するための排気管が取り付けられている（不図示）。排気管は通常鉛を含有する低融点のガラスで形成されている。
【０４７３】
図３２に示すＦＰＤは、マトリックス駆動方式の表面伝導型電子源ディスプレイ（ＳＥＤ）の例であり、一部を切り欠いて示している。図３２において、リアプレート１の上には表面伝導型電子源１１とこの電子源を駆動するための配線１２、１３が形成されている。１２、１３はそれぞれＸ方向（Ｄｏｘｌ，Ｄｏｘ２，・・・Ｄｏｘｍ）及びＹ方向（Ｄｏｙｌ，Ｄｏｙ２，・・・Ｄｏｙｎ）の素子配線であり、その材質はＡｇ，Ｐｂ等である。Ｘ方向配線１２とＹ方向配線１３とは少なくともそれらの交差部分において絶縁層（不図示）によって隔てられている。この絶縁層には鉛を多く含むガラスが使用されている。
【０４７４】
以上述べたように、ＦＰＤの様々な部分に鉛を含有する材料が使用されている。本発明の主旨はこれらの鉛を除去して、ガラスなどを再利用可能な状態にするための処理を、被処理部材の形状に適合した方法によって効率的に実施することである。
【０４７５】
図５３は本発明の実施態様を説明するための、ＦＰＤ機器の解体処理方法の工程を示す流れ図である。この方法の前半である工程（１）〜（３）は、前処理工程であり、ＦＰＤ機器の筐体からＦＰＤを取り出し、それに付随する配線や端子を除去する工程を含む。次に工程（４）〜（６）においてＦＰＤの真空解除を適切な方法で行った後、排気管を取り外す。排気管には鉛が含まれているため、鉛含有ガラスとして処理され再利用される。
【０４７６】
次に、工程（７）でパネルを枠の部分で切断し各部を分離するか、若しくは工程（８）で接合部のフリットガラスを溶解させて各部を分離する。工程（７）または工程（８）を経ることにより、この廃棄ＦＰＤは枠部分、パネル内部材、フェースプレート、リアプレートそれぞれの部分に分離されることになる。以下、それぞれの処理方法を記述する。
【０４７７】
枠部分は粉砕して、鉛入りガラスとして再利用される。
【０４７８】
パネル内部材としてスペーサ（ガラス製）、グリッド（金属製）などが含まれている場合はそれぞれ回収し再利用される（工程（９））。
【０４７９】
フェースプレートにおいては、まず蛍光体が除去され（工程（１０））、蛍光体の回収が行われる（工程（１１））。次に、工程（１２）において残留フリットガラスを除去するためにフェースプレートを液体処理槽に投入する。図５２はこのとき使用される処理槽の構成を示す模式図である。この処理槽８１では、複数のフェースプレート８２を同時に処理することが可能である。処理槽８１内で各フェースプレート８２は支持枠（不図示）などにより、表面と表面が接触しないように、一定の間隅を置いて平行に並べられ、フリットガラスを溶解させる作用を有する液体８３（例えば希硝酸）に浸漬される。なお、処理槽８１は例えばステンレスのような耐食性の高い材料で構成される。
【０４８０】
フリットガラスの溶解を加速するために、▲１▼液体を流動させる、▲２▼フェースプレートに振動または音波を伝播させる、▲３▼加熱機構により液体の温度を上げる、という手段が適宜とられる。フリットガラスが溶け出した処理液は、処理槽８１から処理液再生手段８６に取り出され、鉛やその他溶出物の回収が行われる（工程（１３））。その結果、処理液は再生され、処理槽８１へ戻される。このように処理液の再生、循環機構を設けることにより、処理槽内の環境を概ね一定の状態に保ことができ、フェースプレート８２から残留フリットガラスを除去する処理を連続して行うことが可能となる。図５２中に記入された矢印は処理液の流れを模式的に示すためのものである。
【０４８１】
続いて、フェースプレートは処理槽から洗浄槽へ移され、洗浄される（工程（（１４））。この洗浄工程では、洗浄に使用される液体（例えば水）が用いられ、フェースプレートに付着している上記処理液が除去される。洗浄槽の構造および機能は、図５２に示した処理槽と基本的に同じである。洗浄工程を終えたガラスは、そのまま、または粉砕、再溶融工程を経てフェースプレート用基板として再利用可能である。
【０４８２】
リアプレートにおいては、まず工程（１５）として配線を除去するためにリアプレートを図５２に示した液体処理槽に投入する。フェースプレートと同様、処理槽８１内で各リアプレートは支持枠（不図示）などにより、表面と表面が接触しないように、一定の間隔を置いて平行に並べられ、配線材料を溶解させる作用を有する液体８３（例えば希硝酸）に浸漬され、複数枚のリアプレートが同時に処理される。リアプレート用処理槽の構造および機能はフェースプレート用処理槽と基本的に同じである。処理槽内で配線を除去した後、配線に含まれていた金属（Ａｇ、Ｐｂ等）を回収する（工程（１６））。
【０４８３】
続いて、リアプレートは処理槽から洗浄槽へ移され、洗浄される（工程（１７）。この洗浄工程では、洗浄に使用される液体（例えば水）が用いられ、リアプレートに付着している上記処理液が除去される。洗浄槽の構造および機能は、上記処理槽と基本的に同じである。洗浄工程を終えたガラスは、そのまま、または粉砕、再溶融工程を経てリアプレート用基板として再利用可能である。
【０４８４】
［実施例１０］
以下、図３２，図４３，図５２〜図５３を参照しながら、実施例にしたがって本発明を詳細に説明する。
【０４８５】
［実施例１０−１］（切断分離してから一括処理する方法）
図３２に示すような、マトリックス駆動方式の表面伝導型電子源ディスプレイ（ＳＥＤ）１０個を解体処理した。このＳＥＤは図４３に示すようなスペーサを含む、パネル構造をしている。
【０４８６】
図５３のＦＰＤ機器の解体処理工程図に従い、ＳＥＤ機器の筐体からＳＥＤを取り出し、それに付随する配線や端子を除去した。次にＳＥＤの真空解除を行い、排気管を取り外した。排気管は、鉛含有ガラスとして処理し再利用した。
【０４８７】
次に、ＳＥＤパネルのフリットガラスで接合された領域の内側に切断線を設定し、ダイヤモンドカッテイングソウを使用して、研削液を加えながら、上記切断線に沿って、ＳＥＤを切断した。
【０４８８】
以上の操作を１０個のＳＥＤについて行なった。切断により各ＳＥＤは、それぞれ枠部分、フェースプレート、リアプレートに分割された。スペーサは切断の際にはずれたものと、フェースプレートに接着した状態のものとがあったが、両者とも手作業により回収し再生可能なものを選別し、再利用した。
【０４８９】
枠部分はそのまま粉砕して、鉛入りガラスの原料として再利用した。フェースプレートは、メタルバック及び蛍光体を除去してから、残留鉛成分を除去するために１０枚をまとめて液体処理槽へ投入した。図５２はこのとき使用した処理槽の構成を示す模式図である。処理槽８１には処理液８３として、０．２Ｎの硝酸が満たされており、各フェースプレート８２を平行に並べて、これに浸漬した。処理槽８１内には、フェースプレート８２が一定の間隔を置いて平行に並ぶように支持枠（不図示）が設置されている。液体流動手段８４により、処理液８３をフェースプレート８２の表面に沿って流動させると共に、処理液８３を、加熱用ヒーター８５により５０℃に加熱した状態で、１時間処理を行った。
【０４９０】
この間、処理液８３は処理液再生機構８６へと送られ、再生されて処理槽８１に戻される。処理液再生機構８６では、フィルターによって固形成分を除去し、溶解成分は電解法により分離回収した。
【０４９１】
続いて、フェースプレート８２は１０枚まとめて処理槽８１から洗浄槽へ移し、洗浄した。洗浄槽の構造は、上記処理槽と基本的に同じである。洗浄液として水を使用し、３０分間洗浄した。洗浄工程を終えたガラスは、粉砕、再溶融工程を経てフェースプレート用基板として再利用した。
【０４９２】
リアプレートは図５２に示す処理槽へ１０枚まとめて投入し、残留フリットガラスおよび配線を除去した。処理液は０．２Ｎの硝酸であり、温度５０℃に加熱し、さらに、超音波印加手段８７により超音波を印加しながら２時間処理を行った。
【０４９３】
続いて、リアプレートは１０枚まとめて処理槽から洗浄槽へ移し、洗浄した。洗浄槽の構造は、上記処理槽と基本的に同じである。洗浄液として水を使用し、３０分間洗浄した。洗浄工程を終えたガラスは、粉砕、再溶融工程を経てリアプレート用基板として再利用した。
【０４９４】
［実施例１０−２］（溶解分離してから一括処理する方法）
図５３のＦＰＤ機器の解体処理工程図に従い、ＳＥＤ機器の筐体からＳＥＤを取り出し、それに付随する配線や端子を除去した。次にＳＥＤの真空解除を行い、排気管を取り外した。排気管は、鉛含有ガラスとして処理し再利用した。
【０４９５】
次に、各ＳＥＤパネルをそれぞれ硝酸液に浸漬し、パネルの接合部のフリットガラスを溶解させた。その結果各パネルは、それぞれ枠部分、フェースプレート、リアプレートに分割された。
【０４９６】
以上の操作を１０個のＳＥＤについて行なった。
【０４９７】
以降、フェースプレート、リアプレートの洗浄工程までは実施例１０−１と共通である。洗浄工程を終えたガラスは乾燥後そのままフェースプレートもしくはリアプレート用基板として再利用した。
【０４９８】
本実施例では、ガラス基板の切断を行わないため、回収されたガラス基板はそのままの形でＳＥＤの部材として再利用が可能となる。
【０４９９】
［実施形態１１］
以下、図面に基づき、本発明によるフラットパネルディスプレイの蛍光体回収方法および装置の好適な実施形態を説明する。
【０５００】
この実施形態において、処理されるべきディスプレイはフェースプレート、リアプレートおよびびパネル間に設置される枠部とからなり、フェースプレート内面に蛍光体を塗布され、電子線の照射により蛍光体を発光させる形態のフラットパネルディスプレイとする。
【０５０１】
本発明の蛍光体回収装置において、作業台または作業ベルト等の基台上に載置されたフラットパネルディスプレイを囲繞するように該フラットパネルディスプレイに対して進退可能に配設された固定治具を備え、この固定治具がその四方周囲から摺動して当接することにより固定するようにした固定装置を使用する。
【０５０２】
図５４は、本発明における処理の基本工程を示している。
【０５０３】
図５４において、処理・廃棄されるディスプレイ（Ｓ４０）は、キャビネットから分離される。この場合、ディスプレイのフェースプレート側を下面として作業台上に配置し、その周囲を本発明に係る可動絞り式の固定治具で仮固定し、さらに作業台に設けられた吸引チャックを作動させて完全に固定する。
【０５０４】
ここで使用される固定治具において、その移動距離に基づき位置が検出され、この位置情報からフラットパネルディスプレイのサイズ情報が検知される（Ｓ４１）。この情報は制御端末（制御部）に送られ、後述の枠部切断時に使用されるカッタ（切離手段）の移動範囲、あるいはその後の蛍光体回収ブラシ（回収手段）の作業範囲が決定される（Ｓ４１）。また、吸引チャックの吸引口周囲にはフェースプレートの密着性を増すために、ゴムまたはプラスティックからなるシールが設けられている。
【０５０５】
つぎに、上方から吸盤を降下させて上側のリアプレートに吸着させ、上述した制御端末からの情報に従い枠部を切断する（Ｓ４４）。または枠部のフリットガラスを熱溶融させるなどの方法でフェースプレートとリアプレートおよび枠部を分離させる（Ｓ４５，Ｓ４９）。リアプレートおよび枠部（Ｓ４５）はフェースプレート上から取り除かれ（Ｓ４６）、金、銀およびパラジウムなどの貴金属元素（Ｓ４７）を取り除かれた後にカレット化の工程へ移送される（Ｓ４８）。
【０５０６】
一方、フェースプレート（Ｓ４９）は、吸引機構付の蛍光体回収ブラシをフェースプレート上に降下、複数回フェースプレート上を往復作動させ（Ｓ５０）、蛍光体を回収する（Ｓ５１）。この場合フェースプレートに残留する蛍光体の量を検知する蛍光体検知手段を備え、この蛍光体検知手段で得られた蛍光体量情報により、回収手段の回収ブラシの作動を制御するようになっている。
【０５０７】
本発明に係る蛍光体検知手段を使って蛍光体回収作業の終了を判断する方法として、たとえば可視光を照射してその透過率を検知する手段を作業台に設け、作業終了を判断することができる。あるいは回収ブラシ後方に蛍光スペクトロメータ検知部を配しておき、蛍光体が発する蛍光強度が初期値の０．５％以下、より好ましくは０．２％以下となったところで作業終了を判断する方法がある。
【０５０８】
また、リアプレートおよび枠部を分離した後にフェースプレートを治具ごと反転させ、下方からブラシを作用させて、蛍光体を落下回収する方法もある。この方法によれば、ブラシの吸引機構のエネルギおよび回収チューブの取回しが必要なくなるため、作業をより効率的に行うことができる。
【０５０９】
このようにして蛍光体の大部分が除かれたフェースプレートはさらに、蒸留水または蛍光体を溶解し易い水溶液、たとえばシュウ酸水溶液による洗浄工程にかけられ、さらに蛍光体が完全に回収除去される。後のシュウ酸の回収工程コストを考慮すると、蒸留水のみで洗浄できるようにブラシ工程での蛍光体の掻出しを充分に行なうのが望ましい（Ｓ５２）。
【０５１０】
洗浄工程を経たフェースプレートは、フェースプレートとして再利用することができるよう乾燥工程を施され（Ｓ５３）、フェースプレートの製造工程に回される（Ｓ５５）。あるいはまた、内面がフェースプレートの規格に達しない場合にはカレット化、溶融工程を経て通常のガラスとして再利用される（Ｓ５４）、またはフェースプレート部材の一部として再利用される。
【０５１１】
回収された蛍光体は、既知の方法によって分離、精製され、特にその手段は問わない。たとえば、回収した蛍光体をＮａＯＨ、ＮａＣｌＯおよびＨ_２Ｏ_２を含有する水溶液で処理し、ついで弱酸で処理する方法（特開平６−１０８０４７号公報）、あるいは回収した蛍光体を強酸で処理して希土類を浸出させ、さらにシュウ酸を添加して希土類をシュウ酸塩とし、これを焙焼して希土類酸化物を得る方法（特開平８−３３３６４１号公報）などの方法で行うことができる。
【０５１２】
上記の場合、本発明装置に含まれる固定装置やカッタあるいは回収ブラシ等の駆動制御は、ＣＰＵを有する制御部において所定のプログラムに従って行われるようになっている。すなわち、固定治具の位置情報や蛍光体検知手段の蛍光体量情報により、カッタあるいは回収ブラシ等の部材の移動量やＯＮ／ＯＦＦに関して、それらに対する駆動機構に適正な駆動命令を出して、それらの処理作業を制御する。
【０５１３】
［実施例１１］
つぎに、本発明における具体的な実施例を説明する。
【０５１４】
（実施例１１−１）
ここで、図５８は、フラットパネルディスプレイから蛍光体を回収する実施例１１−１に係る工程を示している。
【０５１５】
まず、フラットパネルディスプレイ２６０からパネル周辺部品の取外しを行なう。ディスプレイ周辺部の締付けネジをドライバ等で外し、ディスプレイケーシングを取り外す。さらに電源ケーブル、高圧電源部、チューナ部およびフレキシケーブルを取り外し、金属類とプラスティックを別途収容し、パネル部分のみとする。
【０５１６】
図５５、図５６に示すように上記のようにして取り出したパネル部分（フラットパネルディスプレイ２６０）を、フェースプレート部２を下にして真空吸引チャック２７１を備えた作業台２６１上に置く。フラットパネルディスプレイ２６０は、制御端末に接続された可動絞り式治具２７０を用いて固定される。すなわち、図５５（ａ）に示されるようにパネルの上下を固定する治具２７０ａ，２７０ｂは、パネルに接触するまで徐々に縦方向に移動する。同時にパネルの左右を固定する治具２７０ｃ，２７０ｄがパネルに接触するまで横方向に徐々に移動し、つまりパネルの上下端およびパネルの左右端を検知するまで治具２７０が移動する。
【０５１７】
実際にはこれらパネルの上端下端の検知移動、パネルの左端右端の検知移動は交互に行われ、何れかの端を検知するまでは交互に、その後は未検知の方向のみの検知移動が行われる。このため治具２７０の移動は、治具２７０が次第に間隔を狭めながらパネルを固定するように観察される。これらパネル固定治具２７０の位置情報は制御端末に送られ、後述するカッタの移動範囲や吸引機構付きブラシの作業範囲を決定する。
【０５１８】
なお、パネルは作業台２６１に設けた吸引孔２６２ａを介して、吸引チャック２６２により完全に作業台２６１上に固定される。この場合、吸引チャック２６２の吸引口周囲はシール２６３によって完全にシールされる。
【０５１９】
つぎに図５５に示すようにリアプレート１を４囲２７０ａ，２７０ｂ，２７０ｃ，２７０ｄからなる吸盤２７０によって押さえる。前述の制御端末によって移動範囲を制御されたカッタ２７２により、図示のようにフェースプレート２と枠部３の間を切断分離する。リアプレート１および枠部３は吸盤により取り去られ、配線に使用されている貴金属回収の工程に回され、主にリアプレートはガラスカレットとして収容される。
【０５２０】
一方、フェースプレート２は、図５７に示したようなブラシ２７３によって蛍光体を掃出し、吸引回収された。この場合フェースプレート２の上方から図示しない蛍光スペクトロメータにより蛍光体の残量を確認し、その情報を制御端末で処理して、ブラシ２７３の作業時間を決定する。この段階で、製造時に使用した内の９９．５％の蛍光体を除去することができ、また、９９．２％を回収することができた。
【０５２１】
フェースプレート２は、さらに洗浄工程にかけられ、粉塵として残留している蛍光体が回収される。ここまでの段階で、フェースプレート２上には検知できる蛍光体は存在しなかった。また回収された蛍光体は製造時に使用したうちの９９．４％であった。フェースプレート２はそのままフェースプレートとして使用できるか否かを検査され、検査に合格すれば再使用される。またはガラスカレット化され通常のガラス資源として再利用される工程に回される。
【０５２２】
（実施例１１−２）
つぎに、実施例１１−２を説明する。
【０５２３】
この例ではリアプレート１および枠部３を除いた後に、フェースプレート２を治具ごと反転させ、その他は実施例１１−１と同様にして蛍光体の回収を行なった。
【０５２４】
実施例１１−１の場合と同様にフェースプレート２上には検知できる蛍光体は存在しなかった。また蛍光体の回収率は９９．６％であった。
【０５２５】
（実施例１１−３）
つぎに、実施例１１−３では蛍光体の検知手段として、可視光の透過率を用いた他は実施例１１−１と同様の方法で蛍光体の回収を行なった。この場合、透過率が変化しなくなった時点でブラシ工程を終了した。
【０５２６】
処理工程終了後、蛍光スペクトロメータを用いて残留蛍光体量を測定したところ、約１％の蛍光体が残留していることが確認された。また、蛍光体の回収率は９９．２％であった。
【０５２７】
［実施形態１２］
以下、図面に基づき、本発明による基板処理方法および装置の好適な実施の形態を説明する。
【０５２８】
この実施形態では、図４３および図３２に示すように内部にスペーサを有し、フェースプレート内面に蛍光面を有するＦＰＤを解体処理する場合の例とする。
【０５２９】
図４３において、１はリアプレート、２はフェースプレート、３は枠、４はスペーサである。また図中、黒色で示す接合部には鉛含有のフリットガラス５が使用されている。
【０５３０】
スペーサ４はフェースプレート２側およびリアプレート１側のどちらか一方、
あるいはその両側に接着されている。ここでは、フェースプレート２側のみの場合を示している。リアプレート１、フェースプレート２および枠３は、石英ガラス、Ｎａ等の不純物含有量を減少したガラス、青板ガラスあるいは青板ガラスにシリカ層を積層したもの等が用いられる。フェースプレート２には、ガラス基板２ａの内側に蛍光膜２ｂが形成され、その蛍光膜２ｂの内面にはＡｌを含むメタルバック２ｃが形成されている。
【０５３１】
スペーサ４の材質も基本的にはガラスからなり、帯電防止のためその表面に導電性膜がコーティングされている場合がある。以上の構成部材の他に一般には、ＦＰＤ内部を真空に排気するための排気管が取り付けられている（図示せず）。排気管は通常鉛を含有する低融点のガラスで形成されている。
【０５３２】
図３２に示すようにＦＰＤの１例として、マトリックス駆動方式の表面伝導型
電子源ディスプレイ（ＳＥＤ）を示す。図２において、リアプレート１上には表面伝導型電子源１１とこの電子源を駆動するための配線１２、１３が形成されている。図において、１２，１３はそれぞれＸ方向（Ｄｏｘ１，Ｄｏｘ２，．．．Ｄｏｘｍ）およびＹ方向（Ｄｏｙ１，Ｄｏｙ２，．．．Ｄｏｙｎ）の素子配線であり、その材質はＡｇ，Ｐｂ等である。Ｘ方向配線とＹ方向配線とは少なくとも、それらの交差部分において絶縁層によって絶縁されている。絶縁層には鉛を多く含むガラスが使用されている。
【０５３３】
上述のようにＦＰＤの様々な部分に鉛を含有する材料が使用されている。本発明はこれらの鉛を除去し、ガラスなどを再利用可能な状態にするために被処理部材の形状に適合した方法によって効率的な処理を実施するものである。
【０５３４】
ここで、図６１は本発明の実施形態を説明するためのＦＰＤ機器の解体処理方法の工程を示す流れ図である。
【０５３５】
この方法の前半である工程（１）〜（３）は、前処理工程であり、ＦＰＤ機器の筐体からＦＰＤを取り出し、それに付随する配線や端子を除去する工程を含む。つぎに工程（４）〜（６）において適切な方法でＦＰＤの真空解除を行った後、排気管を取り外す。排気管には鉛が含まれているため鉛含有ガラスとして処理され、再利用される。
【０５３６】
工程（７）でパネルを枠の部分で切断し、各部を分離する。または接合部のフリ
ットガラスを溶解させる工程（８）によって各部を分離する。工程（７）または工程（８）を経ることにより、この廃棄ＦＰＤは（９）枠部分、（１１）パネル内部材、（１３）フェースプレート、（２０）リアプレートそれぞれの部分に分離されることになる。以下、それぞれの処理方法を記述する。
【０５３７】
（９） の枠部分は粉砕して、鉛入りガラスとして再利用される（工程（１０））。
（１１）のパネル内部材としてスペーサ（ガラス製）、グリッド（金属製）などが存在している場合はそれぞれ回収し再利用される（工程（１２））。
【０５３８】
フェースプレートにあっては、まず工程（１４）にて蛍光体が除去され、工程（１５）にて蛍光体の回収が行われる。つぎにフェースプレート基板であったガラス板を、本発明の基板処理装置であるガラス板保持装置に収納して残留フリットガラスを除去するために液体処理槽に投入する（工程（１６））。
【０５３９】
図５９は、このときに使用されるガラス基板保持装置の構成を説明する図である。ここで図５９を用いて、ガラス基板保持装置の構成および機能について詳しく説明する。この装置に収納された複数のガラス板２８６は、互いに平行にかつ一定の隙間をおいて保持される。これは液体処理槽中で、処理液がガラス表面に沿って充分に流動できるようにする効果がある。また液切れを良くして、処理槽からの処理液の持ち出しを最小限にするため、典型的にはガラス板２８６の表面がほぼ鉛直方向を向くようにガラス板２８６が保持されることが好ましい。なお、一点鎖線により示すようにガラス板２８６を適度に傾斜させて保持するようしてもよい。
【０５４０】
さらに、ガラス板２８６に接触する支持部材２８７は典型的には、円柱形状を有する。このように支持部材２８７の少なくとも基板との接触部位を円形もしくは円弧状にすることで、ガラス板２８６と線接触してガラス板２８６を保持するようになっており、この構造も処理液の持ち出しを低減する効果がある。
【０５４１】
なお、本ガラス基板保持装置において、上記のように支持部材２８７の形状等によって処理液の液切れ性を向上させる場合の他、たとえばエアーブロー等を用いてガラス板２８６から処理液を除去するようにしてもよい。また、保持すべきガラス板は同一サイズのものを複数保持し、あるいは異なるサイズのものを複数保持するいずれの場合にも本ガラス基板保持装置を適用可能である。
【０５４２】
ガラス基板保持装置は、多数のガラス板２８６を収納したうえで、液体処理槽間を迅速に移動する必要がある。そのため全体として、十分な強度を有することが求められる。また、酸やアルカリ溶液による処理に対応するため高い耐食性が要求される。ガラス基板保持装置はたとえばステンレス、テフロン（登録商標）、ポリプロピレンのような材料で構成することが可能である。
【０５４３】
図６０は、このとき使用される処理槽の構成を示す模式図である。処理槽８１内で各ガラス板は保持装置により、表面と表面が接触しないように一定の間隔を置いて平行に並べられ、フリットガラスを溶解させる作用を有する液体（たとえば希硝酸）の処理液８３に浸漬される。
【０５４４】
フリットガラスの溶解を加速するために、▲１▼処理液８３の液体を流動させる、▲２▼ガラス板に振動または音波を伝播させる、▲３▼加熱機構により液体の温度を上げる等の手段が適宜とられる。フリットガラスが溶け出した処理液８３は、処理槽８１から取り出され、工程（１７）にて（図６１参照）鉛やその他溶出物の回収が行われる。その結果処理液８３は再生され、処理槽８１へ戻される。このように処理液８３の再生、循環機構を設けることにより、処理槽８１内の環境を一定の状態に保ことができ、ガラス板から残留フリットガラスを除去する処理を連続して行うことが可能となる。図６０中に記入された矢印は、処理液８３の流れを模式的に示すためのものである。処理槽８１はたとえば、ステンレスのような耐食性の高い材料で構成されている。
【０５４５】
続いて、フェースプレート２であったガラス板は、ガラス板保持装置に収納されたまま処理槽８１から洗浄槽へ移され、洗浄される（工程（１８））。この洗浄工程では、洗浄に使用される液体（たとえば水）が用いられ、上述の処理液８３が除去される。洗浄槽の構造および機能は、処理槽８１と基本的に同じである。洗浄工程を終えたガラスはそのまま、または粉砕あるいは再溶融工程を経て、フェースプレート用基板として再利用可能である（工程（１９））。
【０５４６】
図６１、（２０）のリアプレート１にあっては、まずリアプレート１であったガラス板は、ガラス板保持装置に収納して配線を除去するために液体処理槽に投入する（工程（１６））。ガラス板保持装置の構成および機能はフェースプレートで使用されたものと基本的に同じである。
【０５４７】
処理槽８１内で各ガラス板はガラス板保持装置により、表面と表面が接触しないように一定の間隔を置いて平行に並べられ、配線材料を溶解させる作用を有する液体（たとえば希硝酸）に浸漬される。リアプレート用処理槽の構造および機能はフェースプレート用処理槽と基本的に同じである。工程（２１）で処理槽内で配線を除去した後、工程（２２）によって配線に含まれていた金属（Ａｇ、Ｐｂ等）を回収する。
【０５４８】
続いて、リアプレート１であったガラス板はガラス板保持装置に収納されたまま、処理槽から洗浄槽へ移され洗浄される。洗浄工程（２３）では、洗浄に使用される液体（たとえば水）が用いられ、上述の処理液が除去される。洗浄槽の構造および機能は、上述した処理槽と基本的に同じである。洗浄工程を終えたガラスはそのまま、または粉砕あるいは再溶融工程を経てリアプレート用基板として再利用可能である（工程（２４））。
【０５４９】
［実施例１２］
つぎに、図４３、図３２、図５９〜図６１を参照しながら、本発明における具体的な実施例について説明する。
【０５５０】
（実施例１２−１）
本発明の実施例１２−１において、図５９に示したガラス板保持装置に収納された複数のガラス板２８６は、互いに平行にかつ一定の隙間をおいて保持される。またガラス板２８６の表面がほぼ鉛直方向を向くようにガラス板が保持されるようになっている。
【０５５１】
本実施例では、厚さ３ｍｍのガラス板２８６が１０枚収納可能である。ガラス板２８６に接触する支持部材２８７は円柱形状を有し、ガラス板２８６と線接触することによりガラス板２８６を保持するようになっている。ガラス板２８６に接触する部材はテフロン（登録商標）で構成されている。
【０５５２】
本実施例のガラス基板保持装置は、１０枚のガラス板２８６を収納したうえで、液体処理槽間を迅速に移動することが可能なように、多数のステンレス製の桁材で補強されている。これらの構造材は、液体処理槽内で処理液の流動を妨げないような形状と配置をとっている。また、本実施例のガラス基板保持装置を液体処理槽空引き上げる際に処理液の持ち出しを最小限にするため、水平面を少なくしてある。
【０５５３】
（実施例１２−２）
実施例１２−２において、図３２に示すようなマトリックス駆動方式の表面伝導型電子源ディスプレイ（ＳＥＤ）を１０個の解体処理した例について説明する。
【０５５４】
このＳＥＤは図４３に示すようなスペーサを含む、パネル構造をしている。そして図６１のＦＰＤ機器の解体処理工程に従い、ＳＥＤ機器の筐体からＳＥＤを取り出し、それに付随する配線や端子を除去した。つぎにＳＥＤの真空解除を行い、排気管を取り外した。排気管は、鉛含有ガラスとして処理し再利用した。
【０５５５】
つぎに、ＳＥＤパネルのフリットガラスで接合された領域の内側に切断線を設定し、ダイヤモンドカッティングソウを使用して、研削液を加えながら、切断線に沿ってＳＥＤを切断した。以上の操作を１０個のＳＥＤについて行なった。
【０５５６】
切断により各ＳＥＤはそれぞれ、枠部分、フェースプレートおよびリアプレートに分割された。スペーサは切断の際に外れたものとフェースプレートに接着した状態のものとがあったが、両者とも手作業により回収し再生可能なものを選別し、再利用した。枠部分はそのまま粉砕して、鉛入りガラスの原料として再利用した。フェースプレート１０枚は、メタルバックおよび蛍光体を除去してから、図５９に示すガラス板保持装置２８２に収納した。
【０５５７】
フェースプレート１０枚は、メタルバックおよび蛍光体を除去してから、図５９に示すガラス板保持装置２８２に収納した。さらにこれを残留鉛成分を除去するために液体処理槽へ投入した。図６０はこのとき使用した処理槽の構成を示す模式図である。処理槽には処理液として、０．２Ｎの硝酸が満たされている、液体流動手段８４により、処理液をフェースプレートの表面に沿って流動させた。処理液を加熱用ヒータ８５により５０℃に加熱した状態で、１時間処理を行った。
【０５５８】
この間、処理液は処理液再生機構へと送られ、再生されて処理槽に戻される。処理液再生機構では、フィルタによって固形成分を除去し、溶解成分は電解法により分離回収した。続いて、本実施例のガラス板保持装置２８２を処理槽から洗浄槽へ移し洗浄した。洗浄槽の構造は、上述した処理槽と基本的に同じである。洗浄液として水を使用し、３０分間洗浄した。洗浄工程を終えたガラスは、ガラス板保持装置２８２から取り出され、粉砕あるいは再溶融工程を経てフェースプレート用基板として再利用した。
【０５５９】
リアプレート１０枚は、図５９に示すガラス板保持装置２８２に収納した。さらにこれを図６０に示す処理槽へ投入し、残留フリットガラスおよび配線を除去した。処理液は０．２Ｎの硝酸で、温度５０℃に加熱した。さらに超音波印加手段８７により超音波を印加しながら２時間処理を行った。
【０５６０】
続いて、リアプレート基板１０枚を収納したガラス板保持装置２８２を処理槽から洗浄槽へ移し洗浄した。洗浄槽の構造は、上述した処理槽と基本的に同じである。洗浄液として水を使用し、３０分間洗浄した。洗浄工程を終えたガラスは、ガラス板保持装置２８２から取り出され、粉砕あるいは再溶融工程を経てリアプレート用基板として再利用した。
【０５６１】
ここで、本発明方法によって処理したガラス基板上に、表面伝導型電子放出素子を多数形成してなる電子源基板を構成し、これを用いて画像形成装置を製造する例を説明する。
【０５６２】
まず、再生後のガラス基板上に、真空成膜技術およびフォトリソグラフィ技術を用いてＰｔ電極をマトリクス状に形成する。ここでは素子電極の間隔は、２０μｍ、各素子電極の幅は５００μｍ、厚さは１００ｎｍ、そして素子の配列ピッチは１ｍｍとした。続いて、印刷法によりＡｇからなる配線をマトリクス状に形成する。
【０５６３】
つぎに素子電極の間に酢酸パラジウムモノエタノールアミン水溶液をスピンナによって回転塗布し、２７０℃で１０分間の加熱焼成処理を行う。酸化パラジウム（ＰｄＯ）微粒子からなる薄膜が得られた。その後フォトリソグラフィ法とドライエッチング法により幅３００μｍの導電性薄膜が得られた。
【０５６４】
つぎに真空中で素子電極間に電圧を印加してフォーミング処理を行い、導電性薄膜に亀裂形状の電子放出部を形成する。
【０５６５】
つぎに通電フォーミングが終了した素子に活性化処理を施す。本実施形態では真空中にエチレンガスを導入し、素子電極間に波高値２０Ｖのパルス電圧を３０分間繰り返し印加する。この活性化工程により電子放出部に近傍に炭素を主とする化合物が約１０ｎｍ堆積した。
【０５６６】
このように表面伝導型電子放出素子が多数形成された電子源基板をリアプレートとし、フェースプレートおよび支持枠とで外囲器を形成した。この外囲器の内部を真空排気し、封止を行って表示パネルさらにはテレビジョン表示を行うための駆動回路を有する画像形成装置を作製した。この画像形成装置において、非発光部（画素欠陥）のない極めて良好な画像が形成される。
【０５６７】
［実施形態１３］
以下、図面に基づき本発明の好適な実施の形態を説明する。ここでは、図２９に示したようなフラットパネルディスプレイを解体処理する場合の例とする。
【０５６８】
図６２は、この実施形態における解体処理方法の工程を示す流れ図である。まず筐体から取り出されたフラットパネルディスプレイ（Ｓ６０）から配線、端子などを除去した後（Ｓ６１）、内部の真空解除を行い、ついで排気管を取り外す（Ｓ６２）。つぎにフェースプレート（Ｓ６４）、リアプレート（Ｓ７０）および枠部等（Ｓ６３）の各構成部材に分離する。これら各部を溶着しているフリットガラスとしては、酸化鉛を主材料とする低融点ガラスが一般に用いられている。分離の方法としては、加熱によるフリットガラスの融解や適当な溶媒によるフリットガラスの溶解等の方法を用いることができる。
【０５６９】
分離後のフェースプレート（Ｓ６４）は蛍光体、黒色体およびメタルバックを適当な方法で除去した後（Ｓ６５）、残留フリットガラスの除去とガラス表面の洗浄のため、硝酸等の溶剤および水で洗浄する（Ｓ６６）。一方、分離後のリアプレート（Ｓ７０）についても、適当な溶剤および水洗浄工程を行うことで（Ｓ７１，Ｓ７２）、基板上に形成された構成材料の一部あるいは全てを除去することができる。
【０５７０】
つぎに、上記のような除去工程を経た後のガラス基板表面に存在する元素の検出を行う。
【０５７１】
図６３はガラス表面に存在する元素を検出するための本発明に係る蛍光Ｘ線分析装置を示す模式図である。図６３において、３０１はガラス基板３０２の支持台、３０２は試料であるガラス基板、３０３はＸ線光源、３０４はモノクロメータ、３０５は１次Ｘ線、３０６は蛍光Ｘ線、３０７は半導体検出器、３０８は冷却装置、３０９はプリアンプ、３１０はアンプ、３１１はマルチチャンネルアナライザ、３１２はコンピュータである。
【０５７２】
元素の検出は、以下の手順で行われる。まず、Ｘ線光源３０３から放出される一次Ｘ線３０５をモノクロメータ３０４で単色化した後、支持台３０１上のガラス基板３０２の表面に角度θで入射させる。Ｘ線の光源としては、ガラス基板３０２上に存在する元素を励起し得るエネルギを有するものである。たとえば、Ｗ−Ｌα線、Ａｕ−Ｌα線、Ｍｏ−Ｋα線等が用いられる。一次Ｘ線３０５が照射されたガラス基板３０２の表面からは蛍光Ｘ線が発生し、これをガラス基板３０２の上方に設置された半導体検出器３０７で検出する。検出素子としてはＳｉ（Ｌｉ）半導体検出器が用いられる。半導体検出器３０７からの検出信号はプリアンプ３０９、アンプ３１０およびマルチチャンネルアナライザ３１１を経た後コンピュータ３１２によって処理され、ガラス基板３０２の表面元素の種類や濃度に応じた信号強度が得られる。なお、半導体検出器３０７およびプリアンプ３０９は、液体窒素によって冷却されている。
【０５７３】
なお、ここで一次Ｘ線３０５の入射角θをＸ線が全反射を起こす角度、すなわち全反射臨界角以下の低角度にすると、そのＸ線は試料表面から数ｎｍ程度しか侵入せず、かつ蛍光Ｘ線が効率良く発生する。このため試料表面数ｎｍｎｍ以下の領域で、検出下限１０^９ ａｔｏｍｓ／ｃｍ^２程度の極めて敏感な元素分析を行うことができる。全反射臨界角は、θｃ≒１．６４×１０^５ ×ρ^１／２ ×λ（ρ：基板の密度（ｇ／ｃｍ３ ）、λ：Ｘ線の波長（ｃｍ））で求めることができる。
【０５７４】
ところで本実施形態におけるガラス基板３０２は、大きいもので一辺が数１０ｃｍの大きさを有している。本発明は、このような広い面積の元素分析を効率良く、また低コストで行うことを意図するものである。上記の方法で感度よく測定するには、一般にはできる限り検出器を試料表面に接近させることが好ましい。この場合、分析領域はほぼ検出器の口径に依存しており、通常約１０ｍｍφ程度である。しかしこのように試料と検出器を接近させた状態での測定は、広い面積を測定する場合には、試料を走査して多数点のデータをとり、あるいは検出器を多数配置することが必要となる。したがって、そのままでは多くの時間および設備コストを要することになる。
【０５７５】
そこで本発明においては、感度を犠牲にすることなく、効率よく元素分析を行うために、基板の大きさに応じて試料表面と検出器の相対位置を変化させる方法を用いる。つぎに、本発明における相対位置を変化させる方法について、図６４を用いて説明する。
【０５７６】
図６４において、３０１はガラス基板３０２の支持台、３０２は試料であるガラス基板、３０７は半導体検出器、３１４は半導体素子、３１５はＸ線透過窓、３１６はコリメータを示す。半導体検出器３０７の構成は図に示したようになっており、半導体素子３１４は、点線で示した領域、すなわちＸ線透過窓３１５の大きさや半導体素子３１４との相対位置等から決まる角度φと、半導体素子３１４自体の大きさｌに依存した広がりを有する領域のＸ線を受光することができる。
【０５７７】
図６４（ａ）のように半導体検出器７を試料表面に近づけた場合、分析領域はほぼＸ線透過窓３１５の口径と同等である。これに対し、半導体検出器３０７の位置を試料表面から遠ざけて図６４（ｂ）の状態にすると、単位面積から検出できるＸ線強度は減少するが、検出し得る領域は増加する。したがって一辺の長さＬのガラス基板３０２からの蛍光Ｘ線を検出する場合、２ｄ・ｔａｎφ＞Ｌとなるようにガラス基板３０２と半導体検出器３０７の距離ｄを設定し、かつガラス基板３０２全面に一次Ｘ線を照射しながら測定することにより、結果として感度を犠牲にすることなくガラス基板３０２全体からのＸ線を取り込むことができる。
【０５７８】
Ｘ線を所望の領域に照射するためには、図６５に示したように照射すべき領域Ｗおよび１次Ｘ線の入射角θからａ＞Ｗ・ｓｉｎθに基づき、１次Ｘ線のビーム径ａを決定すればよい。なお、ガラス基板３０２が極めて大きく、それに応じた距離ｄ確保することが装着の構成上難しい場合は、ガラス基板３０２を複数の領域に分割して測定を繰り返すことで行うことができる。
【０５７９】
半導体検出器３０７のＸ線透過窓３１５の形状については、ガラス基板３０２の形状に近い矩形であることが好ましい。たとえば図６６に、形状が円の場合（図６６（ａ））とガラス基板３０２と相似形である場合（図６６（ｂ））の蛍光Ｘ線の検出領域の違いを示した。図６６において、３０２はガラス基板（上部から見た図）であり、点線もしくはドット表示部分はＸ線の検出領域である。Ｘ線透過窓３１５が円形の場合、ガラス基板３０２との形状が一致しないことから、検出効率としては必ずしも高いとは言えない。これに対して、図６６（ｂ）の場合には効率よくＸ線を検出することができる。ガラス基板３０２のアスペクト比は必ずしも一定ではないが、その種類と使用量から適当な透過窓の形状を選択することで、より効率よい検出工程が可能となる。このような方法でガラス基板３０２の表面から発生した蛍光Ｘ線を検出することにより、基板表面の残留元素や基板内部へ拡散している元素の有無、および基板表面に形成された薄膜の有無等を知ることができる。
【０５８０】
以上の工程でガラス構成元素以外の元素が検出された場合には、続いてこれを除去する工程を行う。この場合の除去方法としては、いろいろな方法を用いることができるが、特にガラス基板３０２の表面研磨が好適である。
【０５８１】
図６７は、本発明における研磨装置の一例を示す模式図である。図６７において、３２７はガラス基板３２８の支持台、３２８はガラス基板、３２９は研磨具、３３０は回転支持棒、３３１は支持アーム、３３２はモータ、３３３は支柱、３３４は研磨面である。研磨されるガラス基板３２８は研磨面を上向きにして支持台３２７上に設置され、研磨面には研磨具３２９が押しつけられる。モータ３３２の作動により回転支持棒３３０および研磨具３２９が回転するとともに、研磨面３３４には酸化セリウム等の研磨剤を含むスラリーが供給され、ガラス表面３３４の研磨が行われる。
【０５８２】
研磨後のガラス基板３２８は洗浄した後再び、上述した元素分析を行う。こうして最終的にガラス基板３２８のガラス構成元素以外の元素が検出されなくなるまでガラス表面３３４の元素検出と研磨を繰り返す。以上の工程を終了したガラス基板３２８はそのまま、またはカレット化され、再融解工程を経てフラットディスプレイ用基板あるいは他製品の原料として再利用することが可能である。
【０５８３】
［実施例１３］
以下に、実施例を挙げて本発明をさらに詳しく説明する。なお、以下の実施例においては、図２９に示したようなマトリックス駆動方式の表面伝導型電子源ディスプレイを解体処理した例とする。
【０５８４】
（実施例１３−１）
実施例１３−１においては、フェースプレート２、リアプレート基板として８０ｍｍ×８００ｍｍ×２．８ｍｍの石英ガラスが用いられる。またリアプレートは基板上にＰｄを主成分とする冷陰極素子１１、Ａｇを主成分とする配線１２、Ｐｔからなる電極等が形成されており、フェースプレート２は基板上に蛍光体２ｂ、黒色体、メタルバック２ｃ等が形成されている。かかる構成のディスプレイについての解体処理方法を、図６３、図６４、図６７および図２９を用いて述べる。
【０５８５】
▲１▼筐体部を分解し、リアプレート１、フェースプレート２、枠３がフリットガラスにより溶着された部分を取り出した。
【０５８６】
▲２▼リアプレート１、フェースプレート２および枠３部を０．２規定の硝酸溶液中に浸漬して溶着部を徐々に溶解し、各部を分離した。
【０５８７】
▲３▼リアプレート１およびフェースプレート２上に形成されている構成物の物理的な掻き落とし作業を行なった後、再び０．２規定硝酸溶液中に浸漬し、超音波振動を加えた。その後リアプレート１およびフェースプレート２を純水で洗浄し、基板上に残ったフリットガラスその他の溶解物を除去した。
【０５８８】
▲４▼つぎに図６３に示すような蛍光Ｘ線分析装置で基板表面に存在する元素の検出を行った。Ｘ線の光源としてＡｕ−Ｌα線（λ＝０．１２７６４ｎｍ）を用い、Ｘ線の基板への入射角θは全反射角臨界角以上とした。またガラス基板全面にＸ線が照射されるように、図６５に示したビーム幅０．１５ｍｍ以上で、奥行き８０ｍｍ以上のＸ線を照射した。またＸ線透過窓の形状は正方形であり、図６４に示したガラス基板と検出器の距離ｄを４０ｍｍに設定した。
【０５８９】
このようにしてガラス基板全面から発生する蛍光Ｘ線を２００秒間取り込み元素を測定したところ、リアプレート基板からは基板元素であるＳｉの他、ＰｔおよびＡｇが検出された。またフェースプレート基板からはＳｉ以外の元素は検出されなかった。
【０５９０】
▲５▼つぎにＰｔおよびＡｇが検出されたリアプレート基板の表面を、図６７に示した研磨装置で研磨した。基板の研磨面に研磨具３２５を押しつけ、研磨具を回転させるとともに平均粒径１０ミクロンの酸化セリウムスラリーをかけながら基板全体を５分間研磨した。
【０５９１】
▲６▼研磨後のリアプレート基板を純水で洗浄した後再び、上述した元素分析を行った。その結果、ＰｔおよびＡｇは検出限界以下となり、基板上の残留物が全て除去できたことを確認した。
【０５９２】
▲７▼以上の工程を終了したリアプレート基板は、研磨工程を要しなかったフェースプレート基板とともにカレット化せずにそのまま基板として再利用することができた。
【０５９３】
（実施例１３−２）
この実施例１３−２においては、フェースプレート基板として８０ｍｍ×８００ｍｍ×２．８ｍｍの青板ガラス、リアプレート基板として同じ大きさの青板ガラスにＳｉＯ_２薄膜が１００ｎｍ積層されたものが用いられる。またリアプレートは基板上にＰｄを主成分とする冷陰極素子１１、Ａｇを主成分とする配線１２、１３、Ｐｔからなる電極等が形成されており、フェースプレートは基板上に蛍光体、黒色体およびメタルバック等が形成されている。このようなディスプレイについて、以下に解体処理方法を述べる。
【０５９４】
まず実施例１３−１における▲１▼〜▲３▼の工程と同じ方法で、リアプレート、フェースプレート、枠部を分離した後、基板上に形成されていた素子の構成材料の一部を除去した。
【０５９５】
▲４▼つぎに基板表面に存在する元素の検出を行った。本実施例においては、Ｘ線の光源としてＡｕ−Ｌα線（λ＝０．１２７６４ｎｍ）を用い、Ｘ線の基板への入射角θは全反射角臨界角以下の０．１°とした。またガラス基板全面にＸ線が照射されるように、図６５に示したビーム幅０．１５ｍｍ以上で、奥行き８０ｍｍ以上のＸ線を照射した。Ｘ線透過窓の形状は正方形であり、図６４に示したガラス基板と検出器の距離ｄを４０ｍｍに設定した。
【０５９６】
このようにしてガラス基板全面から発生する蛍光Ｘ線を２００秒間取り込み、元素分析を行ったところ、リアプレート基板から基板構成元素の他、Ｐｔ、ＡｇおよびＰｂが検出された。またフェースプレート基板からも基板構成元素の他にＰｂが検出された。
【０５９７】
▲５▼つぎにリアプレートおよびフェースプレート基板の表面を図６７に示した研磨装置で研磨した。基板の研磨面に研磨具３２９を押しつけ、研磨具を回転させるとともに平均粒径１０ミクロンの酸化セリウムスラリーをかけながら基板全体を５分間研磨した。
【０５９８】
▲６▼研磨後のリアプレート基板を純水で洗浄した後再び、上述した元素分析を行った。その結果、ＰｔおよびＰｂは検出限界以下となったが、Ａｇは強度が減少したものの依然検出された。一方フェースプレート基板からは基板構成元素以外の元素は検出されなかった。
【０５９９】
▲７▼再びリアプレート基板の表面を図６７に示した研磨装置で研磨した。▲５▼の工程と同様の方法で基板全体を１５分間研磨した。
【０６００】
▲８▼研磨後のリアプレート基板を純水で洗浄した後再び、上述した元素分析を行った。その結果、基板構成元素以外の元素は検出されず、基板上の残留物および基板内に拡散元素が全て除去できたことを確認した。
【０６０１】
▲９▼以上の工程を終えたリアプレート基板及びフェースプレート基板はカレット化し、溶融工程を経た後、フラットディスプレイ用基板として再利用した。
【０６０２】
（実施例１３−３）
実施例１３−３においては、フェースプレート、リアプレート基板として３００ｍｍ×２５０ｍｍ×２．８ｍｍの石英ガラスが用いられる。この点以外は実施例１３−１と同様の構成のフラットディスプレイについて解体処理方法を述べる。
【０６０３】
まず実施例１３−１における▲１▼〜▲３▼の工程と同じ方法で、リアプレート、フェースプレート、枠部を分離した後、硝酸溶液中で基板上に形成されていた素子の構成材料の一部を除去した。
【０６０４】
▲４▼つぎに図６３に示すような全反射蛍光Ｘ線分析装置で基板表面に存在する元素の検出を行った。本実施例において、Ｘ線の光源としてＡｕ−Ｌα線（λ＝０．１２７６４ｎｍ）を用い、Ｘ線の基板への入射角θを０．１°とした。またガラス基板全面にＸ線が照射されるように、図６５に示したビーム幅０．６ｍｍ以上、奥行き３００ｍｍ以上のＸ線を照射した。またＸ線透過窓の形状は正方形とし、図６４に示したガラス基板と検出器の距離ｄを１５０ｍｍに設定した。
【０６０５】
このようにしてガラス基板表面から発生する蛍光Ｘ線を２００秒間取り込み、元素分析を行った結果、リアプレート基板からは基板元素であるＳｉの他、ＰｔおよびＡｇが検出された。またフェースプレート基板からはＳｉ以外の元素は検出されなかった。
【０６０６】
続いて実施例１における▲５▼〜▲７▼の工程と同じ方法で、ガラス表面の研磨を行い、基板上の残留物を全て除去した。以上の工程を終了したリアプレート基板は、研磨工程を要しなかったフェースプレート基板とともにカレット化せずにそのまま基板として再利用することができた。
【０６０７】
（実施例１３−４）
この実施例１３−４においては、リアプレート基板として３００ｍｍ×２５０ｍｍ×２．８ｍｍの青板ガラスに、ＰをドープしたＳｉＯ_２薄膜が１μｍ積層されたものが用いられる。この点以外は実施例１３−１の場合と同様の構成のフラットディスプレイについて、解体処理方法を述べる。
【０６０８】
まず実施例１３−１の▲１▼〜▲３▼の工程と同じ方法で、リアプレート、フェースプレートおよび枠部を分離した後、硝酸溶液中で基板上に形成されていた素子の構成材料の一部を除去した。
【０６０９】
▲４▼つぎに図６３に示すような全反射蛍光Ｘ線分析装置で基板表面に存在する元素の検出を行った。本実施例１３−４においては、Ｘ線の光源としてＭｏ−Ｋα線（λ＝０．０７１０７ｎｍ）を用い、Ｘ線の基板への入射角θを０．１°とした。またガラス基板全面にＸ線が照射されるように、図６５に示したビーム幅０．６ｍｍ以上、奥行き３００ｍｍ以上のＸ線を照射した。またＸ線透過窓の形状は正方形であり、図６４に示したガラス基板と検出器の距離ｄを１５０ｍｍに設定した。
【０６１０】
このようにしてガラス基板表面から発生する蛍光Ｘ線を２００秒間取り込み、元素分析を行ったところ、リアプレート基板からはＳｉ、Ｐ、Ｐｔ、ＡｇおよびＰｂが検出された。またフェースプレート基板からは基板構成元素の他にＰｂが検出された。
【０６１１】
▲５▼つぎにリアプレートおよびフェースプレート基板の表面を図６７に示した研磨装置で研磨した。基板の研磨面に研磨具３２９を押しつけ、研磨具を回転させるとともに平均粒径１０ミクロンの酸化セリウムスラリーをかけながら基板全体を５分間研磨した。
【０６１２】
▲６▼研磨後のリアプレート基板を純水で洗浄した後再び、上述した元素分析を行った。その結果、Ｐｔ、ＡｇおよびＰｂは検出限界以下となり、ＳｉおよびＰのみが検出された。一方フェースプレート基板からは基板構成元素以外の元素は検出されなかった。
【０６１３】
▲７▼再びリアプレート基板の表面を図６７に示した研磨装置で研磨した。▲５▼と同様の方法で基板全体を１０分間研磨した。
【０６１４】
▲８▼研磨後のリアプレート基板を純水で洗浄した後再び、上述した元素分析を行った。その結果、Ｐは検出限界以下となる一方、ガラス構成元素のＫ、Ｃａ等が検出された。これにより、ＰをドープしたＳｉＯ_２層が除去されたこと、および基板上の残留物を全て除去したことを確認した。
【０６１５】
▲９▼以上の工程を終了したリアプレート基板およびフェースプレート基板はカレット化し、溶融工程を経た後、フラットディスプレイ用基板として再利用することができた。
【０６１６】
ここで、本発明方法によって処理したガラス基板上に、表面伝導型電子放出素子を多数形成してなる電子源基板を構成し、これを用いて画像形成装置を製造する例を説明する。
【０６１７】
まず、再生後のガラス基板上に、真空成膜技術およびフォトリソグラフィ技術を用いてＰｔ電極をマトリクス状に形成する。ここでは素子電極の間隔は、２０μｍ、各素子電極の幅は５００μｍ、厚さは１００ｎｍ、そして素子の配列ピッチは１ｍｍとした。続いて、印刷法によりＡｇからなる配線をマトリクス状に形成する。
【０６１８】
つぎに素子電極の間に酢酸パラジウムモノエタノールアミン水溶液をスピンナによって回転塗布し、２７０℃で１０分間の加熱焼成処理を行う。酸化パラジウム（ＰｄＯ）微粒子からなる薄膜が得られた。その後フォトリソグラフィ法とドライエッチング法により幅３００μｍの導電性薄膜が得られた。
【０６１９】
つぎに真空中で素子電極間に電圧を印加してフォーミング処理を行い、導電性薄膜に亀裂形状の電子放出部を形成する。
【０６２０】
つぎに通電フォーミングが終了した素子に活性化処理を施す。本実施形態では真空中にエチレンガスを導入し、素子電極間に波高値２０Ｖのパルス電圧を３０分間繰り返し印加する。この活性化工程により電子放出部に近傍に炭素を主とする化合物が約１０ｎｍ堆積した。
【０６２１】
このように表面伝導型電子放出素子が多数形成された電子源基板をリアプレートとし、フェースプレートおよび支持枠とで外囲器を形成した。この外囲器の内部を真空排気し、封止を行って表示パネルさらにはテレビジョン表示を行うための駆動回路を有する画像形成装置を作製した。この画像形成装置において、非発光部（画素欠陥）のない極めて良好な画像が形成される。
【０６２２】
【発明の効果】
以下、本発明の効果について、上述の各実施形態及び実施例の添え字に沿った効果を列記する。
【０６２３】
［発明の効果１］ 本発明によれば、廃棄ＦＰＤを解体処理する際に、鉛を含まないガラスと鉛入りのガラスに区分けして処理することができるため、解体処理と部材の再利用を容易に行うことができる。また鉛による環境汚染を防止することができる。
【０６２４】
［発明の効果２］ 本発明により、ＦＰＤの廃棄、再利用において必要とされる解体処理を容易に行なうことができる。
【０６２５】
また、その際に問題となる有害金属である鉛の分離回収も行なうことができるため、廃棄の際の環境負荷を削減することができる。さらに、使用されている貴金属元素や希土類元素等の希少元素の回収再利用も可能であるため、資源の確保という視点からも有効である。
【０６２６】
［発明の効果３］ 本発明の再生方法によって、廃棄されるパネルディスプレイの重要な構成部品であるリアプレートの再利用が可能になり、資源を有効に使用することができコストの削減を実現できる。
【０６２７】
［発明の効果４］ 本発明によれば、フラットディスプレイを分解する過程において、スペーサにほとんど損傷を与えることなく回収、再利用することが可能なことから、資源を有効に使用することができ、コストの削減を実現できる。また回収工程においては細かな手作業を必要としないため、安全に回収することが可能である。
【０６２８】
［発明の効果５］ 本発明によれば、ＣＲＴ、フラットディスプレイ装置を問
わず、これらから蛍光体を効率よく回収し、且つ凹凸が少なく再利用可能なフェースプレートを回収できる方法を提供することができる。
【０６２９】
［発明の効果６］ 本発明の画像表示装置によれば、大気圧に比べ低い圧力に保った気密容器と排気装置に接続する手段と必要に応じて容器内を徐々に大気圧に戻す手段を備えるため、気密容器を大気圧に戻す時、容器内の耐大気圧構造部材や画像表示手段を破壊したり、傷つけることが少ないため、分解後の部材の再利用を容易にする。さらに、製造工程で発生した不良部分を容易に修理することができるようになった。
【０６３０】
［発明の効果７］ 本発明のフラットディスプレイにおいては、外囲器を形成する部材を順次分離できることから、解体過程において外囲器及び内部の部材に損傷を与えることなく安全かつ簡易的な方法で部材を回収できる。従って再利用可能な状態で回収することが容易となり、資源の有効利用やコストの削減が実現できる。
【０６３１】
［発明の効果８］ 本発明の残留有害金属量の検査装置は、次に示すような優れた効果を奏する。
【０６３２】
本発明の残留有害金属量の検査装置は、まず第一溶出手段の浴槽に検査対象を浸すと、浴槽の酸性液により当該検査対象に含まれる有害金属が溶出させられる。次に、その検査対象を洗浄手段に送って洗浄し、この後、第二溶出手段の浴槽に浸すと、浴槽の酸性液により当該検査対象に残留している有害金属が溶出させられる。そして、この溶出液を定量検出手段に送り込めば、その定量検出手段が溶出液中に含まれている有害金属量を定量的に検出する。従って、フラットパネルディスプレイなどの解体，分別処理に際して、ガラスからなる分別部材及び廃棄物等の検査対象に残留した鉛等の有害金属量を定量的に検出することができる。
【０６３３】
この場合、酸性液を満たした浸漬浴槽に検査対象を単に浸し漬けるだけなので容易であり、即ち、その定量検出を手間なく容易に行うことができる。そして、検査対象としては、酸性液に不溶解であれば、それが含む鉛等の有害金属を溶出させることができ、その材質，形状等には特に制限がなく、各種の部材を検査できる。
【０６３４】
［発明の効果９］ 本発明のフラットパネルディスプレイの解体装置は、次に示すような優れた効果を奏する。
（１） 本発明のフラットパネルディスプレイの解体装置は、ディスプレイ本体（真空容器）から枠部材を分離させる工程に際して、スペーサと固着状態にある側のプレートを、第一支持手段により引上力を加えて支持するので、スペーサは吊り下げ状態になり、これと固着しているプレートの重量が加わらなく、枠部材の分離をスペーサに負担なく行える。従って、スペーサの損傷を防止することができる。
【０６３５】
枠部材を分離した後は、第二支持手段により、スペーサと固着状態にある側のプレート縁部を受け支持するので、このときもスペーサは吊り下げ状態になり、これと固着しているプレートの重量が加わらない。そして、この第二支持手段により受け支持されたプレートからスペーサを分離させる工程は、スペーサ回収手段が、その受け支持している状態そのままで行うので、スペーサの分離，回収工程においてもスペーサには余分な重量が加わらなく、その損傷を防ぐことができる。
【０６３６】
即ち、解体処理を適切な工程により行えるものであり、そのまま再利用し得るスペーサ等の構成部材を破損することなく回収することができる。その結果、再資源化を好ましく図ることができる。
【０６３７】
［発明の効果１０］ 本発明によれば、廃棄ＦＰＤを解体処理する際に、液体中処理によってガラス基板から鉛などの成分を分離する工程において、多数のガラス基板をまとめてから一括して処理することができるため、▲１▼処理液の必要量が少ない、▲２▼処理に必要なエネルギーが小さい、▲３▼短時間に多量のガラスの処理が可能である、という効果があり、その結果、廃棄ＦＰＤの処理にかかるコストを大幅に減少させることが可能となる。
【０６３８】
［発明の効果１１］ 本発明によれば、この種のフラットパネルディスプレイにおいて蛍光体を回収する際、蛍光体回収作業時のフェースプレート固定治具および固定方法を工夫するとともに、蛍光体回収に使用されるブラシを固定治具の位置情報に基づき駆動制御することで、蛍光体を極めて効率よくしかも確実に回収することができる。
【０６３９】
［発明の効果１２］ 本発明によれば、廃棄ＦＰＤを解体処理する際に、液体中処理によってガラス基板から鉛などの成分を分離する工程において、多数のガラス基板をまとめてから一括して液体処理槽で処理することが容易になる。また多数のガラス基板を安全に迅速に搬送することが可能となり、工程を自動化することが容易になる。その結果、廃棄ＦＰＤの処理にかかるコストを大幅に減少させることが可能となる等の利点を有している。
【０６４０】
［発明の効果１３］ 本発明によれば、簡易的な方法で基板表面の残留物や基板内部に拡散した元素を検出するとともに、これらガラス構成元素以外の元素を全て除去することができることから、ガラスを無駄に廃棄することなく、効率よく再利用することが可能となる。
【図面の簡単な説明】
【図１】本発明の解体処理方法により処理されるフラットパネルディスプレイの一例を示す模式図である。
【図２】本発明に係わるフラットパネルディスプレイのうち、表面伝導型電子源ディスプレイの模式図である。
【図３】本発明のフラットパネルディスプレイ解体処理方法における、フラットパネルディスプレイの切断位置を示す平面図である。
【図４】本発明のＦＰＤ解体処理方法の流れ図である。
【図５】本発明の廃棄フラットパネルディスプレイの解体方法の工程を示すフロー図である。
【図６】（ａ）、（ｂ）は本発明の方法においてパネル全体を同時に解体する状態を示す説明図である。
【図７】（ａ）、（ｂ）は本発明の方法においてパネルの一部を残して解体する方法を示す図である。
【図８】（ａ）、（ｂ）は本発明の方法においてパネルの一部を残して解体する方法を示す図である。
【図９】本発明の方法によって解体処理されるＦＰＤとしての表面伝導型電子源ディスプレイ（ＳＥＤ）を概略的に示す斜視図である。
【図１０】本発明で再生されるリアプレートを備えた画像表示装置の一例を模式的に示す一部切欠斜視図である。
【図１１】（ａ）、（ｂ）は本発明のリアプレートの回収、再生方法の工程を示す説明図である。
【図１２】本発明の再生方法で洗浄したリアプレート用基板の一例を示す斜視図である。
【図１３】リアプレート上の電子放出素子を形成する工程を説明するための模式図である。
【図１４】本発明の再生方法で洗浄したリアプレート用基板の他の一例を示す斜視図である。
【図１５】本発明に従ったスペーサ回収方法の一態様を示す図である。
【図１６】本発明方法で使用されるスペーサ回収容器を示し、（Ａ）は平面図、（Ｂ）は断面図である。
【図１７】本発明で使用される他のスペーサ回収容器を示し、（Ａ）は平面図、（Ｂ）は断面図である。
【図１８】本発明に従ったスペーサ回収方法の他の一態様を示す図である。
【図１９】本発明におけるスペーサを示す図である。
【図２０】本発明に従ったスペーサ回収工程の一例を示す図である。
【図２１】本発明に従ったフラットディスプレイパネルの切断方法を示す図である。
【図２２】本発明に従ったスペーサ回収工程の他の一例を示す図である。
【図２３】本発明に従ったスペーサ回収工程の他の一例を示す図である。
【図２４】本発明に従ったスペーサ回収工程の他の一例を示す図である。
【図２５】本発明のディスプレイ装置からの蛍光体の回収方法の工程を示すフローチャートである。
【図２６】公転運動方式のブラシの動作を示す図である。
【図２７】スリコギ運動方式のブラシの動作を示す図である。
【図２８】ブラシ及び吸引器の構成を示す図である。
【図２９】スペーサを用いたディスプレイ装置の斜視図である。
【図３０】本発明の画像表示装置の構成を示す模式図である。
【図３１】本発明の画像表示装置の一例を示すＦＰＤの模式図である。
【図３２】本発明の画像表示装置の一例を示すＳＥＤの模式図である。
【図３３】本発明に従ったフラットディスプレイの１態様を示す図である。
【図３４】本発明に従ったフラットディスプレイの解体方法の１態様を示す図である。
【図３５】本発明に従ったフラットディスプレイの解体方法の別の１態様を示す図である。
【図３６】本発明に従ったフラットディスプレイの解体方法の別の１態様を示す図である。
【図３７】本発明における電子放出素子の一例を示す図である。
【図３８】本発明に従ったフラットディスプレイの製造方法の１態様を示す図である。
【図３９】本発明に従ったフラットディスプレイの解体方法の別の１態様を示す図である。
【図４０】本発明に従ったフラットディスプレイの解体方法の別の１態様を示す図である。
【図４１】本発明の一実施形態を示す残留有害金属量の検査装置の構成図である。
【図４２】図４１に示す残留有害金属量の検査装置による検査処理を順に説明するフローチャートである。
【図４３】フラットパネルディスプレイを一部分解して示す斜視図（ａ）及びその断面図（ｂ）である。
【図４４】本発明の第１実施形態を示し、フラットパネルディスプレイの解体装置の構成を示す斜視図（ａ）及びその平面図（ｂ）である。
【図４５】図４４の保持台及び支持手段を示す側面図である。
【図４６】図４４の搬送手段を示す正面図（ａ）及びその側面図（ｂ）である。
【図４７】図４４の搬送手段の他例を示す正面図（ａ）及びその側面図（ｂ）である。
【図４８】図４４のスペーサ回収治具を示す側面図である。
【図４９】図４４のスペーサ回収治具の他例を示す側面図である。
【図５０】図４４に示すフラットパネルディスプレイの解体装置による解体工程を順に説明するフローチャートである。
【図５１】本発明の第２実施形態を示し、フラットパネルディスプレイの解体装置の構成を示す斜視図（ａ）及びその平面図（ｂ）である。
【図５２】本発明のＦＰＤ解体処理方法における、液体処理槽の構成例を示す模式図である。
【図５３】本発明のＦＰＤ解体処理方法を説明するための流れ図である。
【図５４】本発明における蛍光体回収処理の基本工程を示す図である。
【図５５】本発明に係る可動絞り式治具の構成例を示す平面図および側面図である。
【図５６】本発明に係るフェースプレートおよびリアプレートの分離工程を示す斜視図である。
【図５７】本発明に係る回収ブラシの構成作用を示す図である。
【図５８】本発明におけるフラットパネルディスプレイから蛍光体を回収する工程を示す図である。
【図５９】本発明のＦＰＤ解体処理方法に係るガラス板保持機構を説明する図である。
【図６０】本発明のＦＰＤ解体処理方法に係る液体処理槽の構成を示す模式図である。
【図６１】本発明のＦＰＤ解体処理方法の工程例を示すフローチャートである。
【図６２】本発明のフラットディスプレイの解体処理工程を示す流れ図である。
【図６３】本発明のガラス基板表面に存在する元素を検出する蛍光Ｘ線分析装置を示す模式図である。
【図６４】本発明の全反射蛍光Ｘ線分析装置における試料表面と検出器の相対位置を示す模式図である。
【図６５】本発明の全反射蛍光Ｘ線分析装置における１次Ｘ線の照射領域を示す模式図である。
【図６６】本発明の全反射蛍光Ｘ線分析装置における蛍光Ｘ線の検出領域を示す模式図である。
【図６７】本発明のガラス基板表面の研磨装置を示す模式図である。
【図６８】本発明に用いることのできる電子放出素子の平面図と断面図である。
【図６９】本発明に用いられる電子放出素子のフォーミング時の印加電圧波形図である。
【符号の説明】
１ リアプレート
２ フェースプレート
３ 枠
４ スペーサ
５ フリットガラス
６ 硝酸液槽
１１ 表面伝導型電子源
１２ Ｘ方向素子配線（上配線）
１３ Ｙ方向素子配線（下配線）
１５ 画像表示装置
２ａ ガラス基板（フェースプレート基板）
２ｂ 蛍光面
２ｃ メタルバック
２１ テフロン（登録商標）製網目籠
２２ 処理槽
２３ 硝酸液
２５ 純粋洗浄液
３１ テフロン（登録商標）製支持台
４１ リアプレート基板
４２、４３ 素子電極
４５ 層間絶縁層
４６ 切り欠き
４９ 導電性膜
５０ フラットパネルディスプレイ
５４，２４０ 支持手段（第一支持手段）
５５ 制御部
５６ 真空排気装置（吸引手段）
５７ 保持台
６０ ステージ
６１ 柱
６２ 押え治具
６３ アーム
７０ 負荷回避治具
７１，７２ スペーサ回収治具（第二支持手段）
７３ 酸性液浸漬槽（スペーサ回収手段）
７４ 熱処理炉（スペーサ回収手段）
８１ 液体処理槽
８２ 処理されるガラス基板
８３ 処理液
８４ 処理液流動手段
８５ 加熱用ヒーター
８６ 処理液再生手段
８７ 超音波印加手段
３００，３０１ 搬送手段
１００，１２０ 浸漬浴槽
１０１，１２１，１２６ 配管
１０２ 回収浴槽
１０３，１２２ 開閉バルブ
１０４，１２３ 液送ポンプ
１０５ 搬送コンベア
１０６ 網かご
１１０ 洗浄浴槽
１２４ 切替えバルブ
１２５ 超音波振動子
１３０ 鉛溶出回収部（第一溶出手段）
１３１ 洗浄部（洗浄手段）
１３２ 残留鉛溶出部（第二溶出手段）
１３３ 残留鉛定量部（定量検出手段）
１４８ 凹部
１４９ 凹型容器
１５０ 弾力材
１５１ 硝酸液槽
１５２ 硝酸溶液
１５３ フェースプレート
１５４ スペーサ
１５５ スペーサ収納容器
１５６ フェースプレートの支持材
１５７ フリット
１５８ フェースプレートの支持台
１５９ スペーサの支持アーム
１６０ アーム先端部
１６１ スペーサ基材
１６２ 導電膜
１６３ リアプレート
１６４ 枠
１６５ 純水
１６６ 温風
１６７ スペーサ収納容器
１６８ 収納容器用支持台
１６９ 電子源基板
１７０ 冷陰極素子
１７１ ブラシ部
１７２ 吸引孔
１７３ 吸引機構
１７４ 吸引器
１７５ タービン
２０１ 画像表示部
２０２ 気密容器
２０３ 耐大気圧構成部材
２０４ 排気装置に接続する手段
２０５ 徐々に大気圧に戻す手段
２２１ 電子放出素子
２２２ リアプレート
２２３ 画像形成部
２２４ フェースプレート
２２５ 支持枠
２２６ スペーサ
２２７ 第１のフリットガラス
２２８ 第２のフリットガラス
２２９ 第３のフリットガラス
２３０ 蛍光膜
２３１ メタルバック
２３２ ガラス基板
２３３ 電子放出部
２３４ 電子放出部を含む薄膜
２３５、２３６ 素子電極
２３７ 液槽
２３８ 容器
２３９ フリットガラス溶解液
２４０ フリット塗布箇所
２６０ フラットパネルディスプレイ
２６１ 作業台（基台）
２６２ 吸引チャック
２６２ａ 吸引孔
２６３ シール
２７０ 可動絞り式固定治具
２７０ａ，２７０ｂ，２７０ｃ，２７０ｄ 治具
２７１ 吸盤
２７２ カッタ
２７３ ブラシ
２８２ ガラス板保持装置
２８６ ガラス板
２８７ 支持部材
３０１ ガラス基板の支持台
３０２ ガラス基板
３０３ Ｘ線光源
３０４ モノクロメータ
３０５ １次Ｘ線
３０６ 蛍光Ｘ線
３０７ 半導体検出器
３０８ 冷却装置
３０９ プリアンプ
３１０ アンプ
３１１ マルチチャンネルアナライザ
３１２ コンピュータ
３１３ １次Ｘ線の入射角
３１４ 半導体素子
３１５ Ｘ線透過窓
３１６ コリメータ
３２１Ｒ，３２１Ｌ，３２２Ｒ，３２２Ｌ 吊り棒
３２１Ｒ１，３２１Ｌ１，３２２Ｒ２，３２２Ｌ２ ツメ部
３２７ ガラス基板の支持台
３２８ ガラス基板
３２９ 研磨具
３３０ 回転支持棒
３３１ 支持アーム
３３２ モータ
３３３ 支柱
３３４ 研磨面[0001]
[Explanation of headings of description of the present invention]
The contents of the present invention will be described in the following order. The subscripts for each of the issues, solutions, embodiments, and examples correspond to each other.
[0002]
(1) Conventional technology
(2) Problems to be solved by the invention Problems 1 to 13
(3) Means for solving the problem Means 1 to 13
(4) Embodiments of the Invention Embodiments 1 to 13
(5) Example Examples 1 to 13
(6) Effects of the Invention Effects 1 to 13 of the Invention
[0003]
TECHNICAL FIELD OF THE INVENTION
According to the present invention, in order to promote the global environment, two substrates using glass as a main constituent material, that is, a face plate (front glass substrate) and a rear plate (rear glass substrate) are fritted through a frame. A method of dismantling a flat panel display having a structure hermetically bonded by glass or the like for disposal, reuse of the flat panel display, and among the metal elements used for this, it is a harmful metal element A method of separating and recovering lead and effectively reusing other noble metal elements and rare earth elements, a method of disassembling an image forming apparatus welded by frit glass and regenerating its face plate and rear plate, a method of collecting and reusing spacers Method, flat display device or C that emits light by irradiating electron beam or ultraviolet light to the phosphor coated portion Method for recovering phosphor from T (Cathode Ray Tube), method for manufacturing display device, image display device suitable for disassembly, disassembly, and reuse, amount of residual harmful metal for inspecting amount of harmful metal contained in waste, etc. And a method and an apparatus for collecting a phosphor in a flat display panel.
[0004]
[Prior art]
Conventionally, most of the discarded home electric appliances have been shredded, and after collecting valuables such as metals, the rest has been thrown away as "industrial waste" in a "stable disposal site" which can be buried in a burrow.
[0005]
In recent years, environmental pollution due to harmful substances has become a problem along with the growing shortage of capacity at disposal sites. For example, lead-containing glass is often used for CRTs for televisions, but the Environment Agency estimates that 20,000 tons of lead are contained in discarded CRTs annually, most of which are landfilled in stable landfills. Have been. However, it has been recognized that rainwater permeates naturally in a stable disposal site and that there is no drainage facility, so that lead, which is a harmful substance, may diffuse.
Under such circumstances, the conventional processing method needs to be reviewed. With regard to CRTs for televisions, an empirical study has been conducted by the Japan Home Appliances Association to convert the CRT glass into cullets (glass pieces) and reuse them again for CRTs. Among them, a system has been developed in which a cathode ray tube is taken out of a television body and made into a glass cullet (for example, see “Electronic Technology”, November 1997).
[0006]
For example, a method of recovering glass as cullet is disclosed in Japanese Patent Application Laid-Open No. Sho 61-50688. There is also known an example in which a CRT glass is culletted (glass pieces) and reused again for the CRT (Japanese Patent Laid-Open No. 9-193762). Further, a method of separating a cathode ray tube from a face plate portion and a funnel portion for each material and forming it into a cullet is disclosed in Japanese Patent Application Laid-Open No. 05-185064. Further, a method of separating a cathode ray tube into a face plate portion and a funnel portion, separating the phosphor and the black mask from the face plate portion, and then regenerating the face plate is disclosed in Japanese Patent Application Laid-Open No. 7-037509.
[0007]
In order to reuse CRT glass, it is necessary to separate and process panel glass and funnel glass containing lead. This is because if a predetermined amount or more of lead is mixed into the panel glass, a browning phenomenon occurs, so that the glass mixed with lead cannot be reused as a raw material for the panel glass. For this purpose, first, there is a step of separating into a panel portion and a funnel portion. This includes a method of cutting by defining a position (Japanese Patent Application Laid-Open No. Hei 9-115449) and a frit glass for joining the panel portion and the funnel portion. Has been proposed (Japanese Patent Laid-Open No. 7-45198).
[0008]
As a technique for separating a funnel portion and a panel portion fused with frit glass, for example, JP-A-5-151898, JP-A-7-029496, JP-A-9-200654, and JP-A-9-200657. There is known a technique for separating a funnel portion and a panel portion by using thermal strain during heat treatment disclosed in a gazette or the like.
[0009]
On the other hand, in recent years, research for applying cold cathode devices has been actively conducted. As the cold cathode device, a surface conduction type emission device, a field emission type device, a metal / insulating layer / metal type emission device, etc. are known, and an electron emission can be obtained at a lower temperature than a hot cathode device. Therefore, a heater for heating is not required, the structure is simpler than that of the hot cathode element, and a fine element can be formed. Further, even when a large number of elements are arranged on a substrate at a high density, problems such as thermal melting of the substrate hardly occur. In addition, the hot cathode element operates by heating of the heater, so that the response speed is slow, whereas the cold cathode element has another advantage that the response speed is fast.
[0010]
Among the cold cathode devices, particularly, the surface conduction electron-emitting device has an advantage that a large number of devices can be formed over a large area because of its simple structure and easy manufacture. Therefore, as disclosed in, for example, JP-A-64-31332 by the present applicant, a method for arranging and driving a large number of elements has been studied.
[0011]
As for applications of the surface conduction electron-emitting device, for example, image forming apparatuses such as image display apparatuses and image recording apparatuses, and charged beam sources have been studied.
[0012]
In particular, as an application to an image display device, for example, as disclosed in US Pat. No. 5,066,883, JP-A-2-257551 or JP-A-4-28137, An image display device using a combination of a mold emitting element and a phosphor that emits light by irradiation with an electron beam has been studied. An image display device using a combination of a surface conduction electron-emitting device and a phosphor is expected to have better characteristics than other conventional image display devices. For example, compared to a liquid crystal display device that has become widespread in recent years, it can be said that it is excellent in that it does not require a backlight because it is a self-luminous type and that it has a wide viewing angle.
[0013]
A method of driving a large number of field emission devices is disclosed in, for example, US Pat. No. 4,904,895. Further, as an example in which the FE type is applied to an image display device, for example, R.F. The flat display reported by Meyer et al. Is known [R. Meyer: “Recent Development on Micro-tips Display LETI”, Tech. Digest of 4 ^th Int. Vacuum Micro-electronics Conf. , Nagahama, pp. 6-9 (1991)].
[0014]
An example in which a number of metal / insulating layers / metal-type emission elements are arranged and applied to an image display device is disclosed in, for example, JP-A-3-55738.
[0015]
Among the image forming apparatuses using the above-described electron-emitting devices, a flat display having a small depth has been attracting attention as a replacement for a cathode-ray tube display because it is space-saving and lightweight.
Further, the inside of the airtight container in the image forming apparatus is maintained at a vacuum of about 10 −6 Torr, and as the display area of the image display device increases, the pressure difference between the inside and the outside of the airtight container increases. A means for preventing deformation or destruction of the rear plate and the face plate is required. The method of increasing the thickness of the rear plate and the face plate not only increases the weight of the image display device, but also causes image distortion and parallax when viewed from an oblique direction. On the other hand, it is general that a spacer made of a relatively thin glass plate and having a conductive film formed on its surface to prevent charging is provided.
Flat displays, including fluorescent display (VFD), plasma display (PDP), surface conduction electron source display (SED), etc., in addition to the above-described field emission type electron source display (FED) and MIM type display, are omitted. Because of its space and light weight, it has attracted attention as a replacement for CRT display devices, and much research and development has been conducted.
[0016]
For example, the present applicant has made some proposals regarding an electron source in which a large number of surface conduction electron-emitting devices, which are a kind of cold-cathode type electron-emitting devices, are arranged on a substrate, and an image display device using the same. .
[0017]
The configuration of the surface conduction electron-emitting device and the configuration of an image display device using the same are described in detail in, for example, JP-A-7-235255, and will be briefly described.
[0018]
FIGS. 68A and 68B show an example of the configuration of a surface conduction electron-emitting device. 411 is a base, 412 and 413 are a pair of device electrodes, and 414 is a conductive film, which has an electron-emitting portion 415 in a part thereof and constitutes an electron-emitting device 416.
[0019]
As a method for forming the electron-emitting portion 415, a method in which a voltage is applied between the pair of element electrodes 412 and 413 to deform, alter, or destroy a part of the conductive film to increase resistance. This is referred to as “energization forming processing”. In order to form an electron-emitting portion having good electron-emitting characteristics by this method, it is preferable that the conductive film is formed of conductive fine particles. Examples of the material include PdO fine particles. The voltage applied in the energization forming process is preferably a pulse voltage, and a method of applying a pulse having a constant peak value as shown in FIG. 69 (a) or a gradually increasing peak value as shown in FIG. 69 (b) Any of the methods of applying the applied pulse can be applied.
[0020]
In order to form a conductive fine particle film, it is possible to directly deposit conductive fine particles by a gas deposition method. However, a solution of a compound containing a constituent element of the conductive film (for example, an organometallic compound) is applied. A method of forming a desired conductive film by heat treatment or the like is a desirable method because a vacuum device is not required, the manufacturing cost is low, and the method is easily applicable to forming a large electron source. Further, as a method of applying the solution of the organometallic compound, a method of applying only a necessary portion using an ink jet device is more preferable because an extra step for patterning a conductive film is not required. is there.
[0021]
After forming the electron-emitting portion, a pulse voltage is applied between the device electrodes in an appropriate atmosphere containing an organic substance (this is referred to as an “activation process”), whereby carbon is removed from the electron-emitting portion and the vicinity thereof. A deposited film containing a main component is formed, the current flowing through the element increases, and the electron emission characteristics also improve.
[0022]
Next, a step called “stabilization treatment” is preferably performed. This is a process in which the evacuation is continued while heating the vacuum container and the electron-emitting device, thereby sufficiently removing organic substances and the like and stabilizing the characteristics of the electron-emitting device.
[0023]
A method of forming such a conductive film of an electron source using a surface conduction electron-emitting device using an ink-jet device is disclosed in Japanese Patent Application Laid-Open No. 8-273529.
[0024]
The inkjet device will be briefly described. There are two main types of ink-jet devices that eject ink. The first method is a method of discharging liquid droplets by a contraction pressure of a piezo element provided in a nozzle, which is called a piezo jet method. In this method, a thin film of a conductive material is stored in an ink reservoir, and a predetermined voltage is applied to an electric signal input terminal, whereby the cylindrical piezo contracts and the liquid is discharged as droplets.
[0025]
The second method is a method in which a liquid is heated and foamed by a heating resistor, thereby discharging droplets, and is called a bubble jet (registered trademark) method. In an ink jet apparatus using the bubble jet (registered trademark) method, a heating resistor generates heat and a liquid foams, whereby a droplet is ejected from a nozzle.
[0026]
Using the above-described inkjet apparatus, a solution of an organometallic compound is applied only to predetermined positions as droplets and dried, and then the organometallic compound is thermally decomposed by a heat treatment to obtain a metal or metal oxide. Is formed.
FIG. 1 shows an example of the configuration of an image display device. In FIG. 1, reference numeral 1 denotes a rear plate, 2 denotes a face plate in which a fluorescent film 2b and a metal back 2c are formed on the inner surface of a substrate 2a, and 3 denotes a support frame, and the rear plate 1, the support frame 3 and the face plate 2 The image display device 15 is formed by sealing and sealing with frit glass.
[0027]
The flat panel display having the above-described configuration is expected to increase in size and dramatic increase in production in the future. Further, in these flat panel displays, the frit glass used for sealing contains lead, and the phosphors 2b and the spacers 4 forming the image forming member are high cost members. As in the case of glass, establishment of a recovery system has become an important issue in terms of "detoxification", "volume reduction", and "recycling".
[0028]
[Problems to be solved by the invention]
Hereinafter, the problems to be solved by the present invention will be described in the following order, and the solving means, the embodiments, and the examples will be described in the order.
[0029]
[Problem 1] Since the structure of the FPD is different from that of the cathode ray tube, another processing method is required. That is, the FPD has a structure in which two substrates using glass as a main constituent material, that is, a face plate and a rear plate, are hermetically bonded by frit glass via a frame. Generally, frit glass having a high lead component is used so that low-temperature firing can be performed.
[0030]
For the same reason as a cathode ray tube, in order to reuse glass, it is necessary to separate and treat the lead-free glass and the lead-containing glass. Further, a step of removing lead is required when reusing members other than glass.
[0031]
The present invention has been made to solve the above problems, and an object of the present invention is to provide a processing method for facilitating reuse of discarded FPD.
[0032]
[Problem 2] Another object of the present invention is to provide a disassembly method including a method for separating and recovering lead, which is a harmful metal, and a method for recovering and reusing rare elements such as noble metal elements and rare earth elements.
[0033]
[Problem 3] Further, when the flat display is discarded due to the occurrence of a defect in the manufacturing process or the elapse of the service life, if the entire display is shredded and discarded, the discard amount increases. In recent years, there has been a social demand for controlling the generation of waste accompanying industrial activities as much as possible, and the reuse of components has become a highly urgent issue.
[0034]
Further, when a harmful element or the like is contained in the constituent material, it is necessary to separate and treat the harmful element. Further, an expensive substrate is often used for a rear plate having electron-emitting devices that influence the performance of an image display device in order to obtain uniform device characteristics. Above all, the element electrode formed first on the rear plate substrate often uses a strong material that can withstand the subsequent steps.
[0035]
The present invention has been made to solve the above problems, and an object of the present invention is to provide a disassembly method for facilitating reuse of a rear plate, which is an important component of a discarded image display device. It is. Another object of the present invention is to provide a method for separating and recovering elements such as lead contained in a constituent material. Another object of the present invention is to efficiently form a conductive film including electron-emitting portions of a plurality of electron-emitting devices at the time of rear plate reproduction with a minimum amount of raw materials.
[0036]
[Problem 4] In addition, when a flat display is discarded due to a defect in a manufacturing process or a lapse of service life, shredding the entire display and discarding involves a relatively expensive member in a constituent material. It is not economically favorable because it is done. In particular, the above-described spacer is a component that is used in a large number of panels, and requires extremely thin manufacturing cost and time because it requires thinning of glass and formation of a conductive film. Further, even if the display is discarded for some reason, it is extremely rare that the cause is a defective spacer, and there is often no problem in reusing the display.
[0037]
For this reason, when the flat display is discarded, it is desired to separate and collect the spacer from other members for reuse.
[0038]
However, as described above, since the spacer has a thin plate shape and is made of glass as a substrate, there is a concern that the spacer may be damaged during disassembly of the display, so that the spacer can be collected without being damaged. The development of a method is desired.
[0039]
[Problem 5] Further, recovery of rare earth elements from display devices discarded after use has hardly been performed.
[0040]
This is because (1). The amount of rare earth elements used per display device is small and difficult to recover (2). Since the rare earth element is used not in a simple substance but in the form of a compound or an alloy, the isolation is costly. (3). Relatively inexpensive imported rare earth elements can be obtained at lower cost due to the strong yen.
[0041]
However, from the viewpoints of environmental protection and stable supply of rare element resources, it is desired to promote the recycling of these materials, and a method for recovering rare earth elements from industrial products is an important issue. Note that the rare earth element is mainly contained in the phosphor.
[0042]
Further, chromium and sulfur elements are also contained in the phosphor, and their recovery is also desired from the viewpoint of environmental conservation.
[0043]
On the other hand, the face plate from which the phosphor has been recovered by the conventional method has almost no smoothness on the inner surface. For this reason, conventionally, a method has been adopted in which cullets are formed and buried in a stable disposal site, or reused as a glass material. Furthermore, a method of regenerating the inner surface smoothness by acid treatment or the like and reusing it as a face plate without culleting has been recently devised. However, stable landfills are becoming saturated and are no longer an effective method. Further, since the acid treatment is a wet treatment, it is not preferable in terms of cost and working environment.
[0044]
The present invention has been made in view of the above-described circumstances, and efficiently collects a phosphor contained in a display device, and recovers a face plate while maintaining or smoothing the inner surface while maintaining the smoothness. And provide a method for reuse.
[0045]
[Problem 6] In order to disassemble, disassemble, and reuse an image display device having an airtight container maintained at a pressure lower than the atmospheric pressure, it is necessary to return the inside of the airtight container to the atmospheric pressure. When the pressure is set to the atmospheric pressure, as the pressure difference between the inside of the hermetic container and the inside of the hermetic container increases, gas such as air flows into the hermetic container rapidly, often damaging the inside of the hermetic container or destroying the hermetic container. In addition, unexpected destruction occurs and fragments are scattered around, which is not preferable in terms of safety. In addition, when the CRT was culletted and reused as a glass material, this did not pose a major problem. However, considering the maximum reuse of each member of the image display device, such destruction is a problem in resource conservation. From a viewpoint, it not only increases waste such as garbage, but also wastes energy and labor. In particular, in the FPD, since many atmospheric pressure resistant components such as spacers are provided inside the container, these components are severely damaged, and not only the atmospheric pressure resistant components are damaged, but also the damaged components are airtight of the image display device. The inside of the container was damaged and damaged, and the reuse of these members was significantly hindered. In addition, spacers occupy a large cost compared to other members, such as uniform side faces and uniform coating of a film with conductivity according to the specifications of the image display device to prevent image disturbance. It is a member that is.
[0046]
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to smoothly return an image display device to an external pressure in a vacuum-exhausted airtight, thereby reassembling members when disassembling and disassembling the image display device. It makes use possible.
[0047]
[Problem 7] In addition, when a flat display is discarded due to the occurrence of a defect in a manufacturing process or the elapse of a service life, it is environmentally problematic to shred the entire display and discard it. This is not economically desirable because it includes relatively expensive members. For example, a large number of spacers are used in a panel, and the production thereof requires thinning of glass, formation of a conductive film, and the like, which requires a production cost and time. In the rear plate, the face plate, and the support frame, it is also possible to reuse a part that needs repair according to the situation after performing an appropriate process.
[0048]
For these reasons, when disassembling the flat display due to the occurrence of defects in the manufacturing process and the elapse of the service life, it is desirable to recover and reuse the members without damage and efficiently recover resources. It is rare.
[0049]
Therefore, an object of the present invention is to provide a method for disassembling a flat display into each component by a safe and simple method, and to provide a flat display panel having a configuration suitable for such disassembly.
[0050]
[Problem 8] Also, in the dismantling and sorting of cathode ray tubes and flat panel displays, etc., the amount of harmful metals in the remaining waste from which the sorting materials have been collected for reuse is determined due to the aforementioned problems of environmental pollution and destruction. It is necessary to inspect and confirm that the residual amount is below the allowable value. Also, there is a demand for quantitatively knowing the residual amount of lead (hazardous metal) from the necessity to separate the separation member for reuse depending on the presence or absence of lead as in the above-mentioned CRT glass.
[0051]
Here, in order to detect lead in a member, for example, a method of inspecting with a fluorescent X-ray or the like is known. However, since it is necessary to scan the entire surface of the member to be inspected, the inspection target such as culletized glass is used. When the number is large, it is troublesome, the object to be examined is limited, and quantitative detection cannot be performed, so that application is difficult.
[0052]
Therefore, the present invention has been made in view of such a conventional problem, and when disassembling and sorting a flat panel display or the like, a harmful metal such as lead remaining on a sorting member made of glass and an inspection target such as waste. An object of the present invention is to provide an inspection device for the amount of residual harmful metals that can quantitatively detect the amount, can inspect various members without particular limitation, and can easily perform the quantitative detection without any trouble. I do.
[0053]
[Problem 9] In the flat panel display, a technology of dismantling processing for recycling is still under development, and a conventionally known related technology cannot be used as it is. For example, when the technique of disassembling CRT glass disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 9-193762 is used, the weight of the rear plate or the face plate is loaded when the spacer 4 is separated. This is not applicable to dismantling flat panel displays.
[0054]
Therefore, the present invention has been made in view of such a conventional problem, and the dismantling process can be performed by an appropriate process, and constituent members such as spacers that can be reused as they are can be collected without damaging them. It is an object of the present invention to provide a flat panel display disassembly device which can preferably achieve the following.
[0055]
[Problem 10] Further, since the structure of the FPD is different from that of the cathode ray tube, another processing method is required. The above FPD has a structure in which two substrates using glass as a main constituent material, that is, a face plate and a rear plate, are hermetically bonded by frit glass via a frame. Generally, a frit glass having a large lead component is used so that it can be fired at a low temperature. In addition to the frit glass, lead may be contained in a wiring material or a constituent material of the face plate in some cases. In the case of the FPD, for the same reason as in the cathode ray tube, it is necessary to separate and process lead-free glass and lead-containing glass in order to reuse the glass. Further, a step of removing lead is required when reusing members other than glass.
[0056]
In order to remove lead, it is effective to selectively dissolve and separate the lead component using an aqueous solution of an acid or an alkali. Performing this method on a large scale requires a large amount of aqueous solution for dissolving lead and a large amount of water for the subsequent washing step. Also, a lot of energy has to be input to heat and flow the liquid. As a result, there is a problem that the processing cost increases.
[0057]
The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for processing discarded FPDs at a low cost.
[0058]
[Problem 11] Rare earth elements have hardly been recovered from displays disposed after use. This is because (1). The amount of rare earth elements used per display is small, it is difficult to recover them, and automation is not advanced. (2). Since the rare earth element is used not in a simple substance but in the form of a compound or an alloy, the isolation is costly. (3). Relatively inexpensive imported rare earth elements are available less expensively due to the strong yen. And the like.
[0059]
However, it is necessary to promote the recycling of these materials from the viewpoint of environmental protection and stable supply of rare element resources, and a method of recovering rare earth elements from industrial products has become an important issue. As for CRTs, some home appliance manufacturers have started the collection business, and there is an increasing demand for urgent promotion of recycling of flat panel displays.
[0060]
In view of such circumstances, an object of the present invention is to provide a method and an apparatus for collecting a phosphor that can be efficiently and simply disassembled in a flat panel display, and can particularly effectively collect a phosphor.
[0061]
[Problem 12] Further, since the structure of an FPD (flat panel display) is different from that of a cathode ray tube, another processing method is required. That is, the FPD has a structure in which two substrates using glass as a main constituent material, that is, a face plate 2 and a rear plate 1 are hermetically bonded by frit glass via a frame. Generally, a frit glass having a large lead component is used so that it can be fired at a low temperature. Further, in addition to the frit glass, lead may be contained in the wiring material or the constituent material of the face plate in some cases. In the case of the FPD, for the same reason as in the cathode ray tube, it is necessary to separate and treat lead-free glass and lead-containing glass in order to reuse the glass. Further, a step of removing lead is required when reusing members other than glass.
[0062]
In order to remove lead, a method of selectively dissolving and separating the lead component using an aqueous solution of an acid or an alkali (treatment in liquid) is effective. Performing this method on a large scale requires a large amount of aqueous solution for dissolving lead and a large amount of water for the subsequent washing step. Also, a lot of energy must be applied to heat and flow the liquid. Therefore, in order to reduce costs and perform processing in a short period of time, it is necessary to collect a large number of glass plates obtained by dismantling waste FPDs, put them into a liquid processing tank, and perform processing. In order to quickly transport the glass sheets, a transport mechanism for simultaneously transporting a large number of glass plates is required.
[0063]
The present invention has been made in view of the above circumstances, and has as its object to provide a substrate processing method and apparatus that realizes efficient and accurate in-liquid processing.
[0064]
[Problem 13] When the substrate glass is reused, the rear plate 1 and the face plate 2 are separated from other members. Then, after removing the wiring and elements formed on the substrate and returning to the state of glass alone, reuse it as a substrate as it is, or once cullet and then use it as a raw material for glass for substrates or other products It can be reused.
[0065]
However, materials such as wiring, electron-emitting devices, and frit glass are formed on the glass substrate as described above, and a thin film is formed on the surface in advance when using blue glass as the substrate as described above. In some cases. Some of these materials have extremely high adhesion to the glass substrate, or some of the elements can diffuse gradually into the glass substrate, making it difficult to completely separate them from the substrate glass. There are things.
[0066]
Further, when used glass is once culleted and reused, if elements other than glass constituent elements are mixed in the culletted glass, the physical properties and color of the glass are affected. Therefore, the glass mixed with the impurity element may not be reused. Further, even in the case where the glass substrate is reused as it is, it is desired that the glass substrate be returned to a state as close as possible to the initial glass substrate.
[0067]
The present invention has been made in view of the above circumstances, and has as its object to provide a method of processing a glass substrate that realizes effective and efficient reuse of substrate glass.
[0068]
[Means for Solving the Problems]
Means for solving the problems of the present invention will be described in the order corresponding to the problems to be solved by the above-described inventions.
[0069]
[Solution 1] In order to achieve the above object, the present invention provides a method in which two substrates using glass as a main constituent material, that is, a face plate and a rear plate, are hermetically joined by frit glass via a frame. In the method for disassembling an FPD having a certain structure, a portion of a frame joined by frit glass is separated from other portions.
[0070]
Further, the present invention provides a disassembly method of an FPD having a spacer inside and a fluorescent screen on an inner surface of a face plate, wherein when a frame portion joined by frit glass is separated, a spacer and a fluorescent It is characterized in that the surface remains.
[0071]
Further, the present invention is characterized in that a part of the frame joined by the frit glass is separated from other parts by cutting a part of the face plate and the rear plate.
[0072]
In the present invention, the means for determining the cutting position is constituted by means (video camera) for detecting the position of the frame portion joined by the frit glass.
[0073]
[Solution 2] In order to achieve the above object, the present invention provides a method in which two substrates using glass as a main constituent material, that is, a face plate and a rear plate are hermetically joined by frit glass via a frame. In a FPD having a certain structure, the joint is dissolved in nitric acid and peeled off. Further, the present invention may have a spacer internally bonded by frit glass.
As a method of dissolving the frit glass in nitric acid, it is necessary to allow the nitric acid to penetrate deep into the frit joint. Therefore, a method of dipping the nitric acid in nitric acid is safe and easy. Although this method is used in the present invention, there is another method such as a method of spraying nitric acid with a nozzle on the joint portion, and the method is not limited thereto.
The frit joints to be dissolved in nitric acid are: (1) a method in which all the joints are immersed in nitric acid to dissolve and peel off, each part is separated, discarded and reused; and (2) a part to be reused is eroded with acid. It can be broadly divided into a method of immersing the other part in nitric acid, dissolving and stripping it, and discarding it. In either method, of the metal components dissolved in nitric acid, only harmful lead components can be separated, and other elements can be recovered and reused.
[0074]
[Solution 3] In order to achieve the above object, a rear plate reproducing method according to the present invention provides a rear plate provided with a plurality of electron-emitting devices each including a pair of device electrodes and a conductive film, and electrons emitted from the electron-emitting devices. An image display in which at least a face plate provided with an image forming member on which an image is formed by collision, a support frame connecting the rear plate and the face plate and maintaining an internal pressure, and these are welded with frit glass This is a method of collecting and reusing a rear plate including a step of dissolving a frit glass by immersing a welded portion in a nitric acid solution and a step of forming a conductive film by an inkjet method when disposing the apparatus.
[0075]
According to the present invention, the frit glass is chemically dissolved and the rear plate is disassembled without mechanical cutting or the like, so that the rear plate substrate and the device electrodes can be recovered and reused with almost no damage. Is possible, waste can be reduced, resources can be effectively used, and costs can be reduced. Further, elements such as Pb can be easily recovered because they are dissolved in the immersed nitric acid solution. Further, when the rear plate is reproduced, the conductive film is formed by an ink jet method, so that the material for forming the conductive film is used only in a necessary portion, so that the conductive film material may be in a minimum amount. Further, even when a defect is found after the formation of the conductive film, only the defective portion can be re-formed.
[0076]
[Solution 4] The present invention has been made in view of the above demands. That is, the present invention provides a rear plate on which a plurality of electron-emitting devices are disposed, a face plate disposed opposite to the rear plate and provided with an image display unit, a frame portion, and the rear plate and the face plate. A spacer for maintaining a distance between the spacers with respect to the atmospheric pressure, and a method for collecting the spacers in a flat display in which the spacers are welded by frit glass, wherein the spacers are welded to a rear plate or a face plate. A spacer collecting jig for avoiding contact between spacers or between spacers and peripheral members when the frit glass is melted by immersing the portion in a nitric acid solution. Things.
[0077]
The spacer collecting jig used in one embodiment of the present invention is a flat plate having one or more concave portions large enough to accommodate the spacer. In another aspect, a spacer collecting jig has a tip portion capable of sandwiching and holding individual spacers, and an arm portion capable of moving the tip portion in an arbitrary direction.
[0078]
According to the present invention, in the process of disassembling the flat display, the flat display can be recovered with almost no damage to the spacer, so that the flat display can be easily reused, resources can be effectively used, and cost can be reduced. Reduction can be realized. In addition, since fine manual work is not required in the collection process, the collection can be performed safely.
[0079]
[Solution 5] A method for collecting a phosphor from a display device according to the present invention is a method for collecting a phosphor from a display device in which a phosphor is applied to a substrate and the display is performed by causing the phosphor to emit light. The phosphor applied to the substrate is recovered by using a brush and a suction device together.
[0080]
The method of manufacturing a display device according to the present invention is characterized in that the base body from which the phosphor has been removed by using the method for recovering a phosphor from the display device of the present invention is reused for the display device.
[0081]
The present invention relates to a phosphor and a base such as a face plate from a display device in which a phosphor is applied to a base such as a face plate such as a CRT or a flat display device, and the phosphor is emitted by irradiation of an electron beam or ultraviolet rays. Effective for recovery, sweeping the surface of the substrate coated with the phosphor with a brush, sweeping out the phosphor, or the phosphor and the black matrix component, maintaining the smoothness of the substrate surface or regenerating if there is damage, Along with the sweep, the phosphor and black matrix components are suctioned by an aspirator, and the phosphor and the black matrix are further sent to the phosphor separation process, and the base such as a face plate is maintained in a form that does not maintain or impair the surface smoothness. It is carried out of the process and reused as a base such as a face plate.
[0082]
As a flat display device that performs display by emitting light from a phosphor, there are a display device using an electron-emitting device described later and a fluorescent display tube that emits light by a low-speed electron beam, as a method of irradiating an electron beam. As a system using ultraviolet light, a plasma display device can be used. The phosphor is applied to the face plate side of a flat display device when an electron beam or ultraviolet light is emitted from the back surface and visible light is emitted from the surface. When visible light is emitted from the surface irradiated to the body, a phosphor is applied to the rear plate side.
[0083]
[Solution 6] To achieve the above object, an image display device according to the present invention provides a display means for displaying an image, an airtight container, and, if necessary, gradually increasing the pressure inside the airtight container to a pressure outside the airtight container. And means for approaching.
[0084]
Further, the present invention provides the image display device, further comprising an exhaust device, wherein the means for approaching the pressure outside the airtight container is located at a different position of the airtight container from the means connected to the exhaust device. I do. Further, the means for approaching the pressure outside the airtight container is provided with a filter as needed.
[0085]
Further, the present invention requires a display means for displaying an image, an airtight container for maintaining an external pressure, an atmospheric pressure resistant structural member in the airtight container, and means for connecting to an exhaust device for exhausting the inside of the airtight container. Means for gradually bringing the inside of the hermetic container closer to the force outside the hermetic container according to.
[0086]
Since the image display device having the above configuration has a means for gradually returning the inside of the airtight container to the atmospheric pressure, stress due to a change in pressure is hardly applied to the members in the airtight container during disassembly and disassembly.
[0087]
Therefore, the member is not easily broken, and it is possible to prevent the secondary damage due to the broken piece of the member.
[0088]
[Solution 7] The present invention relates to a rear plate on which a plurality of electron-emitting devices are arranged, a face plate arranged opposite to the rear plate and provided with an image display section, a support frame, and a support frame. In a flat display having at least a spacer for maintaining a space between the face plate and the atmospheric pressure, and a flat display in which these are welded by frit glass, joining of the rear plate and the support frame and formation of the face plate and the support frame are performed. A frit glass having a different softening temperature is used for bonding, and a frit glass having a softening temperature equal to or higher than that of a frit glass having a higher softening temperature is used for bonding the spacer and the substrate. It is characterized by having been done.
[0089]
Here, each of the plurality of frit glasses has a softening temperature different from that of the other frit glasses by 20 ° C. or more.
[0090]
Further, the spacer according to the present invention is characterized in that the spacer is bonded to either the rear plate or the face plate.
[0091]
In the flat display disassembly method of the present invention, the panel is heated to a temperature equal to or higher than the softening temperature of the frit glass having the lowest softening temperature and equal to or lower than the softening temperature of the other frit glass, and only the frit glass having the lowest softening temperature is melted to thereby melt the frit. The method is characterized in that only the joints joined by glass are selectively separated, and the same procedure is repeated to sequentially separate the joints using frit glass having a low softening temperature.
[0092]
Here, as a method of separating the bonded portion joined by the frit glass having the highest softening temperature, a method of heating the frit glass to a temperature equal to or higher than the softening temperature and melting and separating the frit glass may be used. A method of dissolving with an appropriate solvent and separating may be used.
[0093]
Further, in a flat display having at least an airtight container storing a substrate on which a plurality of electron-emitting devices are arranged and a substrate provided with an image display unit opposed to the substrate, the substrate and the airtight container May be joined by frit glass having different softening temperatures according to the order of disassembly.
[0094]
Further, a rear plate on which a plurality of electron-emitting devices are disposed, a face plate disposed opposite to the rear plate and provided with an image display unit, and a support frame for supporting between the substrates are at least constituent members. In a flat display in which these components are welded with frit glass, frit glass having a different softening temperature is used for joining the rear plate and the support frame and joining the face plate and the support frame. A flat display characterized by being welded may be used.
[0095]
In a flat display having an envelope in which electron-emitting devices are stored, two types of frit having different softening temperatures are provided at a joint between a rear plate and a support frame and a joint between a face plate and a support frame, which constitute the envelope. Using frit glass having a softening temperature higher than the softening temperature of the two types of frit glass or the same softening temperature as one of the two types of frit glass is used for a joint between the glass and the spacer supporting the substrates and at least one of the substrates. A flat display characterized by being bonded together may be used.
[0096]
Further, upon disassembly of the flat display, the flat display is heated stepwise, and sequentially melted and separated from the joint using the frit glass having a low softening temperature, and disassembled while being separated. It is also a dismantling method.
[0097]
In the flat display of the present invention, since the members forming the envelope can be sequentially separated, the members can be collected in a safe and simple manner without damaging the envelope and the internal members during the disassembly process. Therefore, it is easy to collect the data in a reusable state, and effective use of resources and cost reduction can be realized.
[0098]
[Solution 8] In order to achieve the above-mentioned object, the inspection apparatus for residual toxic metals according to claim 1 of the present invention comprises lead that is disassembled and separated for recycling and is included in inspection targets such as waste. A residual harmful metal amount inspection apparatus for inspecting the amount of harmful metals such as, wherein a first leaching means having an acidic liquid for leaching harmful metals contained in the inspection target in a bath bath in which the inspection target is immersed, An acid solution that elutes the harmful metal remaining in the test object into a washing unit that cleans the test object after being eluted by the elution unit, and a bathtub that immerses the test object after being washed by the cleaning unit; And a quantitative detection means for quantitatively detecting the amount of harmful metals eluted in the acidic solution of the second elution means.
[0099]
In the above-described inspection apparatus for the amount of residual harmful metals, first, when the test object is immersed in the bath of the first elution means, the harmful metal contained in the test object is eluted by the acidic solution in the bath. Next, the test object is sent to the cleaning means for cleaning, and then immersed in the bath of the second elution means, whereby the harmful metal remaining on the test object is eluted by the acidic solution in the bath. Then, when this eluate is sent to the quantitative detection means, the quantitative detection means quantitatively detects the amount of harmful metals contained in the eluate.
[0100]
Therefore, at the time of disassembly and sorting of flat panel displays and the like, it is possible to quantitatively detect the amount of harmful metals such as lead remaining on the inspection object such as the sorting member made of glass and the waste.
[0101]
[Solution 9] In the flat panel display disassembly apparatus of the present invention, a frame member is arranged between a rear plate and a face plate to form a flat vacuum container, and a gap between both plates is held to withstand atmospheric pressure. The flat panel display in which the spacer to be fixed is fixed to both of the plates or one of the plates. A first support means for applying a pulling force to the plate on the side of the second support means, a second support means for receiving and supporting a plate edge on the side fixed to the spacer after separating the frame member, And a spacer collecting means for performing a step of separating the spacer from the plate supported and received by the second supporting means.
[0102]
In addition, the flat panel display disassembly apparatus of the present invention receives the plate of the support from the first support means after performing the step of separating the frame member from the vacuum container, and receives and supports the edge of the plate. Then, a transporting means for transporting this to the second transporting means is provided.
[0103]
Further, in the flat panel display disassembly device of the present invention, the transporting means has a structure in which a load of a plate fixed to the spacer is not applied to the spacer.
[0104]
With the above configuration, the flat panel display disassembly device of the present invention supports the plate on the side fixed to the spacer by applying a pulling force by the first support means in the step of separating the frame member from the vacuum container. Therefore, the spacer is in a suspended state, the weight of the plate fixed thereto is not added, and the frame member can be separated without burden on the spacer.
[0105]
After separating the frame member, the second supporting means receives and supports the plate edge portion on the side fixed to the spacer, so that the spacer is also in a suspended state, and the plate fixed to this is also suspended. Does not add weight. Since the step of separating the spacer from the plate received and supported by the second support means is performed in a state in which the spacer recovery means is in the state of receiving and supporting the spacer, even in the step of separating and recovering the spacer, extra space is not added to the spacer. Weight is not added and the damage can be prevented.
[0106]
[Solution 10] The present invention provides a flat panel having a structure in which two substrates, a face plate and a rear plate, each of which is mainly composed of glass, are hermetically bonded to each other with lead-containing frit glass via a frame. In the disassembly processing method of a display, a step including separating a portion including a face plate and a portion including a rear plate from a flat panel display to be dismantled, and removing the portion including the extracted face plate and the portion including the rear plate. The method is characterized in that it includes a step of separately collecting a plurality of pieces, putting them into a processing tank, and collectively performing a liquid treatment.
[0107]
The present invention is further characterized by:
"The treatment in the liquid is a treatment with an acid or alkali aqueous solution",
"The treatment in liquid is a treatment with an acid or alkali aqueous solution and a subsequent washing treatment with water or an organic solvent."
"Performing the processing in the liquid by flowing the processing liquid in the processing tank"
`` Performing the liquid treatment, circulating the treatment liquid between the treatment tank and the outside ''
"The above treatment in liquid is performed by heating the treatment liquid",
"Performing the above-mentioned in-liquid treatment by propagating vibration or sound waves to the object to be treated".
[0108]
[Solution 11] A flat panel body fixing device of the present invention is a device for fixing a flat panel body formed by joining a pair of opposed panels via a frame portion, and is mounted on a base. A fixing jig arranged so as to be able to advance and retreat with respect to the flat panel body so as to surround the flat panel body, and the fixing jig slides from the periphery of the flat panel body and abuts thereon. It fixes the flat panel body.
[0109]
Further, in the flat panel body fixing device of the present invention, a driving mechanism for moving the fixing jig forward and backward with respect to the flat panel body, and position detecting means for detecting a position of the fixing jig based on a moving amount of the fixing jig, And a control unit capable of controlling the driving mechanism, wherein the size of the flat panel body is detected based on the position information of the fixing jig obtained by the position detection unit. .
[0110]
Further, in the flat panel body fixing device according to the present invention, the flat panel body is provided with a suction chuck means for suction-fixing the flat panel body via a suction hole provided in the base.
[0111]
In addition, the flat panel display phosphor recovery apparatus of the present invention includes a face plate, a rear plate, and a frame portion, wherein the flat panel display is configured to emit light by irradiating the phosphor applied to the face plate with electrons. An apparatus for recovering a phosphor, wherein the apparatus includes the fixing device, and the fixing plate fixes the face plate from all sides.
[0112]
Further, the flat panel display phosphor recovery device of the present invention includes a plurality of processing means for recovering the phosphor from the face plate fixed by the fixing device, and these processing means are the position detection means. The driving is controlled by the control unit based on the obtained position information.
[0113]
In the flat panel display phosphor recovery apparatus of the present invention, the processing unit includes a separation unit for separating a face plate and a rear plate, and a recovery unit for sweeping and suctioning the phosphor of the face plate. It is characterized by having.
[0114]
In the flat panel display phosphor recovery apparatus according to the present invention, the processing of the cutter of the separating unit and the processing of the recovery brush of the recovery unit may be controlled by the control unit such that the processing is performed within a predetermined working range. It is characterized by.
[0115]
Further, the flat panel display phosphor recovery device of the present invention further includes a phosphor detection unit for detecting the amount of the phosphor remaining on the face plate, and the phosphor amount information obtained by the phosphor detection unit is used to determine the amount of the phosphor. The operation of the collection means is controlled.
[0116]
Further, in the phosphor recovery device for a flat panel display according to the present invention, the phosphor amount information is defined by a transmittance or an absorbance of visible light transmitted through the face plate.
[0117]
Further, in the phosphor recovery device for a flat panel display according to the present invention, the phosphor amount information is defined by a fluorescence intensity generated by irradiating the inner surface of the face plate with ultraviolet light or visible light. .
[0118]
In the flat panel display phosphor recovery apparatus according to the present invention, the phosphor detection means moves following the working range of the recovery brush of the recovery means.
[0119]
Further, the method for recovering a phosphor of a flat panel display of the present invention is directed to a flat panel display including a face plate, a rear plate and a frame portion, wherein the flat panel display is configured to emit light by irradiating electrons to the phosphor applied to the face plate. A method for recovering a phosphor, comprising: fixing a flat panel display mounted on a base by sliding a fixing jig from all sides thereof; and a face plate of the fixed flat panel display. And a step of separating the rear plate, and a recovery step of sweeping out and sucking the phosphor of the face plate.
[0120]
Further, the method of recovering a phosphor of a flat panel display according to the present invention is characterized in that the method further includes a step of detecting a position of the fixing jig for fixing the flat panel display based on a moving amount of the fixing jig.
[0121]
Further, the method for collecting a phosphor of a flat panel display according to the present invention is characterized in that the method further includes a step of suction-fixing the flat panel display via a suction hole provided in a base.
[0122]
In the method for recovering a phosphor of a flat panel display according to the present invention, when the face plate and the rear plate are separated, the separating operation by the cutter is adjusted to the dimensions of the face plate based on the position information of the fixing jig. It is characterized by being controlled.
[0123]
In the method of collecting a phosphor of a flat panel display according to the present invention, when collecting the phosphor of the face plate, the collecting operation by the collecting brush is adjusted to the dimension of the face plate based on the position information of the fixing jig. It is characterized by being controlled.
[0124]
In the method of collecting a phosphor of the flat panel display according to the present invention, the method further includes a step of detecting an amount of the phosphor remaining on the face plate, wherein the operation of the collection brush is controlled based on the detected amount of the phosphor. It is characterized by doing so.
[0125]
Further, the method for collecting a phosphor of a flat panel display according to the present invention is characterized in that the method further includes a step of controlling the recovery brush to move following the working range of the recovery brush.
[0126]
According to the present invention, the flat panel display placed on the base is fixed by sliding the fixing jig from all sides. At this time, the position is detected based on the amount of movement of the fixing jig, and this position information is effectively used in subsequent processing steps. That is, when driving a cutter for separating the face plate and the rear plate and a recovery brush for sweeping and sucking the fluorescent material of the face plate, the work range of those is controlled using the positional information of the fixing jig.
[0127]
This makes it possible to recover the phosphor on the face plate extremely efficiently and reliably. In addition, it can effectively cope with a change in the panel size of the flat panel display, and has a very high practical value.
[0128]
[Solution 12] A substrate processing method according to the present invention is a method for disassembling a substrate having a pair of glasses which are hermetically bonded via a frame as a main constituent material, the method comprising: A step of separating the substrates, a step of holding the plurality of separated substrates in parallel and at a fixed gap, and a step of carrying the plurality of held substrates at once and performing a predetermined process. It is characterized by the following.
[0129]
Further, in the substrate processing method of the present invention, the substrate is held such that the surface of the substrate is oriented substantially vertically.
[0130]
Further, in the substrate processing method of the present invention, the substrate is supported by linearly contacting a predetermined portion of the substrate.
[0131]
Further, the substrate processing apparatus of the present invention is an apparatus for disassembling a substrate having a pair of glasses which are hermetically bonded via a frame as a main constituent material. A plurality of supporting members arranged in the above-described manner, and the separated substrate is held between the supporting members so as to be directed substantially vertically.
[0132]
Further, in the substrate processing apparatus of the present invention, the support member is characterized in that at least a contact portion with the substrate has a circular or arc shape.
[0133]
In addition, the flat panel display disassembly method of the present invention has a structure in which a face plate and a rear plate, which are a pair of substrates mainly composed of glass, are hermetically joined by lead-containing frit glass via a frame. A flat panel display disassembly processing method, wherein a face plate or a rear plate is processed by any one of the above substrate processing methods when a glass substrate taken out of a flat panel display to be dismantled is transported and processed in a liquid. It is characterized by the following.
[0134]
Further, in the flat panel display disassembly method of the present invention, the substrate processing apparatus is used.
[0135]
According to the present invention, there is provided a means for holding a glass plate in order to collectively transport a large number of glass plates obtained by dismantling the waste FPD and to perform treatment in a liquid. By suitably holding a large number of substrates collectively in this manner, it is possible to realize a method of processing FPD that is discarded as a result at a low cost.
[0136]
[Solution 13] A glass substrate processing method of the present invention is a method of detecting a surface state of a glass substrate and processing the substrate surface according to the detection result, and irradiating the glass substrate surface with primary X-rays. And a detecting step of detecting an element present on the surface of the glass substrate by detecting the generated fluorescent X-rays, and a removing step of removing elements other than glass constituent elements from the surface of the glass substrate according to the detection result of the detecting step. It is characterized by having.
[0137]
Further, in the method for treating a glass substrate of the present invention, in the detection step of detecting an element on the surface of the glass substrate, the relative position between the glass substrate and the fluorescent X-ray detector changes according to the size of the glass substrate. I do.
[0138]
Further, in the method for processing a glass substrate according to the present invention, the fluorescent X-ray detector irradiates a primary X-ray to a region wider than a region where the fluorescent X-ray can be detected.
[0139]
Further, in the method for processing a glass substrate of the present invention, an incident angle at which a primary X-ray is incident on the glass substrate is an angle equal to or less than a critical angle of the primary X-ray. In the method for treating a glass substrate according to the present invention, the step of removing the surface of the glass substrate is performed by polishing the surface of the glass substrate.
[0140]
Further, in the method for processing a glass substrate of the present invention, the detection step and the removal step for the glass substrate surface are repeatedly performed.
[0141]
Further, a method for regenerating a glass substrate in a flat display of the present invention includes a rear plate in which a plurality of electron-emitting devices are arranged on a glass substrate, a face plate in which an image display unit is provided on a glass substrate, and A support frame for joining plates so as to face each other, and a method for regenerating a glass substrate in a flat display, comprising: separating and removing a rear plate and a face plate; The method is characterized by applying a processing method for processing.
[0142]
Further, in the method for regenerating a glass substrate in a flat display according to the present invention, a wiring mainly composed of Ag is formed on the glass substrate in the rear plate.
[0143]
Further, in the method for regenerating a glass substrate in a flat display according to the present invention, a thin film containing an element other than the glass constituent element is formed on the surface of the glass substrate constituting the rear plate.
[0144]
Further, in the method for regenerating a glass substrate in a flat display according to the present invention, frit glass for joining the rear plate, the face plate and the frame is melted to separate these members. .
[0145]
Further, the apparatus for reprocessing a glass substrate in the flat display of the present invention includes a rear plate in which a plurality of electron-emitting devices are arranged on a glass substrate, a face plate in which an image display unit is provided on the glass substrate, and A support frame for joining plates so as to face each other, and a glass substrate reproduction processing apparatus for a flat display, wherein X-rays are applied to a surface of a glass substrate constituting a rear plate or a face plate which is separately taken out. It is characterized by having a mechanism for detecting elements present on the glass substrate surface by irradiating and detecting the generated fluorescent X-rays, and a mechanism for removing elements other than glass constituent elements from the glass substrate surface.
[0146]
ADVANTAGE OF THE INVENTION According to this invention, the residue on the glass substrate surface can be detected by a simple method especially in the processing process of a used substrate glass, and all the elements other than the glass constituent element can be removed. This makes it possible to reuse glass without waste.
[0147]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Thus, the suffixes of the embodiments and examples are described in conformity with the suffixes of the above-described problems and solving means.
[0148]
[Embodiment 1]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Here, a case will be described as an example in which an FPD having a spacer inside and a fluorescent screen on the face plate inner surface as shown in FIGS. 1 and 2 is dismantled.
[0149]
In FIG. 1, reference numeral 1 denotes a rear plate, 2 denotes a face plate, 3 denotes a frame, and 4 denotes a spacer. Further, a lead-containing frit glass 5 is used at each joint between the rear plate 1 and the face plate and the frame 3 shown in black in the drawing.
[0150]
The spacer 4 is bonded to one or both of the face plate side and the rear plate side or both sides with frit glass or the like. Here, only the face plate side is shown. For the rear plate, the face plate, and the frame, quartz glass, glass with a reduced content of impurities such as Na, soda lime glass, or a laminate of a silica plate on a soda lime glass and the like are used. The face plate has a fluorescent film 2b formed inside a glass substrate 2a, and a metal back 2c containing Al is formed on the inner surface of the fluorescent film. The material of the spacer is also basically made of glass, and the surface thereof may be coated with a conductive film to prevent charging.
[0151]
In addition to the above, generally, an exhaust pipe for evacuating the inside of the FPD to a vacuum is attached (not shown). The exhaust pipe is usually formed of a low-melting glass containing lead.
[0152]
FIG. 2 shows a matrix drive type surface conduction electron source display (SED) as an example of the FPD. In FIG. 2, a surface conduction electron source 11 and wirings 12 and 13 for driving the electron source are formed on a rear plate 1. Reference numerals 12 and 13 denote element wirings in the X direction (Dox1, Dox2,... Doxm) and in the Y direction (Doy1, Doy2,... Doyn), respectively, and their materials are Ag, Pb, and the like. The X-direction wiring and the Y-direction wiring are separated by an insulating layer at least at their intersections. Glass containing much lead is used for the insulating layer.
[0153]
As described above, materials containing lead are used in various parts of the FPD. Among them, the frit glass in the frame part is particularly used in a large amount. The gist of the present invention is to process this frame part separately from other parts. That is, as shown in the drawing, in the FPD dismantling method of the present invention, the FPD is cut along cutting lines AA, A'-A ', BB, and B'-B'.
[0154]
FIG. 4 is a flowchart illustrating steps of a disassembly processing method of an FPD device for describing an embodiment of the present invention. Steps (1) to (3), which are the first half of this method, are pre-processing steps and include a step of taking out the FPD from the housing of the FPD device and removing wirings and terminals accompanying the FPD. Next, in steps (4) to (6), after the vacuum release of the FPD is performed by an appropriate method, the exhaust pipe is removed. Since the exhaust pipe contains lead, it is treated as lead-containing glass and reused.
[0155]
In step (7), the FPD is measured to obtain information about the extent of the region joined by the frit glass in the frame portion, and the cutting position is determined. Normally, frit glass is black, and its presence can be optically detected through a glass substrate. Specifically, an FPD can be photographed with a video camera, and from the video, the extent of the region joined by the frit glass can be measured by image analysis. In this case, a cutting line is set inside the region joined by the frit glass. If it is known that the position and width of the frame are within a certain value range, it is also possible to simply detect the end of the FPD and set a line separated by a predetermined distance therefrom as the cutting line.
[0156]
Step (8) is a step of separating the frame portion from other portions. Cutting is performed along the cutting line set in the step (7). As for the cutting method, a general method for cutting glass can be used. (1) Method of applying a thermal stress to the damaged part by making a scratch with a cemented carbide roller, (2) Diamond cutting saw, (3) Diamond grinding wheel, (4) Laser processing, (5) Ultrasonic processing And the like. By this step, the waste FPD is separated into three parts, namely, (9) a frame part, (11) a panel inner member, (13) a face plate, and (20) a rear plate. Hereinafter, each processing method will be described.
[0157]
First, (9) the frame portion is pulverized and (10) reused as lead-containing glass.
[0158]
Step (11) If a spacer (made of glass), a grid (made of metal), or the like is present as a panel internal member, each is collected and reused (step (12)).
[0159]
Next, in the step (13) face plate, the phosphor is removed in the step (14), and the phosphor is recovered in the step (15). The step (16) is a step of further removing the residual frit glass. After the lead of the residual frit glass is recovered through this step, the glass substrate is pulverized into a glass cullet in the step (18). The step (19) makes this glass cullet reusable as a face plate and rear plate substrate.
[0160]
In the step (20) for the rear plate, after removing the wiring in the step (21), the metal (Ag, Pb, etc.) contained in the wiring is recovered in the step (22). In the above, the glass substrate becomes a crushed glass cullet. The step (24) makes this glass cullet reusable as a face plate and rear plate substrate.
[0161]
[Example 1]
Hereinafter, the present invention will be described in detail with reference to FIGS.
[0162]
[Example 1-1]
A matrix drive type surface conduction electron source display (SED) as shown in FIG. 2 was dismantled. This SED has a panel structure including a spacer as shown in FIG.
[0163]
According to the disassembly process diagram of the FPD device in FIG. 4, the SED was taken out of the housing of the SED device, and the wires and terminals attached thereto were removed. Next, the vacuum of the SED was released, and the exhaust pipe was removed. The exhaust pipe was treated and reused as lead-containing glass.
[0164]
Next, the SED was photographed with a video camera, and the image was taken into an image processing device. In that image, the area joined by the frit glass can be recognized as an area that looks darker than the rest of the panel. Therefore, by binarizing the image, the spread of the region joined by the frit glass was measured.
[0165]
First, pretreatment steps (1) to (5) for dismantling are performed. That is, the flat panel display is removed from the housing of the flat panel display device and put in [Steps (1) and (2)], the attached wires and terminals are removed [Step (3)], and the exhaust pipe mounting section is removed. The vacuum in the vacuum container is released by an appropriate process such as breaking the sealing of the above, the pressure is returned to the atmospheric pressure [Step (4)], and the exhaust pipe is removed [Step (5)]. The exhaust pipe is collected and reused [Step (6)]. Next, the dimensions of the flat panel display are measured, and the cutting position is determined [Step (7)].
[0166]
Next, thereafter, the frame member 3 is separated from the flat panel display 20 [Step (8)]. For this separation, an appropriate method such as simply cutting, pushing a wedge blade tool into the joint between the frame member 3 and the two plates 1 and 2 to separate it, and spraying a nitric acid solution may be adopted.
[0167]
The frame member 3 separated in the step (7) is [step (9)] crushed and reused as recycled new glass material [step (10)].
[0168]
Next, the spacer 4 is collected [Step (11)]. At this time, the spacers 4 are separated and collected [Step 12].
After the spacers 4 have been collected, if the plate member is the face plate 2 [step (13)], the phosphor 2b is collected from the face plate 2 [step (14)], and crushed and a lead component is removed. It is removed and reused as recycled new glass material [Step (15)]. Thereafter, the residual frit glass is removed [Step (16)], the glass substrate is pulverized [Step (18)], and reused as glass for the substrate (Step (19)).
[0169]
When the plate member is the rear plate 1 [step (20)], the wiring is removed from the rear plate 1 [step (21)], crushed and [step (23)], and recycled as a new glass material. Reuse [Step (24)].
[0170]
From the measurement results, cutting lines AA, A'-A ', BB, and B'-B' were set inside the region joined by the frit glass as shown in FIG. Next, the SED was cut along the cutting line using a diamond cutting saw while adding a grinding fluid.
[0171]
By cutting, the SED was divided into a frame portion 3, a face plate 2, and a rear plate 1. The spacer 4 was detached at the time of cutting, and was in a state of being adhered to the face plate 2, and both were manually collected and recyclable, and were reused.
[0172]
The frame portion 3 was ground as it was and reused as a raw material for lead-containing glass. After removing the phosphor and removing the residual frit glass with nitric acid, the face plate 2 was ground and reused. After the wiring was removed from the rear plate 1, the glass substrate was pulverized and reused.
[0173]
[Example 1-2]
A matrix drive type surface conduction electron source display (SED) as shown in FIG. 2 was dismantled. The steps up to the step of setting the cutting lines AA, A'-A ', BB, and B'-B' are the same as in the first embodiment. Next, a scratch was made with a cemented carbide roller along the cutting line of the SED. Subsequently, the wound portions were sequentially heated by a gas burner obtained by adding oxygen to city gas. As a result, the glass was cut along the cutting line, and the SED was divided into a frame portion 3, a face plate 2, and a rear plate 1. The subsequent steps are the same as in Example 1-1.
[0174]
In Example 1-2, since no grinding fluid or the like is used, collection and reuse of each member are facilitated.
[0175]
[Embodiment 2]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0176]
FIG. 5 is a flowchart of the FPD dismantling method according to the present invention. Here, a case where the FPD having the spacer as shown in FIG. 1 is dismantled will be described as an example.
[0177]
In FIG. 1, reference numeral 1 denotes a rear plate, 2 denotes a face plate, 3 denotes a frame, and 4 denotes a spacer. In addition, a lead-containing glass frit 5 is used in the joint shown in black in FIG. Some spacers 4 are adhered to one or both of the face plate 2 and the rear plate 1. Here, only the face plate 1 is shown.
[0178]
The rear plate 1, the face plate 2, and the frame 3 are made of quartz glass, glass with a reduced content of impurities such as Na, blue plate glass, and SiO formed on blue plate glass by sputtering or the like. ₂ Are used. In the face plate 2, a phosphor film 2b containing a phosphor containing a rare earth such as Y is formed inside a glass substrate 2a, and a metal back 2c is formed on the inner surface side of the phosphor film.
[0179]
The material of the spacer 4 is also basically made of glass, and its surface is coated with a conductive film in order to prevent electrification. As the conductive film material, for example, oxides of metals such as Cr, Ni, and Cu, nitrides of Al and a transition metal alloy, and carbon are used.
[0180]
Further, as a material of the glass frit 5, a material having a large lead component is used so that low-temperature firing can be performed, and PbO is a main component.
[0181]
The present invention is to dissolve lead (Pb) in the glass frit 5 used for the joint in nitric acid, and peel off each part from the joint to disassemble. The nitric acid concentration applied to the present invention is as follows. A range of 0.1N (defined) to several N, preferably 0.1N to 2N is used. The immersion time is in the range of several hours to several tens of hours, preferably 10 hours to 24 hours.
[0182]
Hereinafter, the disassembly method will be described in detail with reference to FIG. 6 according to the flowchart of FIG.
(1) Remove the housing, remove the terminal outside the container, and take out only the display unit (S1 to S3).
(2) The vacuum type leaks vacuum (S4).
(3) The entire display is immersed in a bath filled with nitric acid (S5). At this time, in order to prevent the glass from being damaged, a mesh basket 21 made of Teflon (registered trademark) resin is put in the tank 22, and the display 50 is placed in the mesh basket 21 (FIG. 6A).
(4) The mesh basket 21 is pulled up, and the parts separated from the frit joint are collected (S6, S7), transferred to a washing tank of pure water 25 and washed (S8), and reusable and discarded. (FIG. 6B) (S9, S10).
(5) The nitric acid solution is filtered (S11), and separated into a filtrate and an insoluble matter (S12, S13).
[0183]
The insoluble component at this time is a nitric acid-insoluble component of the frit component or a component insoluble in nitric acid in the spacer coating component. In the filtrate (S13), lead and a noble metal element or a rare earth element are dissolved (S14, S16).
(6) The metal in the filtrate is separated into lead and other metals by an electrolytic method.
[0184]
At this time, lead is PbO ₂ Other metals, including noble metals, deposit on the anode.
(7) PbO deposited on the cathode ₂ Is collected and disposed of as harmful substances (S15).
(8) Since noble metals and the like are deposited on the anode, they are collected and reused (S16).
(9) When a rare earth element is mixed (S19), the solution is adjusted to pH = 0, and then oxalic acid is added to precipitate as an oxalate, which is collected by filtration.
[0185]
The above method is a method of recovering a noble metal element, but as another method, a sulfate ion is added to the filtrate of (6) to precipitate a lead component (PbSO4). ₄ ) Is generated to separate lead, but in this case, the noble metal element is also coprecipitated, and it is difficult to recover it. This method is simple and convenient when the precious metal element does not need to be recovered in a very small amount or is not contained.
[0186]
In the above method, the entire panel is immersed in nitric acid. However, even when a part to be reused is left and only the other part is immersed in nitric acid, the method is basically based on the above method.
[0187]
Hereinafter, the process of partially immersing in nitric acid and performing the treatment will be described with reference to FIGS. 7 and 8.
[0188]
7 and 8 show that only the rear plate portion 1 and the face plate portion 2 are immersed in nitric acid (FIGS. 7 (a) and 8 (a)). This is a method of pulling up the rear plate 1 attached and reusing it (FIGS. 7B and 8B). The nitric acid solution is treated in the same manner as in the method of dipping the whole.
[0189]
In this case, the position of immersion in nitric acid needs to be precisely controlled, but the method can be confirmed by experimental means. At this time, it is convenient to place a support 31 made of Teflon (registered trademark). In a display having spacers, when the spacers are reused, there are a method of immersing the entire display in nitric acid and a method of immersing only the frit joint. Basically, the same method as described above is used.
[0190]
[Example 2]
Hereinafter, the present invention will be described in more detail with reference to examples.
[0191]
(Example 2-1)-Method of immersing whole in nitric acid-
Embodiment 2-1 will be described with reference to FIGS. 5, 6, and 9. FIG.
[0192]
FIG. 9 shows a simplified diagram of the FPD used in this example. 1 are denoted by the same reference numerals. This display is a surface conduction electron source display (SED) having a glass rear plate provided with electrodes and wiring, an insulating layer, an electron-emitting device, and the like. The rear plate 1 is made of SiO. ₂ Is coated. The element electrode formed on the upper surface is made of Pt, and the electron-emitting device 11 formed between the two electrodes is made of Pd. Further, an upper wiring 13 and a lower wiring 12 made of Ag, Pb, B, etc., and an insulating layer made of PbO for insulating between the wirings are formed. Blue glass is also used as the material of the frame 3. Dx01 to Dx0m and Dy01 to Dy0n are terminals outside the container.
[0193]
In the face plate 2, a fluorescent film 2b made of a black stripe and a fluorescent material is formed inside a blue glass substrate 2a, and a metal back 2c made of Al is formed on the inner surface side of the fluorescent film. The black stripe is made of PbO and C (carbon), and the phosphor is made of ZnS and YS. A spacer 4 is adhered to the inner surface of the display with a glass frit.
[0194]
The material of the spacer 4 is a glass substrate whose surface is coated with conductive ceramics.
[0195]
This panel was dismantled as follows.
(1) The display was removed from the housing, and the terminal outside the container was removed.
(2) The vacuum of the display was leaked and returned to normal pressure.
(3) The entire display was immersed in a 1.2 N nitric acid tank all day and night. At this time, in order to prevent the glass from being damaged, a mesh basket 21 made of Teflon (registered trademark) resin was placed in a nitric acid tank, and a display was placed in the mesh basket 21 (FIG. 6A).
(4) The rear plate, face plate, frame, and spacer, which have been peeled off from the frit joint, are pulled up from the nitric acid solution, transferred to a pure water washing tank, washed, and then separated into reusable and discarded ones. (FIG. 6B).
(5) The nitric acid solution after each part was lifted was filtered to separate the filtrate into insoluble matter.
(6) In the filtrate, in addition to the lead component of the frit glass, Pd of the electron-emitting device film and a part of Ag of the wiring are dissolved. Was electrolyzed.
[0196]
The filtrate was set at a potential of +1.4 to 1.7 V based on a silver / silver chloride standard electrode, and Pd and Ag deposited at the cathode were recovered and reused. ₂ The oxidized precipitate was collected and disposed of as a harmful substance.
(7) Further, since Y (yttrium) used in the phosphor is dissolved in the filtrate, the pH is adjusted to 0 to recover the Y, and oxalic acid is added to the filtrate to add Y (yttrium). ₂ (C ₂ O ₄ ) ₃ The precipitate was recovered.
[0197]
(Example 2-2)
-Method of leaving face plate (with frame and spacer) and immersing others in nitric acid-
Embodiment 2-2 will be described with reference to FIGS.
[0198]
Using the same FPD as in Example 2-1, the disassembly was performed as follows.
(1) The same treatment as (1) and (2) of Example 2-1 was performed.
(2) The frame of the display is marked at two locations in the horizontal direction with respect to the nitric acid solution surface, placed on a support 31 made of Teflon (registered trademark), and the face is soaked that only the joint between the frame and the rear plate is immersed in nitric acid. The liquid level was adjusted to be below the mark on the plate side, and the plate was immersed in a 1.2 N nitric acid tank all day and night (FIG. 7A).
(3) The face plate with the frame and the spacer was lifted up, transferred to a pure water cleaning tank, and the portion immersed in nitric acid was cleaned and reused (FIG. 7 (b)).
(4) The nitric acid solution was treated in the same manner as (5) to (6) of Example 2-1.
[0199]
(Example 2-3)
-Method of leaving the rear plate (with frame) and immersing others in nitric acid-
Third Embodiment A third embodiment will be described with reference to FIGS.
[0200]
Using the same FPD as in Example 2-1, the disassembly was performed as follows.
(1) The same treatment as (1) and (2) of Example 2-1 was performed.
(2) Marking was performed in the same manner as in Example 2-2, and only the joint between the frame and the face plate was immersed in nitric acid. 8 (a)).
(3) As in Example 2-2, the framed rear plate was pulled up, washed, and reused (FIG. 8B).
(4) The nitric acid solution is filtered, sulfuric acid is added to the filtrate, and PbSO ₄ Was formed, and this precipitate was separated by filtration and disposed of as a hazardous substance.
(5) Since the above nitric acid solution contains Y as a phosphor, the pH of the solution is adjusted to 0, and oxalic acid is added to add Y to the solution. ₂ (C ₂ O ₄ ) ₃ The precipitate was recovered.
[0201]
[Comparative Example 2]
As a method of peeling from the joint portion for the purpose of discarding and reusing the FPD similar to that in Example 2-1, an attempt was made to heat and melt the frit glass portion to peel it off.
[0202]
However, in order to melt PbO as a frit glass component, it is necessary to raise the melting point to a high temperature of about 900 ° C. or more. If such a high temperature is locally applied to the frit joint, depending on conditions, distortion or distortion of the glass substrate may occur. Cracks occurred, and it was difficult to set conditions for reusing the substrate.
[0203]
[Embodiment 3]
Hereinafter, the present invention will be described in detail with reference to other preferred embodiments.
[0204]
To describe the present invention more specifically, first, an electron-emitting device comprising a conductive film connected to both a pair of device electrodes of the electron-emitting device and the pair of device electrodes and partially having an electron-emitting portion. , A face plate 2 provided with an image forming member on which an image is formed by colliding electrons emitted from the electron-emitting device, and connecting the rear plate and the face plate to form an internal pressure. A method of recovering a rear plate of an image display device for recovering and reusing a rear plate 1 when discarding an image display device in which these are welded with frit glass 5, wherein In a nitric acid solution to dissolve the frit glass 5 and a step of forming a conductive film by an inkjet method.
[0205]
FIG. 10 is a diagram showing a configuration of the image display device. In FIG. 10, reference numeral 1 denotes a rear plate provided with a plurality of electron-emitting devices 11, 2 denotes a face plate provided with an image forming member on which an image is formed by collision of electrons emitted from the electron-emitting devices 11, 3 Is a support frame that connects the rear plate 1 and the face plate 2 and maintains the internal pressure, and 4 is a frit that connects the rear plate 1 to the face plate 2 and the support frame 3. The image display device 5 is formed from these components.
[0206]
As shown in FIG. 11, the image display device 5 from which the terminal outside the container is removed leaks when the internal pressure is low, and is then immersed in a nitric acid solution tank 6 filled with nitric acid, as shown in FIG. The image display device 5 may have a spacer therein as an anti-atmospheric pressure support member. At the time of immersion in nitric acid, the rear plate 1 is taken out from the image display device 5 by adjusting the amount of nitric acid solution as necessary so that the rear plate 1 is easily peeled off, or by providing a base (not shown) in the nitric acid solution tank 6. FIG. 11 (b). Here, an example of dissolving the frit 4 for welding in the vicinity of the rear plate is shown. However, the entire image display device 15 is immersed in a nitric acid solution tank 6 filled with nitric acid to separate the respective components, and the rear plate 1 is taken out. You can also. At this time, the nitric acid concentration is in the range of 0.1N (regulated) to several N, preferably 0.1 to 2N.
[0207]
The immersion time is preferably in the range of several hours to several tens of hours, more preferably 10 to 24 hours. The removed rear plate 1 is transferred to a pure water washing tank, washed and dried. At this time, in order to prevent uneven drying, washing with a solvent of ketones or alcohols may be performed as necessary. Further, by washing with a solvent for a conductive film forming droplet described later, formation of the conductive film at the time of reproduction may be facilitated. FIG. 12 shows the rear plate 1 that has been taken out and washed as described above. 41 is a rear plate substrate, and 42 and 43 are device electrodes. After the cleaning, the conductive film and the printed wiring are removed, and the device electrodes 42 and 43 remain on the rear plate substrate 41.
[0208]
The substrate 41 for the rear plate 1 is made of quartz glass, glass with a reduced content of impurities such as Na, blue plate glass, blue plate glass, or the like by sputtering, CVD, liquid phase growth, or the like. ₂ Laminated glass substrate, P-doped SiO ₂ Are used. As the electrode material for the device electrode, any material may be used as long as it has conductivity. However, if the electrode material is formed of a noble metal such as Pt or Au which is not deteriorated by a nitric acid solution, the material after cleaning is used. It remains on the rear plate substrate and can be reused. In the case of a material that is altered by the nitric acid solution, only the rear plate substrate is reused because it is dissolved in the nitric acid solution.
[0209]
FIG. 12 shows an example in which the upper wiring and the lower wiring that are electrically connected to the element electrodes 42 and 43 to drive the element are dissolved in the nitric acid solution. However, one of the element electrodes and the lower wiring are made of the same material, Since they can be formed at the same time, the lower wiring including the device electrode may remain on the rear plate substrate. Further, as a material of the frit glass used for the joining portion, a material having a large lead component is used so that low-temperature firing can be performed, and PbO is a main component. Since the lead component in the frit glass is dissolved in the nitric acid solution, it can be recovered as a precipitate by an electrolysis method or as a precipitate by an acid-alkali reaction.
[0210]
Thus, the rear plate 1 is manufactured using the rear plate substrate 41 on which the device electrodes 42 and 43 are formed. As an example, after forming the Y-direction wiring 13 on the element electrode 42 and providing the interlayer insulating layer 45, the notch 46 is formed, and the X-direction wiring 12 is formed. Such wirings and interlayer insulating layers can be formed by a printing method or the like. Next, a film to be a precursor of the conductive film is formed by an ink-jet apparatus which extracts a conductive solution by an ink-jet method, and after the solvent is dried, heat treatment is performed to form a conductive film 49. Thus, the rear plate 1 of the image display device 15 can be reproduced.
[0211]
[Example 3]
Hereinafter, the present invention will be described in more detail with reference to Examples.
[0212]
[Example 3-1]
Example 3-1 will be described with reference to FIGS.
[0213]
FIG. 10 shows the configuration of the image display device of this embodiment. 10, reference numeral 1 denotes a rear plate, 2 denotes a face plate in which a fluorescent film 2b and a metal back 2c are formed on the inner surface of a substrate 2a, and 3 denotes a support frame, and the rear plate 1, the support frame 3, and the face plate 2 Is sealed with frit glass to form the image display device 5. Dox1, Dox2,... Dox (m-1), Doxm, Doy1, Doy2,... Doy (n-1), Doyn are terminals outside the container.
[0214]
In FIG. 10, reference numeral 11 corresponds to a surface conduction electron-emitting device. Reference numerals 42 and 43 in FIG. 12 denote a Y-direction wiring 13 and an X-direction wiring 12 connected to a pair of device electrodes of the surface conduction electron-emitting device in FIG.
[0215]
The rear plate substrate 41 is made of SiO2 on blue plate glass. ₂ Is coated. The device electrodes 42 and 43 are Pt. The Y direction wiring 13 and the X direction wiring 12 are made of Ag paste, the interlayer insulating layer 45 is made of PbO glass paste, and the conductive film 49 is made of Pd.
[0216]
FIG. 11 is an explanatory diagram showing a method of collecting and regenerating a rear plate according to the present invention. In FIG. 11, reference numeral 1 denotes a rear plate provided with a plurality of electron-emitting devices 11, and reference numeral 2 denotes a face plate provided with an image forming member on which an image is formed by collision of electrons emitted from the electron-emitting devices 11. Reference numeral 3 denotes a support frame that connects the rear plate 1 and the face plate 2 and maintains the internal pressure, and reference numeral 4 denotes a frit glass that connects the rear plate 1 to the face plate 2 and the support frame 3. The image display device 15 is formed from these components.
[0219]
Since the internal pressure was low, the image display device 15 from which the terminal outside the container was removed was leaked and then immersed in the nitric acid solution tank 6 filled with 1.2N nitric acid for 24 hours. This state is shown in FIG. At the time of immersion in nitric acid, the amount of the nitric acid solution is adjusted so that the rear plate 1 is easily peeled, and the rear plate 1 is taken out from the image display device 15 (FIG. 11B). The removed rear plate 1 is transferred to a pure water washing tank and washed, and then washed and dried with acetone and isopropanol.
[0218]
FIG. 12 shows the rear plate after washing thus taken out. 41 is a rear plate substrate, and 42 and 43 are device electrodes. After the cleaning, the conductive film and the printed wiring were removed, and the device electrodes 42 and 43 remained on the rear plate substrate 41.
[0219]
The nitric acid solution was filtered, and the filtrate was electrolyzed as follows.
[0220]
When the filtrate was set to a potential of +1.4 to 1.7 V based on a silver / silver chloride standard electrode, Pd and Ag were deposited on the cathode, and PbO was deposited on the cathode. ₂ Was precipitated. Collected respectively, Pd and Ag are reused, PbO ₂ Has disposed of.
[0221]
Next, the rear plate 1 is manufactured using the rear plate substrate 41 on which the device electrodes 42 and 43 are formed. FIG. 13 is a diagram showing a manufacturing process of the rear plate 1.
[0222]
An Ag paste is screen-printed in a predetermined shape on the rear plate substrate 41 (FIG. 13A) on which the device electrodes 42 and 43 are formed, and this is heated and baked to form the Y-directional wiring 13. Note that the thickness of the Y-direction wiring was about 20 μm and the width was 100 μm (FIG. 13B).
[0223]
A glass paste is printed in a predetermined shape, and this is heated and baked to form an interlayer insulating layer 45. At this time, a notch 46 is provided so as not to cover the element electrode 43. The width of the interlayer insulating layer was about 250 μm, and the thickness was about 20 μm in a portion overlapping with the Y-direction wiring and about 35 μm in other portions (FIG. 13C).
Subsequently, an Ag paste was printed on the interlayer insulating layer 45 and heated and fired to form the X-directional wiring 12. The width of the X-direction wiring was about 200 μm and the thickness was 15 μm (FIG. 13D).
[0224]
Subsequently, a solution of an organoamine palladium ethanolamine complex is applied as droplets by a piezo jet type inkjet device to form a film that is a precursor of a conductive film. After the solvent is dried, heat treatment is performed at 300 ° C. for 10 minutes. Thus, the precursor film was changed to a conductive film 49 made of PdO fine particles. The conductive film had a substantially circular shape, a diameter of 40 μm, and a thickness of 15 nm (FIG. 13E).
[0225]
Thus, the rear plate 1 was regenerated. The face plate and the support frame were welded with frit glass, the inside of the container was sufficiently evacuated, and then forming and activation were performed to produce an image display device 15 shown in FIG.
[0226]
The image display device manufactured in this way had no noticeable defects in the image and no variation in luminance.
[0227]
[Example 3-2]
This embodiment relates to a reproducing method similar to that of the embodiment 3-1 except for the following points.
[0228]
In the embodiment 3-1, the Y-directional wiring 13 is a printed electrode, but in this embodiment, it is Pt connected to the device electrode 42 formed simultaneously with the device electrodes 42 and 43. Therefore, as shown in FIG. 14, the device electrode and the Y-directional wiring 13 connected to one of the device electrodes remain on the rear plate substrate after immersion in the nitric acid solution and washing.
[0229]
The ink jet device used for applying the droplets in Example 3-1 is of the piezo jet type. Instead of this, in this example, a bubble jet (registered trademark) type was used. Even in this case, the rear plate 1 of the image display device 15 can be reproduced.
[0230]
[Embodiment 4]
Hereinafter, the present invention will be described in more detail.
[0231]
A feature of the present invention is to disassemble the flat display so that the spacer can be reused by recovering the flat display without damaging the spacer by a simple method.
[0232]
The method of recovering the spacer according to the present invention is a method of separating only the spacer by immersing a portion between the spacer and the flat panel or the substrate, which is welded by frit glass, in a nitric acid solution and melting the welded portion. At this time, in order to avoid damage due to contact with other spacers or peripheral members, a jig for storing or holding the spacers is used.
[0233]
FIG. 15 is a schematic view showing one embodiment of the spacer collecting method and the collecting apparatus of the present invention. In FIG. 15, reference numeral 151 denotes a nitric acid solution tank, 152 denotes a nitric acid solution, 153 denotes a rear plate or face plate, 154 denotes a spacer, 155 denotes a spacer storage container, 156 denotes a rear plate or face plate support material, and 157 denotes a frit.
[0234]
The spacer 154 may be welded to the face plate, the rear plate, or both, but the former case will be described here.
[0235]
First, the rear plate, the face plate and the frame are separated, and disassembled until the face plate and the spacer are welded by frit. Methods for separating the rear plate, face plate, and frame include a cutting method, a method of dissolving the frit by spraying or dipping a nitric acid solution on a frit portion where the members are welded, and a method of dissolving the frit by heating. However, dissolving with nitric acid can be said to be a preferable method because the spacer is not damaged.
[0236]
Next, the spacer and the face plate are immersed in a nitric acid solution. As shown in FIG. 15, the immersion is performed by supporting the face plate 153 with the support member 156 and immersing the spacer 154 downward.
[0237]
The frit 157 between the spacer 154 and the face plate 153 is melted and separated from each other. At this time, the spacer 157 falls into the nitric acid solution layer 151 so as not to be damaged by contact with other spacers and peripheral members. For this purpose, a storage container 155 as shown in FIG. 16 is used.
[0238]
The storage container 155 has substantially the same size as the face plate 153, and has a concave portion 148 formed in accordance with the arrangement of the spacer 154. The storage container 155 is a material that is stable against nitric acid and does not damage the spacer. , For example, made of fluororesin. Further, in order to prevent the liquid from collecting in the concave portion, the whole container or the bottom of the concave portion may have a mesh shape. By disposing the storage container 155 below the spacer 154 so that the spacer 154 separated from the face plate 153 is stored in the recess 148, contact between the spacers 154 can be prevented.
[0239]
After removing the face plate 153, the storage container 155 is pulled up from the nitric acid solution layer 151, and the next washing step and drying step can be performed with the storage container.
[0240]
Note that the storage container 155 for the spacer is not limited to the above shape. FIG. 16 shows an example of the shape of the container described above. In addition, as shown in FIG. 17, a large number of concave containers 149 slightly larger than the spacer 154 are used, and each container 149 is formed by a spacer. May be used to accommodate a spacer 154 that is disposed below and separated from the face plate 153. When this method is used, the container 149 pulled up from the nitric acid solution layer 151 can be collected in a narrow range, so that the size of the subsequent washing tank and drying tank can be reduced.
[0241]
FIG. 18 is a schematic view showing another embodiment of the spacer collecting method and the collecting apparatus of the present invention. In FIG. 18, reference numeral 151 denotes a nitric acid solution tank, 152 denotes a nitric acid solution, 153 denotes a rear plate or face plate, 154 denotes a spacer, 157 denotes a frit, 158 denotes a support for the rear plate or face plate, 159 denotes a spacer support arm, 160 Is an arm tip.
[0242]
The spacer 154 is immersed in the nitric acid solution tank 151 after the rear plate, the face plate, and the frame are separated from each other, disassembled to a state where they are welded to the rear plate or the face plate and the frit.
[0243]
The spacer 154 may be welded to the face plate, the substrate, or both, and the present invention can be used in either case. Here, the former case will be described.
[0244]
As shown in FIG. 18, the immersion method is as follows. First, the face plate 153 is placed on the support base 158 so that the spacer 154 faces upward, and the upper part of each spacer 154 is sandwiched by the tip 160 of the arm 159. Fix it. Thereafter, the support 158 is lowered, and the face plate 153 and the welded portion 157 are immersed in the nitric acid solution 152. By fixing the spacer 154 in advance and preventing the spacer 154 separated from the face plate 153 from falling, damage to the spacer 154 can be prevented. Note that the arm 159 and its tip 160 must be formed of a material stable against nitric acid, for example, a fluorine-based compound.
[0245]
The next washing step and drying step can be performed while the spacer 154 is fixed to the arm tip 160. The cleaning step dissolves the frit glass 157 remaining on the spacer 154 and removes reattachment of the dissolved substance from the face plate 153 and the substrate, and is usually performed in a new nitric acid solution tank. After that, it is transferred to a pure water tank and is finally washed.
[0246]
Further, in the drying step, any method may be used as long as the pure water is volatilized, and for example, drying with warm air or the like can be used.
[0247]
When the dried spacer is reused, it is necessary to inspect the spacer for damage. An inspection method is appropriately adopted, and for example, a method of visually confirming the presence or absence of a defect, a method of examining the presence or absence of cracks due to heating, and the like can be used.
[0248]
FIG. 19 is a schematic view showing the spacer 154. The shape of the spacer 154 is usually a thin plate having a length and width of several tens of mm and a thickness of 300 μm or less, and a conductive film 162 for the purpose of preventing electrification is formed on the surface of the insulating base material 161. The spacers 154 are arranged in a necessary number and at a necessary interval to achieve the purpose, and are fixed to the inside of the face plate 153 or the surface of the substrate by glass frit. The spacer 154 is handled in the same manner as when it is fixed to the rear plate, as in the case where it is fixed to the face plate.
[0249]
Examples of the conductive film material include metal oxides such as chromium, nickel, and copper, nitrides of aluminum and a transition metal alloy, and carbon.
[0250]
As the insulating base material 161 of the spacer 154, for example, quartz glass, glass with a reduced impurity content such as Na, soda lime glass, or SiO.sub. ₂ A substrate on which an insulating layer made of a material is laminated can be used.
[0251]
As described above, the conductive film 162 is formed on the spacer surface, and some of the materials are stable to nitric acid and others are soluble in nitric acid. When a material stable to nitric acid is formed, it can be reused after washing, drying, and inspection steps. On the other hand, if a material that dissolves in nitric acid is used, it is possible to completely dissolve the film in a nitric acid solution, and after cleaning, drying, and inspection steps, a new conductive film can be formed and reused. Become.
[0252]
[Example 4]
Hereinafter, the present invention will be described in more detail with reference to Examples.
[0253]
[Example 4-1]
The spacer was recovered using the spacer recovery apparatus according to the present invention shown in FIG. The apparatus shown in FIG. 15 is an apparatus for melting a frit glass 157 to which a face plate 153 and a spacer 154 are welded and separating them. In FIG. 15, reference numeral 151 denotes a nitric acid solution tank, 152 denotes a nitric acid solution, 153 denotes a face plate, 154 denotes a spacer, 155 denotes a spacer storage container, 156 denotes a face plate support material, and 157 denotes frit glass.
[0254]
FIG. 20 schematically shows the state in each step of the spacer collecting method according to the present invention. 20A shows a step of separating the substrate, the face plate and the frame, FIG. 20B shows a step of separating the face plate and the spacer, FIGS. 20C and 20D show a step of cleaning the spacer, and FIG. e) represents the step of drying the spacer.
[0255]
In this example, a display was used in which 25 spacers 154 were welded to a face plate 153 made of soda lime glass of 300 mm × 250 mm × 2.8 mm. The spacer 154 used was a soda-lime glass substrate having a height of 2.8 mm, a plate thickness of 200 μm, and a length of 40 mm, in which aluminum nitride was formed as a conductive film to a thickness of about 100 nm as a conductive film.
[0256]
Hereinafter, this will be described in detail with reference to FIGS. 15, 16 and 20.
[0257]
{Circle around (1)} The housing was disassembled, and a portion where the rear plate 163, the face plate 153, and the frame 164 were welded with the frit glass 157 was taken out.
[0258]
{Circle around (2)} A 0.2 N nitric acid solution is jetted into the above-mentioned welded portion to gradually dissolve the welded portion, and when most of the frit 157 is dissolved, the face plate 153 is pulled up by the supporting material 156 and separated from the frame portion. (FIG. 20 (a)).
[0259]
{Circle around (3)} A container 155 for accommodating the spacers was submerged in a nitric acid solution tank 151 having a length of 400 mm and a width of 350 mm containing a 0.2 N nitric acid solution. As shown in FIG. 16, this container has a length of 300 mm × a width of 250 mm × a height of 10 mm, and has 25 concave portions (length: 50 mm, width: 5 mm, depth: 4 mm) according to the arrangement of the spacers. The container is made of a fluororesin that is stable against nitric acid and does not damage the spacer. Further, the concave portion is formed in a mesh shape so that the liquid does not accumulate.
[0260]
The face plate 153 in a state where the spacer 154 is welded is immersed in the nitric acid solution tank 151 so that the spacer 154 faces down, and the frit between the spacer 154 and the face plate 153 is dissolved to separate them. . Each spacer 154 fell into the recess of the container 155.
[0261]
After removing the face plate 153 separated from the spacer 154, the container 155 was pulled out of the nitric acid solution tank (FIG. 20B).
[0262]
{Circle around (4)} The spacer 154 together with the container 155 was submerged in a washing nitric acid solution tank containing a 0.2 N nitric acid solution. In this step, the frit glass 157 remaining on the spacer 154 was melted, and the reattachment of the melt from the face plate 153 and the substrate was removed (FIG. 20C).
[0263]
{Circle around (5)} Next, the spacer 154 was transferred together with the container 155 to a pure water tank, and was finally washed with pure water 165. The nitric acid washing tank and the pure water washing tank used had the same size as the nitric acid solution tank in FIG. 20 (b) (FIG. 20 (d)).
[0264]
{Circle around (6)} Subsequently, hot air 166 was blown onto the spacer 154 together with the container 155 to perform drying (FIG. 20E).
[0265]
{Circle around (7)} In reusing the spacer thus recovered, the spacer 154 was inspected. As an inspection method, first, after confirming the presence or absence of film peeling, scratches, deposits, and other stains of the conductive film by an optical microscope, the presence or absence of cracks due to heating is checked, and a spacer that has a defect in the glass base material is removed. Was used. These tests were performed either in containers or individually removed. As a result of the inspection, about 10% of the spacer was removed as a defective product, and most of the spacers could be reused. The good spacer was used as it was for the assembly of a new display.
[0266]
[Example 4-2]
In the present embodiment, a display having the same configuration as that of the embodiment 4-1 is used, and the same method as that of the embodiment 4-1 is used except that the frame, the rear plate, and the face plate separated from the housing are separated by cutting. The spacer was collected.
[0267]
As shown in FIG. 21, the frame, the substrate, and the face plate were cut so as to separate the welded portions on the four sides and the inside thereof, that is, the portion having the spacer. The method of collecting the spacer after cutting was the same as in steps (3) to (6) of Example 4-1.
[0268]
As a result of the inspection, about 15% of the spacers were removed as defectives, and most of the spacers could be reused.
[0269]
[Example 4-3]
In this embodiment, a display having the same configuration as that of the first embodiment is used, and a method similar to that of the embodiment 4-1 is used, except that the one shown in FIG. 17 is used as a spacer storage container used for separating the face plate and the spacer. Was used to recover the spacer.
[0270]
Hereinafter, a description will be given with reference to FIGS. 15, 16, 17, and 22.
[0271]
The face plate and the frame were separated in the same manner as in (1) and (2) of Example 4-1.
[0272]
{Circle around (3)} 25 containers 167 for accommodating the spacers 154 in a nitric acid solution tank containing a 0.2 N nitric acid solution were fixed to the base 168, the same number as the spacers, and sunk.
[0273]
This container is a rectangle having a length of 60 mm, a width of 10 mm, and a height of 10 mm as shown in FIG. 17, and a concave portion having a length of 50 mm, a width of 5 mm, and a depth of 8 mm is formed at an upper portion. The concave portion is formed in a mesh shape so as not to store liquid, and is formed of a fluororesin which is stable against nitric acid and does not damage the spacer. This container was fixed on a pedestal so as to be disposed directly below each spacer, and then submerged in a nitric acid solution tank 151.
[0274]
The face plate 153 with the spacer 154 welded thereto was immersed in the nitric acid solution tank 151 so that the spacer 154 was directed downward, and the frit glass 157 was dissolved to separate them. Each spacer 154 fell into the recess of the storage container.
[0275]
After moving the face plate 153 separated from the spacer 154, the container 167 and the base 168 were lifted out of the nitric acid solution tank (FIG. 22A).
[0276]
{Circle around (4)} After each container was rearranged so as not to leave an interval, each container was submerged in a washing nitric acid solution tank containing a 0.2 N nitric acid solution. In this step, the frit glass remaining on the spacer was melted, and the re-adhesion of the melt from the face plate and the substrate was removed (FIG. 22B).
[0277]
(5) Subsequently, pure water washing, drying, and inspection were performed in the same manner as in Example 4-1. The cleaning tank used in this example was smaller than that used in Example 4-1 and had a length of 200 mm and a width of 150 mm (FIGS. 22C and 22D).
[0278]
As a result of the inspection, about 10% of the spacer was removed as a defective product, and most of the spacers could be reused.
[0279]
[Example 4-4]
In the present embodiment, the same device as in Embodiment 4-1 was used to collect the spacer. In this example, the same face plate as that of Example 4-1 was used in which 25 spacers were welded. The spacer is made of nickel oxide NiO as a conductive film on a quartz glass substrate. ₂ Was used.
[0280]
Separation, washing and drying of the spacer were performed in the same manner as in (1) to (6) of Example 4-1.
[0281]
Next, the thus recovered spacer was inspected. As an inspection method, a method was first used in which a contaminant and other stains were confirmed by an optical microscope, and a scratch or peeling of the conductive film was confirmed. As a result of the inspection, about 10% of the spacer was removed as a defective product, and most of the spacers could be reused. The good spacer was used as it was for the assembly of a new display.
[0282]
[Example 4-5]
In this example, a flat display having the same configuration as that of Example 4-1 was used.
[0283]
As the spacer collecting device, an apparatus as shown in FIG. 18 was used. In FIG. 18, 151 is a nitric acid solution tank, 152 is a nitric acid solution, 153 is a face plate, 154 is a spacer, 157 is a frit, 158 is a support plate of a face plate, 159 is a spacer support arm, and 160 is a tip portion thereof. Reference numeral 150 denotes an elastic material for supporting the support. The support 158 and the arm 159 are made of a fluorine resin that is stable against nitric acid, and the tip 160 is made of a fluorine rubber that does not damage the spacer.
[0284]
This will be described below with reference to FIGS.
[0285]
First, the face plate and the frame were separated in the same manner as in (1) and (2) of Example 4-1.
[0286]
{Circle around (3)} After the face plate 153 was placed on the support base 158 such that the spacers faced upward, the upper portions of the respective spacers 154 were sandwiched and fixed by the tip 160 of the support arm 159 (FIG. 23A). Thereafter, the support 158 was lowered, and the face plate 153 and the welded portion 157 were immersed in a nitric acid solution tank 151 containing a 0.2 N nitric acid solution. After confirming that the frit glass 157 was melted and the spacer 154 was separated, the frit glass 157 was pulled out of the nitric acid solution tank (FIG. 23B).
[0287]
{Circle around (4)} The spacer was immersed in a washing nitric acid solution tank made of a 0.2 N nitric acid solution with the spacer sandwiched between the support members. In this step, the frit glass remaining on the spacer was melted, and the re-adhesion of the melt from the face plate and the substrate was removed (FIG. 23C).
[0288]
{Circle around (5)} Next, the wafer was transferred to a pure water tank 165 to perform final cleaning (FIG. 23D).
[0289]
{Circle around (6)} Subsequently, hot-air drying was performed (FIG. 23E).
[0290]
{Circle around (7)} As a result of inspecting the thus recovered spacers in the same manner as in Example 4-1, about 10% of the spacers were removed as defective products, indicating that most of the spacers can be reused. became.
[0291]
[Example 4-6]
In this example, a display having the same configuration as that of Example 4-1 was used except that the spacers were welded on both sides of the substrate and the face plate.
[0292]
Hereinafter, this will be described in detail with reference to FIGS.
[0293]
{Circle around (1)} A portion where the substrate 163, the face plate 153, and the frame 164 were welded by the frit glass 157 was taken out from the housing.
[0294]
{Circle around (2)} In the same manner as in Example 4-2, the welded portions of the frame, the substrate, and the face plate were cut (FIG. 24A).
[0295]
{Circle around (3)} The unit is gradually immersed below the substrate in a nitric acid solution tank 151 containing a 0.2 N nitric acid solution, and when the welded portion between the substrate and the spacer sinks in the solution, the unit is further immersed. Was stopped (FIG. 24 (b)).
[0296]
Thus, only the frit between the substrate and the spacer was dissolved and separated (FIG. 24C).
[0297]
{Circle around (4)} After lifting the substrate from the nitric acid solution tank, the spacers were separated and collected from the face plate in the same manner as in steps (3) to (7) of Example 4-1.
[0298]
As a result of recovery by such a method, about 15% of the spacers were removed as defectives, and most of the spacers could be reused.
[0299]
[Embodiment 5]
FIG. 25 is a flowchart showing steps of a method for recovering a phosphor from a display device of the present invention. The collecting step will be described with reference to FIG.
[0300]
The display device (S20) to be processed and discarded here is a display in which a phosphor is applied to a face plate and the phosphor is emitted by irradiation of an electron beam or ultraviolet rays. Specifically, a normal CRT and a flat display are used. Some of them have a face plate coated with a phosphor.
[0301]
The above-mentioned display device is identified by a sensor before separating the CRT unit or the flat display unit from the cabinet, and the data is used in subsequent processes (for example, dimensions, how to remove the display, and the shape of the face plate). Brush size, shape and aspirator shape) are retrieved from the database.
[0302]
According to the data obtained in the above identification step, the display unit is taken out of the cabinet and the display is fixed on a jig so that the face plate can be easily removed from the display. As the jig used here, a jig having an optimal shape is selected and used in accordance with the data obtained in the above-described identification step. If a plastic or metal member is attached to the display unit, it is removed as necessary (S21).
[0303]
The display fixed to the jig breaks the internal reduced pressure state and is sent to the next step.
[0304]
In the step of separating (disassembling) the face plate (S22), along the frit glass portion between the face plate portion and the frame portion in the case of a CRT or between the face plate portion and the frame portion in the case of a flat display. Remove the face plate from the display. Examples of the removal method include a method of cutting between the face plate portion and the funnel portion, or a method of peeling a frit glass portion sealing both portions with a peeling liquid. As a method of disassembling a CRT, for example, a method of cutting with a heating wire (Japanese Patent Application Laid-Open No. 07-029496), a method of decomposing by generating thermal strain (Japanese Patent Application Laid-Open No. 05-151898), and ultrasonic vibration simultaneously with heating And a method of using nitric acid as a stripping solution (Japanese Patent Application Laid-Open No. 07-045198) have been proposed. However, the reason is that thermal distortion is prevented and the wet process requires time and cost. Cutting with a wire saw or an energy cutter is preferred. The glass chips generated at this time are removed by suction by a suction device attached to the cutting machine. The funnel and rear plate are glass cullet.
[0305]
The removed face plate is fixed on a jig with the inner surface facing up, and is sent to a brush sweeping and suctioning step (S28).
[0306]
The brush sweeping step can be completed with only one sweep if the purpose is only to recover the phosphor, but if the purpose is also to reuse the face plate, it is repeated until the inner surface meets the specifications. It is also possible to sweep. At this time, a brush for removing the fluorescent substance may be used, and a buff for internal mirror finishing may be used.
[0307]
As a brush used in the brush sweeping process of the present invention, a brush having a shape corresponding to R (radius of curvature) of the inner surface of the face plate is selected in the case of a normal CRT, and in the case of a flat CRT or a flat display. The brush corresponding to the plane is selected. In the case where the sliding motion method described later is adopted, a curved brush with R is used even in the flat face plate processing step in consideration of the sliding motion (S32).
[0308]
The movement of the brush used in the present invention is not particularly limited, such as a simple rotation movement or a repetition rotation movement, with respect to the surface of the face plate 2. For example, the brush 171 simultaneously performs both the rotation movement and the revolution movement. If the method (FIG. 26) or the method of rotating around a certain point while rotating around the center line (FIG. 27) (FIG. 27), the phosphor is easily and quickly discharged. This is also desirable and helps to smooth the inner surface.
[0309]
The shape of the nozzle and the suction force are not particularly limited as long as the suction device used in the present invention has a capability of sucking and collecting the phosphor 2b and the black stripe swept out by the brush. It is also possible to install the inside of the brush to prevent scattering of the phosphor 2b, or to install so as to surround the outer periphery of the brush. It is preferably installed inside.
[0310]
The phosphor 2b and the black stripe recovered in the present invention are separated and purified by a known method, and any means may be used. For example, the collected phosphors are NaOH, NaClO and H ₂ O ₂ (JP-A-06-108047), treating the recovered phosphor with a strong acid to leach rare earths, and further adding oxalic acid to convert the rare earths to oxalic acid. A method has been disclosed in which a salt is obtained and roasted to obtain a rare earth oxide (Japanese Patent Application Laid-Open No. 08-333641).
[0311]
Hereinafter, as an example of a flat display, a configuration example of a flat display device using a surface conduction electron-emitting device will be described. FIG. 29 is a perspective view of a display device using spacers, in which a part of the panel is cut away to show the internal structure.
[0312]
In FIG. 29, 11 is an electron-emitting device portion, 1 is a rear plate, 3 is a side wall (frame).
Reference numeral 2 denotes a face plate, which forms an airtight container (enclosure 15) for maintaining the inside of the display panel at a vacuum by the rear plate 1, the side wall 3, and the face plate 2. The spacer 4 is provided as needed, and is provided for the purpose of preventing the envelope from being damaged or deformed by receiving the atmospheric pressure. When assembling an airtight container, it is necessary to seal the joints of each member to maintain sufficient strength and airtightness.For example, apply frit glass to the joints, It seals by baking at 400-500 degree | times for 10 minutes or more.
[0313]
A substrate 41 is fixed to the rear plate 1, and a cold cathode type electrode is placed on the substrate.
N × M element emitting elements 11 are formed (N and M are positive integers of 2 or more and are appropriately set according to the target number of display pixels. For example, display of a high-definition television is performed. In an intended image forming apparatus, it is desirable to set the number to be equal to or greater than N = 3000 and M = 1000.) The N × M cold cathode type electron-emitting devices 11 are arranged in a simple matrix by M X-directional wirings 12 and N Y-directional wirings 13.
[0314]
Here, the configuration is such that the substrate 41 of the multi-electron beam source is fixed to the rear plate 1 of the hermetic container. However, if the substrate 41 of the multi-electron beam source has a sufficient strength, As 1, the substrate 41 of the multi-electron beam source may be used.
[0315]
A fluorescent film 2b is formed on the lower surface of the face plate 2. Color
In the case of the display described above, phosphors of three primary colors of red, green and blue used in the field of CRT are separately applied to the portion of the fluorescent film 2b. Black stripes are provided between the phosphors. The purpose of providing the black stripe is to prevent the display color from being shifted even if the electron beam irradiation position is slightly shifted, and to prevent the reflection of external light to prevent the display contrast from being lowered. is there.
[0316]
When a monochrome display panel is created, a single-color phosphor material is
It may be used for the optical film 2b, and the black stripe need not always be used.
[0317]
A metal plate, which is well-known in the field of CRTs, is provided on the surface of the fluorescent film 2b on the rear plate side.
A back 2c is provided. The purpose of providing the metal back 2c is to improve the light utilization rate by mirror-reflecting a part of the light emitted from the fluorescent film 2b, to protect the fluorescent film 2b from the collision of negative ions, and to increase the electron beam acceleration voltage. To act as an electrode for applying an electric field, or to act as a conductive path for excited electrons of the fluorescent film 2b. The metal back 2c was formed by forming the fluorescent film 2b on the face plate substrate 2a, smoothing the surface of the fluorescent film, and vacuum-depositing Al thereon. When a fluorescent material for a low acceleration voltage is used for the fluorescent film 2b, the metal back 2c may not be used.
[0318]
In addition, a face plate is used to apply an acceleration voltage and to improve the conductivity of the fluorescent film.
A transparent electrode made of, for example, ITO may be provided between the gate substrate 2a and the fluorescent film 2b.
[0319]
Further, Dx1 to Dxm and Dy1 to Dyn and Hv are the same as those of the display panel (not shown).
This is an electric connection terminal having an airtight structure provided for electrically connecting to an electric circuit. Dx1 to Dxm are electrically connected to the X-directional wiring of the multi-electron beam source, Dy1 to Dyn are electrically connected to the Y-directional wiring of the multi-electron beam source, and Hv is electrically connected to the metal back 2c of the face plate.
[0320]
[Example 5]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0321]
[Example 5-1]
A flat display device using a surface conduction electron-emitting device comprising a face plate portion, a frame portion, and a rear plate portion is fixed on a jig with the face plate side down, and a holding member provided with a rubber sucker is rearwardly mounted. The display was fixed by closely contacting the plate portion. The vacuum state in the display was broken by crushing the end of the exhaust pipe, and the frit portion between the face plate portion and the frame portion was cut with an energy cutter and disassembled.
[0322]
While removing the rear plate portion and the frame portion, the inner surface of the face plate 2 is swept out by the rotating brush (see FIG. 27) provided with a suction device and performing a scribing motion (see FIG. 27), and the phosphor 2b is swept out (about 20 minutes). The black matrix was suctioned and collected from the suction holes 172.
[0323]
After the phosphor 2b was completely removed, the inner surface was polished for an additional 30 minutes to perform mirror finishing.
[0324]
The unevenness of the black matrix portion and the phosphor 2b coating portion on the inner surface of the face plate was suppressed to 15 μm or less, indicating that the face plate can be used as it is as a reproduction face plate.
[0325]
[Comparative Example 5-1]
In the same manner as in Example 5-1, the decomposed face plate was immersed in an oxalic acid aqueous solution to remove the phosphor, and then the black matrix was removed with high-pressure water. Irregularities of about 85 μm were observed in the phosphor-coated portion and the black matrix-coated portion.
[0326]
[Example 5-2]
The electron gun and the deflection yoke were cut out of the CRT separated from the cabinet. The CRT was fixed on a jig with the face plate side down, and a presser provided with a rubber sucker was brought into close contact with the funnel to fix the CRT. The explosion-proof band wound around the frit glass part of the CRT was peeled off, and the adhesive was removed by a grinding operation. The CRT was disassembled into a face plate portion and a funnel portion using an energy cutter.
[0327]
The funnel is removed, and the revolving brush (see FIGS. 26 and 28) equipped with an aspirator sweeps the inner surface of the face plate to sweep out the phosphor (about 20 minutes), while sucking and collecting the phosphor and black tomatrix. did.
[0328]
After the phosphor was completely removed, the rotating brush was changed to a buff, and the inner surface was polished for another 30 minutes to perform a mirror finishing treatment.
[0329]
The unevenness of the black matrix portion and the phosphor-coated portion on the inner surface of the face plate was suppressed to 10 μm or less, and it was found that the face plate could be used as a reproduction face plate as it was.
[0330]
FIGS. 28A and 28B are cross-sectional views showing the configuration of the brush and the suction device. FIG.
7A, a suction hole is provided in the brush part 171, and suction is performed by a suction mechanism 173. In FIG. 28B, the brush part 171 is covered with a suction device 174 to perform suction, and the flow of air caused by the suction is changed to a rotational motion by a turbine 175 and used as a driving force of the brush part 171.
[0331]
[Embodiment 6]
Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings. In the present embodiment, when the face plate, the rear plate, the frame, the spacer, and the like described above are to be collected, first, a low pressure close to a vacuum of about 10-5 Pa is set by an airtight container inside the FPD. Must be returned to In that case, if the processing is directly performed by cutting, melting, or the like without returning the air pressure, efficient recovery cannot be performed. Accordingly, a method of returning the pressure from a vacuum-tight container to a normal pressure as one step of a recyclable recovery method will be described below.
[0332]
FIG. 30 is a schematic diagram showing an embodiment of the image display device of the present invention. In the figure, 201 is an image display unit, 202 is a hermetic container for maintaining the pressure of the image display device, 203 is inside the hermetic container, and an anti-atmospheric pressure member for stably maintaining the hermetic container, and 204 obtains the pressure. Means 205 for connecting to the exhaust device, means for gradually returning the inside of the airtight container to atmospheric pressure.
[0333]
FIG. 31 is a schematic diagram of an FPD showing an example of an embodiment of the image display device of the present invention. In the figure, reference numeral 2 denotes a face plate as an image display unit, which comprises a glass substrate 2a, a fluorescent screen 2b, and a metal back 2c. 1 is a rear plate and 3 is a frame. The face plate 2, the rear plate 1, and the frame 3 form an airtight container 202. A means 204 for connecting to the exhaust device shown in FIG. 30 and a means 205 for returning to atmospheric pressure are provided. Further, a spacer 4 is provided as an example of the atmospheric pressure resistant component.
[0334]
An image display device suitable for the present invention is a display device in which the inside maintains a pressure lower than the atmospheric pressure. For example, an image display device such as a CRT, a plasma display panel (PDP), a flat image display device including a surface conduction electron-emitting device, a flat image display device including an electric field (FE) electron-emitting device, A flat-panel image display device including an insulator-metal (MIM) type electron-emitting device, a fluorescent display tube, a flat CRT, a thin FPD, and the like are applicable.
[0335]
The image display unit 15 of an image display device such as a CRT is maintained at a considerably lower pressure than a normal atmospheric pressure with respect to a liquid crystal display device or an electroluminescent panel. This is because image information is displayed by irradiating electrons to fine phosphors and the like, causing them to emit light, and controlling this. That is, unless the pressure is reduced and the atmosphere in which a substance that interferes with electrons is obstructed is sufficiently excluded, the trajectory of electrons cannot be controlled. As the pressure at which such electron trajectories can be controlled, an optimal pressure is appropriately selected depending on the configuration of the image display device, but is preferably 10 Pa or less. Preferably, the pressure is 1 Pa or less.
[0336]
As the material of the airtight container that maintains the internal pressure of the image display unit 15, the face plate 2a is a material that is transparent to visible light capable of displaying the internal image information to the outside and has a strength capable of maintaining the internal pressure. Various glass materials are mainly used. Further, in order to keep the inside of the face plate 2a, the frame 3, and the rear plate 1 airtight, it is preferable to use a material that has substantially the same coefficient of thermal expansion and can be sealed with frit glass or the like having substantially the same coefficient of thermal expansion.
[0337]
When the internal pressure is larger than the external atmospheric pressure, an atmospheric pressure resistant component such as a spacer 4 is used to improve the strength of the airtight container 202 and prevent the airtight container 202 from being deformed. In particular, in the case of a large-screen image display device, if the strength of the airtight container 202 is increased by increasing the thickness of the airtight container 202, the weight of the image display device increases, making it difficult to use at home.
[0338]
Therefore, in order to reduce the weight of the image display device, other than the outer wall of the airtight container 202, an atmospheric pressure resistant component is used. In the case of a thin FPD, a uniform image can be obtained over the entire surface of the image display device by keeping the distance between the face plate 2 as the image display unit 1 inside the panel constituting the airtight container 202 and the rear plate 1 constant. Can be. Therefore, a large number of spacers 4 are disposed inside the panel as anti-atmospheric pressure components, and the distance between the face plate 2 and the rear plate 1 in the panel, which is the hermetic container 202, is kept substantially constant.
[0339]
The spacers 4 must be used in more places in the panel to suppress distortion of the face plate 2 and the rear plate 1 as the panel becomes larger. The shape, the number, and the like are appropriately determined depending on the size, strength, and distance of the face plate 2 and the rear plate 1, the strength of the frame 3, and the like.
[0340]
The hermetic container 202 having the image display unit having such a configuration can reduce the pressure inside the hermetic container 202 by having the means 204 connected to an exhaust device such as a vacuum pump. After evacuating to a sufficiently low pressure, the inside of the airtight container 15 can be kept at a low pressure by sealing. Then, the image display unit of the image display device is driven.
[0341]
After being connected to the airtight container 202, it is means for gradually returning to the atmospheric pressure. Normally, the amount Q of gas flowing when leaking is represented by the following equation.
[0342]
Q = C (P ₁ −P ₀ ) [Pa ・ m ² / S] ... (1)
here,
C: Conductance [m ² / S]
P ₁ : Atmospheric pressure [Pa]
P ₀ : Pressure inside the airtight container [Pa]
P ₁ −P ₀ ： Difference between atmospheric pressure and pressure inside airtight container [Pa]
It is.
[0343]
In order to prevent breakage of the hermetic container and internal components, it is important to prevent abrupt gas flow into the hermetic container. For this purpose, the gas flow rate Q is set to 10 ¹ Pa ・ m ² / S or less. Therefore, from the equation (1), the conductance C becomes 10 ^-4 m ² A mechanism having a leak unit of about / s or less is disposed in the airtight container 202 as a unit 205 for gradually returning to the atmospheric pressure.
[0344]
The means 205 for gradually returning to the atmospheric pressure is provided by providing a slow leak valve, a long narrow tube according to specifications in an airtight container, or using a porous material. Further, the means 205 for gradually returning to the atmospheric pressure is disposed at a position connecting the airtight container 202 and the atmosphere side, and is also connected to the exhaust device from the atmosphere side and sealed. In this way, when the airtight container 202 is maintained at a low pressure, the airtight container 202 is also sealed from the atmosphere side. When a leak occurs in order to reuse the image display device, the sealing on the atmosphere side is released, and the pressure in the airtight container can be gradually increased to the atmospheric pressure.
[0345]
Further, in the present embodiment, an example in which the means 205 for gradually returning to the atmospheric pressure is provided on one side of the airtight container 202 has been described. However, the present invention is not limited to this. What is necessary is just to arrange | position in the position which does not obstruct part 1.
[0346]
If necessary, a filter or the like may be provided and connected to a mechanism for gradually introducing gas.
[0347]
When the used image display device is reused, an inert gas, nitrogen, air, air from which moisture is removed, or the like is gradually introduced in accordance with the subsequent processing.
[0348]
In the case of repairing a defect that occurred during the manufacturing process, the gas to be introduced is appropriately selected so as not to hinder the subsequent manufacturing process, and the airtight container 202 maintained at a low pressure is gradually returned to the atmospheric pressure to be disassembled. Make repairs.
[0349]
[Example 6]
Hereinafter, the present invention will be described in detail with reference to examples.
[0350]
[Example 6-1]
First Embodiment A first embodiment will be described with reference to FIGS. FIG. 30 is a diagram showing the configuration of the image display device of the present invention. FIG. 31 shows an example of the FPD in the image display device of the present invention.
[0351]
A spacer 214 as an anti-atmospheric pressure member is disposed in an airtight container 202 including a face plate 2 serving as an image display unit, a rear plate 1, and a frame 3. Exhaust connection means 204 connected to the exhaust device is connected to the hermetic container 202, and is sealed after keeping the inside at low pressure. In this embodiment, 5 × 10 ^-2 After evacuation to about Pa, sealing was performed. Further, to the airtight container 202, an air pressure returning means 205 for gradually returning to the atmospheric pressure is connected. In this embodiment, the conductance C is about 10 ^-7 m ² / S slow leak valve was used. This slow leak valve is 5 × 10 ^-2 After evacuating to about Pa, sealing is performed. In order to disassemble the image display device, the air side of the means 205 for gradually returning to the atmospheric pressure was broken, and the airtight container 202 was leaked. When the inside of the panel was confirmed after disassembly and disassembly, there was no breakage of the spacer 4 and there was no evidence that the members in the airtight container 202 were particularly damaged.
[0352]
Next, for comparison, the exhaust connection means 204 connected to the exhaust device of the same image display device was broken, and the airtight container 202 was leaked. Immediately, the inside of the panel was released to the atmospheric pressure, but the internal spacer 4 was damaged, and the fragments of the panel 4 caused a lot of scratches on the face plate 2, the rear plate 1, and the frame 3.
[0353]
[Example 6-2]
In this embodiment, an example of a matrix drive type surface conduction electron source display (SED) as shown in FIG. 32 will be described as an image display device. Wirings 12 and 13 for driving an electron source 11 of a surface conduction electron source are formed on the rear plate 1. The wirings 12 and 13 are element wirings in the X direction (Dox1, Dox2,... Doxm) and the Y direction (Doy1, Doy2,... Doyn), respectively. This SED has a structure including a spacer 214 as shown in FIG. This embodiment also has an air pressure returning unit 205 that gradually returns to the atmospheric pressure, as in the embodiment 6-1.
[0354]
When the panel was driven after it was almost completed, it was found that a part of the panel was defective. Then, the atmospheric pressure side of the atmospheric pressure returning means 205 for gradually returning to the atmospheric pressure was opened, the panel was leaked, and the defect was repaired. Thereafter, the inside of the panel was evacuated and sealed from the evacuating connection means 204 again connected to the evacuating device, and simultaneously, the atmosphere side of the air pressure returning means 205 for gradually returning to the atmospheric pressure was evacuated and sealed, thereby completing the image display device. When driven and an image was displayed, the defect was repaired and no other defects occurred.
[0355]
[Embodiment 7]
Hereinafter, Embodiment 7 of the present invention will be described with reference to the drawings.
[0356]
FIG. 33A is a cross-sectional view schematically showing one embodiment of the flat display of the present invention, and FIG. 33B is a plan view of the flat display shown in FIG. It is.
[0357]
The flat display of the present invention includes a rear plate 222 having a large number of electron-emitting devices 221 disposed on a glass substrate, a face plate 224 disposed opposite to the rear plate 222 and having an image display unit 223, and a support plate. It has at least a frame 225 and a spacer 226 for maintaining the distance between the rear plate 222 and the face plate 224 against the atmospheric pressure, and is configured by airtightly joining these with a frit glass 229. ing. The frit glass 229 is generally a low-melting glass mainly containing lead oxide or the like.
[0358]
In joining the members, the first frit glass 227 is used for joining the spacer and the substrate, the second frit glass 228 is used for joining the rear plate and the support frame, and the second frit glass 228 is used for joining the face plate and the support frame. The third frit glass 229 is used. Of the above three types, the frit glasses 228 and 229 have different softening temperatures, and the first frit glass 227 joining the spacer 226 has a higher softening temperature among the second and third frit glasses 228 and 229. It has a high softening temperature equal to or higher than. Both are in the range of 350 to 470 ° C., and preferably differ by 20 ° C. or more from other frit glass.
[0359]
Of the plurality of frit glasses, the second and third frit glasses 228 and 229 may have a higher softening temperature, which is a problem in the process. The spacer 226 is bonded to one of the substrates of the rear plate 222 and the face plate 224, and it may be either substrate.
[0360]
The joining of each member in the manufacturing process is performed by applying frit glass to the joint and heating the frit glass to a temperature equal to or higher than the softening temperature of the frit. As an actual operation, a heat treatment at about 300 ° C. is performed in the air to remove components contained as a binder in the frit glass (this step is referred to as calcination). A heat treatment at a temperature of not less than ℃ is performed to weld the joint. The joining of the members may be performed in any order, and it is also possible to apply the plurality of frits simultaneously and heat them to a temperature equal to or higher than the softening temperature of all the frit to join them at once. Also, a method of joining in order from a place where a frit having a high softening temperature is used can be used. This method can be said to be a preferable method because the frit glass at the previously bonded portion can be sequentially bonded at a temperature at which the frit glass does not melt.
[0361]
The softening temperature in the present invention means that the viscosity of the frit glass is 10 ^7.65 It is a temperature equivalent to dPa · s (Poise), and can be joined by heating at a temperature higher than the softening temperature (firing temperature).
[0362]
The shape of the spacer is usually a thin plate having a length and width of several tens of mm and a thickness of 300 μm or less, and a conductive film for the purpose of preventing electrification is formed on the surface of the insulating base material. The spacers are arranged as many as necessary to achieve the purpose and at the necessary intervals.
[0363]
As the insulating member of the spacer, for example, quartz glass, glass having a reduced impurity content such as Na, soda lime glass, or SiO.sub. ₂ A substrate on which an insulating layer made of a material is laminated can be used.
[0364]
Examples of the conductive film material include metal oxides such as chromium, nickel, and copper, nitrides of aluminum and a transition metal alloy, and carbon.
[0365]
Next, the configuration of the face plate 224 will be described. In FIG. 33, a face plate 224 is formed by forming a fluorescent film 230 and a metal back 231 on a glass substrate, and this portion becomes an image display area. The fluorescent film 230 is made of only a phosphor in the case of a display device for displaying a black-and-white image. ) Is formed, and the space between them may be separated by a black conductive material. The black conductive material is called a black stripe, a black matrix, or the like depending on its shape. The metal back 231 is made of a conductive thin film such as Al. The metal back 231 reflects light traveling toward the electron source composed of the electron-emitting device group 221 out of the light generated from the phosphor in the direction of the glass base to improve the brightness, and the gas remaining in the panel is reduced. Also, it has a function of preventing the phosphor from being damaged by the impact of ions generated by ionization by the electron beam.
[0366]
Further, it provides conductivity to the image display area of the face plate 224 to prevent accumulation of electric charge, and serves as an anode electrode for the electron source. The metal back 231 is electrically connected to the high voltage terminal Hv so that a voltage can be externally applied through the high voltage terminal Hv.
[0367]
Next, a method of disassembling the flat display of the present invention will be described.
[0368]
FIG. 34 is a schematic view showing one embodiment of the disassembly method of the present invention. In FIG. 34, reference numeral 222 denotes a rear plate, 224 denotes a face plate, 225 denotes a support frame, 226 denotes a spacer, 227 denotes a first frit glass, 228 denotes a second frit glass, and 229 denotes a third frit glass. In FIG. 34, three types of frit glasses having different softening temperatures are used for the first, second, and third frit glasses used in each joint (FIG. 34A). Here, as one mode, it is assumed that the first frit glass 227> the second frit glass 228> the third frit glass 229 in order of increasing softening temperature.
[0369]
The disassembly procedure is as follows. First, the panel is placed in an appropriate heating furnace, and heated to a temperature higher than the softening temperature of the third frit glass 229 and lower than the softening temperature of the other frit, and only the third frit glass 229 is melted. The face plate 224 is separated from the support frame 225 while maintaining the temperature (FIG. 34B). Next, the heating temperature is increased to the softening temperature of the second frit glass 228 or more and the softening temperature of the first frit glass 227 or less. When the second frit glass 228 is melted, the support frame 225 and the rear plate 222 are separated (FIG. 34C). The heating temperature is further raised to melt the first frit glass 227, and the spacer 226 and the rear plate 222 are separated.
[0370]
In addition, as a method of separating at the joining portion by the first frit glass 227, a method by heating need not be particularly used. For example, as shown in FIG. 35, after the panel is separated to the state shown in FIG. 34 (c), the panel can be immersed in a solution 239 for dissolving the frit to dissolve the frit glass and separate the two. is there. Nitric acid is preferably used as the solution.
[0371]
Each member after separation is removed through a cleaning process, after removing residual frit glass with nitric acid or the like. The recovered member proceeds to a reuse process or a finer recovery process.
[0372]
FIG. 36 is a schematic view showing another embodiment of the disassembly method of the present invention. Also in FIG. 36, three types of frit glass having different softening temperatures are used for each joint (FIG. 36 (a)). Here, as one mode, it is assumed that the first frit glass 227> the third frit glass 229> the second frit glass 228 in the order of higher softening temperature.
[0373]
The disassembly procedure is as follows. First, the panel is placed in an appropriate heating furnace and heated to a temperature higher than the softening temperature of the second frit glass 228 and lower than the softening temperature of the other frit glass, and only the second frit glass 228 is melted. While heating, it is separated into a face plate 224 and a support frame 225, and a rear plate 222 and a spacer 226 (FIG. 36B). For the former, the heating temperature is set to be equal to or higher than the softening temperature of the second frit glass 228 in the next step. Then, since the second frit glass 228 is melted, the support frame 225 and the rear plate 222 are separated (FIG. 36 (c)). Separation of the rear plate 222 and the spacer 226 can be performed in the same manner as in the first embodiment.
[0374]
[Example 7]
The present invention will be described in more detail with reference to examples. In this example, a frit glass shown in Table 1 below was appropriately selected and used.
[0375]
[Table 1]

[0376]
[Example 7-1]
FIG. 33A is a cross-sectional view schematically showing one embodiment of the flat display of the present invention, and FIG. 33B is a plan view of the flat display shown in FIG. It is. The flat display of the present invention includes a rear plate 222 having a large number of electron-emitting devices 221 disposed on a glass substrate, a face plate 224 disposed opposite to the rear plate 222 and having an image display section 223, and a support plate. It has at least a frame 225 and a spacer 226 for maintaining a distance between the rear plate 222 and the face plate 224 to the atmospheric pressure, and is configured by air-tightly joining these using frit glass. I have.
[0377]
In this example, a display was manufactured in which 25 spacers 226 were welded to a rear plate 222 made of soda lime glass of 300 mm × 250 mm × 2.8 mm. The spacer used was a soda-lime glass substrate having a height of 2.8 mm, a plate thickness of 200 μm, and a length of 40 mm in which about 100 nm of aluminum nitride was deposited as a conductive film.
[0378]
Table 1-III (softening temperature: 410 ° C.) was used as the frit glass 227 between the spacer 226 and the rear plate 222. Table 1-II (softening temperature: 390 ° C.) for the frit glass 228 between the rear plate 222 and the support frame 225, and Table 1-I (softening temperature: 365 ° C.) for the frit glass 229 between the face plate 224 and the support frame 225. Frit glass 229 was used.
[0379]
As the electron-emitting device 221, a surface conduction electron-emitting device of the type shown in FIG. 37 was manufactured.
[0380]
Next, a method of manufacturing a flat display according to the present embodiment will be described with reference to FIGS.
{Circle around (1)} First, soda lime glass was used as a rear plate, and device electrodes 235 and 236 were formed on the substrate using Pt. At this time, the device electrode interval L1 was 10 μm, the device electrode width W1 was 500 μm, and the device electrode thickness d was 100 nm. Next, after applying an organic palladium-containing solution to a desired position including on the device electrode, a heat treatment is performed at 300 ° C. for 10 minutes to form a fine particle film 234 composed of palladium oxide (PdO) fine particles (average particle diameter: 7 nm). did.
[0381]
As described above, a plurality of electron-emitting devices 221 were formed on the substrate, and a rear plate 222 was obtained. The face plate used was a glass substrate coated with a phosphor as the image forming member 223.
{Circle over (2)} Next, the sealing method in this embodiment will be described. First, the spacer 226 was welded to the rear plate 222 using frit glass III (softening temperature: 410 ° C.) (FIG. 38A).
(3) Next, frit glass II (softening temperature: 390 ° C.) is applied to the outer peripheral portion on the rear plate 222 (portion of the frit application portion 240 in FIG. 33B), and frit is applied to the same portion on the face plate 224. After applying the glass I (softening temperature: 365 ° C.), the face plate 224, the support frame 225, and the rear plate 222 were overlapped while performing precise alignment (FIG. 38B). The face plate 224 and the rear plate 222 were fixed using a jig so as not to move, and were fired in a furnace at 400 ° C. for 10 minutes or more.
[0382]
Thus, the face plate, the rear plate, and the support frame were joined (FIG. 38C).
{Circle around (4)} Next, in order to evacuate the inside of the container manufactured in the above process, a vacuum is drawn by an exhaust pipe (not shown) provided in the support frame 225 or the like after the sealing process, and then the exhaust pipe is sealed. Stopped.
[0383]
[Example 7-2]
In this example, a display having the same configuration as that of Example 7-1 was manufactured. In this embodiment, the spacer is bonded to the rear plate, and frit glass III (softening temperature: 410 ° C.) is used for the bonding. Frit glass I (softening temperature: 365 ° C.) was used for joining the rear plate 222 and the support frame 225, and frit glass II (softening temperature: 390 ° C.) was used for joining the face plate 224 and the support frame 225.
[0384]
The manufacturing method of the flat display in the present example was the same as that in Example 7-1.
[0385]
[Example 7-3]
In this example, a display having the same configuration as that of Example 7-1 was manufactured. In this embodiment, the spacer 226 is joined to the rear plate 222, and frit glass IV (softening temperature: 450 ° C.) is used for the joining. Also, frit glass III (softening temperature 410 ° C.) was used for joining the rear plate 222 and the support frame 225, and frit glass II (softening temperature 390 ° C.) was used for joining the face plate 224 and the support frame 225.
[0386]
The manufacture of the rear plate 222 and the face plate 224 in the flat display according to the present embodiment uses the same method as in (1) of Embodiment 7-1.
{Circle over (2)} Next, the sealing method in this embodiment will be described. First, the spacer 226 was welded to the rear plate 222 with frit glass IV (softening temperature: 450 ° C.) (FIG. 38A).
{Circle around (3)} Next, frit glass III (softening temperature 410 ° C.) is applied to the outer peripheral portion (portion 240 in FIG. 33B) on the rear plate 222, and frit glass II (softening temperature) is applied to the same portion on the face plate 224. After applying a temperature of 390 ° C.), the face plate 224 and the support rear plate 222 were overlapped while performing precise alignment (FIG. 38B). The face plate 224 and the rear plate 222 were fixed using a jig so as not to move, and baked in a furnace at 420 ° C. for 10 minutes or more.
[0387]
Thus, the face plate 224, the rear plate 222, and the support frame 225 were joined (FIG. 38C).
{Circle around (4)} Next, in order to evacuate the inside of the container manufactured in the above process, a vacuum is drawn by an exhaust pipe (not shown) provided in the support frame 225 or the like after the sealing process, and then the exhaust pipe is sealed. Stopped.
[0388]
[Example 7-4]
In this example, a display having the same configuration as that of Example 7-1 was manufactured. In the present embodiment, the spacer 226 is joined to the face plate 224, and frit glass III (softening temperature: 410 ° C.) is used for the joining. Frit glass II (softening temperature: 390 ° C.) was used for joining the rear plate 222 and the support frame 225, and frit glass I (softening temperature: 365 ° C.) was used for joining the face plate 224 and the support frame 225.
[0389]
The manufacture of the rear plate 222 and the face plate 224 in the flat display according to the present embodiment uses the same method as in (1) of Embodiment 7-1.
{Circle over (2)} Next, the sealing method in this embodiment will be described with reference to FIG. First, the spacer 226 was welded to the face plate 224 using frit glass III (softening temperature: 410 ° C.) (FIG. 39A).
(3) Next, frit glass II (softening temperature: 390 ° C.) is applied to the outer peripheral portion on the rear plate 222, and frit glass I (softening temperature: 365 ° C.) is applied to the same portion on the face plate. 224, the support frame 225, and the rear plate 222 were overlapped while performing precise alignment (FIG. 39B). The face plate 224 and the rear plate 222 were fixed using a jig so as not to move, and baked in a furnace at 420 ° C. for 10 minutes or more.
[0390]
Thus, the face plate 224, the rear plate 222, and the support frame 225 were joined (FIG. 39C).
{Circle around (4)} Next, in order to evacuate the inside of the container manufactured in the above process, a vacuum is drawn by an exhaust pipe (not shown) provided in the support frame 225 or the like after the sealing process, and then the exhaust pipe is sealed. Stopped.
[0391]
[Example 7-5]
In this example, a display having the same configuration as that of Example 7-1 was manufactured. In this embodiment, the spacer 226 is joined to the rear plate 222, and frit glass II (softening temperature: 390 ° C.) is used for the joining. Also, frit glass II (softening temperature: 390 ° C.) was used for joining the rear plate 222 and the support frame 225, and frit glass I (softening temperature: 365 ° C.) was used for joining the face plate 224 and the support frame 225.
[0392]
The manufacture of the rear plate 222 and the face plate 224 in the flat display according to the present embodiment uses the same method as in (1) of Embodiment 7-1.
{Circle over (2)} The sealing method in this embodiment will be described with reference to FIG. First, the spacer 226 and the support frame 225 were welded to the rear plate 222 using frit glass II (softening temperature: 390 ° C.) (FIG. 40A).
{Circle over (3)} After frit glass I (softening temperature: 365 ° C.) was applied to the outer peripheral portion on the face plate 224, the face plate 224 and the support frame 225 were overlapped while performing precise alignment (FIG. 40 (b)). )). The face plate 224 and the support frame were fixed using a jig so as not to move, and baked in a furnace at 420 ° C. for 10 minutes or more.
[0393]
Thus, the face plate 224 and the support frame 225 were joined (FIG. 40 (c)).
{Circle around (4)} Next, in order to evacuate the inside of the container manufactured in the above process, a vacuum is drawn by an exhaust pipe (not shown) provided in the support frame 225 or the like after the sealing process, and then the exhaust pipe is sealed. Stopped.
[0394]
[Example 7-6]
In this embodiment, a method of disassembling the flat display shown in Embodiment 7-1 will be described. The disassembly method will be described with reference to FIG.
{Circle around (1)} First, the sealed portion of the exhaust pipe was broken, air was introduced, and the vacuum in the container was released (not shown).
{Circle around (2)} Next, the display was put into a heating furnace, and the rear plate 222 and the face plate 224 were held by an appropriate jig, and then heated to 380 ° C. When the temperature exceeds 365 ° C., the frit glass I joining the face plate 224 and the support frame 225 gradually melts, and the jig holding the face plate 224 is pulled up to separate them (FIG. 34). (A), (b)).
{Circle over (3)} After holding the support frame 225 with an appropriate jig, the heating temperature was increased to 400 ° C. When the temperature exceeds 390 ° C., the frit glass II joining the rear plate 222 and the support frame 225 gradually melts, and the jig holding the support frame 225 is pulled up to separate them from each other (FIG. 34). (C)).
{Circle over (4)} After the respective spacers 226 were held by a suitable jig, the heating temperature was increased to 450 ° C. When the temperature exceeds 410 ° C., the frit glass III joining the rear plate 222 and the spacer 226 gradually melts, and the jig holding the spacer 226 is pulled up to separate the two (FIG. 34 (d)). )).
[0395]
After recovery, each member was washed with a 0.2N nitric acid solution to remove residual frit glass, and then washed and dried. After that, the spacers and the support frame were selected through an inspection process, and those that were not damaged proceeded to a reuse process. In addition, the rear plate and the face plate have proceeded to a recovery step of each resource formed on the substrate, a reuse step of the substrate itself, and the like. In the flat display disassembled according to this embodiment, the face plate 222, the rear plate 224, the support frame, and the spacer 226 were hardly damaged during the process.
[0396]
[Example 7-7]
In this embodiment, a method of disassembling the flat display shown in Embodiment 7-2 will be described. The disassembly method will be described with reference to FIG.
{Circle around (1)} First, the sealed portion of the exhaust pipe was broken, air was introduced, and the vacuum in the container was released (not shown).
{Circle around (2)} Next, the display was put into a heating furnace, and the rear plate 222 and the face plate 224 were held by an appropriate jig, and then heated to 380 ° C. When the temperature exceeds 365 ° C., the frit glass I that has joined the rear plate 222 and the support frame 225 gradually melts, and the jig holding the face plate 224 is pulled upward, so that the face plate 224 and the support frame 225 are raised. And it was separated into two parts, a rear plate 222 and a spacer 226 (FIGS. 36 (a), (b) and (c)).
{Circle around (3)} Of the two parts separated, the face plate 224 and the support frame 225 are heated to 410 ° C. in the same manner as in the method of Example 7-5, so that the frit glass II is gradually melted. By lifting the jig holding the above, the two were separated (FIG. 36 (e)).
{Circle around (4)} On the other hand, separation of the rear plate 222 and the spacer 226 was performed in the same manner as in {circle around (4)} of Example 7-5 (FIG. 36 (d)). Each member after recovery was washed with a 0.2 N nitric acid solution to remove residual frit glass, and then washed and dried. After that, the spacer 226 and the support frame were selected through an inspection process, and those that were not damaged proceeded to a reuse process as they were. In addition, the rear plate 222 and the face plate 224 have proceeded to a step of collecting each resource formed on the substrate, a step of reusing the substrate itself, and the like. In the flat display disassembled according to this example, the face plate, the rear plate, the support frame, and the spacer were hardly damaged during the process.
[0397]
[Example 7-8]
In this embodiment, a method of disassembling the flat display shown in Embodiment 7-3 will be described. The disassembly method will be described with reference to FIGS.
[0398]
First, the face plate 224 and the support frame 225 were separated from the display to the state shown in FIG. 34C by the methods (1) to (3) of Example 7-6.
(4) Next, the rear plate is held by an appropriate jig, and the joint between the rear plate 222 and the spacer 226 is immersed in a liquid tank 237 containing a 0.2 N nitric acid solution 239 (FIG. 35A). . The nitric acid solution tank 237 has a mesh-like container 238 made of Teflon (registered trademark) inside. When the joined portion was immersed in the nitric acid solution 239, the frit glass IV was dissolved, and the spacer 226 was collected in the container 238. After confirming that all the spacers 226 were separated, the rear plate 222 was pulled up (FIG. 35B). Also, the spacer 226 was pulled up from the nitric acid solution 239 together with the container 238.
[0399]
After the collection, each member was cleaned of residual frit glass, washed and dried. Thereafter, the components were sorted through an inspection process, and the process was advanced to a reuse process or a more detailed recovery process. In the flat display disassembled according to this example, the face plate, the rear plate, the support frame, and the spacer were hardly damaged during the process.
[0400]
[Example 7-9]
In this embodiment, a method of disassembling the flat display shown in Embodiment 7-4 will be described. First, the display was heated to 360 ° C. in the same manner as in (1) and (2) of Example 7-7, and separated into two parts, a rear plate 222 and a support frame 225, and a face plate 224 and a spacer 226.
[0401]
Next, of the two parts separated, the rear plate 222 and the support frame 225 were separated in the same manner as in (3) of Example 7-7.
[0402]
On the other hand, separation of the face plate 224 and the spacer 226 was performed in the same manner as in (4) of Example 7-6.
[0403]
In the flat display disassembled according to this embodiment, the face plate 224, the rear plate 222, the support frame 225, and the spacer 226 were hardly damaged during the process.
[0404]
[Example 7-10]
In this embodiment, a method of disassembling the flat display shown in Embodiment 7-5 will be described. First, the face plate 224 was separated from the display to the state shown in FIG. 34 (b) in the same manner as in (1) and (2) of Example 7-6.
(3) Next, after holding the support frame 225 and the spacer 226 simultaneously with an appropriate jig, the heating temperature was increased to 410 ° C. When the temperature exceeds 390 ° C., the frit glass II joining the rear plate 222 and the support frame 225 and the rear plate 222 and the spacer 226 gradually melts, and the jig holding the support frame 225 and the spacer 226 is placed on the top. Each member was separated by pulling up.
[0405]
In the flat display disassembled according to this embodiment, the face plate 224, the rear plate 222, the support frame 225, and the spacer 226 were hardly damaged during the process.
[0406]
[Comparative Example 7-1]
In the flat display disassembled in this comparative example, frit glass II (softening temperature: 390 ° C.) is used for joining the spacer 226 and the rear plate 222, the rear plate 222 and the support frame 225, and the face plate 224 and the support frame 225. This is a display manufactured using the same method as that of Example 7-1 except for the above.
[0407]
The flat display was dismantled as follows. First, after the vacuum in the container was released, the container was put into a heating furnace, and the rear plate 222, the face plate 224, and the support frame 225 were held by appropriate jigs, and then heated to 410 ° C. When the temperature exceeded 390 ° C., frit glass II began to melt. The joints of the rear plate, frame and face plate are melted and separated at the same time, so they are held by jigs but lack stability, and sometimes the members are damaged due to contact between members or between jigs and members There was something. In particular, the spacer formed in a thin plate shape was frequently damaged.
[0408]
[Embodiment 8]
Hereinafter, an embodiment of an inspection device for a residual harmful metal amount according to the present invention will be described with reference to the accompanying drawings.
[0409]
FIG. 41 shows an embodiment of the present invention, and is a configuration diagram of an inspection device for the amount of residual harmful metals.
[0410]
As shown in FIG. 41, this inspection device is for inspecting the amount of harmful metals such as lead contained in the inspection target X such as members and wastes disassembled and separated for recycling, and mainly elutes lead. And a lead elution / recovery section 130 that performs the recovery and recovery, a cleaning section 131, a residual lead elution section 132, and a residual lead quantification section 133.
[0411]
As a test object X, a flat panel display including a rear plate 1, a face plate 2, a frame 3, and a spacer 4 shown in FIG. Disassembled and separated members and their waste are listed. However, as will be described later, this inspection apparatus is configured to elute lead into a nitric acid solution, and therefore, can be inspected as long as it is insoluble in a nitric acid solution, and the inspection object X is limited to a glass member. Absent.
[0412]
In FIG. 41, the lead elution recovery unit 130 fills the immersion bath 100 in which the test object X is immersed with the acidic solution A, and elutes the harmful metal (lead) contained in the test object X. That is, the recovery bath 102 is connected to the immersion bath 100 via the pipe 101, and the eluate of lead is passed through the open / close valve 103 and the liquid feed pump 104 provided in the middle of the pipe 101. It is configured to be sent to.
[0413]
At the upper edge of the immersion bath 100, a transport outlet of the transport conveyor 105 is disposed, and an inspection target X such as a sorting member is sent from a disassembly processing unit (not shown). A net basket 106 is set inside the immersion bathtub 100, and the inspection object X falls from the transport conveyor 105 into the net basket 106, and after a predetermined elution time has elapsed, holds the handle of the net basket 106 and lifts up. And take it out.
[0414]
The cleaning unit 131 is configured to clean the inspection target X after the cleaning bath 110 in which the inspection target X is immersed is filled with pure water B and eluted by the lead elution and recovery unit 130. That is, the net basket 106 pulled up from the immersion bathtub 100 is set in the cleaning bathtub 110 this time.
[0415]
The residual lead elution section 132 fills the immersion bath 120 in which the test object X is immersed with the acidic liquid C, and elutes the lead remaining in the test object X after being cleaned by the cleaning section 131. . That is, the immersion bath 120 is connected to the open / close valve 122, the liquid feed pump 123, and the switching valve 124 by an appropriate pipe 121, so that the residual lead eluate is sent to the residual lead quantitative unit 133. . An ultrasonic vibrator 125 is provided below the immersion bath 120 to apply ultrasonic vibration to the acidic liquid C in the immersion bath 120 to promote elution.
[0416]
A pipe 126 extending to the immersion bath 100 is connected to the other end of the switching valve 124 so that the remaining portion of the acidic liquid C filled in the immersion bath 120 is sent to the immersion bath 100 for reuse. Examples of the acidic solution C and the acidic solution A for recycling the acidic solution include a nitric acid solution, and the concentration of the nitric acid solution is preferably in the range of 0.1N (normal) to 1N.
[0417]
The residual lead quantification unit 133 employs an appropriate configuration for quantitative detection, which will be described later, and quantitatively detects lead from the eluate sent in.
[0418]
The material of each of the bathtubs 100, 102, 110, 120 is preferably a resin such as Teflon (registered trademark) or a glass containing no lead. No. The same applies to the material of the net basket 106, which is a material which is not affected by the acidic liquids A and C in which it is immersed. For example, a resin such as Teflon (registered trademark) is preferable.
[0419]
That is, in this inspection apparatus, first, the inspection target X is immersed in the acidic solution A (nitric acid solution) in the immersion bath 100 to dissolve the lead component contained therein, and then washed with pure water B in the washing bath 110. Thereafter, the residual lead is dissolved by immersion in an acid solution C (new nitric acid solution) in the immersion bath 120, and the residual lead is determined by the residual lead quantification unit 133, thereby inspecting the residual lead amount.
[0420]
FIG. 42 is a flowchart for sequentially explaining the inspection processing by the inspection apparatus for the amount of residual harmful metals shown in FIG. 41. Here, a case where the flat panel display shown in FIG. 43 is disassembled will be described as an example.
[0421]
First, pretreatment steps (1) to (3) for dismantling are performed. That is, the connection of terminals and the like is disconnected from the housing of the flat panel display device [Step (1)], and only the display body is taken out [Step (2)]. Then, the vacuum in the vacuum container forming the display body is released to return to the atmospheric pressure [Step (3)].
[0422]
Thereafter, the display main body is disassembled and separated by an appropriate means, and the separated member and the remaining waste are the inspection objects X.
[0423]
The inspection object X is transported to the lead elution and recovery unit 130 by the transport conveyor 105, and is immersed in the acidic solution A (nitric acid solution) in the immersion bath 100 [Step (4)].
[0424]
After a predetermined time has elapsed, the net basket 106 is pulled up, and the member from which the frit glass has been fixed is removed (step (5)).
[0425]
Next, the raised net basket 106 is transported to the cleaning unit 131 and put into the cleaning bath 110, and the nitric acid solution attached to the inspection target X is cleaned with pure water [Step (6)].
[0426]
After the washing, the net basket 106 is transported to the residual lead elution portion 132 and put in the immersion bath 120, and is immersed in the nitric acid solution C [Step (7)]. At this time, the ultrasonic vibrator 125 is activated to vibrate the immersion bath 120 to increase the elution efficiency.
[0427]
Thereafter, the opening / closing valve 122 is operated, and the eluate in the immersion bath 120 is sent to the residual lead determination section 133 to be taken out [Step (8)]. This take-out amount of several tens cc is sufficient.
[0428]
In the residual lead determination section 133, iodide is added to the sent eluate to form a color, and the absorbance is measured [Step (9)]. The measurement wavelength is preferably around 340 nm in order to obtain high analysis accuracy. Then, the lead ion concentration is determined from the measured absorbance.
[0429]
The lead ion concentration is determined in advance by determining the relationship between the lead ion concentration of the standard sample and the absorbance (calibration curve), and illuminating the absorbance against the calibration curve to determine the lead ion concentration. However, at this time, the quantitative value of lead in the nitric acid solution used is used as the blank value.
[0430]
Alternatively, the eluate sent may be directly measured by plasma emission spectroscopy (ICP) to detect the concentration of lead ions. The measurement wavelength at that time is preferably 220.4 nm for sensitivity.
[0431]
The lower limit of lead quantification by the absorbance method is about 1 ppm, and the lower limit of lead quantification by the ICP method is about 0.05 ppm.
[0432]
Here, the remaining nitric acid solution of the eluate taken out for inspection is sent to the immersion bath 100 by operating the switching valve 124 and reused. This is preferable because wasteful waste can be reduced.
[0433]
If the lead ion concentration value obtained in this way is equal to or less than a predetermined allowable value (for example, several tens ppm), it can be seen that no residual lead is attached to the inspection target X. If the lead ion concentration exceeds the allowable value, the process returns to the step (7) and is immersed again in a new nitric acid solution, and the steps (8) to (10) are repeated [step (10)]. At this time, after all of the nitric acid solution in step (8) has been discharged, a new nitric acid solution may be added to the immersion bath 120, or alternatively, a plurality of immersion baths 120 may be prepared and used. However, since the lead ion concentration is a contrast amount that changes with the increase and decrease of the solution amount, it is needless to say that the new nitric acid solution prepared in the immersion bath 120 needs to maintain the steadiness of the solution amount and concentration value.
[0434]
On the other hand, after performing the step (4), the nitric acid solution in the immersion bath 100 is sent to the recovery bath 102 by operating the opening / closing valve 103 [step (11)]. Then, an excessive amount of sulfate ion is added to the recovery bath 102 to cause the lead in the nitric acid solution to react and precipitate as lead sulfate, which is collected by filtration and suitable as a harmful substance containing lead. Perform disposal.
[0435]
With the configuration described above, the inspection apparatus for the amount of residual harmful metals according to the present embodiment first immerses the inspection target X in the immersion bath 100 of the lead elution and recovery unit 130, and performs the inspection using the nitric acid solution (acid solution A) in the immersion bath 100. The lead (hazardous metal) contained in the target X is eluted. Next, the test object X is sent to the cleaning unit 131 for cleaning, and then immersed in the immersion bath 120 of the residual lead elution unit 132. Then, the test object X is treated with the nitric acid solution (acid solution C) in the immersion bath 120. Residual lead (hazardous metal) is eluted. Then, when this eluate is sent to the residual lead determination unit 133, the residual lead determination unit 133 quantitatively detects the concentration of lead ions (amount of harmful metals) contained in the eluate.
[0436]
Therefore, at the time of dismantling and sorting of a flat panel display or the like, it is possible to quantitatively detect the amount of harmful metals such as lead remaining in the inspection object X such as the sorting member made of glass and the waste. In this case, the test object X is simply immersed and immersed in the immersion baths 100 and 120 filled with the acidic liquids A and C, so that it is easy to perform the quantitative detection without any trouble. As the inspection target X, if it is insoluble in the acidic liquids A and C, it can elute harmful metals such as lead contained therein, and there is no particular limitation on the material, shape, etc., and various members can be used. Can be inspected.
[0437]
[Embodiment 9]
Hereinafter, an embodiment of a flat panel display disassembly apparatus according to the present invention will be described with reference to the accompanying drawings.
[0438]
(Embodiment 9-1)
44 to 49 show a first embodiment of the present invention. FIG. 44 (a) is a perspective view showing a configuration of a flat panel display disassembly apparatus, FIG. 44 (b) is a plan view thereof, and FIG. FIG. 46 (a) is a front view showing the carrying means of FIG. 44, FIG. 46 (b) is a side view of the carrying means, and FIG. 47 (a) is FIG. 47 (b) is a side view of another example, FIG. 48 is a side view showing the spacer recovery jig of FIG. 44, and FIG. 49 is a view of the spacer recovery jig of FIG. It is a side view showing other examples.
[0439]
In the figure, 50 is a flat panel display, 57 is a holding table on which the flat panel display 50 is mounted, 54 is a supporting means for applying a pulling force to the upper surface of the flat panel display 50 to support it, and 55 is a pulling force to the supporting means 54. A control unit for generating, 71 (72) is a spacer collecting jig, and 300 is a conveying means.
[0440]
The flat panel display 50 to be disassembled takes the configuration shown in FIG. 43 having the same configuration as described above, and is placed on the holding table 57 with the plate member fixed to the spacer 4 facing upward, and the upper surface thereof. The supporting means 54 is brought into contact with and fixed by applying a predetermined pulling force. FIG. 45 shows an example in which the spacer 4 is fixed to at least the face plate 2 side. The holding table 57 can be moved up and down while the flat panel display 50 is placed thereon.
[0441]
The support means 54 is connected to the control unit 55. The control unit 55 generates a pulling force for supporting the weight of the upper surface by inputting the model number of the flat panel display 50.
[0442]
As a configuration in which the support means 54 exerts a pulling force, a configuration in which suction means exerts the pulling force by the suction force of the vacuum exhaust device to perform the support, or a mechanism in which the suction force of the suction cup exerts the pulling force is exerted. In this case, a configuration is adopted in which the suction means is used to perform support. In this embodiment, a configuration of a suction unit is adopted, and the support unit 54 is connected to a vacuum exhaust device 56. Note that the pulling force of the support means 54 is not a value capable of supporting the entire weight of the flat panel display 50 placed on the holding table 57, but the weight of the frame member 3 separated from the flat panel display 50, that is, It is set to a value that can support the plate member on the side that is fixed to the spacer 4, and for example, it is preferable that the weight is set to be larger than its weight by about 1 kg.
[0443]
The transporting unit 300 transports the plate member on the side fixed to the spacer 4 to the spacer collecting unit 73 (74) after separating the frame member 3 from the flat panel display 50, and along the guide rail 100. To move and carry. The configuration shown in FIGS. 46A and 46B is for a display in which the spacer 4 is fixed to one of the plates 1 and 2, and the configuration shown in FIGS. It is for display fixed to both plates 1 and 2.
[0444]
The column 61 of the transporting means 300 can move back and forth and left and right on the stage 60. An arm 63 is attached to the column 61, and the height of the arm 63 can be adjusted. The holding jig 62 is attached to the arm 63.
[0445]
The holding jig 62 is configured to hold a plate member fixed to the spacer 4 by sandwiching the plate member from both sides, that is, a pair of left and right hanging rods 321R, 321L and 322R, 322L are provided before and after the arm 63. The hanging rods 321R, 321L and 322R, 322L are provided with claws 321R1, 321R2 and 321L1, 321L2, and 322R1, 322R2 and 322L1, 322L2, which are separated by a vertical distance d1. The vertical interval d1 is set to an interval at which the rear plate 1 or the face plate 2 can be placed. The holding jig 62 attached to the arm 63 can adjust the left and right opening angles and the front and rear positions.
[0446]
The spacer collecting jig 71 (72) receives and supports the plate edge portion on the side fixed to the spacer 4 after the frame member 3 is separated, and the structure shown in FIG. , 2 is fixed to one of the displays, and the configuration shown in FIG. 49 is a display 72 in which the spacer 4 is fixed to both the plates 1 and 2.
[0447]
The spacer recovery jig 71 (72), which receives and supports the plate member, is housed in the spacer recovery section 73 (74), where the spacer 4 is separated and recovered.
[0448]
Regarding the spacer collecting jig 71, the groove depth d2 is set to be equal to or larger than the height of the spacer 4, the groove width d3 is set to be equal to or larger than the area of the spacer 4, and the receiving opening d4 is formed of a plate member to be received and supported. It is set to the width or more. In the spacer collecting jig 72, the lower groove depth d5 is set to be equal to or greater than the thickness of the plate member, and the shelf thickness d6 is the distance between the rear plate 1 and the face plate 2, that is, the frame separated in the previous process. The thickness is set to be equal to or less than the thickness of the member 3. A load avoiding jig 70 is provided at the bottom of the groove of the spacer collecting jig 72 so that a load is not applied to the spacer 4 in the plate member in the receiving and supporting state.
[0449]
The spacer collecting section 73 (74) accommodates a spacer collecting jig 71 (72) in a state of receiving and supporting the plate member, and performs separation and collection of the spacer 4.
[0450]
In order to separate and recover the spacers 4, a configuration in which the spacers 4 are immersed in an acidic solution such as a nitric acid solution or a configuration in which the spacers 4 are heated may be employed. The spacer 4 is taken out from the plate member in the receiving and supporting state by immersing (72) in the acid solution, and the spacer 4 collected at the bottom of the groove is recovered. Further, a heat treatment furnace 74 is provided as a spacer collecting section, and the spacer 4 is separated from the plate member in the receiving and supported state by heating the spacer collecting jig 71 (72). Is taken out, and the spacer 4 collected at the bottom of the groove is recovered.
[0451]
Note that, for example, a 0.2N nitric acid solution is used as the acidic solution. When adopting a configuration in which the spacer collecting section is immersed in an acidic liquid, the spacer collecting jig 71 (72) is formed from an acid-resistant material such as plastic, and in a case where heating is adopted, the spacer collecting jig 71 (72) is used. ) Is formed from a heat-resistant material such as a metal.
[0452]
FIG. 50 is a flowchart for sequentially explaining a disassembling process by the flat panel display disassembly apparatus shown in FIG.
[0453]
First, pretreatment steps (1) to (5) for dismantling are performed. That is, the flat panel display 50 is removed from the housing of the flat panel display device [Step (1)], and is placed on the holding base 57 with the plate member fixed to the spacer 4 facing upward [Step (2)]. )], Remove the attached wires and terminals [Step (3)], and release the vacuum in the vacuum vessel to an atmospheric pressure by appropriate processing such as breaking the seal of the mounting portion of the exhaust pipe. [Step (4)], and the exhaust pipe is removed [Step (5)].
[0454]
Next, as shown in FIG. 45, the supporting means 54 is brought into contact with the upper surface of the flat panel display 50 on the holding base 57, and fixed by applying a predetermined pulling force [Step (6)].
[0455]
Thereafter, the frame member 3 is separated from the flat panel display 50 [Step (7)]. For this separation, an appropriate method such as simply cutting, pushing a wedge blade tool into the joint between the frame member 3 and the two plates 1 and 2 to separate it, and spraying a nitric acid solution may be adopted.
[0456]
The frame member 3 separated in the step (7) is [crushed] and a lead component is removed in the [step (8)] and reused as recycled new glass material [step (9)].
[0457]
Next, the plate member on the side fixed to the spacer 4 is held by the transport means 300 shown in FIG. 46 [Step (10)], and is moved along the guide rail 100 to move the spacer collecting jig 71 ( 72) [Step (11)]. That is, while adjusting the opening angles of the suspension rods 321L, 321R and 322L, 322R, the plate members are suspended and supported by the claws 321L1, 321L2 and 321R1, 321R2 and 322L1, 322L2 and 322R1, 322R2, and the stage 60 is guided by the guide rail. It is moved along 100 and is moved to the spacer collecting jig 71 (72) by a procedure operation reverse to the hanging support procedure.
[0458]
Thereafter, the spacer 4 is collected [Step (12)]. For this purpose, a spacer collecting jig 71 (72) for receiving and supporting the plate member on the side fixed to the spacer 4 is housed in the spacer collecting section 73 (74), where the spacer 4 is separated and collected. Let it do.
[0459]
After the spacers 4 have been collected, if the plate member is the face plate 2 [step (13)], the phosphor is collected from the face plate 2 [step (14)], and crushed and the lead component is removed. Then, it is reused as a recycled new glass material [Step (15)].
[0460]
When the plate member is the rear plate 1 [step (16)], the wiring is removed from the rear plate 1 [step (17)], and the lead component is crushed and the lead component is removed. Reuse [Step (18)].
[0461]
With the above configuration, the flat panel display disassembly apparatus of the present embodiment pulls the plate member on the side fixed to the spacer 4 by the support means 54 in the step of separating the frame member 3 from the display body (vacuum container). Since the spacer 4 is suspended by applying an upward force, the weight of the plate member fixed thereto is not added, and the frame member 3 can be separated without burden on the spacer 4. Therefore, damage to the spacer 4 can be prevented.
[0462]
After the frame member 3 is separated, the spacer recovery jig 71 (72) receives and supports the plate edge portion on the side fixed to the spacer 4, so that the spacer 4 is also in a suspended state. And the weight of the plate member fixed thereto is not added. Since the step of separating the spacer 4 from the plate member received and supported by the spacer recovery jig 71 (72) is performed while the spacer recovery section 73 (74) is in the state of receiving and supporting the spacer 4, the spacer 4 is removed. In the separation / recovery process, no extra weight is applied to the spacer 4 and the spacer 4 can be prevented from being damaged.
[0463]
That is, the disassembly process can be performed by an appropriate process, and components that can be reused as they are, such as the spacers 4, can be collected without damage. As a result, it is possible to preferably achieve recycling.
[0464]
(Embodiment 9-2)
FIG. 51 shows Embodiment 9-2 of the present invention. FIG. 51 (a) is a perspective view showing the configuration of a flat panel display disassembly apparatus, and FIG. 51 (b) is a plan view thereof.
[0465]
Embodiment 9-2 is different from Embodiment 9-2 in that the support unit that applies a pulling force to the upper surface of the flat panel display 50 to support the suction unit 240 is a suction unit 240 that exerts a pulling force by the suction force of the suction cup to support the unit. Is configured to rotate the upper arm 63 around the column 61 as a rotation axis. Within the rotation range of the arm 63, the holding table 57, the spacer collecting section 73 (74), and the spacer collecting jig 71 (72) Is adopted. The same components as those in the above-described embodiment 9-1 are denoted by the same reference numerals, and description thereof will be omitted.
[0466]
The disassembly process in this case is also the same as that of Embodiment 9-1. In each process, the spacer 4 can be suspended, the spacer 4 can be separated and collected without burden, and the damage can be reduced. Can be prevented. Then, each member can be disassembled and reused as a new recycled glass material, that is, dismantling can be performed by an appropriate process, and as a result, recycling can be preferably achieved.
[0467]
[Embodiment 10]
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, a case will be described as an example in which an FPD having a spacer inside and a fluorescent screen on the face plate inner surface, which is schematically shown in FIGS. 43 and 32, is dismantled.
[0468]
FIG. 43A is a perspective view in which a part of the FPD is cut away, and FIG. 43B is a cross-sectional view. In FIG. 43, 1 is a rear plate, 2 is a face plate, 3 is a frame, and 4 is a spacer. In addition, lead-containing frit glass 5 is used for the joints shown in black in FIG.
[0469]
The rear plate 1, the face plate 2, and the frame 3 are made of quartz glass, glass having a reduced content of impurities such as Na, soda lime glass, or a laminate of a soda lime glass and a silica layer.
[0470]
The face plate 2 is configured such that a fluorescent film 2b is formed inside a glass substrate 2a, and a metal back 2c containing Al is formed on the inner surface of the fluorescent film 2b.
[0471]
The spacer 4 is adhered to one of the face plate side and the rear plate side, or both sides thereof. Here, only the face plate side is shown. The material of the spacer 4 is also basically made of glass, and a surface thereof may be coated with a conductive film to prevent charging.
[0472]
In addition to the above, an exhaust pipe for evacuating the inside of the FPD to a vacuum is generally attached (not shown). The exhaust pipe is usually made of a low-melting glass containing lead.
[0473]
The FPD shown in FIG. 32 is an example of a matrix drive type surface conduction electron source display (SED), and is partially cut away. In FIG. 32, a surface conduction electron source 11 and wirings 12 and 13 for driving the electron source are formed on a rear plate 1. Reference numerals 12 and 13 denote element wirings in the X direction (Doxl, Dox2,... Doxm) and in the Y direction (Doyl, Doy2,... Doyn), respectively, and are made of Ag, Pb, or the like. The X-direction wiring 12 and the Y-direction wiring 13 are separated by an insulating layer (not shown) at least at their intersections. Glass containing a large amount of lead is used for this insulating layer.
[0474]
As described above, lead-containing materials are used in various parts of the FPD. The gist of the present invention is to efficiently carry out a process for removing such lead to make glass or the like reusable by a method suitable for the shape of the member to be processed.
[0475]
FIG. 53 is a flowchart showing the steps of the disassembly processing method of the FPD device for explaining the embodiment of the present invention. Steps (1) to (3), which are the first half of this method, are pre-processing steps, and include a step of taking out the FPD from the housing of the FPD device and removing wirings and terminals associated therewith. Next, in steps (4) to (6), after the vacuum release of the FPD is performed by an appropriate method, the exhaust pipe is removed. Since the exhaust pipe contains lead, it is treated and reused as lead-containing glass.
[0476]
Next, in step (7), the panel is cut at the frame portion to separate each part, or in step (8), the frit glass at the joint is melted to separate each part. Through the step (7) or the step (8), the waste FPD is separated into the frame portion, the panel inner member, the face plate, and the rear plate. Hereinafter, each processing method will be described.
[0477]
The frame portion is crushed and reused as lead-containing glass.
[0478]
When a spacer (made of glass), a grid (made of metal), or the like is included as a member in the panel, each is collected and reused (step (9)).
[0479]
In the face plate, the phosphor is first removed (step (10)), and the phosphor is collected (step (11)). Next, in step (12), a face plate is put into a liquid processing tank in order to remove residual frit glass. FIG. 52 is a schematic diagram showing the configuration of the processing tank used at this time. In this processing tank 81, it is possible to simultaneously process a plurality of face plates 82. In the processing tank 81, the face plates 82 are arranged in parallel at predetermined corners by a support frame (not shown) or the like so that the surfaces do not come into contact with each other, and a liquid 83 having an action of melting frit glass is provided. (Eg, dilute nitric acid). The processing tank 81 is made of a material having high corrosion resistance such as stainless steel.
[0480]
In order to accelerate the melting of the frit glass, there are appropriately taken means of (1) flowing the liquid, (2) transmitting vibration or sound waves to the face plate, and (3) raising the temperature of the liquid by a heating mechanism. The processing liquid in which the frit glass has melted is taken out of the processing tank 81 to the processing liquid regenerating means 86, and lead and other eluted substances are collected (step (13)). As a result, the processing liquid is regenerated and returned to the processing tank 81. By providing the processing liquid regenerating and circulating mechanism in this manner, the environment in the processing tank can be kept substantially constant, and the processing for removing the residual frit glass from the face plate 82 can be continuously performed. It becomes. Arrows shown in FIG. 52 are for schematically showing the flow of the processing solution.
[0481]
Subsequently, the face plate is transferred from the processing tank to the cleaning tank and cleaned (step (14)), in which a liquid (eg, water) used for cleaning is used and adheres to the face plate. The structure and function of the cleaning tank are basically the same as those of the processing tank shown in Fig. 52. The glass after the cleaning step may be used as it is, or may be subjected to a pulverization and re-melting step. After that, it can be reused as a face plate substrate.
[0482]
In the rear plate, first, as a step (15), the rear plate is put into the liquid processing tank shown in FIG. 52 in order to remove wiring. Like the face plate, each rear plate is arranged in parallel at a predetermined interval by a support frame (not shown) or the like in the processing tank 81 so that the surfaces do not come into contact with each other. The liquid is immersed in a liquid 83 (for example, diluted nitric acid), and a plurality of rear plates are simultaneously processed. The structure and function of the rear plate processing tank are basically the same as those of the face plate processing tank. After removing the wiring in the processing tank, the metal (Ag, Pb, etc.) contained in the wiring is recovered (step (16)).
[0483]
Subsequently, the rear plate is moved from the treatment tank to the washing tank and washed (step (17)). In this washing step, a liquid (eg, water) used for washing is used and adheres to the rear plate. The processing solution is removed, and the structure and function of the cleaning tank are basically the same as those of the processing tank.The glass after the cleaning step is used as it is or as a rear plate substrate through a crushing and re-melting step. Reusable.
[0484]
[Example 10]
Hereinafter, the present invention will be described in detail according to embodiments with reference to FIGS. 32, 43, and 52 to 53. FIG.
[0485]
[Example 10-1] (Method of performing batch processing after cutting and separating)
As shown in FIG. 32, ten matrix-driven surface-conduction electron source displays (SEDs) were disassembled. This SED has a panel structure including a spacer as shown in FIG.
[0486]
According to the disassembly process diagram of the FPD device in FIG. 53, the SED was taken out of the housing of the SED device, and the wiring and terminals attached thereto were removed. Next, the vacuum of the SED was released, and the exhaust pipe was removed. The exhaust pipe was treated and reused as lead-containing glass.
[0487]
Next, a cutting line was set inside the region joined by the frit glass of the SED panel, and the SED was cut along the cutting line using a diamond cutting saw while adding a grinding fluid.
[0488]
The above operation was performed for 10 SEDs. Each SED was divided into a frame portion, a face plate, and a rear plate by cutting. There were spacers that were detached at the time of cutting, and spacers that were adhered to the face plate. In both cases, those that could be recovered and reclaimed manually were selected and reused.
[0489]
The frame portion was ground as it was and reused as a raw material for lead-containing glass. After removing the metal back and the phosphor, ten face plates were put together into a liquid processing tank in order to remove the residual lead component. FIG. 52 is a schematic diagram showing the configuration of the processing tank used at this time. The treatment tank 81 was filled with 0.2 N nitric acid as a treatment liquid 83, and the face plates 82 were arranged in parallel and immersed in the same. In the processing tank 81, a support frame (not shown) is provided so that the face plates 82 are arranged in parallel at regular intervals. The processing liquid 83 was caused to flow along the surface of the face plate 82 by the liquid flowing means 84, and the processing was performed for 1 hour while the processing liquid 83 was heated to 50 ° C. by the heater 85.
[0490]
During this time, the processing liquid 83 is sent to the processing liquid regeneration mechanism 86, regenerated, and returned to the processing tank 81. In the treatment liquid regeneration mechanism 86, a solid component was removed by a filter, and a dissolved component was separated and recovered by an electrolytic method.
[0490]
Subsequently, ten face plates 82 were collectively transferred from the processing tank 81 to the cleaning tank and cleaned. The structure of the cleaning tank is basically the same as the above-mentioned processing tank. Using water as a washing solution, washing was performed for 30 minutes. The glass after the washing step was reused as a face plate substrate through a pulverizing and re-melting step.
[0492]
52 rear plates were put into the processing tank shown in FIG. 52 at a time to remove residual frit glass and wiring. The treatment liquid was 0.2 N nitric acid, heated to a temperature of 50 ° C., and further treated for 2 hours while applying ultrasonic waves by an ultrasonic wave applying means 87.
[0493]
Subsequently, ten rear plates were collectively transferred from the treatment tank to the washing tank and washed. The structure of the cleaning tank is basically the same as the above-mentioned processing tank. Using water as a washing solution, washing was performed for 30 minutes. The glass after the washing step was reused as a rear plate substrate through a pulverizing and re-melting step.
[0494]
[Example 10-2] (Method of performing batch treatment after dissolution separation)
According to the disassembly process diagram of the FPD device in FIG. 53, the SED was taken out of the housing of the SED device, and the wiring and terminals attached thereto were removed. Next, the vacuum of the SED was released, and the exhaust pipe was removed. The exhaust pipe was treated and reused as lead-containing glass.
[0495]
Next, each SED panel was immersed in a nitric acid solution to dissolve the frit glass at the joint of the panels. As a result, each panel was divided into a frame portion, a face plate, and a rear plate.
[0496]
The above operation was performed for 10 SEDs.
[0497]
Hereinafter, the steps up to the step of cleaning the face plate and the rear plate are the same as those of the example 10-1. After the washing process, the glass was dried and reused as it was as a face plate or rear plate substrate.
[0498]
In this embodiment, since the glass substrate is not cut, the recovered glass substrate can be reused as it is as a member of the SED.
[0499]
[Embodiment 11]
Hereinafter, preferred embodiments of a method and an apparatus for collecting a phosphor of a flat panel display according to the present invention will be described with reference to the drawings.
[0500]
In this embodiment, the display to be processed is composed of a face plate, a rear plate and a frame placed between the panels, a phosphor is applied to the inner surface of the face plate, and the phosphor is emitted by irradiation with an electron beam. Form flat panel display.
[0501]
In the phosphor recovery device of the present invention, a fixing jig provided so as to be capable of moving forward and backward with respect to the flat panel display so as to surround the flat panel display placed on a base such as a work table or a work belt. There is used a fixing device provided so that the fixing jig is slid from the four sides and abutted to fix the jig.
[0502]
FIG. 54 shows the basic steps of the processing according to the present invention.
[0503]
In FIG. 54, the display (S40) to be processed and discarded is separated from the cabinet. In this case, the display is arranged on the work table with the face plate side as the lower surface, the periphery thereof is temporarily fixed with the movable-aperture-type fixing jig according to the present invention, and the suction chuck provided on the work table is operated. Secure completely.
[0504]
In the fixing jig used here, the position is detected based on the moving distance, and the size information of the flat panel display is detected from the position information (S41). This information is sent to the control terminal (control unit), and the range of movement of the cutter (separating means) used for cutting the frame portion, which will be described later, or the range of operation of the phosphor recovery brush (recovering means) thereafter is determined. (S41). Further, a seal made of rubber or plastic is provided around the suction port of the suction chuck in order to increase the adhesion of the face plate.
[0505]
Next, the suction cup is lowered from above to be sucked on the upper rear plate, and the frame is cut in accordance with the information from the control terminal (S44). Alternatively, the face plate, the rear plate, and the frame are separated by a method such as fusing the frit glass in the frame (S45, S49). The rear plate and the frame (S45) are removed from the face plate (S46), and after the noble metal elements (S47) such as gold, silver and palladium are removed, they are transferred to a culletizing step (S48).
[0506]
On the other hand, the face plate (S49) lowers the phosphor recovery brush with the suction mechanism onto the face plate, reciprocates the face plate a plurality of times (S50), and recovers the phosphor (S51). In this case, a phosphor detecting means for detecting the amount of the phosphor remaining on the face plate is provided, and the operation of the collecting brush of the collecting means is controlled based on the phosphor amount information obtained by the phosphor detecting means. I have.
[0507]
As a method of judging the end of the phosphor recovery work using the phosphor detection means according to the present invention, for example, a means for irradiating visible light and detecting the transmittance thereof is provided on the workbench, and the end of the work is judged. it can. Alternatively, a method of arranging a fluorescence spectrometer detection unit behind the collection brush and determining the end of the work when the fluorescence intensity emitted from the phosphor becomes 0.5% or less, more preferably 0.2% or less of the initial value. There is.
[0508]
There is also a method in which the face plate is turned over together with the jig after the rear plate and the frame are separated, and a brush is acted from below to drop and collect the phosphor. According to this method, since the energy of the brush suction mechanism and the necessity of arranging the collection tube are not required, the operation can be performed more efficiently.
[0509]
The face plate from which most of the phosphor has been removed in this manner is further subjected to a washing step using distilled water or an aqueous solution in which the phosphor is easily dissolved, for example, an oxalic acid aqueous solution, and the phosphor is completely recovered and removed. Considering the cost of the subsequent oxalic acid recovery step, it is desirable to sufficiently scrape the phosphor in the brush step so that the phosphor can be washed only with distilled water (S52).
[0510]
The face plate that has undergone the cleaning step is subjected to a drying step so that it can be reused as a face plate (S53), and is sent to a face plate manufacturing step (S55). Alternatively, if the inner surface does not meet the face plate standard, it is reused as ordinary glass through a cullet and melting process (S54), or is reused as a part of the face plate member.
[0511]
The collected fluorescent material is separated and purified by a known method, and any means may be used. For example, the recovered phosphors are NaOH, NaClO and H ₂ O ₂ Or a treatment with a weak acid (JP-A-6-108047), or a treatment of the recovered phosphor with a strong acid to leach rare earths, and further adding oxalic acid to remove the rare earths. It can be carried out by a method such as a method of obtaining a rare earth oxide by roasting the acid salt and obtaining a rare earth oxide (Japanese Patent Laid-Open No. 8-333641).
[0512]
In the above case, the drive control of the fixing device, the cutter, the collection brush, and the like included in the apparatus of the present invention is performed by a control unit having a CPU according to a predetermined program. That is, based on the position information of the fixing jig and the phosphor amount information of the phosphor detecting means, a proper drive command is issued to the drive mechanism for the movement amount and ON / OFF of the member such as the cutter or the recovery brush, and To control the processing work.
[0513]
[Example 11]
Next, specific examples of the present invention will be described.
[0514]
(Example 11-1)
Here, FIG. 58 shows a process according to Example 11-1 of collecting a phosphor from a flat panel display.
[0515]
First, panel peripheral components are removed from the flat panel display 260. Remove the screw around the display with a screwdriver and remove the display casing. In addition, the power cable, high-voltage power section, tuner section, and flexi cable are removed, metal and plastic are separately housed, and only the panel section is provided.
[0516]
As shown in FIGS. 55 and 56, the panel portion (flat panel display 260) taken out as described above is placed on a work table 261 provided with a vacuum suction chuck 271 with the face plate portion 2 facing down. The flat panel display 260 is fixed using a movable diaphragm type jig 270 connected to a control terminal. That is, as shown in FIG. 55 (a), the jigs 270a and 270b for fixing the upper and lower sides of the panel gradually move in the vertical direction until they come into contact with the panel. At the same time, the jigs 270c and 270d that fix the left and right sides of the panel gradually move in the horizontal direction until they come into contact with the panel, that is, the jigs 270 move until the upper and lower ends of the panel and the left and right ends of the panel are detected.
[0517]
Actually, the detection movement of the upper and lower ends of these panels and the detection movement of the left end and right end of the panel are performed alternately, until one of the ends is detected, and thereafter, the detection movement only in the undetected direction is performed. . Therefore, the movement of the jig 270 is observed as the jig 270 fixes the panel while gradually narrowing the interval. The position information of the panel fixing jig 270 is sent to the control terminal, and determines the moving range of the cutter and the working range of the brush with the suction mechanism described later.
[0518]
The panel is completely fixed on the work table 261 by the suction chuck 262 via the suction hole 262a provided in the work table 261. In this case, the periphery of the suction port of the suction chuck 262 is completely sealed by the seal 263.
[0519]
Next, as shown in FIG. 55, the rear plate 1 is pressed by a suction cup 270 including four enclosures 270a, 270b, 270c, and 270d. The face plate 2 and the frame 3 are cut and separated as shown in the figure by the cutter 272 whose movement range is controlled by the control terminal described above. The rear plate 1 and the frame 3 are removed by a suction cup and are sent to a process of recovering noble metal used for wiring, and the rear plate is mainly housed as a glass cullet.
[0520]
On the other hand, the phosphor was swept out of the face plate 2 by the brush 273 as shown in FIG. In this case, the remaining amount of the fluorescent substance is confirmed from above the face plate 2 by a fluorescent spectrometer (not shown), and the information is processed by the control terminal to determine the operation time of the brush 273. At this stage, 99.5% of the phosphor used in the production could be removed, and 99.2% could be recovered.
[0521]
The face plate 2 is further subjected to a washing step, and the phosphor remaining as dust is collected. At this stage, no detectable fluorescent substance was present on the face plate 2. The recovered phosphor was 99.4% of the phosphor used at the time of production. The face plate 2 is inspected as to whether or not it can be used as a face plate as it is. Alternatively, the glass cullet is turned into a process of being reused as ordinary glass resources.
[0522]
(Example 11-2)
Next, an example 11-2 will be described.
[0523]
In this example, after removing the rear plate 1 and the frame portion 3, the face plate 2 was turned over together with the jig, and the rest of the procedure was the same as in Example 11-1 to collect the phosphor.
[0524]
As in the case of Example 11-1, no detectable phosphor was present on the face plate 2. The recovery rate of the phosphor was 99.6%.
[0525]
(Example 11-3)
Next, in Example 11-3, the recovery of the phosphor was performed in the same manner as in Example 11-1, except that the visible light transmittance was used as the phosphor detection means. In this case, the brush step was terminated when the transmittance stopped changing.
[0526]
After the treatment step, the amount of the remaining phosphor was measured using a fluorescence spectrometer, and it was confirmed that about 1% of the phosphor remained. The recovery rate of the phosphor was 99.2%.
[0527]
[Embodiment 12]
Hereinafter, preferred embodiments of a substrate processing method and apparatus according to the present invention will be described with reference to the drawings.
[0528]
In this embodiment, as shown in FIGS. 43 and 32, an example will be described in which an FPD having a spacer inside and a phosphor screen on the inner surface of the face plate is dismantled.
[0529]
In FIG. 43, 1 is a rear plate, 2 is a face plate, 3 is a frame, and 4 is a spacer. In the drawing, lead-containing frit glass 5 is used for the joints shown in black.
[0530]
The spacer 4 is either one of the face plate 2 side and the rear plate 1 side,
Or it is glued on both sides. Here, the case where only the face plate 2 side is shown. The rear plate 1, the face plate 2, and the frame 3 are made of quartz glass, glass having a reduced content of impurities such as Na, blue plate glass, or a laminate of a blue plate glass and a silica layer. In the face plate 2, a fluorescent film 2b is formed inside a glass substrate 2a, and a metal back 2c containing Al is formed on the inner surface of the fluorescent film 2b.
[0531]
The material of the spacer 4 is also basically made of glass, and a surface thereof may be coated with a conductive film to prevent charging. In addition to the above components, an exhaust pipe for evacuating the inside of the FPD to vacuum is generally attached (not shown). The exhaust pipe is usually made of a low-melting glass containing lead.
[0532]
As shown in FIG. 32, as one example of the FPD, a surface conduction type of a matrix drive system
1 shows an electron source display (SED). In FIG. 2, a surface conduction electron source 11 and wirings 12 and 13 for driving the electron source are formed on a rear plate 1. In the figure, reference numerals 12 and 13 denote element wirings in the X direction (Dox1, Dox2,... Doxm) and in the Y direction (Doy1, Doy2,... Doyn), respectively, and are made of Ag, Pb, or the like. The X-direction wiring and the Y-direction wiring are insulated by an insulating layer at least at their intersections. Glass containing much lead is used for the insulating layer.
[0533]
As mentioned above, various parts of the FPD use lead-containing materials. The present invention implements an efficient treatment by a method suitable for the shape of the member to be treated in order to remove the lead and make the glass or the like reusable.
[0534]
Here, FIG. 61 is a flowchart showing the steps of the disassembly processing method of the FPD device for explaining the embodiment of the present invention.
[0535]
Steps (1) to (3), which are the first half of this method, are pre-processing steps, and include a step of taking out the FPD from the housing of the FPD device and removing wirings and terminals associated therewith. Next, in steps (4) to (6), after the vacuum of the FPD is released by an appropriate method, the exhaust pipe is removed. Since the exhaust pipe contains lead, it is treated as lead-containing glass and reused.
[0536]
In step (7), the panel is cut at the frame portion, and each portion is separated. Or joint
Each part is separated by the step (8) of melting the wet glass. Through the step (7) or the step (8), the discarded FPD is separated into (9) a frame portion, (11) a panel inner member, (13) a face plate, and (20) a rear plate. become. Hereinafter, each processing method will be described.
[0537]
The frame portion of (9) is pulverized and reused as lead-containing glass (step (10)).
When a spacer (made of glass), a grid (made of metal), or the like exists as a panel internal member of (11), each is collected and reused (step (12)).
[0538]
In the case of the face plate, the phosphor is first removed in step (14), and the phosphor is recovered in step (15). Next, the glass plate serving as the face plate substrate is housed in the glass plate holding device, which is the substrate processing device of the present invention, and is put into a liquid processing tank to remove the residual frit glass (step (16)).
[0539]
FIG. 59 is a diagram illustrating the configuration of the glass substrate holding device used at this time. Here, the configuration and function of the glass substrate holding device will be described in detail with reference to FIG. The plurality of glass plates 286 housed in this device are held parallel to each other and with a certain gap. This has the effect that the processing liquid can sufficiently flow along the glass surface in the liquid processing tank. In addition, in order to improve the liquid drainage and minimize the removal of the processing liquid from the processing tank, it is typically preferable that the glass plate 286 be held so that the surface of the glass plate 286 is oriented substantially vertically. . Note that the glass plate 286 may be held at an appropriate inclination as indicated by a chain line.
[0540]
Further, the support member 287 that contacts the glass plate 286 typically has a cylindrical shape. In this manner, by making at least the contact portion of the support member 287 with the substrate circular or arcuate, the support member 287 is in line contact with the glass plate 286 to hold the glass plate 286, and this structure also takes out the processing liquid. Has the effect of reducing
[0541]
In addition, in the present glass substrate holding apparatus, in addition to the case where the liquid drainage property of the processing liquid is improved by the shape or the like of the support member 287 as described above, the processing liquid may be removed from the glass plate 286 using, for example, an air blow. It may be. Further, the glass substrate holding apparatus can be applied to a case in which a plurality of glass plates to be held are held in the same size or a plurality of glass plates in different sizes are held.
[0542]
The glass substrate holding device needs to quickly move between liquid processing tanks after accommodating a large number of glass plates 286. Therefore, it is required to have sufficient strength as a whole. In addition, high corrosion resistance is required to cope with treatment with an acid or alkali solution. The glass substrate holding device can be made of a material such as stainless steel, Teflon (registered trademark), or polypropylene.
[0543]
FIG. 60 is a schematic diagram showing the configuration of the processing tank used at this time. In the processing tank 81, the respective glass plates are arranged in parallel by a predetermined interval by a holding device so that the surfaces do not come into contact with each other, and a processing liquid 83 of a liquid (for example, dilute nitric acid) having an action of dissolving the frit glass. Immersed in
[0544]
Means for accelerating the melting of the frit glass include: (1) flowing the liquid of the processing liquid 83; (2) transmitting vibration or sound waves to the glass plate; and (3) raising the temperature of the liquid by a heating mechanism. Taken as appropriate. The processing liquid 83 in which the frit glass has been melted is taken out of the processing tank 81, and lead and other eluted substances are collected in step (17) (see FIG. 61). As a result, the processing liquid 83 is regenerated and returned to the processing tank 81. By providing the regeneration and circulation mechanism of the processing liquid 83 in this manner, the environment in the processing tank 81 can be kept constant, and the processing for removing the residual frit glass from the glass plate can be continuously performed. It becomes. The arrows written in FIG. 60 are for schematically showing the flow of the processing liquid 83. The processing tank 81 is made of, for example, a material having high corrosion resistance such as stainless steel.
[0545]
Subsequently, the glass plate serving as the face plate 2 is transferred from the processing tank 81 to the cleaning tank while being stored in the glass plate holding device, and is washed (step (18)). In this cleaning step, a liquid (for example, water) used for cleaning is used, and the above-described processing liquid 83 is removed. The structure and function of the cleaning tank are basically the same as those of the processing tank 81. The glass having undergone the cleaning step can be reused as it is or through a crushing or remelting step as a faceplate substrate (step (19)).
[0546]
In the rear plate 1 shown in FIGS. 61 and (20), first, the glass plate that was the rear plate 1 is put into a liquid processing tank in order to be housed in a glass plate holding device to remove wiring (step (16)). )). The configuration and function of the glass plate holding device are basically the same as those used in the face plate.
[0547]
In the processing tank 81, the glass plates are arranged in parallel by a glass plate holding device at predetermined intervals so that the surfaces do not come into contact with each other, and are immersed in a liquid (for example, diluted nitric acid) having an action of dissolving the wiring material. Is done. The structure and function of the rear plate processing tank are basically the same as those of the face plate processing tank. After removing the wiring in the processing tank in step (21), the metal (Ag, Pb, etc.) contained in the wiring is recovered in step (22).
[0548]
Subsequently, the glass plate serving as the rear plate 1 is transferred from the processing tank to the cleaning tank and washed while being stored in the glass plate holding device. In the cleaning step (23), a liquid (for example, water) used for cleaning is used, and the above-described processing liquid is removed. The structure and function of the cleaning tank are basically the same as those of the processing tank described above. The glass after the washing step can be reused as it is or as a rear plate substrate through a pulverizing or re-melting step (step (24)).
[0549]
[Example 12]
Next, a specific embodiment of the present invention will be described with reference to FIGS. 43, 32, and 59 to 61. FIG.
[0550]
(Example 12-1)
In Example 12-1 of the present invention, the plurality of glass plates 286 housed in the glass plate holding device shown in FIG. 59 are held parallel to each other with a certain gap. Further, the glass plate 286 is held so that the surface of the glass plate 286 faces substantially vertically.
[0551]
In this embodiment, ten glass plates 286 each having a thickness of 3 mm can be stored. The support member 287 that contacts the glass plate 286 has a columnar shape, and holds the glass plate 286 by being in line contact with the glass plate 286. The member that contacts the glass plate 286 is made of Teflon (registered trademark).
[0552]
The glass substrate holding device of the present embodiment accommodates ten glass plates 286 and is reinforced with a large number of stainless steel girders so as to be able to move quickly between the liquid processing tanks. . These structural materials are shaped and arranged so as not to hinder the flow of the processing liquid in the liquid processing tank. Further, when the glass substrate holding device of the present embodiment is pulled out of the liquid processing tank, the horizontal surface is reduced to minimize taking out of the processing liquid.
[0553]
(Example 12-2)
In Embodiment 12-2, an example will be described in which ten matrix-driven surface conduction electron source displays (SEDs) as shown in FIG. 32 are disassembled.
[0554]
This SED has a panel structure including a spacer as shown in FIG. Then, in accordance with the disassembly process of the FPD device shown in FIG. 61, the SED was taken out of the housing of the SED device, and the wiring and terminals attached thereto were removed. Next, the vacuum of the SED was released, and the exhaust pipe was removed. The exhaust pipe was treated and reused as lead-containing glass.
[0555]
Next, a cutting line was set inside the region joined by the frit glass of the SED panel, and the SED was cut along the cutting line using a diamond cutting saw while adding a grinding fluid. The above operation was performed for 10 SEDs.
[0556]
By cutting, each SED was divided into a frame portion, a face plate, and a rear plate. There were spacers that had come off during the cutting and those that were adhered to the face plate. Both of them were manually collected and recyclable, and selected and reused. The frame portion was ground as it was and reused as a raw material for lead-containing glass. After removing the metal back and the phosphor, the ten face plates were stored in the glass plate holding device 282 shown in FIG.
[0557]
After removing the metal back and the phosphor, the ten face plates were stored in the glass plate holding device 282 shown in FIG. Further, this was charged into a liquid treatment tank in order to remove a residual lead component. FIG. 60 is a schematic diagram showing the configuration of the processing tank used at this time. The processing tank was filled with 0.2 N nitric acid as a processing liquid, and the processing liquid was caused to flow along the surface of the face plate by liquid flowing means 84. The treatment was performed for 1 hour with the treatment liquid heated to 50 ° C. by the heater 85 for heating.
[0558]
During this time, the processing liquid is sent to the processing liquid regeneration mechanism, is regenerated, and is returned to the processing tank. In the treatment liquid regeneration mechanism, solid components were removed by a filter, and dissolved components were separated and recovered by an electrolytic method. Subsequently, the glass plate holding device 282 of this example was moved from the treatment tank to the washing tank and washed. The structure of the cleaning tank is basically the same as the processing tank described above. Using water as a washing solution, washing was performed for 30 minutes. The glass after the washing step was taken out of the glass plate holding device 282, and was reused as a face plate substrate through a pulverizing or re-melting step.
[0559]
The ten rear plates were stored in a glass plate holding device 282 shown in FIG. Further, this was put into the processing tank shown in FIG. 60, and the residual frit glass and the wiring were removed. The treatment liquid was heated to 50 ° C. with 0.2N nitric acid. Further, the treatment was performed for 2 hours while applying ultrasonic waves by the ultrasonic wave applying means 87.
[0560]
Subsequently, the glass plate holding device 282 containing the ten rear plate substrates was moved from the processing tank to the cleaning tank for cleaning. The structure of the cleaning tank is basically the same as the processing tank described above. Using water as a washing solution, washing was performed for 30 minutes. The glass after the cleaning step was taken out of the glass plate holding device 282 and reused as a rear plate substrate through a pulverizing or re-melting step.
[0561]
Here, an example in which an electron source substrate formed by forming a large number of surface conduction electron-emitting devices on a glass substrate treated by the method of the present invention, and using this, an image forming apparatus will be described.
[0562]
First, Pt electrodes are formed in a matrix on the regenerated glass substrate by using a vacuum film forming technique and a photolithography technique. Here, the interval between the element electrodes was 20 μm, the width of each element electrode was 500 μm, the thickness was 100 nm, and the arrangement pitch of the elements was 1 mm. Subsequently, a wiring made of Ag is formed in a matrix by a printing method.
[0563]
Next, an aqueous solution of palladium acetate monoethanolamine is spin-coated with a spinner between the device electrodes, and heated and baked at 270 ° C. for 10 minutes. A thin film composed of palladium oxide (PdO) fine particles was obtained. Thereafter, a conductive thin film having a width of 300 μm was obtained by photolithography and dry etching.
[0564]
Next, a voltage is applied between the device electrodes in a vacuum to perform a forming process, thereby forming a crack-shaped electron emitting portion in the conductive thin film.
[0565]
Next, an activation process is performed on the element for which the energization forming has been completed. In the present embodiment, ethylene gas is introduced into a vacuum, and a pulse voltage having a peak value of 20 V is repeatedly applied between the device electrodes for 30 minutes. By this activation step, a compound mainly composed of carbon was deposited to a thickness of about 10 nm in the vicinity of the electron-emitting portion.
[0566]
The electron source substrate on which a large number of surface conduction electron-emitting devices were formed was used as a rear plate, and an envelope was formed with a face plate and a support frame. The inside of the envelope was evacuated and sealed to produce an image forming apparatus having a display panel and a drive circuit for television display. In this image forming apparatus, an extremely good image without a non-light emitting portion (pixel defect) is formed.
[0567]
Embodiment 13
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Here, it is assumed that the flat panel display as shown in FIG. 29 is dismantled.
[0568]
FIG. 62 is a flowchart showing the steps of the disassembly processing method according to this embodiment. First, after removing wires, terminals, and the like from the flat panel display (S60) taken out of the housing (S61), the inside of the vacuum is released, and then the exhaust pipe is removed (S62). Next, the components are separated into components such as a face plate (S64), a rear plate (S70), and a frame portion (S63). As a frit glass to which these parts are welded, a low-melting glass mainly composed of lead oxide is generally used. As a method of separation, a method of melting the frit glass by heating, dissolving the frit glass with an appropriate solvent, or the like can be used.
[0569]
The face plate (S64) after separation is cleaned with a solvent such as nitric acid or water and water for removing the residual frit glass and cleaning the glass surface after removing the phosphor, the black body and the metal back by an appropriate method (S65). (S66). On the other hand, with respect to the rear plate (S70) after separation, a part or all of the constituent materials formed on the substrate can be removed by performing an appropriate solvent and water washing step (S71, S72).
[0570]
Next, the elements present on the surface of the glass substrate after the removal step as described above are detected.
[0571]
FIG. 63 is a schematic view showing an X-ray fluorescence spectrometer according to the present invention for detecting an element present on a glass surface. In FIG. 63, 301 is a support for a glass substrate 302, 302 is a glass substrate as a sample, 303 is an X-ray light source, 304 is a monochromator, 305 is a primary X-ray, 306 is a fluorescent X-ray, 307 is a semiconductor detector. , 308 is a cooling device, 309 is a preamplifier, 310 is an amplifier, 311 is a multi-channel analyzer, and 312 is a computer.
[0572]
The detection of an element is performed in the following procedure. First, after the primary X-ray 305 emitted from the X-ray light source 303 is monochromated by the monochromator 304, it is incident on the surface of the glass substrate 302 on the support 301 at an angle θ. The X-ray light source has an energy capable of exciting an element existing on the glass substrate 302. For example, W-Lα rays, Au-Lα rays, Mo-Kα rays, and the like are used. Fluorescent X-rays are generated from the surface of the glass substrate 302 irradiated with the primary X-rays 305, and are detected by a semiconductor detector 307 provided above the glass substrate 302. As the detecting element, a Si (Li) semiconductor detector is used. A detection signal from the semiconductor detector 307 passes through a preamplifier 309, an amplifier 310, and a multi-channel analyzer 311 and is then processed by a computer 312 to obtain a signal intensity corresponding to the type and concentration of a surface element of the glass substrate 302. Note that the semiconductor detector 307 and the preamplifier 309 are cooled by liquid nitrogen.
[0573]
Here, when the incident angle θ of the primary X-ray 305 is set to an angle at which the X-ray causes total reflection, that is, a low angle equal to or less than the critical angle of total reflection, the X-ray enters only about several nm from the sample surface, and X-ray fluorescence is generated efficiently. For this reason, the detection lower limit is 10 in the region of several nm or less on the sample surface. ⁹ atoms / cm ² Very sensitive elemental analysis can be performed. The critical angle for total reflection is θc ≒ 1.64 × 10 ⁵ × ρ ^1/2 × λ (ρ: substrate density (g / cm 3), λ: X-ray wavelength (cm)).
[0574]
Incidentally, the glass substrate 302 in the present embodiment is large and has a size of several tens of cm on one side. The present invention intends to perform element analysis of such a large area efficiently and at low cost. In order to measure with high sensitivity by the above method, it is generally preferable to bring the detector as close to the sample surface as possible. In this case, the analysis area substantially depends on the diameter of the detector, and is usually about 10 mmφ. However, when measuring a sample and a detector in close proximity in this way, when measuring a large area, it is necessary to scan the sample and obtain data at many points or arrange many detectors. Become. Therefore, as it is, a lot of time and equipment costs are required.
[0575]
Therefore, in the present invention, in order to perform elemental analysis efficiently without sacrificing sensitivity, a method of changing the relative position between the sample surface and the detector according to the size of the substrate is used. Next, a method of changing the relative position according to the present invention will be described with reference to FIG.
[0576]
In FIG. 64, 301 is a support for a glass substrate 302, 302 is a glass substrate as a sample, 307 is a semiconductor detector, 314 is a semiconductor element, 315 is an X-ray transmission window, and 316 is a collimator. The configuration of the semiconductor detector 307 is as shown in the figure. The semiconductor element 314 has a region indicated by a dotted line, that is, an angle φ determined by the size of the X-ray transmission window 315, the relative position with respect to the semiconductor element 314, and the like. X-rays can be received in a region having an extent depending on the size l of the semiconductor element 314 itself.
[0577]
When the semiconductor detector 7 is brought close to the sample surface as shown in FIG. 64A, the analysis area is substantially equal to the diameter of the X-ray transmission window 315. In contrast, when the position of the semiconductor detector 307 is moved away from the sample surface to the state shown in FIG. 64B, the X-ray intensity that can be detected from a unit area decreases, but the detectable region increases. Therefore, when detecting fluorescent X-rays from the glass substrate 302 having a side length L, the distance d between the glass substrate 302 and the semiconductor detector 307 is set so that 2d · tan φ> L, and the entire surface of the glass substrate 302 is set. By measuring while irradiating primary X-rays, X-rays from the entire glass substrate 302 can be captured without sacrificing sensitivity as a result.
[0578]
In order to irradiate a desired region with X-rays, as shown in FIG. 65, the beam diameter of the primary X-ray is determined based on a> W · sin θ from the region W to be irradiated and the incident angle θ of the primary X-ray. a may be determined. When the glass substrate 302 is extremely large and it is difficult to secure a distance d corresponding to the size, it is possible to repeat the measurement by dividing the glass substrate 302 into a plurality of regions.
[0579]
The shape of the X-ray transmission window 315 of the semiconductor detector 307 is preferably a rectangle close to the shape of the glass substrate 302. For example, FIG. 66 shows the difference between the fluorescent X-ray detection areas when the shape is a circle (FIG. 66A) and when the shape is similar to the glass substrate 302 (FIG. 66B). In FIG. 66, reference numeral 302 denotes a glass substrate (view from above), and a dotted line or a dot display portion is an X-ray detection area. When the X-ray transmission window 315 is circular, the detection efficiency is not necessarily high because the shape of the X-ray transmission window 315 does not match the shape of the glass substrate 302. On the other hand, in the case of FIG. 66B, X-rays can be detected efficiently. Although the aspect ratio of the glass substrate 302 is not necessarily constant, a more efficient detection process can be performed by selecting an appropriate shape of the transmission window based on the type and amount of use. By detecting fluorescent X-rays generated from the surface of the glass substrate 302 by such a method, the presence or absence of a residual element on the substrate surface or an element diffused into the substrate, the presence or absence of a thin film formed on the substrate surface, etc. You can know.
[0580]
When an element other than the glass constituent element is detected in the above steps, a step of removing it is subsequently performed. In this case, various methods can be used as a removing method, and in particular, surface polishing of the glass substrate 302 is preferable.
[0581]
FIG. 67 is a schematic view showing an example of the polishing apparatus according to the present invention. In FIG. 67, 327 is a support for a glass substrate 328, 328 is a glass substrate, 329 is a polishing tool, 330 is a rotating support bar, 331 is a support arm, 332 is a motor, 333 is a column, and 334 is a polishing surface. The glass substrate 328 to be polished is placed on a support 327 with the polished surface facing upward, and a polishing tool 329 is pressed against the polished surface. The rotation support rod 330 and the polishing tool 329 are rotated by the operation of the motor 332, and a slurry containing an abrasive such as cerium oxide is supplied to the polishing surface 334, thereby polishing the glass surface 334.
[0582]
After the glass substrate 328 after polishing is washed, the above-described elemental analysis is performed again. Thus, the element detection and polishing of the glass surface 334 are repeated until no element other than the glass constituent element of the glass substrate 328 is finally detected. The glass substrate 328 that has completed the above steps can be reused as it is or as a cullet, and can be reused as a flat display substrate or a raw material of another product through a remelting step.
[0583]
Example 13
Hereinafter, the present invention will be described in more detail with reference to Examples. The following embodiment is an example in which a matrix-driven surface-conduction electron source display as shown in FIG. 29 is disassembled.
[0584]
(Example 13-1)
In Example 13-1, 80 mm × 800 mm × 2.8 mm quartz glass is used as the face plate 2 and the rear plate substrate. The rear plate is formed with a cold cathode element 11 mainly composed of Pd, a wiring 12 mainly composed of Ag, an electrode composed of Pt, and the like on a substrate. A body, a metal back 2c and the like are formed. A disassembly processing method for a display having such a configuration will be described with reference to FIGS. 63, 64, 67, and 29.
[0585]
{Circle around (1)} The housing was disassembled, and a portion where the rear plate 1, the face plate 2, and the frame 3 were welded with frit glass was taken out.
[0586]
{Circle around (2)} The rear plate 1, the face plate 2, and the frame 3 were immersed in a 0.2N nitric acid solution to gradually dissolve the welded portion, and each portion was separated.
[0587]
{Circle over (3)} After the components formed on the rear plate 1 and the face plate 2 were physically scraped off, they were immersed again in a 0.2N nitric acid solution and subjected to ultrasonic vibration. Thereafter, the rear plate 1 and the face plate 2 were washed with pure water to remove frit glass and other dissolved substances remaining on the substrate.
[0588]
(4) Next, elements present on the substrate surface were detected by an X-ray fluorescence analyzer as shown in FIG. An Au-Lα ray (λ = 0.12764 nm) was used as the X-ray light source, and the incident angle θ of the X-ray to the substrate was equal to or larger than the critical angle of total reflection angle. Further, X-rays having a beam width of 0.15 mm or more and a depth of 80 mm or more shown in FIG. 65 were applied so that the entire surface of the glass substrate was irradiated with X-rays. The X-ray transmission window had a square shape, and the distance d between the glass substrate and the detector shown in FIG. 64 was set to 40 mm.
[0589]
When fluorescent X-rays generated from the entire surface of the glass substrate were captured in this way for 200 seconds and the elements were measured, Pt and Ag were detected from the rear plate substrate in addition to Si as the substrate element. No elements other than Si were detected from the face plate substrate.
[0590]
(5) Next, the surface of the rear plate substrate where Pt and Ag were detected was polished by the polishing apparatus shown in FIG. The polishing tool 325 was pressed against the polishing surface of the substrate, and the entire substrate was polished for 5 minutes while rotating the polishing tool and applying a cerium oxide slurry having an average particle size of 10 microns.
[0591]
{Circle around (6)} After the polished rear plate substrate was washed with pure water, the above-described elemental analysis was performed again. As a result, Pt and Ag were below the detection limit, and it was confirmed that all residues on the substrate could be removed.
[0592]
{Circle around (7)} The rear plate substrate having been subjected to the above steps could be reused as a substrate without being culleted together with the face plate substrate which did not require a polishing step.
[0593]
(Example 13-2)
In Example 13-2, a blue plate glass of 80 mm × 800 mm × 2.8 mm was used as a face plate substrate, and a blue plate glass of the same size was used as a rear plate substrate. ₂ A thin film having a thickness of 100 nm is used. The rear plate has a cold cathode element 11 composed mainly of Pd, wirings 12 and 13 composed mainly of Ag, an electrode composed of Pt, etc. formed on a substrate. A body, a metal back and the like are formed. The disassembly processing method for such a display will be described below.
[0594]
First, the rear plate, the face plate, and the frame are separated by the same method as the steps (1) to (3) in Example 13-1, and then a part of the constituent material of the element formed on the substrate is removed. did.
[0595]
{Circle around (4)} Next, the elements present on the substrate surface were detected. In the present embodiment, an Au-Lα ray (λ = 0.12764 nm) was used as a light source of the X-ray, and the incident angle θ of the X-ray to the substrate was 0.1 ° which was equal to or less than the critical angle of the total reflection angle. Further, X-rays having a beam width of 0.15 mm or more and a depth of 80 mm or more shown in FIG. 65 were applied so that the entire surface of the glass substrate was irradiated with X-rays. The shape of the X-ray transmission window was square, and the distance d between the glass substrate and the detector shown in FIG. 64 was set to 40 mm.
[0596]
In this way, fluorescent X-rays generated from the entire surface of the glass substrate were captured for 200 seconds and subjected to elemental analysis. As a result, Pt, Ag and Pb were detected from the rear plate substrate in addition to the substrate constituent elements. Pb was also detected from the face plate substrate in addition to the substrate constituent elements.
[0597]
(5) Next, the surfaces of the rear plate and the face plate substrate were polished by a polishing apparatus shown in FIG. The polishing tool 329 was pressed against the polishing surface of the substrate, and the entire substrate was polished for 5 minutes while rotating the polishing tool and applying a cerium oxide slurry having an average particle diameter of 10 microns.
[0598]
{Circle around (6)} After the polished rear plate substrate was washed with pure water, the above-described elemental analysis was performed again. As a result, Pt and Pb were below the detection limit, but Ag was still detected although the intensity was reduced. On the other hand, elements other than the substrate constituent elements were not detected from the face plate substrate.
[0599]
{Circle around (7)} The surface of the rear plate substrate was polished again with the polishing apparatus shown in FIG. The entire substrate was polished for 15 minutes in the same manner as in step (5).
[0600]
{Circle around (8)} After the polished rear plate substrate was washed with pure water, the above-described elemental analysis was performed again. As a result, elements other than the constituent elements of the substrate were not detected, and it was confirmed that all the residues on the substrate and the diffusion elements in the substrate were removed.
[0601]
(9) The rear plate substrate and the face plate substrate that have been subjected to the above steps are culleted, and after a melting step, are reused as flat display substrates.
[0602]
(Example 13-3)
In Example 13-3, quartz glass of 300 mm × 250 mm × 2.8 mm was used as the face plate and the rear plate substrate. Except for this point, a disassembly processing method for a flat display having the same configuration as that of the embodiment 13-1 will be described.
[0603]
First, after separating the rear plate, the face plate, and the frame portion in the same manner as the steps (1) to (3) in Example 13-1, the constituent materials of the element formed on the substrate in the nitric acid solution were removed. Some have been removed.
[0604]
(4) Next, elements present on the substrate surface were detected by a total reflection X-ray fluorescence analyzer as shown in FIG. In this example, an Au-Lα ray (λ = 0.12764 nm) was used as the X-ray light source, and the incident angle θ of the X-ray to the substrate was 0.1 °. Further, X-rays having a beam width of 0.6 mm or more and a depth of 300 mm or more shown in FIG. 65 were applied so that the entire surface of the glass substrate was irradiated with X-rays. The shape of the X-ray transmission window was square, and the distance d between the glass substrate and the detector shown in FIG. 64 was set to 150 mm.
[0605]
In this way, fluorescent X-rays generated from the surface of the glass substrate were captured for 200 seconds, and elemental analysis was performed. As a result, Pt and Ag were detected from the rear plate substrate in addition to Si as the substrate element. No elements other than Si were detected from the face plate substrate.
[0606]
Subsequently, the surface of the glass was polished by the same method as in steps (5) to (7) in Example 1 to remove all residues on the substrate. The rear plate substrate having completed the above steps could be reused as a substrate without being culleted together with the face plate substrate which did not require a polishing step.
[0607]
(Example 13-4)
In Example 13-4, P-doped SiO2 glass was used as a 300 mm x 250 mm x 2.8 mm blue plate glass as a rear plate substrate. ₂ A thin film having a thickness of 1 μm is used. Except for this point, a disassembly processing method will be described for a flat display having the same configuration as that of the embodiment 13-1.
[0608]
First, by separating the rear plate, the face plate and the frame in the same manner as in the steps (1) to (3) of Example 13-1, the constituent materials of the element formed on the substrate in the nitric acid solution are removed. Some have been removed.
[0609]
(4) Next, elements present on the substrate surface were detected by a total reflection X-ray fluorescence analyzer as shown in FIG. In Example 13-4, an Mo-Kα ray (λ = 0.07107 nm) was used as the X-ray light source, and the incident angle θ of the X-ray to the substrate was set to 0.1 °. Further, X-rays having a beam width of 0.6 mm or more and a depth of 300 mm or more shown in FIG. 65 were applied so that the entire surface of the glass substrate was irradiated with X-rays. The X-ray transmission window had a square shape, and the distance d between the glass substrate and the detector shown in FIG. 64 was set to 150 mm.
[0610]
In this way, fluorescent X-rays generated from the glass substrate surface were captured for 200 seconds and subjected to elemental analysis. As a result, Si, P, Pt, Ag and Pb were detected from the rear plate substrate. Further, Pb was detected from the face plate substrate in addition to the substrate constituent elements.
[0611]
(5) Next, the surfaces of the rear plate and the face plate substrate were polished by a polishing apparatus shown in FIG. The polishing tool 329 was pressed against the polishing surface of the substrate, and the entire substrate was polished for 5 minutes while rotating the polishing tool and applying a cerium oxide slurry having an average particle diameter of 10 microns.
[0612]
{Circle around (6)} After the polished rear plate substrate was washed with pure water, the above-described elemental analysis was performed again. As a result, Pt, Ag and Pb were below the detection limit, and only Si and P were detected. On the other hand, elements other than the substrate constituent elements were not detected from the face plate substrate.
[0613]
{Circle around (7)} The surface of the rear plate substrate was polished again with the polishing apparatus shown in FIG. The entire substrate was polished for 10 minutes in the same manner as in (5).
[0614]
{Circle around (8)} After the polished rear plate substrate was washed with pure water, the above-described elemental analysis was performed again. As a result, while P was lower than the detection limit, K, Ca, and the like, which are glass constituent elements, were detected. Thereby, P-doped SiO ₂ It was confirmed that the layer was removed and that all residues on the substrate were removed.
[0615]
(9) The rear plate substrate and the face plate substrate that have been subjected to the above steps are culleted, and after the melting step, can be reused as flat display substrates.
[0616]
Here, an example in which an electron source substrate formed by forming a large number of surface conduction electron-emitting devices on a glass substrate treated by the method of the present invention, and using this, an image forming apparatus will be described.
[0617]
First, Pt electrodes are formed in a matrix on the regenerated glass substrate by using a vacuum film forming technique and a photolithography technique. Here, the interval between the element electrodes was 20 μm, the width of each element electrode was 500 μm, the thickness was 100 nm, and the arrangement pitch of the elements was 1 mm. Subsequently, a wiring made of Ag is formed in a matrix by a printing method.
[0618]
Next, an aqueous solution of palladium acetate monoethanolamine is spin-coated with a spinner between the device electrodes, and heated and baked at 270 ° C. for 10 minutes. A thin film composed of palladium oxide (PdO) fine particles was obtained. Thereafter, a conductive thin film having a width of 300 μm was obtained by photolithography and dry etching.
[0619]
Next, a voltage is applied between the device electrodes in a vacuum to perform a forming process, thereby forming a crack-shaped electron emitting portion in the conductive thin film.
[0620]
Next, an activation process is performed on the element for which the energization forming has been completed. In the present embodiment, ethylene gas is introduced into a vacuum, and a pulse voltage having a peak value of 20 V is repeatedly applied between the device electrodes for 30 minutes. By this activation step, a compound mainly composed of carbon was deposited to a thickness of about 10 nm in the vicinity of the electron-emitting portion.
[0621]
The electron source substrate on which a large number of surface conduction electron-emitting devices were formed was used as a rear plate, and an envelope was formed with a face plate and a support frame. The inside of the envelope was evacuated and sealed to produce an image forming apparatus having a display panel and a drive circuit for television display. In this image forming apparatus, an extremely good image without a non-light emitting portion (pixel defect) is formed.
[0622]
【The invention's effect】
Hereinafter, the effects of the present invention will be listed along with the suffixes of the above-described embodiments and examples.
[0623]
[Effect 1 of the Invention] According to the present invention, when the waste FPD is dismantled, the waste FPD can be separated into lead-free glass and lead-containing glass and treated. It can be done easily. Also, environmental pollution due to lead can be prevented.
[0624]
[Effect 2 of the Invention] According to the present invention, disassembly processing required for disposal and reuse of FPDs can be easily performed.
[0625]
In addition, since lead, which is a harmful metal, which is a problem at that time, can be separated and recovered, the environmental load at the time of disposal can be reduced. Furthermore, since rare elements such as noble metal elements and rare earth elements used can be recovered and reused, it is effective from the viewpoint of securing resources.
[0626]
[Effect 3 of the Invention] The recycling method of the present invention makes it possible to reuse the rear plate, which is an important component of the discarded panel display, to use resources effectively and reduce costs. .
[0627]
[Effect 4 of the Invention] According to the present invention, in the process of disassembling the flat display, the flat display can be recovered and reused with almost no damage to the spacer, so that resources can be used effectively. Cost reduction can be realized. In addition, since fine manual work is not required in the collection process, the collection can be performed safely.
[0628]
[Effect 5 of the Invention] According to the present invention, a CRT and a flat display device are questioned.
In addition, it is possible to provide a method capable of efficiently recovering the phosphor from them and recovering a reusable face plate with little unevenness.
[0629]
[Effect 6 of the Invention] According to the image display device of the present invention, the airtight container kept at a pressure lower than the atmospheric pressure, the means for connecting to the exhaust device, and the means for gradually returning the inside of the container to the atmospheric pressure as necessary are provided. When the airtight container is returned to the atmospheric pressure, the member resistant to the atmospheric pressure and the image display means in the container are less likely to be broken or damaged, so that the member after disassembly can be easily reused. Further, defective portions generated in the manufacturing process can be easily repaired.
[0630]
[Effect 7 of the Invention] In the flat display of the present invention, since the members forming the envelope can be sequentially separated, a safe and simple method without damaging the envelope and the internal members during the disassembly process. The members can be collected. Therefore, it is easy to collect the data in a reusable state, and effective use of resources and cost reduction can be realized.
[0631]
[Effect 8 of the Invention] The inspection apparatus for the amount of residual harmful metals of the present invention has the following excellent effects.
[0632]
In the inspection apparatus for the amount of residual harmful metals of the present invention, first, when the test object is immersed in the bath of the first elution means, the harmful metal contained in the test object is eluted by the acid solution in the bath. Next, the test object is sent to the cleaning means for cleaning, and then immersed in the bath of the second elution means, whereby the harmful metal remaining on the test object is eluted by the acidic solution in the bath. Then, when this eluate is sent to the quantitative detection means, the quantitative detection means quantitatively detects the amount of harmful metals contained in the eluate. Therefore, at the time of disassembly and sorting of flat panel displays and the like, it is possible to quantitatively detect the amount of harmful metals such as lead remaining on the inspection object such as the sorting member made of glass and the waste.
[0633]
In this case, the test object is simply immersed and immersed in the immersion bath filled with the acid solution, which is easy, that is, the quantitative detection thereof can be easily performed without any trouble. As a test object, if it is insoluble in an acidic liquid, harmful metals such as lead contained therein can be eluted, and there is no particular limitation on the material, shape and the like, and various members can be tested.
[0634]
[Effect 9 of the Invention] The dismantling device for a flat panel display of the present invention has the following excellent effects.
(1) In the flat panel display disassembly apparatus of the present invention, in the step of separating the frame member from the display main body (vacuum container), a pulling force is applied to the plate on the side fixed to the spacer by the first support means. As a result, the spacer is suspended, and the weight of the plate fixed thereto is not added, and the frame member can be separated without burden on the spacer. Therefore, damage to the spacer can be prevented.
[0635]
After separating the frame member, the second supporting means receives and supports the plate edge portion on the side fixed to the spacer, so that the spacer is also in a suspended state, and the plate fixed to this is also suspended. Does not add weight. Since the step of separating the spacer from the plate received and supported by the second support means is performed in a state in which the spacer recovery means is in the state of receiving and supporting the spacer, even in the step of separating and recovering the spacer, extra space is not added to the spacer. Weight is not added and the damage can be prevented.
[0636]
That is, the disassembly process can be performed by an appropriate process, and components that can be reused as they are, such as spacers, can be collected without damage. As a result, it is possible to preferably achieve recycling.
[0637]
[Effect 10 of the Invention] According to the present invention, in disassembling a waste FPD, in a step of separating components such as lead from a glass substrate by liquid treatment, a large number of glass substrates are collectively processed and then collectively processed. Therefore, (1) the required amount of the processing solution is small, (2) the energy required for the processing is small, and (3) it is possible to process a large amount of glass in a short time. As a result, it is possible to greatly reduce the cost for processing the waste FPD.
[0638]
[Effect 11 of the Invention] According to the present invention, when collecting a phosphor in a flat panel display of this type, a face plate fixing jig and a fixing method during the phosphor collecting work are devised and used for collecting the phosphor. By controlling the driving of the brush to be performed based on the positional information of the fixing jig, the phosphor can be collected extremely efficiently and reliably.
[0639]
[Effect 12 of the Invention] According to the present invention, in disassembling a waste FPD, in a step of separating components such as lead from a glass substrate by liquid treatment, a large number of glass substrates are put together and then the liquid Processing in a processing tank becomes easy. In addition, a large number of glass substrates can be transported safely and quickly, and the process can be easily automated. As a result, there is an advantage that it is possible to greatly reduce the cost for processing the waste FPD.
[0640]
[Effect 13 of the Invention] According to the present invention, it is possible to detect the residue on the substrate surface and the elements diffused into the substrate by a simple method, and to remove all the elements other than the glass constituent elements. It is possible to efficiently reuse glass without wasting glass.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing an example of a flat panel display processed by a disassembly processing method of the present invention.
FIG. 2 is a schematic view of a surface conduction electron source display among flat panel displays according to the present invention.
FIG. 3 is a plan view showing a cutting position of the flat panel display in the flat panel display disassembly processing method of the present invention.
FIG. 4 is a flowchart of an FPD disassembly processing method of the present invention.
FIG. 5 is a flowchart showing steps of a method for dismantling a waste flat panel display of the present invention.
FIGS. 6A and 6B are explanatory views showing a state in which the entire panel is dismantled simultaneously in the method of the present invention.
FIGS. 7A and 7B are views showing a method of dismantling a panel while leaving a part of the panel in the method of the present invention.
FIGS. 8A and 8B are views showing a method of dismantling a panel while leaving a part of the panel in the method of the present invention.
FIG. 9 is a perspective view schematically showing a surface conduction electron source display (SED) as an FPD to be dismantled by the method of the present invention.
FIG. 10 is a partially cutaway perspective view schematically showing an example of an image display device provided with a rear plate reproduced in the present invention.
FIGS. 11A and 11B are explanatory diagrams showing steps of a method for collecting and regenerating a rear plate according to the present invention.
FIG. 12 is a perspective view showing an example of a rear plate substrate washed by the regenerating method of the present invention.
FIG. 13 is a schematic diagram for explaining a step of forming an electron-emitting device on a rear plate.
FIG. 14 is a perspective view showing another example of the rear plate substrate washed by the regenerating method of the present invention.
FIG. 15 is a diagram showing one embodiment of a spacer collecting method according to the present invention.
FIG. 16 shows a spacer collection container used in the method of the present invention, wherein (A) is a plan view and (B) is a cross-sectional view.
17A and 17B show another spacer collecting container used in the present invention, wherein FIG. 17A is a plan view and FIG. 17B is a sectional view.
FIG. 18 is a view showing another embodiment of the spacer collecting method according to the present invention.
FIG. 19 is a view showing a spacer according to the present invention.
FIG. 20 is a diagram illustrating an example of a spacer collecting step according to the present invention.
FIG. 21 is a view illustrating a method of cutting a flat display panel according to the present invention.
FIG. 22 is a diagram showing another example of the spacer collecting step according to the present invention.
FIG. 23 is a diagram showing another example of the spacer collecting step according to the present invention.
FIG. 24 is a diagram showing another example of the spacer collecting step according to the present invention.
FIG. 25 is a flowchart showing steps of a method for collecting a phosphor from a display device of the present invention.
FIG. 26 is a view showing the operation of a revolving motion type brush.
FIG. 27 is a view showing the operation of the brush of the sliding motion type.
FIG. 28 is a diagram showing a configuration of a brush and a suction device.
FIG. 29 is a perspective view of a display device using a spacer.
FIG. 30 is a schematic diagram showing a configuration of an image display device of the present invention.
FIG. 31 is a schematic diagram of an FPD showing an example of the image display device of the present invention.
FIG. 32 is a schematic view of an SED showing an example of the image display device of the present invention.
FIG. 33 is a diagram showing one embodiment of a flat display according to the present invention.
FIG. 34 is a diagram showing one embodiment of a flat display disassembly method according to the present invention.
FIG. 35 is a diagram showing another embodiment of the flat display disassembly method according to the present invention.
FIG. 36 is a diagram showing another embodiment of the flat display disassembly method according to the present invention.
FIG. 37 is a view showing one example of an electron-emitting device according to the present invention.
FIG. 38 is a diagram showing one embodiment of a method of manufacturing a flat display according to the present invention.
FIG. 39 is a diagram showing another embodiment of the flat display disassembly method according to the present invention.
FIG. 40 is a diagram showing another embodiment of the flat display disassembly method according to the present invention.
FIG. 41 is a configuration diagram of an inspection device for the amount of residual harmful metals according to an embodiment of the present invention.
42 is a flowchart for sequentially explaining the inspection processing by the residual harmful metal amount inspection apparatus shown in FIG. 41.
FIG. 43 is a perspective view (a) showing a flat panel display partially exploded and a sectional view (b) thereof.
FIG. 44 shows the first embodiment of the present invention, and is a perspective view (a) and a plan view (b) showing a configuration of a flat panel display disassembly apparatus.
FIG. 45 is a side view showing the holding table and the support means of FIG. 44;
FIG. 46 is a front view (a) and a side view (b) showing the transfer means of FIG. 44;
FIG. 47 is a front view (a) and a side view (b) of another example of the transfer means of FIG. 44.
FIG. 48 is a side view showing the spacer collecting jig of FIG. 44.
FIG. 49 is a side view showing another example of the spacer collecting jig of FIG. 44.
50 is a flowchart for sequentially explaining a disassembling process by the flat panel display disassembly device shown in FIG. 44.
FIGS. 51A and 51B are a perspective view and a plan view, respectively, showing a configuration of a flat panel display disassembly apparatus according to a second embodiment of the present invention.
FIG. 52 is a schematic view showing a configuration example of a liquid processing tank in the FPD dismantling processing method of the present invention.
FIG. 53 is a flowchart for explaining the FPD disassembly processing method of the present invention.
FIG. 54 is a diagram showing a basic step of a phosphor recovery process in the present invention.
FIG. 55 is a plan view and a side view showing a configuration example of a movable aperture jig according to the present invention.
FIG. 56 is a perspective view showing a step of separating the face plate and the rear plate according to the present invention.
FIG. 57 is a view showing the configuration and operation of the recovery brush according to the present invention.
FIG. 58 is a diagram showing a step of collecting a phosphor from a flat panel display according to the present invention.
FIG. 59 is a diagram illustrating a glass plate holding mechanism according to the FPD disassembly processing method of the present invention.
FIG. 60 is a schematic diagram showing a configuration of a liquid processing tank according to the FPD dismantling method of the present invention.
FIG. 61 is a flowchart showing an example of steps of an FPD dismantling method of the present invention.
FIG. 62 is a flowchart showing a flat display dismantling process of the present invention.
FIG. 63 is a schematic view showing an X-ray fluorescence spectrometer for detecting an element present on the surface of a glass substrate of the present invention.
FIG. 64 is a schematic diagram showing a relative position between a sample surface and a detector in the total reflection X-ray fluorescence spectrometer of the present invention.
FIG. 65 is a schematic view showing a primary X-ray irradiation area in the total reflection X-ray fluorescence spectrometer of the present invention.
FIG. 66 is a schematic view showing a fluorescent X-ray detection area in the total reflection X-ray fluorescence spectrometer of the present invention.
FIG. 67 is a schematic view showing a glass substrate surface polishing apparatus of the present invention.
FIG. 68 is a plan view and a cross-sectional view of an electron-emitting device that can be used in the present invention.
FIG. 69 is an applied voltage waveform diagram during forming of the electron-emitting device used in the present invention.
[Explanation of symbols]
1 rear plate
2 Face plate
3 frames
4 Spacer
5 frit glass
6 nitric acid solution tank
11 Surface conduction electron source
12 X direction element wiring (upper wiring)
13 Y direction element wiring (lower wiring)
15 Image display device
2a Glass substrate (face plate substrate)
2b phosphor screen
2c metal back
21 Teflon (registered trademark) mesh basket
22 Processing tank
23 nitric acid solution
25 Pure cleaning solution
31 Teflon (registered trademark) support base
41 Rear plate board
42, 43 device electrode
45 interlayer insulation layer
46 Notch
49 conductive film
50 Flat panel display
54,240 Supporting means (first supporting means)
55 control unit
56 Evacuation device (suction means)
57 Holder
60 stages
61 pillar
62 Holding jig
63 arm
70 Load avoidance jig
71,72 Spacer recovery jig (second support means)
73 Acid liquid immersion tank (spacer collecting means)
74 Heat treatment furnace (spacer collecting means)
81 Liquid treatment tank
82 Glass substrate to be processed
83 Treatment liquid
84 Treatment liquid flowing means
85 heater for heating
86 Treatment liquid regeneration means
87 Ultrasonic wave application means
300,301 Conveying means
100,120 immersion bath
101, 121, 126 piping
102 Recovery tub
103,122 open / close valve
104,123 Liquid pump
105 Conveyor
106 net basket
110 washing tub
124 switching valve
125 ultrasonic transducer
130 Lead elution recovery unit (first elution means)
131 Cleaning unit (cleaning means)
132 Residual lead elution part (second elution means)
133 Residual lead determination unit (quantitative detection means)
148 recess
149 Recessed container
150 elastic material
151 nitric acid solution tank
152 nitric acid solution
153 face plate
154 spacer
155 Spacer storage container
156 Face plate support
157 frit
158 Face plate support
159 Spacer support arm
160 Arm tip
161 Spacer base material
162 conductive film
163 Rear plate
164 frames
165 pure water
166 warm air
167 Spacer storage container
168 Support for storage container
169 electron source substrate
170 cold cathode device
171 brush part
172 suction hole
173 Suction mechanism
174 aspirator
175 turbine
201 Image display section
202 airtight container
203 Atmospheric pressure resistant components
204 Means for Connecting to Exhaust Device
205 Means to gradually return to atmospheric pressure
221 Electron emission device
222 rear plate
223 Image forming unit
224 face plate
225 support frame
226 spacer
227 First frit glass
228 Second frit glass
229 Third frit glass
230 fluorescent film
231 metal back
232 glass substrate
233 Electron emission unit
234 Thin film including electron emission part
235, 236 Device electrode
237 liquid tank
238 containers
239 frit glass solution
240 frit application point
260 flat panel display
261 Workbench (base)
262 Suction chuck
262a Suction hole
263 seal
270 Movable diaphragm fixing jig
270a, 270b, 270c, 270d Jig
271 Sucker
272 cutter
273 brush
282 Glass plate holding device
286 glass plate
287 support member
301 Support for glass substrate
302 glass substrate
303 X-ray light source
304 monochromator
305 Primary X-ray
306 X-ray fluorescence
307 Semiconductor detector
308 Cooling device
309 Preamplifier
310 amplifier
311 Multi-channel analyzer
312 Computer
313 Primary X-ray incidence angle
314 Semiconductor device
315 X-ray transmission window
316 collimator
321R, 321L, 322R, 322L Hanging rod
321R1, 321L1, 322R2, 322L2 claws
327 Support for glass substrate
328 glass substrate
329 polishing tool
330 Rotation support rod
331 Support arm
332 motor
333 prop
334 polished surface

Claims (8)

A rear plate on which a plurality of electron-emitting devices are disposed, a face plate disposed opposite to the rear plate and provided with an image display unit, and a frame disposed between the rear plate and the face plate ; A method of recovering a spacer in a flat display having at least a spacer for maintaining an interval between the rear plate and the face plate with respect to the atmospheric pressure, and these being fused with frit glass.
Using a spacer recovery jig , the welded portion between the spacer and the rear plate or the face plate is immersed in a nitric acid solution while the spacer is housed or held so as to avoid contact between the spacers. Dissolving the frit glass by means of the method. The method for collecting a spacer according to claim 1, wherein the spacer is a plate having a thickness of 300 μm or less. The spacer collecting method according to claim 1, wherein the spacer collecting jig is a flat plate having one or a plurality of concave portions capable of storing the spacer. The spacer collecting method according to claim 1, wherein the spacer collecting jig is a jig having a tip portion capable of holding the spacer therebetween and an arm portion supporting the tip portion. The spacer collecting method according to claim 1, wherein a part or all of the spacer collecting jig is made of a fluororesin. The method for collecting a spacer according to any one of claims 1 to 4, wherein the base material of the spacer is glass. The method of claim 1, wherein the frit glass contains lead oxide. The method for collecting a spacer according to claim 1, wherein the separation of the rear plate, the face plate, and the frame is performed by cutting or dissolving the frit.

Images