JP3979694B2 - 静電チャック装置およびその製造方法 - Google Patents
静電チャック装置およびその製造方法 Download PDFInfo
- Publication number
- JP3979694B2 JP3979694B2 JP2319397A JP2319397A JP3979694B2 JP 3979694 B2 JP3979694 B2 JP 3979694B2 JP 2319397 A JP2319397 A JP 2319397A JP 2319397 A JP2319397 A JP 2319397A JP 3979694 B2 JP3979694 B2 JP 3979694B2
- Authority
- JP
- Japan
- Prior art keywords
- electrostatic chuck
- insulating plate
- ceramic
- electrode layer
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2319397A JP3979694B2 (ja) | 1997-01-22 | 1997-01-22 | 静電チャック装置およびその製造方法 |
| US09/010,934 US6166897A (en) | 1997-01-22 | 1998-01-22 | Static chuck apparatus and its manufacture |
| KR1019980001918A KR100290264B1 (ko) | 1997-01-22 | 1998-01-22 | 정전처크장치 및 그 제조방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2319397A JP3979694B2 (ja) | 1997-01-22 | 1997-01-22 | 静電チャック装置およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10209257A JPH10209257A (ja) | 1998-08-07 |
| JPH10209257A5 JPH10209257A5 (2) | 2004-11-25 |
| JP3979694B2 true JP3979694B2 (ja) | 2007-09-19 |
Family
ID=12103839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2319397A Expired - Fee Related JP3979694B2 (ja) | 1997-01-22 | 1997-01-22 | 静電チャック装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3979694B2 (2) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6716302B2 (en) | 2000-11-01 | 2004-04-06 | Applied Materials Inc. | Dielectric etch chamber with expanded process window |
| WO2002037541A2 (en) * | 2000-11-01 | 2002-05-10 | Applied Materials, Inc. | Etch chamber for etching dielectric layer with expanded process window |
| FR2875054B1 (fr) * | 2004-09-08 | 2006-12-01 | Cit Alcatel | Support de substrats minces |
| US7648914B2 (en) | 2004-10-07 | 2010-01-19 | Applied Materials, Inc. | Method for etching having a controlled distribution of process results |
| US7544251B2 (en) * | 2004-10-07 | 2009-06-09 | Applied Materials, Inc. | Method and apparatus for controlling temperature of a substrate |
| US7436645B2 (en) | 2004-10-07 | 2008-10-14 | Applied Materials, Inc. | Method and apparatus for controlling temperature of a substrate |
| US9275887B2 (en) | 2006-07-20 | 2016-03-01 | Applied Materials, Inc. | Substrate processing with rapid temperature gradient control |
| JP5557164B2 (ja) * | 2010-03-24 | 2014-07-23 | Toto株式会社 | 静電チャック |
-
1997
- 1997-01-22 JP JP2319397A patent/JP3979694B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10209257A (ja) | 1998-08-07 |
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