JP4461507B2 - 成膜装置 - Google Patents

成膜装置 Download PDF

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Publication number
JP4461507B2
JP4461507B2 JP15687199A JP15687199A JP4461507B2 JP 4461507 B2 JP4461507 B2 JP 4461507B2 JP 15687199 A JP15687199 A JP 15687199A JP 15687199 A JP15687199 A JP 15687199A JP 4461507 B2 JP4461507 B2 JP 4461507B2
Authority
JP
Japan
Prior art keywords
film forming
mounting table
processing container
forming apparatus
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP15687199A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000345343A5 (2
JP2000345343A (ja
Inventor
昌彦 松土
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP15687199A priority Critical patent/JP4461507B2/ja
Priority to PCT/JP2000/003358 priority patent/WO2000075971A1/ja
Priority to TW89110803A priority patent/TW484175B/zh
Publication of JP2000345343A publication Critical patent/JP2000345343A/ja
Publication of JP2000345343A5 publication Critical patent/JP2000345343A5/ja
Application granted granted Critical
Publication of JP4461507B2 publication Critical patent/JP4461507B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP15687199A 1999-06-03 1999-06-03 成膜装置 Expired - Fee Related JP4461507B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP15687199A JP4461507B2 (ja) 1999-06-03 1999-06-03 成膜装置
PCT/JP2000/003358 WO2000075971A1 (fr) 1999-06-03 2000-05-25 Appareil de formation de film
TW89110803A TW484175B (en) 1999-06-03 2000-06-02 Film forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15687199A JP4461507B2 (ja) 1999-06-03 1999-06-03 成膜装置

Publications (3)

Publication Number Publication Date
JP2000345343A JP2000345343A (ja) 2000-12-12
JP2000345343A5 JP2000345343A5 (2) 2006-07-27
JP4461507B2 true JP4461507B2 (ja) 2010-05-12

Family

ID=15637222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15687199A Expired - Fee Related JP4461507B2 (ja) 1999-06-03 1999-06-03 成膜装置

Country Status (3)

Country Link
JP (1) JP4461507B2 (2)
TW (1) TW484175B (2)
WO (1) WO2000075971A1 (2)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4639477B2 (ja) * 2001-01-24 2011-02-23 富士電機デバイステクノロジー株式会社 磁気記録媒体の製造方法
JP4597894B2 (ja) * 2006-03-31 2010-12-15 東京エレクトロン株式会社 基板載置台および基板処理装置
JP5347487B2 (ja) * 2008-12-24 2013-11-20 富士電機株式会社 シャワー電極板及びプラズマｃｖｄ装置
JP2013166990A (ja) * 2012-02-15 2013-08-29 Fujifilm Corp 機能性フィルムおよび機能性フィルムの製造方法
JP7164332B2 (ja) * 2018-06-20 2022-11-01 株式会社ニューフレアテクノロジー 気相成長装置
JP7172717B2 (ja) * 2019-02-25 2022-11-16 三菱マテリアル株式会社 プラズマ処理装置用電極板
JP6733802B1 (ja) * 2019-05-28 2020-08-05 信越半導体株式会社 エピタキシャルウェーハの製造方法及びサセプタ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01179309A (ja) * 1987-12-30 1989-07-17 Tokyo Electron Ltd 加熱法
JPH03177561A (ja) * 1989-09-19 1991-08-01 Nippon Mining Co Ltd 薄膜形成装置
JPH04232256A (ja) * 1990-12-28 1992-08-20 Nikko Kyodo Co Ltd 薄膜形成装置
JP3052116B2 (ja) * 1994-10-26 2000-06-12 東京エレクトロン株式会社 熱処理装置
JP3788836B2 (ja) * 1996-12-24 2006-06-21 東芝セラミックス株式会社 気相成長用サセプタ及びその製造方法
JP4037956B2 (ja) * 1998-04-28 2008-01-23 東海カーボン株式会社 チャンバー内壁保護部材

Also Published As

Publication number Publication date
WO2000075971A1 (fr) 2000-12-14
TW484175B (en) 2002-04-21
JP2000345343A (ja) 2000-12-12

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