JP4616779B2 - ホーンホルダ揺動型ボンディング装置 - Google Patents

ホーンホルダ揺動型ボンディング装置 Download PDF

Info

Publication number
JP4616779B2
JP4616779B2 JP2006058925A JP2006058925A JP4616779B2 JP 4616779 B2 JP4616779 B2 JP 4616779B2 JP 2006058925 A JP2006058925 A JP 2006058925A JP 2006058925 A JP2006058925 A JP 2006058925A JP 4616779 B2 JP4616779 B2 JP 4616779B2
Authority
JP
Japan
Prior art keywords
horn holder
horn
holder
arc
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006058925A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007242657A (ja
Inventor
耕平 瀬山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2006058925A priority Critical patent/JP4616779B2/ja
Priority to TW095149130A priority patent/TW200805527A/zh
Priority to KR1020070006522A priority patent/KR100808513B1/ko
Priority to US11/714,560 priority patent/US7578421B2/en
Publication of JP2007242657A publication Critical patent/JP2007242657A/ja
Priority to US12/459,904 priority patent/US20090272498A1/en
Application granted granted Critical
Publication of JP4616779B2 publication Critical patent/JP4616779B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2006058925A 2006-03-06 2006-03-06 ホーンホルダ揺動型ボンディング装置 Expired - Fee Related JP4616779B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006058925A JP4616779B2 (ja) 2006-03-06 2006-03-06 ホーンホルダ揺動型ボンディング装置
TW095149130A TW200805527A (en) 2006-03-06 2006-12-27 Oscillatory horn holder bonding apparatus
KR1020070006522A KR100808513B1 (ko) 2006-03-06 2007-01-22 혼 홀더 요동형 본딩장치
US11/714,560 US7578421B2 (en) 2006-03-06 2007-03-06 Horn-holder pivot type bonding apparatus
US12/459,904 US20090272498A1 (en) 2006-03-06 2009-07-09 Horn-holder pivot type bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006058925A JP4616779B2 (ja) 2006-03-06 2006-03-06 ホーンホルダ揺動型ボンディング装置

Publications (2)

Publication Number Publication Date
JP2007242657A JP2007242657A (ja) 2007-09-20
JP4616779B2 true JP4616779B2 (ja) 2011-01-19

Family

ID=38470644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006058925A Expired - Fee Related JP4616779B2 (ja) 2006-03-06 2006-03-06 ホーンホルダ揺動型ボンディング装置

Country Status (4)

Country Link
US (2) US7578421B2 (2)
JP (1) JP4616779B2 (2)
KR (1) KR100808513B1 (2)
TW (1) TW200805527A (2)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5085801B1 (ja) * 2012-04-10 2012-11-28 新興機械株式会社 超音波接合装置
EP4357067A4 (en) * 2022-08-31 2025-07-09 Wuxi Lead Intelligent Equipment Co Ltd TAB WELDING DEVICE

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3901475C2 (de) * 1989-01-19 1994-07-14 Danfoss As Fluidgesteuerte Servoanordnung
JP2588068B2 (ja) * 1991-02-27 1997-03-05 株式会社カイジョー ワイヤボンディング装置及びその方法
JPH09326424A (ja) * 1996-06-06 1997-12-16 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
JP3742359B2 (ja) * 2002-04-02 2006-02-01 株式会社新川 ボンディング装置
JP3654261B2 (ja) * 2002-05-09 2005-06-02 松下電器産業株式会社 電子部品のボンディング装置およびボンディングツール
JP3666592B2 (ja) * 2002-05-23 2005-06-29 株式会社新川 ボンディング装置
JP4010186B2 (ja) * 2002-05-30 2007-11-21 日本電気株式会社 ボンディング装置
JP4141394B2 (ja) * 2004-02-20 2008-08-27 株式会社新川 ボンディングアーム揺動型ボンディング装置

Also Published As

Publication number Publication date
TWI342056B (2) 2011-05-11
US7578421B2 (en) 2009-08-25
KR100808513B1 (ko) 2008-02-29
US20090272498A1 (en) 2009-11-05
JP2007242657A (ja) 2007-09-20
US20070205252A1 (en) 2007-09-06
KR20070091525A (ko) 2007-09-11
TW200805527A (en) 2008-01-16

Similar Documents

Publication Publication Date Title
JP2019091048A (ja) 駆動装置
KR20200010067A (ko) 감소된 진동 전달을 가지는 구동 시스템
JP4616779B2 (ja) ホーンホルダ揺動型ボンディング装置
JP3742359B2 (ja) ボンディング装置
JP2008035593A (ja) モータ及びワイパ装置
JP2008220066A (ja) アクチュエータ
JP3666592B2 (ja) ボンディング装置
WO2015146867A1 (ja) ワイパシステム制御方法及びワイパシステム
JP5839692B2 (ja) 車両用ワイパ装置
KR100626186B1 (ko) 본딩 암 요동형 본딩장치
JP4141401B2 (ja) ボンディング装置
WO2013076844A1 (ja) アクチュエータ
JP2008185621A (ja) 光偏向器
JP4657942B2 (ja) ボンディング装置
JP4020073B2 (ja) 振動型リニアアクチュエータ及びこれを駆動源とする往復式電動切断器具
JP2006238593A (ja) 送り装置
JP2024059147A (ja) 揺動装置
JP2007174768A (ja) 多次元運動合成ユニット及びそれを用いたアクチュエータ
JP2003347349A (ja) ボンディング装置
JPH05225721A (ja) 磁気ヘッド駆動装置の磁気回路
JP2008003505A (ja) マイクロ揺動デバイス及び光学素子
JPH07163123A (ja) ロータリーアクチュエータ
JP2009087822A (ja) 継電器
JP2007299455A (ja) 位置決めヘッド機構
JP2006048858A (ja) 対物レンズ駆動装置、光ピックアップ装置及び光ディスク装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080404

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100930

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20101018

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20101022

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131029

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees