TW200805527A - Oscillatory horn holder bonding apparatus - Google Patents

Oscillatory horn holder bonding apparatus Download PDF

Info

Publication number
TW200805527A
TW200805527A TW095149130A TW95149130A TW200805527A TW 200805527 A TW200805527 A TW 200805527A TW 095149130 A TW095149130 A TW 095149130A TW 95149130 A TW95149130 A TW 95149130A TW 200805527 A TW200805527 A TW 200805527A
Authority
TW
Taiwan
Prior art keywords
amplifier
holder
fulcrum
amplifier holder
ultrasonic
Prior art date
Application number
TW095149130A
Other languages
English (en)
Chinese (zh)
Other versions
TWI342056B (2
Inventor
Kohei Seyama
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200805527A publication Critical patent/TW200805527A/zh
Application granted granted Critical
Publication of TWI342056B publication Critical patent/TWI342056B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
TW095149130A 2006-03-06 2006-12-27 Oscillatory horn holder bonding apparatus TW200805527A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006058925A JP4616779B2 (ja) 2006-03-06 2006-03-06 ホーンホルダ揺動型ボンディング装置

Publications (2)

Publication Number Publication Date
TW200805527A true TW200805527A (en) 2008-01-16
TWI342056B TWI342056B (2) 2011-05-11

Family

ID=38470644

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149130A TW200805527A (en) 2006-03-06 2006-12-27 Oscillatory horn holder bonding apparatus

Country Status (4)

Country Link
US (2) US7578421B2 (2)
JP (1) JP4616779B2 (2)
KR (1) KR100808513B1 (2)
TW (1) TW200805527A (2)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5085801B1 (ja) * 2012-04-10 2012-11-28 新興機械株式会社 超音波接合装置
EP4357067A4 (en) * 2022-08-31 2025-07-09 Wuxi Lead Intelligent Equipment Co Ltd TAB WELDING DEVICE

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3901475C2 (de) * 1989-01-19 1994-07-14 Danfoss As Fluidgesteuerte Servoanordnung
JP2588068B2 (ja) * 1991-02-27 1997-03-05 株式会社カイジョー ワイヤボンディング装置及びその方法
JPH09326424A (ja) * 1996-06-06 1997-12-16 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
JP3742359B2 (ja) * 2002-04-02 2006-02-01 株式会社新川 ボンディング装置
JP3654261B2 (ja) * 2002-05-09 2005-06-02 松下電器産業株式会社 電子部品のボンディング装置およびボンディングツール
JP3666592B2 (ja) * 2002-05-23 2005-06-29 株式会社新川 ボンディング装置
JP4010186B2 (ja) * 2002-05-30 2007-11-21 日本電気株式会社 ボンディング装置
JP4141394B2 (ja) * 2004-02-20 2008-08-27 株式会社新川 ボンディングアーム揺動型ボンディング装置

Also Published As

Publication number Publication date
TWI342056B (2) 2011-05-11
US7578421B2 (en) 2009-08-25
KR100808513B1 (ko) 2008-02-29
JP4616779B2 (ja) 2011-01-19
US20090272498A1 (en) 2009-11-05
JP2007242657A (ja) 2007-09-20
US20070205252A1 (en) 2007-09-06
KR20070091525A (ko) 2007-09-11

Similar Documents

Publication Publication Date Title
US11420287B2 (en) Wire clamping system for fully automatic wire bonding machine
JP2008040353A (ja) 光学デバイス、光スキャナおよび画像形成装置
JP2024103709A (ja) レンズ駆動装置及びカメラモジュール
TW200805527A (en) Oscillatory horn holder bonding apparatus
JP2005342846A (ja) マイクロマニュピュレータ
JP3742359B2 (ja) ボンディング装置
JP2004215389A (ja) 弾性表面波アクチュエータ及び弾性表面波アクチュエータを適用した偏向器
JP3666592B2 (ja) ボンディング装置
TWI328845B (2)
JPH10128583A (ja) 位置決めクランプ装置
TWI330874B (2)
JPH05304Y2 (2)
JP2006301454A5 (2)
CN114388407B (zh) 一种键合头装置及键合机
JP2002368035A (ja) ワイヤボンダ用ワイヤクランプ装置
JP2009027769A (ja) 位置決め装置
WO2024034170A1 (ja) レンズホルダ駆動装置
JPH0584193U (ja) 超音波駆動装置
TWM368339U (en) Improved structure of transmission mechanism in eyebrow machine
JP2002110705A (ja) ボンディング装置
JPH05291337A (ja) クランプ機構及びこれを具備したワイヤボンディング装置
JPH09225875A (ja) 搬送マニピュレータ用ハンド装置
JP2002056796A (ja) 試料ホルダ搬送装置
JPS603925U (ja) 対物レンズ駆動装置
JP2007012164A (ja) 光ピックアップのアクチュエータ