JP4825112B2 - 高いTg、高いTOS、および低い水分率を有するポリイミド成形品 - Google Patents
高いTg、高いTOS、および低い水分率を有するポリイミド成形品 Download PDFInfo
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- JP4825112B2 JP4825112B2 JP2006304334A JP2006304334A JP4825112B2 JP 4825112 B2 JP4825112 B2 JP 4825112B2 JP 2006304334 A JP2006304334 A JP 2006304334A JP 2006304334 A JP2006304334 A JP 2006304334A JP 4825112 B2 JP4825112 B2 JP 4825112B2
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- 229920001721 polyimide Polymers 0.000 title claims description 75
- 239000004642 Polyimide Substances 0.000 title claims description 74
- 238000000465 moulding Methods 0.000 title claims description 3
- 239000011347 resin Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 34
- 150000004985 diamines Chemical class 0.000 claims description 33
- 239000002253 acid Substances 0.000 claims description 26
- 229920000642 polymer Polymers 0.000 claims description 26
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 21
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 19
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 14
- 230000009477 glass transition Effects 0.000 claims description 12
- 239000002243 precursor Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 claims description 7
- 230000003647 oxidation Effects 0.000 claims description 7
- 238000007254 oxidation reaction Methods 0.000 claims description 7
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical group CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 claims 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims 1
- 230000007935 neutral effect Effects 0.000 claims 1
- 230000000379 polymerizing effect Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 25
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 20
- 239000000463 material Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 9
- 239000002131 composite material Substances 0.000 description 9
- 239000000523 sample Substances 0.000 description 9
- 230000004580 weight loss Effects 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 230000002411 adverse Effects 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- -1 ether diamine Chemical class 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 230000004584 weight gain Effects 0.000 description 4
- 235000019786 weight gain Nutrition 0.000 description 4
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- JWRLKLYWXKMAFL-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)-3-phenylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1C=2C=CC=CC=2)=CC=C1OC1=CC=C(N)C=C1 JWRLKLYWXKMAFL-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013068 control sample Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000006159 dianhydride group Chemical group 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- RBYAGNRAPXMZGZ-UHFFFAOYSA-N n-(2-phenylethynyl)aniline Chemical compound C=1C=CC=CC=1NC#CC1=CC=CC=C1 RBYAGNRAPXMZGZ-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VXKYQNLAEHJBHP-UHFFFAOYSA-N 4-[3-carboxy-3,4,4,4-tetrafluoro-2,2-bis(fluorooxycarbonyl)butanoyl]oxyphthalic acid Chemical compound C(=O)(O)C=1C=C(C=CC1C(=O)O)OC(=O)C(C(C(F)(F)F)(C(=O)O)F)(C(=O)OF)C(=O)OF VXKYQNLAEHJBHP-UHFFFAOYSA-N 0.000 description 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0207—Elastomeric fibres
- B32B2262/0215—Thermoplastic elastomer fibers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/08—Reinforcements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S525/928—Polyimide or polyamide-acid formed by condensation of a polyamine with a polycarboxylic acid having at least three carboxyl groups or derivatives thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Reinforced Plastic Materials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Description
上式では、ポリマー中のBTDA対BPDAのモル比が、約30超対約70未満(>30:<70)から約80対20(80:20)であり、Qは適当な芳香族部分である。また本発明によって、形成されるポリイミドポリマーの分子量を制御する手段として化学量論的過剰量のジアミンまたは二無水物(もしくはそれらの誘導体)のいずれかを有する前駆溶液から形成されたポリイミドが提供される。さらに、本発明はまた、末端基キャッピング剤の使用も含む。その末端基キャッピング剤は、(例えば、架橋が望ましい場合には)非反応性もしくは反応性であっても、または両者の混合物であってもよい。
(テストおよび測定)
下記の実施例では、レジンのガラス転移温度(Tg)について、レジンプラーク、すなわちテストするレジンであるポリイミドポリマーだけから作成されたプラークを形成することによって定量した。温度に対して貯蔵弾性係数値を図示することによって、動的機械的分析を行った。変曲点前および後の曲線に対する接線を引き、これらの接線の交点の温度値をTg値として使用した。測定は、TA Instruments 9900システムを使用し、空気中で昇温率毎分10℃で、最高温度500℃として行った。
本発明に従って各種のポリイミドを調製した。本発明に係るポリイミドはすべて同一の一般的方法でつくり、本発明に従ってつくったポリイミドの特性を例示し比較するために、追加のポリイミトを調製した。BTDAとBPDAの比率については、前駆溶液からポリイミドを生成するため各様に変え、その溶液中ではBTDAをBPDAとの比率に関して約20から約80モルパーセントの範囲内で変え、他方それに応じてBPDAの使用量は、BTDAとの比率に関して約20から約80モルパーセントの範囲で変えた。本明細書で示した実施例は、すべてPPD約95モルパーセントとMPD約5モルパーセントとの混合物を含むジアミン成分でつくられた。比較のため、NR−150レジンのサンプルを本明細書に記載の方法によって調製した。このレジンは、6FTAの100モルパーセントを酸官能性成分または二無水物成分として使用して調製し、他方ジアミン成分は、本発明に係るポリイミドの調製に使用されたものと同じ混合物(PPD対MPDが95対5)であった。使用した特定の量を各表に記載する。
(ポリイミド清純レジン粉末の単離)
各表中の資料の源泉であるプラークおよびクーポンに使用されるポリイミドレジンを下記の通りに調製した。上記の通り調製したサンプル溶液約100グラムを深さ2″のアルミニウム製蒸発皿に入れた。その溶液入り蒸発皿を真空オーブンにいれて、温度110℃、圧力10″(0.25m)Hgに維持した。乾燥窒素放出を全工程を通じて維持した。サンプルを110℃で約1時間または揮発した溶媒のオーブンのコンデンサーへの流動がほぼ停止するまで保った。
(レジンプラークの形成)
サンプルクーポンの切り出し源の清純レジンプラークは、圧搾プレスを利用することによって成形した。プレスは、490℃まで予熱した。寸法3″×6″(0.076m×0.152m)のモールドをプレス圧盤上に置き、選別したレジン粉末60グラムをモールドに入れ、最小圧力に保った。プレス中のモールドの温度が430℃に達したとき、モールドへの圧力を2分間にわたり徐々に上げて最終圧力を平方インチ当たり3,300ポンド(224.55気圧)とし、次いでこの値に保った。モールドの温度が480℃に達したとき、プレスを放置して約300℃まで冷却した。冷却後、圧力を解除して、モールドをプレスから取り出した上、清純レジンプラークをモールドから取り出し、上記のテストを行った。
Claims (2)
- ポリイミドポリマーを磨砕して、加熱および加圧下で形成して得られるガラス転移温度が摂氏300度より高く、熱酸化安定性が2.1−6.5パーセントである樹脂物品であって、
前記ポリイミドポリマーは、3,4,3′,4′−ベンゾフェノンテトラカルボン酸二無水物、3,4,3′,4′−ビフェニルテトラカルボン酸二無水物、および95〜100モルパーセントのp−フェニレンジアミンと、0〜5モルパーセントのm−フェニレンジアミンとから成るジアミンから誘導された構造単位を含むポリイミドポリマーであって、3,4,3′,4′−ベンゾフェノンテトラカルボン酸二無水物から誘導された構造単位と3,4,3′,4′−ビフェニルテトラカルボン酸二無水物から誘導された構造単位とのモル比が3.0対7.0〜4.0対1.0までの範囲にあることを特徴とする樹脂物品。 - ガラス転移温度が摂氏300度より高く、熱酸化安定性が2.1−6.5パーセントである樹脂物品を製造する方法であって、
a.ジエチルエステル形の二無水物を形成するために、3,4,3′,4′−ベンゾフェノンテトラカルボン酸二無水物から誘導された構造単位と3,4,3′,4′−ビフェニルテトラカルボン酸二無水物から誘導された構造単位とのモル比が3.0対7.0〜4.0対1.0までの範囲にある、3,4,3′,4′−ベンゾフェノンテトラカルボン酸二無水物と3,4,3′,4′−ビフェニルテトラカルボン酸二無水物とを極性中性溶媒中に含有する酸官能性成分の溶液を調製し、95〜100モルパーセントのp−フェニレンジアミンと、0〜5モルパーセントのm−フェニレンジアミンとから成るジアミンを含有するジアミン成分と反応させることによって前駆溶液を形成すること、
b.前記前駆溶液を加熱して揮発成分を除去し前駆溶液をポリイミドに重合させること、
c.前記重合ポリイミドを磨砕して、加熱および加圧下で成形して樹脂物品を成形すること、
を含むことを特徴とする方法。
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3158396P | 1996-12-05 | 1996-12-05 | |
| US60/031,583 | 1996-12-05 | ||
| US3893897P | 1997-02-24 | 1997-02-24 | |
| US60/038,938 | 1997-02-24 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52590798A Division JP3942642B2 (ja) | 1996-12-05 | 1997-12-04 | 高いTg、高いTOS、および低い水分率を有するポリイミド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007046065A JP2007046065A (ja) | 2007-02-22 |
| JP4825112B2 true JP4825112B2 (ja) | 2011-11-30 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52590798A Expired - Lifetime JP3942642B2 (ja) | 1996-12-05 | 1997-12-04 | 高いTg、高いTOS、および低い水分率を有するポリイミド |
| JP2006304334A Expired - Lifetime JP4825112B2 (ja) | 1996-12-05 | 2006-11-09 | 高いTg、高いTOS、および低い水分率を有するポリイミド成形品 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52590798A Expired - Lifetime JP3942642B2 (ja) | 1996-12-05 | 1997-12-04 | 高いTg、高いTOS、および低い水分率を有するポリイミド |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6127509A (ja) |
| EP (1) | EP0941272B1 (ja) |
| JP (2) | JP3942642B2 (ja) |
| KR (1) | KR20000057392A (ja) |
| CN (1) | CN1244879A (ja) |
| CA (1) | CA2274264C (ja) |
| DE (1) | DE69702717T2 (ja) |
| EA (1) | EA199900519A1 (ja) |
| WO (1) | WO1998024830A1 (ja) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5792044A (en) * | 1996-03-22 | 1998-08-11 | Danek Medical, Inc. | Devices and methods for percutaneous surgery |
| CN1157284C (zh) * | 1999-06-30 | 2004-07-14 | 松下电器产业株式会社 | 真空绝热材料、使用真空绝热材料的保温设备和电热水器 |
| US6303744B1 (en) * | 2000-03-23 | 2001-10-16 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polyimides and process for preparing polyimides having improved thermal-oxidative stability |
| US6777525B2 (en) * | 2001-07-03 | 2004-08-17 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Heat, moisture, and chemical resistant polyimide compositions and methods for making and using them |
| US6713597B2 (en) * | 2002-03-19 | 2004-03-30 | General Electric Company | Preparation of polyimide polymers |
| US7041778B1 (en) | 2003-06-05 | 2006-05-09 | The United States Of America As Represented By The Secretary Of The Air Force | Processable thermally stable addition polyimide for composite applications |
| US6945974B2 (en) * | 2003-07-07 | 2005-09-20 | Aesculap Inc. | Spinal stabilization implant and method of application |
| US7335608B2 (en) | 2004-09-22 | 2008-02-26 | Intel Corporation | Materials, structures and methods for microelectronic packaging |
| US8633284B2 (en) * | 2006-05-12 | 2014-01-21 | General Electric Company | Tailorable polyimide prepolymer blends, crosslinked polymides and articles formed therefrom |
| CN1958649B (zh) * | 2006-10-26 | 2010-12-01 | 同济大学 | 一种含生色基团的聚酰亚胺薄膜及其制备方法 |
| US20090093608A1 (en) * | 2007-10-04 | 2009-04-09 | Saint-Gobain Performance Plastics Corporation | Polyimide material with improved thermal and mechanical properties |
| KR101430974B1 (ko) * | 2007-12-27 | 2014-08-19 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 필름 및 그 제조방법 |
| US20090170992A1 (en) * | 2007-12-28 | 2009-07-02 | Saint-Gobain Performance Plastics Corporation | Etch resistant polymer composition |
| JP5510545B2 (ja) * | 2010-07-22 | 2014-06-04 | 宇部興産株式会社 | ポリイミド膜積層体の製造方法、ポリイミド膜積層体 |
| CN102604092B (zh) * | 2012-02-20 | 2014-04-16 | 中国科学院化学研究所 | 聚酰亚胺树脂及其制备方法与应用 |
| KR102157067B1 (ko) * | 2013-05-31 | 2020-09-18 | 가부시키가이샤 가네카 | 절연 피복 재료 및 그의 용도 |
| JP5829696B2 (ja) * | 2014-01-17 | 2015-12-09 | 株式会社デンソー | 絶縁電線 |
| JP5829697B2 (ja) * | 2014-01-17 | 2015-12-09 | 株式会社デンソー | 絶縁電線 |
| CN105566630B (zh) * | 2014-10-14 | 2018-03-02 | 株洲时代电气绝缘有限责任公司 | 一种聚酰亚胺薄膜及其制备方法 |
| CN107004473B (zh) | 2014-11-27 | 2019-09-13 | 株式会社钟化 | 耐磨损性优越的绝缘包覆材 |
| JP6694826B2 (ja) | 2014-11-27 | 2020-05-20 | 株式会社カネカ | 耐摩耗性の優れる絶縁被覆材料 |
| CN107778484B (zh) * | 2016-08-31 | 2019-08-13 | 北京化工大学 | 一种聚酰亚胺中空纤维及其制备方法和应用 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2101137B (en) * | 1981-04-14 | 1984-09-26 | Ube Industries | Producing porous aromatic imide polymer membranes |
| JPS59204619A (ja) * | 1983-05-09 | 1984-11-20 | Ube Ind Ltd | 芳香族ポリアミツク酸溶液組成物 |
| JPS60206639A (ja) * | 1984-03-31 | 1985-10-18 | 日東電工株式会社 | ポリイミド−金属箔複合フイルムの製造方法 |
| FR2568258B1 (fr) * | 1984-07-25 | 1987-02-13 | Inst Francais Du Petrole | Compositions de precurseurs de polyimides, leur preparation, les polyimides en derivant et leurs utilisations, notamment dans la fabrication de vernis d'emaillage pour conducteurs electriques |
| AU576675B2 (en) * | 1985-06-20 | 1988-09-01 | National Aeronautics And Space Administration - Nasa | Copolyimides |
| JPH062828B2 (ja) * | 1986-05-15 | 1994-01-12 | 宇部興産株式会社 | ポリイミドフイルムの製造法 |
| US4839217A (en) * | 1986-05-16 | 1989-06-13 | Ube Industries, Ltd. | Aromatic polyimide film |
| JP2622678B2 (ja) * | 1987-01-12 | 1997-06-18 | チッソ株式会社 | 溶融成形可能な結晶性ポリイミド重合体 |
| JP2609279B2 (ja) * | 1988-04-19 | 1997-05-14 | 宇部興産株式会社 | ポリイミド粉末成形体 |
| US5304626A (en) * | 1988-06-28 | 1994-04-19 | Amoco Corporation | Polyimide copolymers containing 3,3',4,4'-tetracarboxybiphenyl dianhydride (BPDA) moieties |
| JPH03137124A (ja) * | 1989-10-20 | 1991-06-11 | Kanegafuchi Chem Ind Co Ltd | ポリイミド樹脂粉末及びその製造方法並びに該樹脂粉末の成形方法 |
| US5077382A (en) * | 1989-10-26 | 1991-12-31 | Occidental Chemical Corporation | Copolyimide odpa/bpda/4,4'-oda or p-pda |
| DE69115076T2 (de) * | 1990-02-20 | 1996-05-09 | Nat Starch Chem Invest | Diarylacetylen endgekappte Polyimide. |
| US5177180A (en) * | 1990-08-07 | 1993-01-05 | General Electric Company | High temperature mixed polyimides and composites formed therefrom |
| DE69115171T2 (de) * | 1990-08-27 | 1996-05-15 | Du Pont | Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung. |
| US5243024A (en) * | 1990-12-21 | 1993-09-07 | Amoco Corporation | High moduli polyimides |
| JPH04256394A (ja) * | 1991-02-08 | 1992-09-11 | Toray Ind Inc | フレキシブル配線基板の製造方法 |
| US5252700A (en) * | 1991-04-30 | 1993-10-12 | Mitsui Toatsu Chemicals, Inc. | Heat-resistant adhesive and method of adhesion by using adhesive |
| DE4135058A1 (de) * | 1991-10-24 | 1993-04-29 | Basf Lacke & Farben | Loesungen von polyimidbildenden ausgangsstoffen |
| JPH0641305A (ja) * | 1991-10-25 | 1994-02-15 | Internatl Business Mach Corp <Ibm> | フッ素化された反応体からのポリアミド酸およびポリイミド |
| US5478913A (en) * | 1993-12-22 | 1995-12-26 | E. I. Du Pont De Nemours And Company | Melt-processible polyimides with high Tg |
| US5412066A (en) * | 1994-03-03 | 1995-05-02 | Ther United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Phenylethynyl terminated imide oligomers |
| US5493002A (en) * | 1994-07-06 | 1996-02-20 | Virginia Tech Intellectual Properties, Inc. | Aryl ethynyl phthalic anhydrides and polymers with terminal or pendant amines prepared with aryl ethynyl phthalic anhydrides |
| US5830564A (en) * | 1996-03-01 | 1998-11-03 | Ube Industries, Ltd. | Aromatic polyimide film |
-
1997
- 1997-12-04 DE DE69702717T patent/DE69702717T2/de not_active Expired - Lifetime
- 1997-12-04 CA CA 2274264 patent/CA2274264C/en not_active Expired - Lifetime
- 1997-12-04 CN CN97180288A patent/CN1244879A/zh active Pending
- 1997-12-04 WO PCT/US1997/023043 patent/WO1998024830A1/en not_active Ceased
- 1997-12-04 JP JP52590798A patent/JP3942642B2/ja not_active Expired - Lifetime
- 1997-12-04 US US09/319,218 patent/US6127509A/en not_active Expired - Lifetime
- 1997-12-04 KR KR1019990704948A patent/KR20000057392A/ko not_active Withdrawn
- 1997-12-04 EA EA199900519A patent/EA199900519A1/ru unknown
- 1997-12-04 EP EP97954121A patent/EP0941272B1/en not_active Expired - Lifetime
-
2006
- 2006-11-09 JP JP2006304334A patent/JP4825112B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP3942642B2 (ja) | 2007-07-11 |
| JP2001505612A (ja) | 2001-04-24 |
| DE69702717D1 (de) | 2000-09-07 |
| JP2007046065A (ja) | 2007-02-22 |
| EP0941272A1 (en) | 1999-09-15 |
| EP0941272B1 (en) | 2000-08-02 |
| KR20000057392A (ko) | 2000-09-15 |
| WO1998024830A1 (en) | 1998-06-11 |
| CN1244879A (zh) | 2000-02-16 |
| EA199900519A1 (ru) | 2000-02-28 |
| CA2274264A1 (en) | 1998-06-11 |
| US6127509A (en) | 2000-10-03 |
| DE69702717T2 (de) | 2001-03-29 |
| CA2274264C (en) | 2006-11-07 |
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