JP4834486B2 - パワー半導体モジュールと端子コネクタとの配置装置 - Google Patents

パワー半導体モジュールと端子コネクタとの配置装置 Download PDF

Info

Publication number
JP4834486B2
JP4834486B2 JP2006221518A JP2006221518A JP4834486B2 JP 4834486 B2 JP4834486 B2 JP 4834486B2 JP 2006221518 A JP2006221518 A JP 2006221518A JP 2006221518 A JP2006221518 A JP 2006221518A JP 4834486 B2 JP4834486 B2 JP 4834486B2
Authority
JP
Japan
Prior art keywords
power semiconductor
semiconductor module
terminal
contact
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006221518A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007059393A (ja
Inventor
シュテーガー ユルゲン
エバースベルガー フランク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik GmbH and Co KG filed Critical Semikron Elektronik GmbH and Co KG
Publication of JP2007059393A publication Critical patent/JP2007059393A/ja
Application granted granted Critical
Publication of JP4834486B2 publication Critical patent/JP4834486B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus

Landscapes

  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
JP2006221518A 2005-08-24 2006-08-15 パワー半導体モジュールと端子コネクタとの配置装置 Expired - Fee Related JP4834486B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005039946.0 2005-08-24
DE102005039946A DE102005039946A1 (de) 2005-08-24 2005-08-24 Anordnung mit Leistungshalbleitermodul und mit Anschlussverbinder

Publications (2)

Publication Number Publication Date
JP2007059393A JP2007059393A (ja) 2007-03-08
JP4834486B2 true JP4834486B2 (ja) 2011-12-14

Family

ID=37517179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006221518A Expired - Fee Related JP4834486B2 (ja) 2005-08-24 2006-08-15 パワー半導体モジュールと端子コネクタとの配置装置

Country Status (7)

Country Link
EP (1) EP1758214B1 (de)
JP (1) JP4834486B2 (de)
CN (1) CN1921110B (de)
AT (1) ATE381798T1 (de)
DE (2) DE102005039946A1 (de)
DK (1) DK1758214T3 (de)
ES (1) ES2299127T3 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006058694B4 (de) * 2006-12-13 2011-06-16 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Kontaktfedern
DE102008012570B4 (de) * 2008-03-04 2014-02-13 Infineon Technologies Ag Leistungshalbleitermodul-System, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung
DE102008034467B4 (de) * 2008-07-24 2014-04-03 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleitermodul und mit einer Verbindungseinrichtung
DE102013113143B4 (de) * 2013-11-28 2016-04-21 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417752B2 (de) * 1971-10-05 1979-07-02
DE3345285A1 (de) * 1983-12-14 1985-06-27 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleiteranordnung
JPH02150771A (ja) * 1988-12-01 1990-06-11 Nec Corp 速度計測装置
JP3201187B2 (ja) * 1994-12-08 2001-08-20 富士電機株式会社 半導体装置
JPH08255643A (ja) * 1995-01-18 1996-10-01 Furukawa Electric Co Ltd:The プリント基板用コネクタ
TW328403U (en) * 1997-05-09 1998-03-11 Formosa Electronicindustries Inc Ac/dc power supplier having a replaceable plug
CN2315700Y (zh) * 1997-06-04 1999-04-21 吴祖榆 交直流两用可抽换电源插头的电源供应器
US6669495B2 (en) * 2000-11-06 2003-12-30 Research In Motion Limited Universal adapter with interchangeable plugs
DE10100460B4 (de) 2001-01-08 2006-06-01 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Gehäuse und Anschlußelementen
JP3644406B2 (ja) * 2001-05-08 2005-04-27 株式会社デンソー 指針計器及びその回動内機
EP1291914A1 (de) * 2001-09-10 2003-03-12 ABB Schweiz AG Druckkontaktierbares Leistungshalbleitermodul
DE102004025609B4 (de) * 2004-05-25 2010-12-09 Semikron Elektronik Gmbh & Co. Kg Anordnung in Schraub- Druckkontaktierung mit einem Leistungshalbleitermodul

Also Published As

Publication number Publication date
CN1921110B (zh) 2010-12-01
DK1758214T3 (da) 2008-04-07
EP1758214A1 (de) 2007-02-28
DE102005039946A1 (de) 2007-03-01
EP1758214B1 (de) 2007-12-19
ATE381798T1 (de) 2008-01-15
CN1921110A (zh) 2007-02-28
ES2299127T3 (es) 2008-05-16
JP2007059393A (ja) 2007-03-08
DE502006000232D1 (de) 2008-01-31

Similar Documents

Publication Publication Date Title
JP4264375B2 (ja) パワー半導体モジュール
US9401558B1 (en) Power connector
JP5175535B2 (ja) 接触バネを有するパワー半導体モジュール
TW202422977A (zh) 測試用探針、以及具有該測試用探針的測試用插座
KR20170127996A (ko) 기판 커넥터
RU2686688C2 (ru) Вставка для скрытой проводки электрического монтажного устройства
JP4046781B2 (ja) 電力を横方向に分配する分配器軌条
US7736157B2 (en) Electric connection box
CN104885180B (zh) 点灭装置
KR20160080636A (ko) 전기 커넥터의 컨택트 및 이를 포함하는 전기 커넥터
US12127344B2 (en) Circuit board interconnection device and circuit board assembly
US20170062959A1 (en) Circuit board passage terminal
JP2007059393A (ja) パワー半導体モジュールと端子コネクタとの配置装置
US7914297B2 (en) Electric connection box
US11304301B2 (en) Electrical junction box and wire harness
US20160226165A1 (en) Power connector and method of making the same
JP7133780B2 (ja) プラグ装置及び配電システム
US6921273B2 (en) Electric connection arrangement for electronic devices
KR101810126B1 (ko) 인쇄회로기판 및 이를 사용한 차량용 기판블록
KR102695676B1 (ko) 기판 커넥터
KR20180004507A (ko) 리셉터클 커넥터
KR102723264B1 (ko) 플러그 커넥터
KR20180006795A (ko) 기판 커넥터
CN1954427A (zh) 功率半导体组件
JP4152190B2 (ja) 印刷回路用電力コネクタ

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090527

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110531

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110829

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110920

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110926

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140930

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees