JP5162070B2 - 静電放電(esd)保護回路 - Google Patents
静電放電(esd)保護回路 Download PDFInfo
- Publication number
- JP5162070B2 JP5162070B2 JP2001574904A JP2001574904A JP5162070B2 JP 5162070 B2 JP5162070 B2 JP 5162070B2 JP 2001574904 A JP2001574904 A JP 2001574904A JP 2001574904 A JP2001574904 A JP 2001574904A JP 5162070 B2 JP5162070 B2 JP 5162070B2
- Authority
- JP
- Japan
- Prior art keywords
- esd
- bus
- circuit
- trigger
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Logic Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/546,601 | 2000-04-10 | ||
| US09/546,601 US6385021B1 (en) | 2000-04-10 | 2000-04-10 | Electrostatic discharge (ESD) protection circuit |
| PCT/US2001/010976 WO2001078148A1 (en) | 2000-04-10 | 2001-04-04 | Electrostatic discharge (esd) protection circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003530698A JP2003530698A (ja) | 2003-10-14 |
| JP5162070B2 true JP5162070B2 (ja) | 2013-03-13 |
Family
ID=24181147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001574904A Expired - Lifetime JP5162070B2 (ja) | 2000-04-10 | 2001-04-04 | 静電放電(esd)保護回路 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6385021B1 (de) |
| EP (1) | EP1277236B1 (de) |
| JP (1) | JP5162070B2 (de) |
| KR (1) | KR100801863B1 (de) |
| CN (1) | CN1242478C (de) |
| AU (1) | AU2001251308A1 (de) |
| WO (1) | WO2001078148A1 (de) |
Families Citing this family (105)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7320457B2 (en) * | 1997-02-07 | 2008-01-22 | Sri International | Electroactive polymer devices for controlling fluid flow |
| JP3796034B2 (ja) * | 1997-12-26 | 2006-07-12 | 株式会社ルネサステクノロジ | レベル変換回路および半導体集積回路装置 |
| US7064472B2 (en) * | 1999-07-20 | 2006-06-20 | Sri International | Electroactive polymer devices for moving fluid |
| US7537197B2 (en) * | 1999-07-20 | 2009-05-26 | Sri International | Electroactive polymer devices for controlling fluid flow |
| FR2803100B1 (fr) * | 1999-12-28 | 2002-12-06 | St Microelectronics Sa | Dispositif de protection de lignes d'interconnexions dans un circuit integre |
| AU2001238675A1 (en) * | 2000-02-23 | 2001-09-03 | Sri International | Electroactive polymer thermal electric generators |
| US6933610B2 (en) * | 2002-02-20 | 2005-08-23 | Silicon Pipe, Inc. | Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby |
| TW529153B (en) * | 2002-02-27 | 2003-04-21 | United Microelectronics Corp | Electrostatic discharge protection circuit |
| WO2003081742A1 (en) * | 2002-03-22 | 2003-10-02 | Freescale Semiconductor, Inc. | Circuit for electrostatic discharge protection |
| US6757147B1 (en) * | 2002-05-03 | 2004-06-29 | Pericom Semiconductor Corp. | Pin-to-pin ESD-protection structure having cross-pin activation |
| US6724603B2 (en) * | 2002-08-09 | 2004-04-20 | Motorola, Inc. | Electrostatic discharge protection circuitry and method of operation |
| US20040212936A1 (en) * | 2002-09-27 | 2004-10-28 | Salling Craig T. | Diode-string substrate-pumped electrostatic discharge protection |
| US7164565B2 (en) * | 2002-11-29 | 2007-01-16 | Sigmatel, Inc. | ESD protection circuit |
| US7209332B2 (en) * | 2002-12-10 | 2007-04-24 | Freescale Semiconductor, Inc. | Transient detection circuit |
| KR100937652B1 (ko) * | 2002-12-31 | 2010-01-19 | 동부일렉트로닉스 주식회사 | 반도체 장치의 정전기방전 보호회로 |
| US7074687B2 (en) * | 2003-04-04 | 2006-07-11 | Freescale Semiconductor, Inc. | Method for forming an ESD protection device |
| US7616414B2 (en) * | 2003-04-25 | 2009-11-10 | Broadcom Corporation | ESD protection circuit for high speed signaling including T/R switches |
| US7203043B2 (en) | 2003-05-30 | 2007-04-10 | Hewlett-Packard Development Company, L.P. | Method and structure for external control of ESD protection in electronic circuits |
| KR100532463B1 (ko) * | 2003-08-27 | 2005-12-01 | 삼성전자주식회사 | 정전기 보호 소자와 파워 클램프로 구성된 입출력 정전기방전 보호 셀을 구비하는 집적 회로 장치 |
| JP2005093497A (ja) | 2003-09-12 | 2005-04-07 | Toshiba Corp | 保護回路を有する半導体装置 |
| US6970336B2 (en) * | 2003-10-10 | 2005-11-29 | Freescale Semiconductor, Inc. | Electrostatic discharge protection circuit and method of operation |
| DE10349405A1 (de) * | 2003-10-21 | 2005-05-25 | Austriamicrosystems Ag | Aktive Schutzschaltungsanordnung |
| KR100645039B1 (ko) * | 2003-12-15 | 2006-11-10 | 삼성전자주식회사 | 정전기 방전 보호 소자 및 그 제조방법 |
| DE102004004789B3 (de) * | 2004-01-30 | 2005-03-03 | Infineon Technologies Ag | ESD-Schutzschaltkreis für eine elektronische Schaltung mit mehreren Versorgungsspannungen |
| GB2430821B (en) * | 2004-02-07 | 2008-06-04 | Samsung Electronics Co Ltd | Buffer circuit having electrostatic discharge protection |
| KR100781537B1 (ko) * | 2004-02-07 | 2007-12-03 | 삼성전자주식회사 | 정전기 방전 보호 반도체 소자 및 이를 포함하는 반도체집적 회로 |
| DE102004007655B8 (de) * | 2004-02-17 | 2013-10-10 | Infineon Technologies Ag | Halbleiterschaltungen mit ESD-Schutzvorrichtung mit einer mit einem Substrat- oder Guard-Ring-Kontakt kontaktierten ESD-Schutzschaltung |
| US7573691B2 (en) * | 2004-04-12 | 2009-08-11 | Agere Systems Inc. | Electrical over stress robustness |
| TWI234266B (en) * | 2004-06-24 | 2005-06-11 | Novatek Microelectronics Corp | Level shifter circuits for ESD protection |
| JP5008840B2 (ja) * | 2004-07-02 | 2012-08-22 | ローム株式会社 | 半導体装置 |
| US20060028776A1 (en) * | 2004-08-09 | 2006-02-09 | Michael Stockinger | Electrostatic discharge protection for an integrated circuit |
| JP4195431B2 (ja) * | 2004-10-07 | 2008-12-10 | 株式会社東芝 | 静電放電の検証方法および半導体装置の製造方法 |
| JP4942007B2 (ja) * | 2004-10-25 | 2012-05-30 | ルネサスエレクトロニクス株式会社 | 半導体集積回路 |
| US7518841B2 (en) * | 2004-11-02 | 2009-04-14 | Industrial Technology Research Institute | Electrostatic discharge protection for power amplifier in radio frequency integrated circuit |
| US7292421B2 (en) * | 2004-11-12 | 2007-11-06 | Texas Instruments Incorporated | Local ESD power rail clamp which implements switchable I/O decoupling capacitance function |
| US7328882B2 (en) * | 2005-01-06 | 2008-02-12 | Honeywell International Inc. | Microfluidic modulating valve |
| US7446990B2 (en) * | 2005-02-11 | 2008-11-04 | Freescale Semiconductor, Inc. | I/O cell ESD system |
| US7301741B2 (en) * | 2005-05-17 | 2007-11-27 | Freescale Semiconductor, Inc. | Integrated circuit with multiple independent gate field effect transistor (MIGFET) rail clamp circuit |
| TWI278093B (en) * | 2005-07-15 | 2007-04-01 | Novatek Microelectronics Corp | Level shifter ESD protection circuit with power-on-sequence consideration |
| CN100442510C (zh) * | 2005-08-26 | 2008-12-10 | 联咏科技股份有限公司 | 考量电源启动顺序的准位移位器静电放电防护电路 |
| US7639462B2 (en) * | 2005-10-25 | 2009-12-29 | Honeywell International Inc. | Method and system for reducing transient event effects within an electrostatic discharge power clamp |
| US8254069B2 (en) * | 2005-10-28 | 2012-08-28 | Fairchild Semiconductor Corporation | ESD protection for outputs |
| US7593202B2 (en) * | 2005-11-01 | 2009-09-22 | Freescale Semiconductor, Inc. | Electrostatic discharge (ESD) protection circuit for multiple power domain integrated circuit |
| US7453676B2 (en) * | 2005-11-16 | 2008-11-18 | Huh Yoon J | RC-triggered ESD power clamp circuit and method for providing ESD protection |
| TWI268599B (en) * | 2005-12-08 | 2006-12-11 | Via Tech Inc | ESD protection circuits and related techniques |
| DE102005060368A1 (de) * | 2005-12-16 | 2007-06-28 | Infineon Technologies Ag | Verfahren zum ESD-Schutz einer elektronischen Schaltung und entsprechend ausgestaltete elektronische Schaltung |
| US7542255B2 (en) * | 2006-03-16 | 2009-06-02 | Denso Corporation | Input protection circuit |
| JP4923645B2 (ja) * | 2006-03-16 | 2012-04-25 | 株式会社デンソー | 入力保護回路 |
| US20070236842A1 (en) * | 2006-04-07 | 2007-10-11 | Hynix Semiconductor Inc. | Electrostatic discharge protection circuit |
| US7808117B2 (en) * | 2006-05-16 | 2010-10-05 | Freescale Semiconductor, Inc. | Integrated circuit having pads and input/output (I/O) cells |
| US7551415B2 (en) * | 2006-08-30 | 2009-06-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Repair circuitry with an enhanced ESD protection device |
| US7589945B2 (en) * | 2006-08-31 | 2009-09-15 | Freescale Semiconductor, Inc. | Distributed electrostatic discharge protection circuit with varying clamp size |
| US7952261B2 (en) | 2007-06-29 | 2011-05-31 | Bayer Materialscience Ag | Electroactive polymer transducers for sensory feedback applications |
| US7777998B2 (en) | 2007-09-10 | 2010-08-17 | Freescale Semiconductor, Inc. | Electrostatic discharge circuit and method therefor |
| US7755871B2 (en) | 2007-11-28 | 2010-07-13 | Amazing Microelectronic Corp. | Power-rail ESD protection circuit with ultra low gate leakage |
| US7817387B2 (en) * | 2008-01-09 | 2010-10-19 | Freescale Semiconductor, Inc. | MIGFET circuit with ESD protection |
| US7710696B2 (en) * | 2008-01-23 | 2010-05-04 | Himax Technologies Limited | Transient detection circuit for ESD protection |
| TWI390699B (zh) * | 2008-01-31 | 2013-03-21 | Realtek Semiconductor Corp | 具有靜電保護功能之網路通訊裝置 |
| JP5312849B2 (ja) * | 2008-06-06 | 2013-10-09 | ルネサスエレクトロニクス株式会社 | 集積回路 |
| JP2010010419A (ja) * | 2008-06-27 | 2010-01-14 | Nec Electronics Corp | 半導体装置 |
| US8536893B2 (en) * | 2009-03-09 | 2013-09-17 | Qualcomm Incorporated | Circuit for measuring magnitude of electrostatic discharge (ESD) events for semiconductor chip bonding |
| EP2239793A1 (de) | 2009-04-11 | 2010-10-13 | Bayer MaterialScience AG | Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung |
| JP5431791B2 (ja) * | 2009-05-27 | 2014-03-05 | ルネサスエレクトロニクス株式会社 | 静電気保護回路 |
| US8947839B2 (en) * | 2009-07-30 | 2015-02-03 | Xilinx, Inc. | Enhanced immunity from electrostatic discharge |
| CN101989739B (zh) * | 2009-08-06 | 2013-12-04 | 技嘉科技股份有限公司 | 保护电路 |
| JP5557658B2 (ja) * | 2010-02-19 | 2014-07-23 | ラピスセミコンダクタ株式会社 | 保護回路及び半導体装置 |
| US20110242712A1 (en) * | 2010-04-01 | 2011-10-06 | Fwu-Juh Huang | Chip with esd protection function |
| US8456784B2 (en) | 2010-05-03 | 2013-06-04 | Freescale Semiconductor, Inc. | Overvoltage protection circuit for an integrated circuit |
| CN101944530B (zh) * | 2010-08-27 | 2011-09-21 | 电子科技大学 | 一种用于集成电路的具有控制电路的esd保护电路 |
| WO2012118916A2 (en) | 2011-03-01 | 2012-09-07 | Bayer Materialscience Ag | Automated manufacturing processes for producing deformable polymer devices and films |
| JP2014517331A (ja) | 2011-03-22 | 2014-07-17 | バイエル・インテレクチュアル・プロパティ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | 電場応答性高分子アクチュエータレンチキュラシステム |
| JP2013073992A (ja) | 2011-09-27 | 2013-04-22 | Semiconductor Components Industries Llc | 半導体装置 |
| US8982517B2 (en) * | 2012-02-02 | 2015-03-17 | Texas Instruments Incorporated | Electrostatic discharge protection apparatus |
| US9876160B2 (en) | 2012-03-21 | 2018-01-23 | Parker-Hannifin Corporation | Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices |
| JP5985851B2 (ja) * | 2012-03-27 | 2016-09-06 | 旭化成エレクトロニクス株式会社 | Esd保護回路及びesd保護回路に係る半導体装置 |
| CN102693979B (zh) * | 2012-06-11 | 2017-02-08 | 上海华虹宏力半导体制造有限公司 | 全芯片esd保护电路 |
| KR20150031285A (ko) | 2012-06-18 | 2015-03-23 | 바이엘 인텔렉쳐 프로퍼티 게엠베하 | 연신 공정을 위한 연신 프레임 |
| US9590193B2 (en) | 2012-10-24 | 2017-03-07 | Parker-Hannifin Corporation | Polymer diode |
| US9438030B2 (en) | 2012-11-20 | 2016-09-06 | Freescale Semiconductor, Inc. | Trigger circuit and method for improved transient immunity |
| US9064938B2 (en) * | 2013-05-30 | 2015-06-23 | Freescale Semiconductor, Inc. | I/O cell ESD system |
| US9472948B2 (en) * | 2013-09-30 | 2016-10-18 | Infineon Technologies Ag | On chip reverse polarity protection compliant with ISO and ESD requirements |
| US9225163B2 (en) * | 2013-11-01 | 2015-12-29 | Infineon Technologies Ag | Combined ESD active clamp for cascaded voltage pins |
| TWI504090B (zh) | 2013-11-06 | 2015-10-11 | Realtek Semiconductor Corp | 靜電放電防護電路 |
| US9876450B2 (en) * | 2014-01-24 | 2018-01-23 | Marvell World Trade, Ltd. | Active clamp for motor driver |
| JP6143690B2 (ja) | 2014-03-12 | 2017-06-07 | 株式会社東芝 | 出力回路 |
| US9337651B2 (en) * | 2014-04-23 | 2016-05-10 | Via Alliance Semiconductor Co., Ltd. | Electrostatic discharge protection circuit |
| US9478529B2 (en) * | 2014-05-28 | 2016-10-25 | Freescale Semiconductor, Inc. | Electrostatic discharge protection system |
| US9553446B2 (en) | 2014-10-31 | 2017-01-24 | Nxp Usa, Inc. | Shared ESD circuitry |
| TWI572106B (zh) | 2015-03-26 | 2017-02-21 | 瑞昱半導體股份有限公司 | 電流鏡式靜電放電箝制電路與電流鏡式靜電放電偵測器 |
| WO2016203648A1 (ja) * | 2015-06-19 | 2016-12-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| DE102015120694B3 (de) * | 2015-11-27 | 2017-06-01 | Elmos Semiconductor Aktiengesellschaft | Vorrichtung zum Schutz von integrierten Schaltungen mittels Schutzbussen |
| DE102015120692B3 (de) * | 2015-11-27 | 2017-05-24 | Elmos Semiconductor Aktiengesellschaft | Vorrichtung zum Schutz von integrierten Schaltungen mittels Schutzbussen |
| DE102015120697B3 (de) * | 2015-11-27 | 2017-06-01 | Elmos Semiconductor Aktiengesellschaft | Vorrichtung zum Schutz von integrierten Schaltungen mittels Schutzbussen |
| DE102015120698B3 (de) * | 2015-11-27 | 2017-05-24 | Elmos Semiconductor Aktiengesellschaft | Vorrichtung zum Schutz von integrierten Schaltungen mittels Schutzbussen |
| DE102015120695B3 (de) * | 2015-11-27 | 2017-06-01 | Elmos Semiconductor Aktiengesellschaft | Vorrichtung zum Schutz von integrierten Schaltungen mittels Schutzbussen |
| DE102015120691B3 (de) * | 2015-11-27 | 2017-05-11 | Elmos Semiconductor Aktiengesellschaft | Vorrichtung zum Schutz von integrierten Schaltungen mittels Schutzbussen |
| DE102015120693B3 (de) * | 2015-11-27 | 2017-05-24 | Elmos Semiconductor Aktiengesellschaft | Vorrichtung zum Schutz von integrierten Schaltungen mittels Schutzbussen |
| TWI604676B (zh) | 2016-10-05 | 2017-11-01 | 瑞昱半導體股份有限公司 | 跨電源域的靜電放電防護電路 |
| TWI604677B (zh) | 2016-10-05 | 2017-11-01 | 瑞昱半導體股份有限公司 | 跨電源域的靜電放電防護電路 |
| US10528111B2 (en) | 2017-12-11 | 2020-01-07 | Micron Technology, Inc. | Apparatuses and methods for indicating an operation type associated with a power management event |
| CN108519541A (zh) * | 2018-04-23 | 2018-09-11 | 珠海深圳清华大学研究院创新中心 | 一种检测电路及检测设备 |
| CN108880212B (zh) | 2018-06-30 | 2021-07-20 | 唯捷创芯(天津)电子技术股份有限公司 | 一种防浪涌的电源钳位电路、芯片及通信终端 |
| US11056879B2 (en) | 2019-06-12 | 2021-07-06 | Nxp Usa, Inc. | Snapback clamps for ESD protection with voltage limited, centralized triggering scheme |
| CN113839374B (zh) * | 2021-11-29 | 2022-03-04 | 珠海市杰理科技股份有限公司 | Esd电源保护电路、工作电源和芯片 |
| JP7790191B2 (ja) * | 2022-02-16 | 2025-12-23 | 株式会社ソシオネクスト | 半導体装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4295176A (en) | 1979-09-04 | 1981-10-13 | Bell Telephone Laboratories, Incorporated | Semiconductor integrated circuit protection arrangement |
| EP0435047A3 (en) * | 1989-12-19 | 1992-07-15 | National Semiconductor Corporation | Electrostatic discharge protection for integrated circuits |
| JPH06164350A (ja) * | 1992-09-18 | 1994-06-10 | Fuji Electric Co Ltd | 半導体集積回路装置 |
| US5361185A (en) | 1993-02-19 | 1994-11-01 | Advanced Micro Devices, Inc. | Distributed VCC/VSS ESD clamp structure |
| US5311391A (en) | 1993-05-04 | 1994-05-10 | Hewlett-Packard Company | Electrostatic discharge protection circuit with dynamic triggering |
| US5561577A (en) | 1994-02-02 | 1996-10-01 | Hewlett-Packard Company | ESD protection for IC's |
| US5610790A (en) * | 1995-01-20 | 1997-03-11 | Xilinx, Inc. | Method and structure for providing ESD protection for silicon on insulator integrated circuits |
| JP2830783B2 (ja) | 1995-07-18 | 1998-12-02 | 日本電気株式会社 | 半導体装置 |
| US5721656A (en) | 1996-06-10 | 1998-02-24 | Winbond Electronics Corporation | Electrostatc discharge protection network |
| US5825600A (en) * | 1997-04-25 | 1998-10-20 | Cypress Semiconductor Corp. | Fast turn-on silicon controlled rectifier (SCR) for electrostatic discharge (ESD) protection |
| US5991134A (en) | 1997-06-19 | 1999-11-23 | Advanced Micro Devices, Inc. | Switchable ESD protective shunting circuit for semiconductor devices |
| JPH1187727A (ja) * | 1997-09-12 | 1999-03-30 | Mitsubishi Electric Corp | 半導体装置 |
| US6002156A (en) * | 1997-09-16 | 1999-12-14 | Winbond Electronics Corp. | Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering |
| US5946177A (en) | 1998-08-17 | 1999-08-31 | Motorola, Inc. | Circuit for electrostatic discharge protection |
-
2000
- 2000-04-10 US US09/546,601 patent/US6385021B1/en not_active Expired - Lifetime
-
2001
- 2001-04-04 CN CNB018078737A patent/CN1242478C/zh not_active Expired - Lifetime
- 2001-04-04 AU AU2001251308A patent/AU2001251308A1/en not_active Abandoned
- 2001-04-04 WO PCT/US2001/010976 patent/WO2001078148A1/en not_active Ceased
- 2001-04-04 EP EP01924673A patent/EP1277236B1/de not_active Expired - Lifetime
- 2001-04-04 KR KR1020027013590A patent/KR100801863B1/ko not_active Expired - Lifetime
- 2001-04-04 JP JP2001574904A patent/JP5162070B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR20020087966A (ko) | 2002-11-23 |
| EP1277236B1 (de) | 2012-01-18 |
| JP2003530698A (ja) | 2003-10-14 |
| WO2001078148A1 (en) | 2001-10-18 |
| AU2001251308A1 (en) | 2001-10-23 |
| EP1277236A1 (de) | 2003-01-22 |
| US6385021B1 (en) | 2002-05-07 |
| CN1426601A (zh) | 2003-06-25 |
| KR100801863B1 (ko) | 2008-02-12 |
| CN1242478C (zh) | 2006-02-15 |
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