JP5597536B2 - 搬送ロボットのティーチング方法 - Google Patents
搬送ロボットのティーチング方法 Download PDFInfo
- Publication number
- JP5597536B2 JP5597536B2 JP2010522732A JP2010522732A JP5597536B2 JP 5597536 B2 JP5597536 B2 JP 5597536B2 JP 2010522732 A JP2010522732 A JP 2010522732A JP 2010522732 A JP2010522732 A JP 2010522732A JP 5597536 B2 JP5597536 B2 JP 5597536B2
- Authority
- JP
- Japan
- Prior art keywords
- transfer robot
- robot
- substrate
- transfer
- detection means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Program-controlled manipulators
- B25J9/16—Program controls
- B25J9/1679—Program controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3306—Horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Numerical Control (AREA)
Description
12 ロボットハンド
16、17 貫通孔(指標部)
2 検知手段
2a、2b 検知位置
S 基板
A ロードロック室
B 搬送室
C 処理室
Cs 基板ステージ
Claims (3)
- 複数の処理室間で処理すべき基板をハンドに支持した状態で同一平面内を旋回及び伸縮動作させて前記基板を所定の位置に搬送する搬送ロボットに対しその搬送動作を教示する搬送ロボットのティーチング方法において、
前記処理室間で基板を搬送する際に基板を検知するように配置された少なくとも1個の検知手段を用い、
前記搬送ロボットを搬送動作させ、予め前記搬送ロボットの作動部分である前記ハンドに設けた指標部の少なくとも1つを前記検知手段にて検出し、この検知位置から、前記旋回及び伸縮動作の少なくとも一方の起点となる基準位置を教示するようにし、
前記起点の教示に先立って、前記ハンドに設けた指標部の少なくとも2個を前記検知手段にて夫々検知し、搬送ロボットの作動部分を組み付けたときの伸縮方向または旋回方向のずれと、伸縮方向に対する前記ハンドの傾きとを所定の比較値に基づき補正する、とともに、
前記検知手段が前記平面に対し垂直に投光するように配置した光学センサであり、前記指標部のそれぞれを前記ハンドに形成した1個の貫通孔から構成したこと、
を特徴とする搬送ロボットのティーチング方法。 - 前記貫通孔の周辺において搬送ロボットを走査移動させるようにしたことを特徴とする請求項1記載の搬送ロボットのティーチング方法。
- 前記搬送ロボットにて基板を支持し、前記作動部分に代えてまたは前記作動部分に加えて前記基板に指標部を形成することを特徴とする請求項1または2に記載の搬送ロボットのティーチング方法。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010522732A JP5597536B2 (ja) | 2008-08-01 | 2009-07-29 | 搬送ロボットのティーチング方法 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008200101 | 2008-08-01 | ||
| JP2008200101 | 2008-08-01 | ||
| PCT/JP2009/063468 WO2010013732A1 (ja) | 2008-08-01 | 2009-07-29 | 搬送ロボットのティーチング方法 |
| JP2010522732A JP5597536B2 (ja) | 2008-08-01 | 2009-07-29 | 搬送ロボットのティーチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2010013732A1 JPWO2010013732A1 (ja) | 2012-01-12 |
| JP5597536B2 true JP5597536B2 (ja) | 2014-10-01 |
Family
ID=41610431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010522732A Active JP5597536B2 (ja) | 2008-08-01 | 2009-07-29 | 搬送ロボットのティーチング方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8688276B2 (ja) |
| JP (1) | JP5597536B2 (ja) |
| KR (1) | KR101621814B1 (ja) |
| CN (1) | CN102112274B (ja) |
| DE (1) | DE112009001863A5 (ja) |
| TW (1) | TWI488723B (ja) |
| WO (1) | WO2010013732A1 (ja) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5728204B2 (ja) * | 2010-11-17 | 2015-06-03 | 株式会社アルバック | 基板位置検出方法 |
| WO2014157358A1 (ja) * | 2013-03-28 | 2014-10-02 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及び記録媒体 |
| DE102013111165A1 (de) | 2013-10-09 | 2015-04-09 | Aixtron Se | Vorrichtung und Verfahren zur Bestimmung der Drehlage eines Suszeptors in einer Prozesskammer |
| JP5949741B2 (ja) * | 2013-12-19 | 2016-07-13 | 株式会社安川電機 | ロボットシステム及び検出方法 |
| CN104772754B (zh) * | 2015-03-26 | 2016-05-11 | 北京欣奕华科技有限公司 | 一种机器人示教器及示教方法 |
| US9796086B2 (en) * | 2015-05-01 | 2017-10-24 | Kawasaki Jukogyo Kabushiki Kaisha | Method of teaching robot and robot |
| US9824908B2 (en) * | 2015-05-05 | 2017-11-21 | Kawasaki Jukogyo Kabushiki Kaisha | Conveying system, conveying robot and teaching method of the same |
| WO2017150551A1 (ja) * | 2016-03-04 | 2017-09-08 | 川崎重工業株式会社 | 基板搬送装置及び基板搬送ロボットの教示方法 |
| KR101909181B1 (ko) * | 2016-03-04 | 2018-10-17 | 세메스 주식회사 | 기판 이송 어셈블리, 이를 포함하는 기판 처리 장치 및 위치 보정 방법 |
| JP6533199B2 (ja) * | 2016-09-14 | 2019-06-19 | Dmg森精機株式会社 | ワーク処理システム |
| TWI617995B (zh) * | 2016-11-04 | 2018-03-11 | 廣明光電股份有限公司 | 機器人視覺定位的驗證方法 |
| JP7074494B2 (ja) * | 2018-02-16 | 2022-05-24 | 日本電産サンキョー株式会社 | 産業用ロボットの補正値算出方法 |
| JP6999443B2 (ja) * | 2018-02-16 | 2022-01-18 | 日本電産サンキョー株式会社 | 産業用ロボットの補正値算出方法 |
| KR101971824B1 (ko) * | 2018-03-05 | 2019-04-23 | 캐논 톡키 가부시키가이샤 | 로봇, 로봇 시스템, 디바이스 제조 장치, 디바이스 제조 방법 및 티칭 위치 조정 방법 |
| JP7097722B2 (ja) * | 2018-03-20 | 2022-07-08 | 日本電産サンキョー株式会社 | ロボットの位置情報復元方法 |
| KR102615555B1 (ko) * | 2018-03-29 | 2023-12-19 | 삼성디스플레이 주식회사 | 표시 장치의 제조 장치 및 표시 장치의 제조 방법 |
| JP7165514B2 (ja) * | 2018-06-14 | 2022-11-04 | 日本電産サンキョー株式会社 | 教示データ作成システムおよび教示データ作成方法 |
| CN108908409B (zh) * | 2018-08-27 | 2019-06-04 | 东北大学 | 一种并联机械手重复定位精度可靠性试验装置及方法 |
| CN112894795B (zh) * | 2019-12-04 | 2023-01-10 | 合肥欣奕华智能机器股份有限公司 | 一种搬运机器人及其搬运控制方法、装置、设备及介质 |
| JP7482689B2 (ja) * | 2020-06-03 | 2024-05-14 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| JP7608106B2 (ja) * | 2020-10-05 | 2025-01-06 | キオクシア株式会社 | 半導体製造装置 |
| KR20230103796A (ko) | 2021-12-30 | 2023-07-07 | 세메스 주식회사 | 기판 처리장치 및 처리방법 |
| JP2024078532A (ja) * | 2022-11-30 | 2024-06-11 | 株式会社安川電機 | 基板搬送ロボットシステムおよび基板搬送ロボットの教示方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06326172A (ja) * | 1993-05-10 | 1994-11-25 | Tel Varian Ltd | 移載装置 |
| JPH09252039A (ja) * | 1996-03-14 | 1997-09-22 | Fujitsu Ltd | 搬送装置におけるティーチング位置設定方法及びティーチング位置設定装置 |
| JPH11254359A (ja) * | 1998-03-12 | 1999-09-21 | Toyota Autom Loom Works Ltd | 部材搬送システム |
| JP2001068530A (ja) * | 1999-08-26 | 2001-03-16 | Anelva Corp | 基板処理装置 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5535306A (en) * | 1993-01-28 | 1996-07-09 | Applied Materials Inc. | Self-calibration system for robot mechanisms |
| US5655060A (en) * | 1995-03-31 | 1997-08-05 | Brooks Automation | Time optimal trajectory for cluster tool robots |
| US5783834A (en) * | 1997-02-20 | 1998-07-21 | Modular Process Technology | Method and process for automatic training of precise spatial locations to a robot |
| US6205870B1 (en) * | 1997-10-10 | 2001-03-27 | Applied Komatsu Technology, Inc. | Automated substrate processing systems and methods |
| US6502054B1 (en) * | 1999-11-22 | 2002-12-31 | Lam Research Corporation | Method of and apparatus for dynamic alignment of substrates |
| CN1365519A (zh) * | 2000-03-29 | 2002-08-21 | 大金工业株式会社 | 印刷线路板传送装置 |
| US6633046B1 (en) * | 2000-04-19 | 2003-10-14 | Applied Materials, Inc. | Method and apparatus for detecting that two moveable members are correctly positioned relatively to one another |
| US6856863B1 (en) * | 2000-07-27 | 2005-02-15 | Applied Materials, Inc. | Method and apparatus for automatic calibration of robots |
| US7109483B2 (en) * | 2000-11-17 | 2006-09-19 | Ebara Corporation | Method for inspecting substrate, substrate inspecting system and electron beam apparatus |
| JP3832292B2 (ja) * | 2001-08-31 | 2006-10-11 | 株式会社ダイフク | 荷保管設備 |
| US7289230B2 (en) * | 2002-02-06 | 2007-10-30 | Cyberoptics Semiconductors, Inc. | Wireless substrate-like sensor |
| JP3902027B2 (ja) * | 2002-03-01 | 2007-04-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US7085622B2 (en) * | 2002-04-19 | 2006-08-01 | Applied Material, Inc. | Vision system |
| US7397539B2 (en) * | 2003-03-31 | 2008-07-08 | Asml Netherlands, B.V. | Transfer apparatus for transferring an object, lithographic apparatus employing such a transfer apparatus, and method of use thereof |
| US6934606B1 (en) * | 2003-06-20 | 2005-08-23 | Novellus Systems, Inc. | Automatic calibration of a wafer-handling robot |
| US6952255B2 (en) * | 2003-08-06 | 2005-10-04 | Lam Research Corporation | System and method for integrated multi-use optical alignment |
| US7319920B2 (en) * | 2003-11-10 | 2008-01-15 | Applied Materials, Inc. | Method and apparatus for self-calibration of a substrate handling robot |
| JP4347156B2 (ja) * | 2004-07-28 | 2009-10-21 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US8545165B2 (en) * | 2005-03-30 | 2013-10-01 | Brooks Automation, Inc. | High speed substrate aligner apparatus |
| JP4963469B2 (ja) * | 2005-06-24 | 2012-06-27 | 株式会社アルバック | 位置修正装置、位置修正方法 |
| JP4534886B2 (ja) | 2005-07-15 | 2010-09-01 | 東京エレクトロン株式会社 | 処理システム |
| US7551979B2 (en) * | 2005-11-18 | 2009-06-23 | Strasbaugh | Robot calibration system and method |
| JP4514700B2 (ja) * | 2005-12-13 | 2010-07-28 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| TWI379748B (en) * | 2007-07-20 | 2012-12-21 | Applied Materials Inc | Dual-mode robot systems,substrate transfer apparatus and methods for electronic device manufacturing, and method of calibrating |
| US8041450B2 (en) * | 2007-10-04 | 2011-10-18 | Asm Japan K.K. | Position sensor system for substrate transfer robot |
-
2009
- 2009-07-29 US US13/054,824 patent/US8688276B2/en active Active
- 2009-07-29 KR KR1020117004863A patent/KR101621814B1/ko active Active
- 2009-07-29 JP JP2010522732A patent/JP5597536B2/ja active Active
- 2009-07-29 CN CN200980130641.6A patent/CN102112274B/zh active Active
- 2009-07-29 WO PCT/JP2009/063468 patent/WO2010013732A1/ja not_active Ceased
- 2009-07-29 DE DE112009001863T patent/DE112009001863A5/de not_active Ceased
- 2009-07-31 TW TW098125901A patent/TWI488723B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06326172A (ja) * | 1993-05-10 | 1994-11-25 | Tel Varian Ltd | 移載装置 |
| JPH09252039A (ja) * | 1996-03-14 | 1997-09-22 | Fujitsu Ltd | 搬送装置におけるティーチング位置設定方法及びティーチング位置設定装置 |
| JPH11254359A (ja) * | 1998-03-12 | 1999-09-21 | Toyota Autom Loom Works Ltd | 部材搬送システム |
| JP2001068530A (ja) * | 1999-08-26 | 2001-03-16 | Anelva Corp | 基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101621814B1 (ko) | 2016-05-17 |
| US8688276B2 (en) | 2014-04-01 |
| TW201012608A (en) | 2010-04-01 |
| JPWO2010013732A1 (ja) | 2012-01-12 |
| DE112009001863T5 (de) | 2012-01-26 |
| CN102112274B (zh) | 2014-11-19 |
| WO2010013732A1 (ja) | 2010-02-04 |
| TWI488723B (zh) | 2015-06-21 |
| KR20110052675A (ko) | 2011-05-18 |
| DE112009001863A5 (de) | 2011-11-24 |
| US20110125325A1 (en) | 2011-05-26 |
| CN102112274A (zh) | 2011-06-29 |
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|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |