JP5874935B2 - 平板型冷却装置及びその使用方法 - Google Patents

平板型冷却装置及びその使用方法 Download PDF

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Publication number
JP5874935B2
JP5874935B2 JP2013516292A JP2013516292A JP5874935B2 JP 5874935 B2 JP5874935 B2 JP 5874935B2 JP 2013516292 A JP2013516292 A JP 2013516292A JP 2013516292 A JP2013516292 A JP 2013516292A JP 5874935 B2 JP5874935 B2 JP 5874935B2
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JP
Japan
Prior art keywords
heat
flat plate
heat receiving
cooling device
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013516292A
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English (en)
Japanese (ja)
Other versions
JPWO2012161002A1 (ja
Inventor
実 吉川
実 吉川
仁 坂本
仁 坂本
正樹 千葉
正樹 千葉
賢一 稲葉
賢一 稲葉
有仁 松永
有仁 松永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2013516292A priority Critical patent/JP5874935B2/ja
Publication of JPWO2012161002A1 publication Critical patent/JPWO2012161002A1/ja
Application granted granted Critical
Publication of JP5874935B2 publication Critical patent/JP5874935B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2013516292A 2011-05-20 2012-05-07 平板型冷却装置及びその使用方法 Expired - Fee Related JP5874935B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013516292A JP5874935B2 (ja) 2011-05-20 2012-05-07 平板型冷却装置及びその使用方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011113684 2011-05-20
JP2011113684 2011-05-20
JP2013516292A JP5874935B2 (ja) 2011-05-20 2012-05-07 平板型冷却装置及びその使用方法
PCT/JP2012/062241 WO2012161002A1 (fr) 2011-05-20 2012-05-07 Dispositif de refroidissement à plaques plates et son procédé d'utilisation

Publications (2)

Publication Number Publication Date
JPWO2012161002A1 JPWO2012161002A1 (ja) 2014-07-31
JP5874935B2 true JP5874935B2 (ja) 2016-03-02

Family

ID=47217082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013516292A Expired - Fee Related JP5874935B2 (ja) 2011-05-20 2012-05-07 平板型冷却装置及びその使用方法

Country Status (2)

Country Link
JP (1) JP5874935B2 (fr)
WO (1) WO2012161002A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6024665B2 (ja) * 2011-10-04 2016-11-16 日本電気株式会社 平板型冷却装置及びその使用方法
US10746474B2 (en) 2016-04-11 2020-08-18 Qualcomm Incorporated Multi-phase heat dissipating device comprising piezo structures
US10353445B2 (en) * 2016-04-11 2019-07-16 Qualcomm Incorporated Multi-phase heat dissipating device for an electronic device
US9999157B2 (en) 2016-08-12 2018-06-12 Qualcomm Incorporated Multi-phase heat dissipating device embedded in an electronic device
US11181323B2 (en) 2019-02-21 2021-11-23 Qualcomm Incorporated Heat-dissipating device with interfacial enhancements
WO2020223017A1 (fr) * 2019-04-29 2020-11-05 Qualcomm Incorporated Dispositif de dissipation de chaleur multiphase comprenant des structures piézoélectriques

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0442931Y2 (fr) * 1986-08-02 1992-10-12
JP3210261B2 (ja) * 1996-12-06 2001-09-17 株式会社東芝 沸騰冷却装置及びその製造方法
JP3900702B2 (ja) * 1998-08-31 2007-04-04 株式会社デンソー 沸騰冷却装置
JP5092931B2 (ja) * 2008-06-24 2012-12-05 株式会社豊田自動織機 沸騰冷却装置
JP2010010204A (ja) * 2008-06-24 2010-01-14 Toyota Industries Corp 沸騰冷却装置

Also Published As

Publication number Publication date
WO2012161002A1 (fr) 2012-11-29
JPWO2012161002A1 (ja) 2014-07-31

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