JP5969988B2 - 平板状の銀微粒子とその製造方法およびそれを用いたペーストとペーストを用いた印刷回路の製造方法 - Google Patents

平板状の銀微粒子とその製造方法およびそれを用いたペーストとペーストを用いた印刷回路の製造方法 Download PDF

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JP5969988B2
JP5969988B2 JP2013512485A JP2013512485A JP5969988B2 JP 5969988 B2 JP5969988 B2 JP 5969988B2 JP 2013512485 A JP2013512485 A JP 2013512485A JP 2013512485 A JP2013512485 A JP 2013512485A JP 5969988 B2 JP5969988 B2 JP 5969988B2
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sem
silver
fine particles
silver fine
paste
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JPWO2012147945A1 (ja
Inventor
太郎 中野谷
太郎 中野谷
崇 樋之津
崇 樋之津
宏敏 齋藤
宏敏 齋藤
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Dowa Electronics Materials Co Ltd
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Dowa Electronics Materials Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0551—Flake form nanoparticles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
JP2013512485A 2011-04-28 2012-04-27 平板状の銀微粒子とその製造方法およびそれを用いたペーストとペーストを用いた印刷回路の製造方法 Expired - Fee Related JP5969988B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011100657 2011-04-28
JP2011100657 2011-04-28
PCT/JP2012/061448 WO2012147945A1 (fr) 2011-04-28 2012-04-27 Particule d'argent tabulaire, procédé de fabrication associé, colle utilisant celle-ci et circuit imprimé utilisant la colle

Publications (2)

Publication Number Publication Date
JPWO2012147945A1 JPWO2012147945A1 (ja) 2014-07-28
JP5969988B2 true JP5969988B2 (ja) 2016-08-17

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JP2013512485A Expired - Fee Related JP5969988B2 (ja) 2011-04-28 2012-04-27 平板状の銀微粒子とその製造方法およびそれを用いたペーストとペーストを用いた印刷回路の製造方法

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Country Link
JP (1) JP5969988B2 (fr)
TW (2) TWI530963B (fr)
WO (1) WO2012147945A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014084026A1 (fr) 2012-11-29 2014-06-05 国立大学法人九州大学 Structure contenant des microparticules métalliques
JP6168837B2 (ja) * 2013-05-13 2017-07-26 国立大学法人東北大学 銅微粒子およびその製造方法
JP5763869B2 (ja) * 2013-06-25 2015-08-12 化研テック株式会社 薄片状銀粉、導電性ペースト、および薄片状銀粉の製造方法
JP2015050120A (ja) * 2013-09-03 2015-03-16 株式会社小森コーポレーション 機能性膜のパターニング方法、電子デバイスの製造方法、透明導電性フィルム
US10214656B2 (en) 2014-02-27 2019-02-26 A School Corporation Kansai University Copper nanoparticles and production method for same, copper nanoparticle fluid dispersion, copper nanoink, copper nanoparticle preservation method, and copper nanoparticle sintering method
JP6325878B2 (ja) * 2014-04-22 2018-05-16 株式会社ノリタケカンパニーリミテド 平板状銀ナノ粒子の製造方法および平板状銀ナノ粒子含有組成物
JP6628351B2 (ja) 2015-07-24 2020-01-08 国立大学法人大阪大学 銀粒子製造方法
JP6920029B2 (ja) 2016-04-04 2021-08-18 日亜化学工業株式会社 金属粉焼結ペースト及びその製造方法、導電性材料の製造方法
JP6762848B2 (ja) * 2016-11-02 2020-09-30 東洋アルミニウム株式会社 ペースト組成物
JP6859799B2 (ja) * 2017-03-29 2021-04-14 三菱マテリアル株式会社 ペースト状銀粉組成物、接合体の製造方法および銀膜の製造方法
KR102509366B1 (ko) * 2018-01-26 2023-03-10 닛신 엔지니어링 가부시키가이샤 은 미립자의 제조 방법
TW202430293A (zh) * 2022-09-27 2024-08-01 日商納美仕有限公司 導電性組成物、導電性組成物的燒結體、積層構造體、電子零件及半導體裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4759271B2 (ja) * 2005-01-12 2011-08-31 バンドー化学株式会社 複合粒子分散体および複合粒子分散体の製造方法
JP4848674B2 (ja) * 2005-06-03 2011-12-28 日本電気株式会社 樹脂金属複合導電材料およびその製造方法
WO2007037440A1 (fr) * 2005-09-29 2007-04-05 Alpha Scientific, Corporation Poudre conductrice et procédé servant à produire celle-ci, pâte de poudre conductrice et procédé servant à produire la pâte de poudre conductrice
JP5065607B2 (ja) * 2006-03-10 2012-11-07 三井金属鉱業株式会社 微粒銀粒子製造方法及びその製造方法で得られた微粒銀粒子
JP5074837B2 (ja) * 2007-07-02 2012-11-14 三井金属鉱業株式会社 扁平銀粉の製造方法、扁平銀粉、及び導電性ペースト
JP2009179879A (ja) * 2008-01-06 2009-08-13 Dowa Electronics Materials Co Ltd 極性媒体との親和性に優れた銀微粉および銀インク
JP5139848B2 (ja) * 2008-03-14 2013-02-06 Ｄｏｗａエレクトロニクス株式会社 没食子酸の誘導体に被覆された銀ナノ粒子
JP5824201B2 (ja) * 2009-09-11 2015-11-25 Ｄｏｗａエレクトロニクス株式会社 接合材およびそれを用いた接合方法

Also Published As

Publication number Publication date
TW201603049A (zh) 2016-01-16
JPWO2012147945A1 (ja) 2014-07-28
WO2012147945A1 (fr) 2012-11-01
TWI530963B (zh) 2016-04-21
TW201306049A (zh) 2013-02-01
TWI530964B (zh) 2016-04-21

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