TWI530963B - Sheet-like silver microparticles and methods for producing the same, and a paste using the same and a paste - Google Patents

Sheet-like silver microparticles and methods for producing the same, and a paste using the same and a paste Download PDF

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Publication number
TWI530963B
TWI530963B TW101115136A TW101115136A TWI530963B TW I530963 B TWI530963 B TW I530963B TW 101115136 A TW101115136 A TW 101115136A TW 101115136 A TW101115136 A TW 101115136A TW I530963 B TWI530963 B TW I530963B
Authority
TW
Taiwan
Prior art keywords
silver
sem
particles
paste
flat
Prior art date
Application number
TW101115136A
Other languages
English (en)
Chinese (zh)
Other versions
TW201306049A (zh
Inventor
中野谷太郎
樋之津崇
齋藤宏敏
Original Assignee
同和電子科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 同和電子科技股份有限公司 filed Critical 同和電子科技股份有限公司
Publication of TW201306049A publication Critical patent/TW201306049A/zh
Application granted granted Critical
Publication of TWI530963B publication Critical patent/TWI530963B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0551—Flake form nanoparticles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
TW101115136A 2011-04-28 2012-04-27 Sheet-like silver microparticles and methods for producing the same, and a paste using the same and a paste TWI530963B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011100657 2011-04-28
PCT/JP2012/061448 WO2012147945A1 (fr) 2011-04-28 2012-04-27 Particule d'argent tabulaire, procédé de fabrication associé, colle utilisant celle-ci et circuit imprimé utilisant la colle

Publications (2)

Publication Number Publication Date
TW201306049A TW201306049A (zh) 2013-02-01
TWI530963B true TWI530963B (zh) 2016-04-21

Family

ID=47072456

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101115136A TWI530963B (zh) 2011-04-28 2012-04-27 Sheet-like silver microparticles and methods for producing the same, and a paste using the same and a paste
TW104133555A TWI530964B (zh) 2011-04-28 2012-04-27 Sheet-like silver microparticles and methods for producing the same, and a paste using the same and a paste

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104133555A TWI530964B (zh) 2011-04-28 2012-04-27 Sheet-like silver microparticles and methods for producing the same, and a paste using the same and a paste

Country Status (3)

Country Link
JP (1) JP5969988B2 (fr)
TW (2) TWI530963B (fr)
WO (1) WO2012147945A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014084026A1 (fr) 2012-11-29 2014-06-05 国立大学法人九州大学 Structure contenant des microparticules métalliques
JP6168837B2 (ja) * 2013-05-13 2017-07-26 国立大学法人東北大学 銅微粒子およびその製造方法
JP5763869B2 (ja) * 2013-06-25 2015-08-12 化研テック株式会社 薄片状銀粉、導電性ペースト、および薄片状銀粉の製造方法
JP2015050120A (ja) * 2013-09-03 2015-03-16 株式会社小森コーポレーション 機能性膜のパターニング方法、電子デバイスの製造方法、透明導電性フィルム
US10214656B2 (en) 2014-02-27 2019-02-26 A School Corporation Kansai University Copper nanoparticles and production method for same, copper nanoparticle fluid dispersion, copper nanoink, copper nanoparticle preservation method, and copper nanoparticle sintering method
JP6325878B2 (ja) * 2014-04-22 2018-05-16 株式会社ノリタケカンパニーリミテド 平板状銀ナノ粒子の製造方法および平板状銀ナノ粒子含有組成物
JP6628351B2 (ja) 2015-07-24 2020-01-08 国立大学法人大阪大学 銀粒子製造方法
JP6920029B2 (ja) 2016-04-04 2021-08-18 日亜化学工業株式会社 金属粉焼結ペースト及びその製造方法、導電性材料の製造方法
JP6762848B2 (ja) * 2016-11-02 2020-09-30 東洋アルミニウム株式会社 ペースト組成物
JP6859799B2 (ja) * 2017-03-29 2021-04-14 三菱マテリアル株式会社 ペースト状銀粉組成物、接合体の製造方法および銀膜の製造方法
KR102509366B1 (ko) * 2018-01-26 2023-03-10 닛신 엔지니어링 가부시키가이샤 은 미립자의 제조 방법
TW202430293A (zh) * 2022-09-27 2024-08-01 日商納美仕有限公司 導電性組成物、導電性組成物的燒結體、積層構造體、電子零件及半導體裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4759271B2 (ja) * 2005-01-12 2011-08-31 バンドー化学株式会社 複合粒子分散体および複合粒子分散体の製造方法
JP4848674B2 (ja) * 2005-06-03 2011-12-28 日本電気株式会社 樹脂金属複合導電材料およびその製造方法
WO2007037440A1 (fr) * 2005-09-29 2007-04-05 Alpha Scientific, Corporation Poudre conductrice et procédé servant à produire celle-ci, pâte de poudre conductrice et procédé servant à produire la pâte de poudre conductrice
JP5065607B2 (ja) * 2006-03-10 2012-11-07 三井金属鉱業株式会社 微粒銀粒子製造方法及びその製造方法で得られた微粒銀粒子
JP5074837B2 (ja) * 2007-07-02 2012-11-14 三井金属鉱業株式会社 扁平銀粉の製造方法、扁平銀粉、及び導電性ペースト
JP2009179879A (ja) * 2008-01-06 2009-08-13 Dowa Electronics Materials Co Ltd 極性媒体との親和性に優れた銀微粉および銀インク
JP5139848B2 (ja) * 2008-03-14 2013-02-06 Ｄｏｗａエレクトロニクス株式会社 没食子酸の誘導体に被覆された銀ナノ粒子
JP5824201B2 (ja) * 2009-09-11 2015-11-25 Ｄｏｗａエレクトロニクス株式会社 接合材およびそれを用いた接合方法

Also Published As

Publication number Publication date
TW201603049A (zh) 2016-01-16
JPWO2012147945A1 (ja) 2014-07-28
WO2012147945A1 (fr) 2012-11-01
JP5969988B2 (ja) 2016-08-17
TW201306049A (zh) 2013-02-01
TWI530964B (zh) 2016-04-21

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