JP6066559B2 - インクジェット用硬化性組成物及び電子部品の製造方法 - Google Patents

インクジェット用硬化性組成物及び電子部品の製造方法 Download PDF

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Publication number
JP6066559B2
JP6066559B2 JP2011541005A JP2011541005A JP6066559B2 JP 6066559 B2 JP6066559 B2 JP 6066559B2 JP 2011541005 A JP2011541005 A JP 2011541005A JP 2011541005 A JP2011541005 A JP 2011541005A JP 6066559 B2 JP6066559 B2 JP 6066559B2
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JP
Japan
Prior art keywords
curable composition
inkjet
compound
meth
containing compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011541005A
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English (en)
Japanese (ja)
Other versions
JPWO2012043473A1 (ja
Inventor
倫久 上田
倫久 上田
貴志 渡邉
貴志 渡邉
秀 中村
秀 中村
崇至 鹿毛
崇至 鹿毛
駿夫 ▲高▼橋
駿夫 ▲高▼橋
孝徳 井上
孝徳 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JPWO2012043473A1 publication Critical patent/JPWO2012043473A1/ja
Application granted granted Critical
Publication of JP6066559B2 publication Critical patent/JP6066559B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/0045—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using protective coatings or film forming compositions cured by mechanical wave energy, e.g. ultrasonics, cured by electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams, or cured by magnetic or electric fields, e.g. electric discharge, plasma
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
JP2011541005A 2010-09-28 2011-09-26 インクジェット用硬化性組成物及び電子部品の製造方法 Active JP6066559B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010217748 2010-09-28
JP2010217748 2010-09-28
PCT/JP2011/071883 WO2012043473A1 (fr) 2010-09-28 2011-09-26 Composition durcissable pour des applications d'impression à jet d'encre et procédé de fabrication d'un composant électronique

Publications (2)

Publication Number Publication Date
JPWO2012043473A1 JPWO2012043473A1 (ja) 2014-02-06
JP6066559B2 true JP6066559B2 (ja) 2017-01-25

Family

ID=45892917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011541005A Active JP6066559B2 (ja) 2010-09-28 2011-09-26 インクジェット用硬化性組成物及び電子部品の製造方法

Country Status (3)

Country Link
JP (1) JP6066559B2 (fr)
TW (1) TWI610990B (fr)
WO (1) WO2012043473A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5880228B2 (ja) * 2012-04-05 2016-03-08 コニカミノルタ株式会社 活性光線硬化型インクジェットインク、及びこれを用いた画像形成方法
JP2019104811A (ja) * 2017-12-12 2019-06-27 株式会社Ｔ＆Ｋ Ｔｏｋａ 潜在性硬化剤組成物及びそれを含む一液性硬化性エポキシド組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59126428A (ja) * 1983-01-06 1984-07-21 Dai Ichi Kogyo Seiyaku Co Ltd エポキシ樹脂用硬化剤
JPH0655806B2 (ja) * 1987-02-23 1994-07-27 株式会社日立製作所 エポキシ樹脂用硬化剤
JPH02283718A (ja) * 1989-04-25 1990-11-21 Dainippon Ink & Chem Inc エポキシ樹脂組成物、プリプレグ及び積層板
JPH0578454A (ja) * 1991-09-25 1993-03-30 Hitachi Ltd エポキシ樹脂用硬化剤
JP2000239418A (ja) * 1999-02-19 2000-09-05 Hitachi Chem Co Ltd 印刷配線板用プリプレグ及びそれを用いた積層体
JP3893833B2 (ja) * 2000-02-09 2007-03-14 ブラザー工業株式会社 インクジェット記録方式用エネルギー線硬化型組成物
JP4290510B2 (ja) * 2003-08-22 2009-07-08 太陽インキ製造株式会社 インクジェット用光硬化性・熱硬化性組成物とそれを用いたプリント配線板
US20090163615A1 (en) * 2005-08-31 2009-06-25 Izhar Halahmi Uv curable hybridcuring ink jet ink composition and solder mask using the same
JP2010059299A (ja) * 2008-09-03 2010-03-18 Chisso Corp インクジェット用インク及びこれから得られた硬化膜
JP5315932B2 (ja) * 2008-11-04 2013-10-16 Ｊｎｃ株式会社 インクジェット用インク
JP2010143982A (ja) * 2008-12-17 2010-07-01 Chisso Corp 光硬化性インクジェット用インク
JP2011021079A (ja) * 2009-07-14 2011-02-03 Chisso Corp インクジェット用インク
JP5617201B2 (ja) * 2009-07-23 2014-11-05 Jnc株式会社 光硬化性インクジェット用インク

Also Published As

Publication number Publication date
WO2012043473A1 (fr) 2012-04-05
TW201224080A (en) 2012-06-16
TWI610990B (zh) 2018-01-11
JPWO2012043473A1 (ja) 2014-02-06

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