JP6187728B1 - 無線通信デバイス、及びその製造方法 - Google Patents

無線通信デバイス、及びその製造方法 Download PDF

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Publication number
JP6187728B1
JP6187728B1 JP2017526613A JP2017526613A JP6187728B1 JP 6187728 B1 JP6187728 B1 JP 6187728B1 JP 2017526613 A JP2017526613 A JP 2017526613A JP 2017526613 A JP2017526613 A JP 2017526613A JP 6187728 B1 JP6187728 B1 JP 6187728B1
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JP
Japan
Prior art keywords
wireless communication
communication device
circuit board
element block
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017526613A
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English (en)
Japanese (ja)
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JPWO2017141663A1 (ja
Inventor
加藤　登
登 加藤
真大 小澤
真大 小澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of JP6187728B1 publication Critical patent/JP6187728B1/ja
Publication of JPWO2017141663A1 publication Critical patent/JPWO2017141663A1/ja
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Details Of Aerials (AREA)
JP2017526613A 2016-02-17 2017-01-27 無線通信デバイス、及びその製造方法 Active JP6187728B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016028171 2016-02-17
JP2016028171 2016-02-17
PCT/JP2017/002888 WO2017141663A1 (fr) 2016-02-17 2017-01-27 Dispositif de communication sans fil et son procédé de fabrication

Publications (2)

Publication Number Publication Date
JP6187728B1 true JP6187728B1 (ja) 2017-08-30
JPWO2017141663A1 JPWO2017141663A1 (ja) 2018-02-22

Family

ID=59625028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017526613A Active JP6187728B1 (ja) 2016-02-17 2017-01-27 無線通信デバイス、及びその製造方法

Country Status (2)

Country Link
JP (1) JP6187728B1 (fr)
WO (1) WO2017141663A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11101540B2 (en) * 2019-10-02 2021-08-24 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and methods of manufacturing semiconductor devices
JP7596070B2 (ja) * 2020-01-22 2024-12-09 株式会社東芝 チップパッケージ
JP7562989B2 (ja) * 2020-03-12 2024-10-08 住友ベークライト株式会社 電子装置
JP7747648B2 (ja) * 2020-10-05 2025-10-01 ローム株式会社 回路部品および半導体装置
WO2024106370A1 (fr) * 2022-11-14 2024-05-23 株式会社村田製作所 Module rfid

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006333403A (ja) * 2005-05-30 2006-12-07 Hitachi Ltd 無線ｉｃタグ、及び無線ｉｃタグの製造方法
JP2007280343A (ja) * 2006-02-10 2007-10-25 Fujitsu Ltd Ｒｆｉｄタグの製造方法およびｒｆｉｄタグ
JP2011211748A (ja) * 2008-02-27 2011-10-20 Mitsubishi Electric Corp Ｒｆｉｄタグ
JP5477459B2 (ja) * 2010-03-12 2014-04-23 株式会社村田製作所 無線通信デバイス及び金属製物品
JP2014147097A (ja) * 2009-04-14 2014-08-14 Murata Mfg Co Ltd 無線ｉｃデバイス

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006333403A (ja) * 2005-05-30 2006-12-07 Hitachi Ltd 無線ｉｃタグ、及び無線ｉｃタグの製造方法
JP2007280343A (ja) * 2006-02-10 2007-10-25 Fujitsu Ltd Ｒｆｉｄタグの製造方法およびｒｆｉｄタグ
JP2011211748A (ja) * 2008-02-27 2011-10-20 Mitsubishi Electric Corp Ｒｆｉｄタグ
JP2014147097A (ja) * 2009-04-14 2014-08-14 Murata Mfg Co Ltd 無線ｉｃデバイス
JP5477459B2 (ja) * 2010-03-12 2014-04-23 株式会社村田製作所 無線通信デバイス及び金属製物品

Also Published As

Publication number Publication date
WO2017141663A1 (fr) 2017-08-24
JPWO2017141663A1 (ja) 2018-02-22

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