JP7073104B2 - 塩素発生用電極およびその製造方法 - Google Patents
塩素発生用電極およびその製造方法 Download PDFInfo
- Publication number
- JP7073104B2 JP7073104B2 JP2017543417A JP2017543417A JP7073104B2 JP 7073104 B2 JP7073104 B2 JP 7073104B2 JP 2017543417 A JP2017543417 A JP 2017543417A JP 2017543417 A JP2017543417 A JP 2017543417A JP 7073104 B2 JP7073104 B2 JP 7073104B2
- Authority
- JP
- Japan
- Prior art keywords
- catalyst layer
- palladium
- conductive substrate
- chlorine
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/04—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1225—Deposition of multilayers of inorganic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1262—Process of deposition of the inorganic material involving particles, e.g. carbon nanotubes [CNT], flakes
- C23C18/1266—Particles formed in situ
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B1/00—Electrolytic production of inorganic compounds or non-metals
- C25B1/01—Products
- C25B1/24—Halogens or compounds thereof
- C25B1/26—Chlorine; Compounds thereof
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/052—Electrodes comprising one or more electrocatalytic coatings on a substrate
- C25B11/053—Electrodes comprising one or more electrocatalytic coatings on a substrate characterised by multilayer electrocatalytic coatings
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/091—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
- C25B11/093—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds at least one noble metal or noble metal oxide and at least one non-noble metal oxide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Nanotechnology (AREA)
- Ceramic Engineering (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Catalysts (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015190314 | 2015-09-28 | ||
| JP2015190314 | 2015-09-28 | ||
| PCT/JP2016/078404 WO2017057337A1 (ja) | 2015-09-28 | 2016-09-27 | 塩素発生用電極およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2017057337A1 JPWO2017057337A1 (ja) | 2018-07-19 |
| JP7073104B2 true JP7073104B2 (ja) | 2022-05-23 |
Family
ID=58423826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017543417A Expired - Fee Related JP7073104B2 (ja) | 2015-09-28 | 2016-09-27 | 塩素発生用電極およびその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP3358043A4 (de) |
| JP (1) | JP7073104B2 (de) |
| KR (1) | KR20180058702A (de) |
| CN (1) | CN107949663A (de) |
| WO (1) | WO2017057337A1 (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190022333A (ko) * | 2017-08-23 | 2019-03-06 | 주식회사 엘지화학 | 전기분해용 양극 및 이의 제조방법 |
| KR102355824B1 (ko) * | 2018-12-27 | 2022-01-26 | 코웨이 주식회사 | 팔라듐, 이리듐 및 탄탈럼으로 구성된 전극용 촉매층 및 상기 전극용 촉매가 코팅된 살균수 생성 모듈 |
| KR102214152B1 (ko) * | 2019-04-29 | 2021-02-09 | 포항공과대학교 산학협력단 | 선박평형수 처리시설의 부식방지를 위한 고선택성 M/Ru 염소 발생반응 촉매 |
| JP7706693B2 (ja) * | 2021-08-31 | 2025-07-14 | 株式会社大阪ソーダ | 塩素発生用電極およびその製造方法 |
| KR102648323B1 (ko) * | 2021-12-13 | 2024-03-14 | 경북대학교 산학협력단 | 선박평형수 전기분해용 Pt-Ru-Ti 촉매 전극 |
| JP2023095833A (ja) * | 2021-12-24 | 2023-07-06 | 石福金属興業株式会社 | 塩素発生用電極 |
| JP2024010642A (ja) * | 2022-07-12 | 2024-01-24 | 石福金属興業株式会社 | 塩素発生用電極 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007239040A (ja) | 2006-03-09 | 2007-09-20 | Ishifuku Metal Ind Co Ltd | 電解用電極 |
| JP2009052069A (ja) | 2007-08-24 | 2009-03-12 | Ishifuku Metal Ind Co Ltd | 電解用電極 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5137877A (en) * | 1974-09-27 | 1976-03-30 | Asahi Chemical Ind | Denkaiyodenkyoku oyobi sonoseizoho |
| JPS51116182A (en) * | 1975-04-04 | 1976-10-13 | Tdk Corp | An electrode |
| JPS5518503A (en) * | 1978-07-21 | 1980-02-08 | Japan Carlit Co Ltd:The | Electrode for electrolytic manufacturing hypochlorite |
| JPS5861286A (ja) * | 1981-10-08 | 1983-04-12 | Tdk Corp | 電解用電極およびその製造方法 |
| DE3227718A1 (de) | 1982-07-24 | 1984-01-26 | Erno Raumfahrttechnik Gmbh, 2800 Bremen | Niedertemperaturwaermespeicher, insbesondere fuer gewaechshaeuser |
| JP3319880B2 (ja) * | 1994-07-22 | 2002-09-03 | クロリンエンジニアズ株式会社 | 次亜塩素酸塩製造用の陽極およびその製造方法 |
| JP3319887B2 (ja) * | 1994-10-05 | 2002-09-03 | クロリンエンジニアズ株式会社 | 次亜塩素酸塩の製造方法 |
| US6572758B2 (en) * | 2001-02-06 | 2003-06-03 | United States Filter Corporation | Electrode coating and method of use and preparation thereof |
| AU2005325733B2 (en) | 2005-01-27 | 2010-06-10 | Industrie De Nora S.P.A. | High efficiency hypochlorite anode coating |
-
2016
- 2016-09-27 KR KR1020187002346A patent/KR20180058702A/ko not_active Ceased
- 2016-09-27 JP JP2017543417A patent/JP7073104B2/ja not_active Expired - Fee Related
- 2016-09-27 EP EP16851508.8A patent/EP3358043A4/de not_active Withdrawn
- 2016-09-27 WO PCT/JP2016/078404 patent/WO2017057337A1/ja not_active Ceased
- 2016-09-27 CN CN201680050732.9A patent/CN107949663A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007239040A (ja) | 2006-03-09 | 2007-09-20 | Ishifuku Metal Ind Co Ltd | 電解用電極 |
| JP2009052069A (ja) | 2007-08-24 | 2009-03-12 | Ishifuku Metal Ind Co Ltd | 電解用電極 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180058702A (ko) | 2018-06-01 |
| JPWO2017057337A1 (ja) | 2018-07-19 |
| CN107949663A (zh) | 2018-04-20 |
| WO2017057337A1 (ja) | 2017-04-06 |
| EP3358043A4 (de) | 2019-06-26 |
| EP3358043A1 (de) | 2018-08-08 |
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