JP7181292B2 - 平坦度取得システムおよび実装機 - Google Patents
平坦度取得システムおよび実装機 Download PDFInfo
- Publication number
- JP7181292B2 JP7181292B2 JP2020526757A JP2020526757A JP7181292B2 JP 7181292 B2 JP7181292 B2 JP 7181292B2 JP 2020526757 A JP2020526757 A JP 2020526757A JP 2020526757 A JP2020526757 A JP 2020526757A JP 7181292 B2 JP7181292 B2 JP 7181292B2
- Authority
- JP
- Japan
- Prior art keywords
- imaging device
- relative position
- holder
- unit
- imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2018/024223 WO2020003384A1 (fr) | 2018-06-26 | 2018-06-26 | Système d'acquisition de planéité et machine de montage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2020003384A1 JPWO2020003384A1 (ja) | 2021-07-15 |
| JP7181292B2 true JP7181292B2 (ja) | 2022-11-30 |
Family
ID=68986854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020526757A Active JP7181292B2 (ja) | 2018-06-26 | 2018-06-26 | 平坦度取得システムおよび実装機 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7181292B2 (fr) |
| WO (1) | WO2020003384A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11694916B2 (en) * | 2018-10-15 | 2023-07-04 | Koh Young Technology Inc. | Apparatus, method and recording medium storing command for inspection |
| US11867499B2 (en) * | 2020-02-19 | 2024-01-09 | Faro Technologies, Inc. | System and method for verifying a position of a component on an object |
| WO2024189795A1 (fr) * | 2023-03-14 | 2024-09-19 | 株式会社Fuji | Machine de montage de composant |
| CN119043253B (zh) * | 2024-10-31 | 2025-02-07 | 山东申鑫新材料有限公司 | 一种用于幕墙铝板复合板材的平整度检测装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007121981A (ja) | 2005-09-30 | 2007-05-17 | Matsushita Electric Ind Co Ltd | 基板検査方法 |
| US20090180679A1 (en) | 1998-07-08 | 2009-07-16 | Charles A. Lemaire | Method and apparatus for parts manipulation, inspection, and replacement |
| JP2013115383A (ja) | 2011-11-30 | 2013-06-10 | Fuji Mach Mfg Co Ltd | 電子部品実装装置 |
| JP2017142188A (ja) | 2016-02-12 | 2017-08-17 | Ckd株式会社 | 三次元計測装置 |
-
2018
- 2018-06-26 WO PCT/JP2018/024223 patent/WO2020003384A1/fr not_active Ceased
- 2018-06-26 JP JP2020526757A patent/JP7181292B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090180679A1 (en) | 1998-07-08 | 2009-07-16 | Charles A. Lemaire | Method and apparatus for parts manipulation, inspection, and replacement |
| JP2007121981A (ja) | 2005-09-30 | 2007-05-17 | Matsushita Electric Ind Co Ltd | 基板検査方法 |
| JP2013115383A (ja) | 2011-11-30 | 2013-06-10 | Fuji Mach Mfg Co Ltd | 電子部品実装装置 |
| JP2017142188A (ja) | 2016-02-12 | 2017-08-17 | Ckd株式会社 | 三次元計測装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2020003384A1 (ja) | 2021-07-15 |
| WO2020003384A1 (fr) | 2020-01-02 |
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