JPH01100456U - - Google Patents
Info
- Publication number
- JPH01100456U JPH01100456U JP19548387U JP19548387U JPH01100456U JP H01100456 U JPH01100456 U JP H01100456U JP 19548387 U JP19548387 U JP 19548387U JP 19548387 U JP19548387 U JP 19548387U JP H01100456 U JPH01100456 U JP H01100456U
- Authority
- JP
- Japan
- Prior art keywords
- view
- lead frame
- lead
- semiconductor device
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案のリードフレームを示す正面
図、第１図ｂは第１図ａのＡ部拡大図、第１図ｃ
は第１図ｂのＹ―Ｙ′線断面図、第２図ａ，ｂは
従来のリードフレームにおける折曲げ部に相当す
る位置での断面図、第３図は外部リードを成形し
た表面実装用半導体装置を示す正面図、第４図は
同平面図、第５図ａは第４図のＢ部拡大図、第５
図ｂは同斜視図である。
１……外部リード、１ａ，１ｂ……折曲げ部、
１ｃ……リードフラツト部、２……リードフレー
ム。
Figure 1a is a front view showing the lead frame of the present invention, Figure 1b is an enlarged view of section A in Figure 1a, Figure 1c
is a sectional view taken along the Y-Y' line in Fig. 1b, Fig. 2a and b are sectional views at positions corresponding to the bending parts in a conventional lead frame, and Fig. 3 is a surface mount type with external leads molded. A front view showing the semiconductor device, FIG. 4 is a plan view of the same, FIG. 5 a is an enlarged view of part B in FIG.
Figure b is a perspective view of the same. 1... External lead, 1a, 1b... Bent part,
1c...lead flat part, 2...lead frame.
Claims (1)
ムにおいて、曲げ部分に相当する個所の外部リー
ドの断面を台形としたことを特徴とするリードフ
レーム。 A lead frame for use in a surface mount semiconductor device, characterized in that the cross section of the external lead at a portion corresponding to a bent portion is trapezoidal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19548387U JPH01100456U (en) | 1987-12-23 | 1987-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19548387U JPH01100456U (en) | 1987-12-23 | 1987-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100456U true JPH01100456U (en) | 1989-07-05 |
Family
ID=31486161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19548387U Pending JPH01100456U (en) | 1987-12-23 | 1987-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01100456U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113764287A (en) * | 2020-06-02 | 2021-12-07 | 三菱电机株式会社 | Method for manufacturing semiconductor device and semiconductor device |
-
1987
- 1987-12-23 JP JP19548387U patent/JPH01100456U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113764287A (en) * | 2020-06-02 | 2021-12-07 | 三菱电机株式会社 | Method for manufacturing semiconductor device and semiconductor device |
| JP2021190607A (en) * | 2020-06-02 | 2021-12-13 | 三菱電機株式会社 | Method of manufacturing semiconductor device, and semiconductor device |
| US11894291B2 (en) | 2020-06-02 | 2024-02-06 | Mitsubishi Electric Corporation | Manufacturing method of semiconductor device and semiconductor device |
| CN113764287B (en) * | 2020-06-02 | 2025-09-09 | 三菱电机株式会社 | Method for manufacturing semiconductor device and semiconductor device |