JPH0328744U - - Google Patents

Info

Publication number
JPH0328744U
JPH0328744U JP8972089U JP8972089U JPH0328744U JP H0328744 U JPH0328744 U JP H0328744U JP 8972089 U JP8972089 U JP 8972089U JP 8972089 U JP8972089 U JP 8972089U JP H0328744 U JPH0328744 U JP H0328744U
Authority
JP
Japan
Prior art keywords
resin
resin body
semiconductor device
external lead
sealed semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8972089U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8972089U priority Critical patent/JPH0328744U/ja
Publication of JPH0328744U publication Critical patent/JPH0328744U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a,bは本考案の一実施例の平面図及び
一部切欠正面図、第2図は従来の樹脂封止型半導
体装置の斜視図である。 1……樹脂体、2……外部リード、3……樹脂
ブロツク。
1A and 1B are a plan view and a partially cutaway front view of an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional resin-sealed semiconductor device. 1... Resin body, 2... External lead, 3... Resin block.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 樹脂体の側面より導出されて前記樹脂体の側面
より底面へ折り曲げられた外部リードを有する樹
脂封止型半導体装置において、最も外側に設けた
前記外部リードに隣接して前記樹脂体の端部に前
記樹脂体と一体化して設けた樹脂ブロツクを有す
ることを特徴とする樹脂封止型半導体装置。
In a resin-sealed semiconductor device having an external lead led out from a side surface of the resin body and bent from the side surface of the resin body to the bottom surface, an end portion of the resin body adjacent to the outermost external lead is provided. A resin-sealed semiconductor device comprising a resin block integrated with the resin body.
JP8972089U 1989-07-28 1989-07-28 Pending JPH0328744U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8972089U JPH0328744U (en) 1989-07-28 1989-07-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8972089U JPH0328744U (en) 1989-07-28 1989-07-28

Publications (1)

Publication Number Publication Date
JPH0328744U true JPH0328744U (en) 1991-03-22

Family

ID=31639289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8972089U Pending JPH0328744U (en) 1989-07-28 1989-07-28

Country Status (1)

Country Link
JP (1) JPH0328744U (en)

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