JPH01100643A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPH01100643A
JPH01100643A JP25994187A JP25994187A JPH01100643A JP H01100643 A JPH01100643 A JP H01100643A JP 25994187 A JP25994187 A JP 25994187A JP 25994187 A JP25994187 A JP 25994187A JP H01100643 A JPH01100643 A JP H01100643A
Authority
JP
Japan
Prior art keywords
signal
active
signals
integrated circuit
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25994187A
Other languages
Japanese (ja)
Inventor
Ryoji Fukuhama
亮二 福濱
Takayuki Miyamoto
宮元 崇行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP25994187A priority Critical patent/JPH01100643A/en
Publication of JPH01100643A publication Critical patent/JPH01100643A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the competition of and output by a wired OR line by the outputs of plural devices by preventing signals from becoming an active condition simultaneously by a NAND gate. CONSTITUTION:External device active signals 1, 2...4 are high-potential active and device active signals 6, 7...9 are low-potential active. Now, the overlapping of the active time of the signals 1...4 in the conversion from the signals 1...4 into the signals 6...9 is between signals 1-4, 1-2, 2-3 and 3-4. There, for the example of the signal 1-4, when the signal 4 is 'L', the signal 9 becomes 'H' surely. By obtaining the NAND of the signals 9 and 1, the signal 6 becomes 'L' only when the signal 1 is 'H' and the signal 9 is 'H'. Consequently, when the signal 4 is 'H', the signal 6 does not become 'L'. It is the same between the signal 1-2, 2-3, and 3-4 and the signals 6...9 do not become active simultaneously. It is the same when the signal 1...4 are low potential.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体集積回路に関し、特に半導体メモリ
をワイヤードOR出力するシステムにおいて、各半導体
メモリの出力間の競合防止に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to semiconductor integrated circuits, and particularly to prevention of competition between outputs of semiconductor memories in a system that performs wired OR output of semiconductor memories.

〔従来の技術〕[Conventional technology]

第9図は従来の半導体集積回路装置を示すワイヤードO
R回路図、第10図は従来の半導体集積回路装置の動作
を示す信号波形図である。図において、Qo、(ロ)、
a2.(至)は半導体メモリ装置、α→、(ト)。
Figure 9 shows a conventional semiconductor integrated circuit device.
R circuit diagram, FIG. 10 is a signal waveform diagram showing the operation of a conventional semiconductor integrated circuit device. In the figure, Qo, (b),
a2. (to) is a semiconductor memory device, α→, (g).

αQ、α力はそれぞれのデバイスからの出力端子、(財
)はワイヤードOR結線されたデータバスライン、as
 、 m 、 aI)、(イ)は信号の論理を反転した
時の外部からの半導体メモリ装置をアクティブにする信
号端子、(至)はデバイスα0と(2)、(ロ)はデバ
イスa〔と(ロ)、(至)はデバイス(ロ)と(2)、
(至)はデバイス(イ)と(至)の出力が競合している
期間を示す。
αQ and α power are output terminals from each device, and data bus line with wired OR connection, as
, m, aI), (a) is a signal terminal that activates the semiconductor memory device from the outside when the logic of the signal is inverted, (to) is the device α0 and (2), (b) is the device a [and (b) and (to) are devices (b) and (2),
(to) indicates a period during which the outputs of devices (a) and (to) compete.

次に動作について説明する。デバイスからの出力を可能
にするデバイスアクティブ信号は、通常低電位の時、出
力端子に出力が現われる。そこで、期間(1)内は信号
の論理を反転した時の外部からの半導体メモリ装置をア
クティブにする信号端子US。
Next, the operation will be explained. The device active signal that enables output from the device normally appears at the output terminal when it is at a low potential. Therefore, during period (1), the signal terminal US activates the semiconductor memory device from the outside when the logic of the signal is inverted.

(イ)が共に低電位アクティブ状態なのでデバイス(l
a(至)の出力の間で競合が生じる。同様に期間6】)
はデバイス(to 、αDの出力の競合が生じ、期間(
イ)はデバイスQ◇、@の出力の競合が生じ、期間に)
はデバイス(2)、Qalの出力の競合が生じるのであ
る。
Since both (a) are in the low potential active state, the device (l
A conflict occurs between the outputs of a(to). Similarly period 6】)
is the device (to, αD output contention occurs, and the period (
b) There is a conflict between the outputs of devices Q◇ and @, and during the period)
This causes a conflict between the outputs of device (2) and Qal.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来の半導体集積回路装置を示すワイヤードOR回路は
以上のように構成されているので、各信号間の同期ずれ
等、2つ以上の信号がアクティブ状態になるとその期間
、デバイスからの出力の競合を起こすなどの問題点があ
った。
The wired OR circuit of a conventional semiconductor integrated circuit device is configured as described above, so if two or more signals become active due to synchronization difference between each signal, competition of outputs from the device will occur during that period. There were problems such as causing

この発明は上記のような問題点を解消するためになされ
たもので、デバイスをアクティブにする信号が同時に2
つ以上アクティブ状態にならない半導体集積回路を得る
ことを目的とする。
This invention was made to solve the above-mentioned problems, and the signal for activating the device is two at the same time.
An object of the present invention is to obtain a semiconductor integrated circuit that does not become active for more than one time.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係る半導体集積回路はデバイスをアクティブ
状態にする端子の前に設けられるものであfi 、WA
NDゲート回路を用いて、外部からのデバイスアクティ
ブ信号とアクティブ状態が近接した信号の出力のNAN
Dをとったものである。
The semiconductor integrated circuit according to the present invention is provided in front of a terminal that puts the device into an active state.
NAN output of a signal whose active state is close to that of an external device active signal using an ND gate circuit
I got a D.

〔作用〕[Effect]

この発明における半導体集積回路はNANDゲートによ
シ、同時に信号がアクティブ状態にならないようにする
ことによシ、複数のデバイスの出力をワイヤードOR結
線による出力の競合を防止する0 〔発明の実施例〕 以下、この発明の一実施例を図について説明する。第1
図はこの発明の一実施例による半導体集積回路を示すワ
イヤードOR回路図である。第1図において、(1) 
、 (21、(3) 、 (/f)は外部からのデバイ
スをアクティブにする信号端子、(5)は(1)から(
4)までの信号波形をととのえる信号変換回路。(6)
 、 (7)。
The semiconductor integrated circuit according to the present invention uses a NAND gate and prevents signals from becoming active at the same time, thereby preventing output competition due to wired OR connection of the outputs of a plurality of devices. ] Hereinafter, one embodiment of the present invention will be described with reference to the drawings. 1st
The figure is a wired OR circuit diagram showing a semiconductor integrated circuit according to an embodiment of the present invention. In Figure 1, (1)
, (21, (3), (/f) is the signal terminal that activates the device from the outside, (5) is the signal terminal from (1) to (
4) A signal conversion circuit that adjusts the signal waveforms up to 4). (6)
, (7).

(81、(9)は半導体メモリ装置fIo) 、(9)
、(2)、(6)をアクティブにする信号端子である。
(81, (9) is the semiconductor memory device fIo), (9)
, (2), and (6) are activated.

次に動作について説明する。第1図に示したようなワイ
ヤードOR回路図における信号変換回路(5)の詳細を
第2図に示す。また、各信号の電圧波形を第3図に示す
Next, the operation will be explained. FIG. 2 shows details of the signal conversion circuit (5) in the wired OR circuit diagram as shown in FIG. Further, the voltage waveforms of each signal are shown in FIG.

外部デバイスアクティブ信号(1) 、 (2) 、 
(31、(4)は高電位時アクティブであるとし、デバ
イスアクティブ信号(6) 、 (7) 、 (8) 
、 (9)は低電位時アクティブであるとすれば、ここ
で、信号(11、(21、(31、(41から信号(6
)、 (7) 、 (8) 、 (93への変換は、以
下のようになる。信号(1) 、 (2) 、 (3)
 、 (4)のアクティブ時がかさなってい石のは信号
(1) −(4) 、 +1) −+2) 、 +2)
 −+3) 、 (3) −(4)の間である。そこで
、信号(1) −(4)を例にとって 考えふと、信号
(4)が“L〃の時(ノンアクティブ)、信号(9)は
かならず1H“(ノンアクティブ)となる。
External device active signal (1), (2),
(31, (4) are assumed to be active at high potential, and device active signals (6), (7), (8)
, (9) are active at low potential, here, the signal (11, (21, (31, (41) to signal (6
), (7), (8), (93 conversion is as follows. Signals (1), (2), (3)
, (4) is activated and the stone signal is (1) -(4) , +1) -+2) , +2)
-+3), (3) -(4). Therefore, taking the signals (1) to (4) as an example, when the signal (4) is "L" (non-active), the signal (9) is always 1H" (non-active).

信号(9)と(1)のNANDをとることにょ夛、信号
(6)は信号(1)が“H#(アクティブ)で信号(9
)が’H” (ノンアクティブ)の時のみ1L“(アク
ティブ)となる。したがって、信号(4)がvIH# 
(アクティブ時)には信号(6)が1L#(アクティブ
)とはならないL信号(1)−(21、+2) −(3
) 、 (3) −(4)間についても同様に考えると
信号(6) 、 (7) 、 (8) 、 (9)が同
時にアクティブになることはなく、(至)のデータバス
上にデータの共合する期間はなくなる。
By NANDing the signals (9) and (1), the signal (6) is determined when the signal (1) is "H# (active)" and the signal (9) is "H# (active)".
) becomes 1L" (active) only when it is 'H' (non-active). Therefore, signal (4) is vIH#
(when active), signal (6) does not become 1L# (active) L signal (1) - (21, +2) - (3
), (3) and (4) in the same way, signals (6), (7), (8), and (9) will not be active at the same time, and the data will be on the data bus at (to). There will be no longer any period of commonality.

以上の説明はデバイスが4ケの場合について考えたが、
他の個数についても第2図のNANDゲートをふやすこ
とによシ同様の効果を奏する。
The above explanation was based on the case of 4 devices, but
Similar effects can be obtained for other numbers by increasing the number of NAND gates shown in FIG.

また、上記実施例では外部アクティブ信号(1)。Also, in the above embodiment, the external active signal (1).

+21 、 (31、(41が高電位時アクティブの場
合について説明したが、低電位時アクティブの場合につ
いて以下に述べる。低電位時アクティブである外部アク
ティブ信号(II 、 m 、 @ 、 @とする。こ
こで、信号(6) 、 (7) 、 (8) 、 (9
)への変換は第4図に示すように信号(至)、(イ)、
0℃、@をインバータにより反転すれば、上記実施例と
同じ第5図のような電圧波形となシ同様の効果を奏する
+21, (31, (The case where 41 is active at a high potential has been described, but the case where it is active at a low potential will be described below. The external active signals (II, m, @, @ are active at a low potential) are described below. Here, the signals (6), (7), (8), (9
), as shown in Figure 4, the signals (to), (a),
If 0° C. and @ are inverted by an inverter, the voltage waveform as shown in FIG. 5, which is the same as in the above embodiment, will be obtained, and the same effect will be obtained.

また、デバイスが2ケの時の実施例については、第6図
、第7図に示すように外部デバイスアクティブ信号を1
つにすることができる。このときの信号電圧波形を第8
図に示す。動作については、上記実施例と全く同じであ
ふので説明は省略する。
In addition, for an embodiment in which there are two devices, the external device active signal is set to one as shown in FIGS. 6 and 7.
can be made into The signal voltage waveform at this time is
As shown in the figure. Since the operation is exactly the same as in the above embodiment, the explanation will be omitted.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によればワイヤードOR結合し
た回路に当該半導体集積回路を付加することによシブバ
イスをアクティブにする信号間のマージンをとらなくて
もよいという効果があシ、またデバイスからの出力の競
合が起こらないという効果がある。
As described above, according to the present invention, by adding the semiconductor integrated circuit to a wired OR-coupled circuit, there is an effect that there is no need to take a margin between signals for activating the active device. This has the effect that no output contention occurs.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例による半導体集積回路を示
すワイヤードOR回路図、第2図はこの発明の一実施例
による半導体集積回路を示す信号変換回路図、第3図は
この発明の一実施例による半導体集積回路の動作を示す
信号波形図、第4図はこの発明の他の実施例による半導
体集積回路を示す信号変換回路図、第5図はこの発明の
他の実施例による半導体集積回路の動作を示す信号波形
図、第6図はこの発明の他の実施例による半導体集積回
路を示すワイヤードOR回路図、第7図はこの発明の他
の実施例による半導体集積回路を示す信号変換回路図、
第8図はこの発明の他の実施例による半導体集積回路の
動作を示す信号波形図、第9図は従来の半導体集積回路
装置を示すワイヤードOR回路図、第10図は従来の半
導体集積回路装置の動作を示す信号波形図でめる0 図において、(1) 、 +21 、 (31、(4)
は外部からのデバイスをアクティブにする信号端子、(
5)は信号変換回路、(6) 、 (7) 、 (8)
 、 (9)は内部デバイスをアクティブにする信号端
子、α(11,Ql)、U、Qlは半導体メモリ装置、
α→、(至)、αQ、αηは半導体メモリ装置からの出
力端子、(至)はワイヤードOR結線されたデータ・パ
スライン、as 、 m 、 a])、(イ)は信号の
論理を反転した時の外部からの半導体メモリ装置をアク
ティブにする信号端子、翰は外部から1つの信号で半導
体メモリ装置をアクティブにする信号端子、(ハ)、に
)は内部の半導体メモリをアクティブにする信号端子、
(ホ)、@は半導体メモリ装置からの出力端子、(ホ)
はワイヤードOR結線されたデータ・パスライン、翰は
半導体メモリ装置、(至)はデバイス001と(至)の
出力が競合している期間、aηはデバイス(1(+1と
(ロ)の出力が競合している期間、(2)はデバイス(
ロ)と(2)の出力が競合している期間、(至)はデバ
イス(6)と(至)の出力が競合している期間である。 なお、図中、同一符号は同−又は相当部分を示す0
FIG. 1 is a wired OR circuit diagram showing a semiconductor integrated circuit according to an embodiment of the present invention, FIG. 2 is a signal conversion circuit diagram showing a semiconductor integrated circuit according to an embodiment of the invention, and FIG. 3 is a diagram showing a semiconductor integrated circuit according to an embodiment of the invention. FIG. 4 is a signal waveform diagram showing the operation of the semiconductor integrated circuit according to the embodiment. FIG. 4 is a signal conversion circuit diagram showing the semiconductor integrated circuit according to another embodiment of the invention. FIG. 5 is a semiconductor integrated circuit according to another embodiment of the invention. A signal waveform diagram showing the operation of the circuit, FIG. 6 is a wired OR circuit diagram showing a semiconductor integrated circuit according to another embodiment of the invention, and FIG. 7 is a signal conversion diagram showing a semiconductor integrated circuit according to another embodiment of the invention. circuit diagram,
FIG. 8 is a signal waveform diagram showing the operation of a semiconductor integrated circuit according to another embodiment of the present invention, FIG. 9 is a wired OR circuit diagram showing a conventional semiconductor integrated circuit device, and FIG. 10 is a conventional semiconductor integrated circuit device. In the signal waveform diagram showing the operation of 0, (1), +21, (31, (4)
is the signal terminal that activates the device from the outside, (
5) is a signal conversion circuit, (6), (7), (8)
, (9) is a signal terminal for activating an internal device, α(11,Ql), U, Ql are semiconductor memory devices,
α→, (to), αQ, αη are output terminals from the semiconductor memory device, (to) is a wired OR-connected data path line, as, m, a]), (a) is the inversion of the signal logic The signal terminal that activates the semiconductor memory device from the outside when it is activated, the signal terminal that activates the semiconductor memory device with one signal from the outside, (c), ni) is the signal that activates the internal semiconductor memory terminal,
(E), @ is the output terminal from the semiconductor memory device, (E)
is the wired OR-connected data path line, 翰 is the semiconductor memory device, (to) is the period when the outputs of device 001 and (to) are competing, and aη is the period when the outputs of device (1(+1) and (b) are During the contention period, (2) is the device (
The period in which the outputs of (b) and (2) are competing with each other, and (to) is the period in which the outputs of devices (6) and (to) are competing with each other. In addition, in the figures, the same symbols indicate the same or corresponding parts.

Claims (2)

【特許請求の範囲】[Claims] (1)半導体メモリをワイヤードOR出力するシステム
において、各半導体メモリをアクティブ状態にする信号
が1つのNANDゲートを通じてシステムに加えられる
構成であることを特徴とする半導体集積回路。
(1) A semiconductor integrated circuit characterized in that, in a system that performs wired OR output of semiconductor memories, a signal for activating each semiconductor memory is applied to the system through one NAND gate.
(2)各アクティブ信号の論理を反転することにより各
NANDゲートの前にそれぞれ1つのインバータゲート
を付加したことを特徴とする特許請求の範囲第1項記載
の半導体集積回路。
(2) The semiconductor integrated circuit according to claim 1, wherein one inverter gate is added in front of each NAND gate by inverting the logic of each active signal.
JP25994187A 1987-10-14 1987-10-14 Semiconductor integrated circuit Pending JPH01100643A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25994187A JPH01100643A (en) 1987-10-14 1987-10-14 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25994187A JPH01100643A (en) 1987-10-14 1987-10-14 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPH01100643A true JPH01100643A (en) 1989-04-18

Family

ID=17341051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25994187A Pending JPH01100643A (en) 1987-10-14 1987-10-14 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPH01100643A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7721367B2 (en) 2005-09-01 2010-05-25 Yoo Soo Ahn Bed mattress using permeable reinforcing member and foaming material, and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7721367B2 (en) 2005-09-01 2010-05-25 Yoo Soo Ahn Bed mattress using permeable reinforcing member and foaming material, and method of manufacturing the same

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