JPH01100677U - - Google Patents
Info
- Publication number
- JPH01100677U JPH01100677U JP19576987U JP19576987U JPH01100677U JP H01100677 U JPH01100677 U JP H01100677U JP 19576987 U JP19576987 U JP 19576987U JP 19576987 U JP19576987 U JP 19576987U JP H01100677 U JPH01100677 U JP H01100677U
- Authority
- JP
- Japan
- Prior art keywords
- steel plate
- floater
- steel
- steel plates
- side guides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000831 Steel Inorganic materials 0.000 claims description 11
- 239000010959 steel Substances 0.000 claims description 11
- 238000007664 blowing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Butt Welding And Welding Of Specific Article (AREA)
Description
第１図は本考案の実施例を示す斜視図、第２図
は第１図のＡ―Ａ矢視を示す断面図、第３図は本
考案装置の配置を示す平面図、第４図は従来例を
示す側面図、第５図は鋼板の芯ずれ状況を示す説
明図である。
１……鋼板、２……マグネツト付ベルトコンベ
ヤ、３……シヤー、４……溶接機、５……ピンチ
ロール、６，７，８……マグネツト付ベルトコン
ベア、１０……フロート、１１……ダクト、１２
……サイドガイド、１３……サイドガイド移動用
スクリユー、１４……空気吹出し孔。
Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is a sectional view taken along arrow A-A in Fig. 1, Fig. 3 is a plan view showing the arrangement of the device of the present invention, and Fig. 4 is a FIG. 5, a side view showing a conventional example, is an explanatory diagram showing the misalignment of a steel plate. 1... Steel plate, 2... Belt conveyor with magnet, 3... Shear, 4... Welding machine, 5... Pinch roll, 6, 7, 8... Belt conveyor with magnet, 10... Float, 11... duct, 12
... Side guide, 13 ... Screw for moving the side guide, 14 ... Air blowing hole.
Claims (1)
た鋼板接続用溶接機の入側および出側に位置させ
てボツクス状チヤンバ上面に多数の空気吹出し孔
を有するフロータを設置する一方、上記フロータ
の上面両側に鋼板の板幅に合わせて進退するサイ
ドガイドを配設し、上記空気吹出し孔から吹出す
空気によつて鋼板をフロータ上に浮上させると共
に上記鋼板の両側端と鋼板に接近したサイドガイ
ド前面との間隙から空気を排出することによつて
上記鋼板を板幅方向に移させるように構成したこ
とを特徴とする鋼板の板合わせ装置。 A floater having a large number of air blowing holes is installed on the top surface of a box-shaped chamber, located on the inlet and outlet sides of a welding machine for connecting steel plates, which is installed on a line that continuously threads steel plates. Side guides are provided on both sides of the upper surface that move forward and backward according to the width of the steel plate, and the air blown from the air blowing hole causes the steel plate to float above the floater, and the side guides approach both ends of the steel plate and the steel plate. A device for joining steel plates, characterized in that the steel plate is moved in the width direction by discharging air from a gap between the steel plate and the front surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19576987U JPH01100677U (en) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19576987U JPH01100677U (en) | 1987-12-25 | 1987-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100677U true JPH01100677U (en) | 1989-07-06 |
Family
ID=31486427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19576987U Pending JPH01100677U (en) | 1987-12-25 | 1987-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01100677U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7094618B2 (en) | 2000-08-25 | 2006-08-22 | Micron Technology, Inc. | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape |
-
1987
- 1987-12-25 JP JP19576987U patent/JPH01100677U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7094618B2 (en) | 2000-08-25 | 2006-08-22 | Micron Technology, Inc. | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape |
| US7238543B2 (en) | 2000-08-25 | 2007-07-03 | Micron Technology, Inc. | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties |
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