JPH01100677U - - Google Patents

Info

Publication number
JPH01100677U
JPH01100677U JP19576987U JP19576987U JPH01100677U JP H01100677 U JPH01100677 U JP H01100677U JP 19576987 U JP19576987 U JP 19576987U JP 19576987 U JP19576987 U JP 19576987U JP H01100677 U JPH01100677 U JP H01100677U
Authority
JP
Japan
Prior art keywords
steel plate
floater
steel
steel plates
side guides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19576987U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19576987U priority Critical patent/JPH01100677U/ja
Publication of JPH01100677U publication Critical patent/JPH01100677U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Butt Welding And Welding Of Specific Article (AREA)

Description

【図面の簡単な説明】
第1図は本考案の実施例を示す斜視図、第2図
は第1図のA―A矢視を示す断面図、第3図は本
考案装置の配置を示す平面図、第4図は従来例を
示す側面図、第5図は鋼板の芯ずれ状況を示す説
明図である。 1……鋼板、2……マグネツト付ベルトコンベ
ヤ、3……シヤー、4……溶接機、5……ピンチ
ロール、6,7,8……マグネツト付ベルトコン
ベア、10……フロート、11……ダクト、12
……サイドガイド、13……サイドガイド移動用
スクリユー、14……空気吹出し孔。

Claims (1)

    【実用新案登録請求の範囲】
  1. 鋼板を連続して通板処理するライン上に設置し
    た鋼板接続用溶接機の入側および出側に位置させ
    てボツクス状チヤンバ上面に多数の空気吹出し孔
    を有するフロータを設置する一方、上記フロータ
    の上面両側に鋼板の板幅に合わせて進退するサイ
    ドガイドを配設し、上記空気吹出し孔から吹出す
    空気によつて鋼板をフロータ上に浮上させると共
    に上記鋼板の両側端と鋼板に接近したサイドガイ
    ド前面との間隙から空気を排出することによつて
    上記鋼板を板幅方向に移させるように構成したこ
    とを特徴とする鋼板の板合わせ装置。
JP19576987U 1987-12-25 1987-12-25 Pending JPH01100677U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19576987U JPH01100677U (ja) 1987-12-25 1987-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19576987U JPH01100677U (ja) 1987-12-25 1987-12-25

Publications (1)

Publication Number Publication Date
JPH01100677U true JPH01100677U (ja) 1989-07-06

Family

ID=31486427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19576987U Pending JPH01100677U (ja) 1987-12-25 1987-12-25

Country Status (1)

Country Link
JP (1) JPH01100677U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7094618B2 (en) 2000-08-25 2006-08-22 Micron Technology, Inc. Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7094618B2 (en) 2000-08-25 2006-08-22 Micron Technology, Inc. Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape
US7238543B2 (en) 2000-08-25 2007-07-03 Micron Technology, Inc. Methods for marking a bare semiconductor die including applying a tape having energy-markable properties

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