JPH01103254A - Both surface supersonic wave vibration grinder - Google Patents
Both surface supersonic wave vibration grinderInfo
- Publication number
- JPH01103254A JPH01103254A JP26079287A JP26079287A JPH01103254A JP H01103254 A JPH01103254 A JP H01103254A JP 26079287 A JP26079287 A JP 26079287A JP 26079287 A JP26079287 A JP 26079287A JP H01103254 A JPH01103254 A JP H01103254A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- supersonic wave
- wave vibration
- ceramics
- lower surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、高脆性材料の上下両方の表面を同時に研削す
る高能率、高精度の研削盤に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a highly efficient and highly accurate grinding machine that simultaneously grinds both the upper and lower surfaces of a highly brittle material.
(従来の技術)
高脆性材料の上下両方の表面を同時に研削する装置は、
従来、金属材料等の加工に用いる装置をそのまま用い、
車に砥石として高脆性材料に適合するものを選定して使
用していた。(Conventional technology) Equipment that simultaneously grinds both the upper and lower surfaces of highly brittle materials is
Using the equipment conventionally used for processing metal materials, etc.,
A grindstone suitable for highly brittle materials was selected and used in the car.
(発明が解決しようとする問題点)
セラミックスなどの高脆性材料は硬質で脆い材料であり
、研削しにくく、加工能率か著しく低かった。また加工
能率を上げようとすると、表面精度、例えば表面粗さや
平面度を損なうという矛盾があり、また微細なりラック
を生ずるなどの問題がある。(Problems to be Solved by the Invention) Highly brittle materials such as ceramics are hard and brittle materials that are difficult to grind and have extremely low processing efficiency. In addition, when attempting to increase processing efficiency, there is a contradiction in that surface accuracy, such as surface roughness and flatness, is impaired, and there are also problems such as fine racks being generated.
本発明は上記実情に鑑み開発されたもので、加工効率が
高く、加工精度が従来の装置と同等以上である両頭研削
加工装置を提供することを目的とする。The present invention was developed in view of the above-mentioned circumstances, and an object of the present invention is to provide a double-head grinding device that has high processing efficiency and processing accuracy that is equal to or higher than conventional devices.
(問題点を解決するための手段)
本発明は、上記問題点を解決するために開発されたもの
であって、高脆性材料の上下両方の平行な表面を同時に
研削する研削盤において、その回転軸に超音波振動発生
装置を取付けたことを技術的特徴としている。(Means for Solving the Problems) The present invention was developed to solve the above problems, and is a grinding machine that simultaneously grinds both the upper and lower parallel surfaces of a highly brittle material. Its technical feature is that an ultrasonic vibration generator is attached to the shaft.
(作用)
本発明は、高脆性材料の研削に用いられる加工機であっ
て、超音波振動を付与しながらワークの上下表面を研削
する。この超音波振動を付与することによって、加工効
率が従来の3〜5倍に上昇し、表面精度を損なうことな
く、高脆性材料にりラック等を生じることかなく、高脆
性材料を研削加工することかてきる。(Function) The present invention is a processing machine used for grinding highly brittle materials, and grinds the upper and lower surfaces of a workpiece while applying ultrasonic vibrations. By applying this ultrasonic vibration, the machining efficiency increases 3 to 5 times compared to conventional methods, and highly brittle materials can be ground without compromising surface accuracy or causing racks in highly brittle materials. Something comes up.
(実施例) 以下本発明を実施例によって詳細に説明する。(Example) The present invention will be explained in detail below using examples.
第1図は本発明の実施例の研削盤の正面縦断面図である
。FIG. 1 is a front vertical sectional view of a grinding machine according to an embodiment of the present invention.
第1図において、上下に対向する研削板lはそれぞれ1
下移動自在な回転駆動部2に支持されて水平面内を回転
し、その上下の研削板lの2面の間に研削すべきワーク
を挿入してその上下両面を研削するものである。In Fig. 1, the grinding plates l facing each other are 1
It rotates in a horizontal plane supported by a rotary drive unit 2 that is freely movable downward, and a workpiece to be ground is inserted between the two surfaces of the upper and lower grinding plates 1, and both the upper and lower surfaces of the workpiece are ground.
回転駆動部の上下の移動はウオーム12およびウオーム
ホイール13を図示しないモータによって操作すること
によって任意に変更することかでき、ワークの上下面の
寸法に応じて研削板lの間隔は自動的に精密に制御され
る。The vertical movement of the rotary drive unit can be changed arbitrarily by operating the worm 12 and worm wheel 13 by a motor (not shown), and the interval between the grinding plates l is automatically adjusted precisely according to the dimensions of the upper and lower surfaces of the workpiece. controlled by.
回転駆動部2の一実施例の縦断面図を第2図に示した。A longitudinal cross-sectional view of one embodiment of the rotation drive section 2 is shown in FIG.
ケーシング3内に駆動軸4か内蔵され、この駆動軸4に
は回転子5と固定子6とから成る回転モータ7が設けら
れており、軸受8に支持され研削板1を回転する。回転
駆動#2にa?7波振動発生装置か取付けられている。A drive shaft 4 is built into the casing 3, and the drive shaft 4 is provided with a rotary motor 7 consisting of a rotor 5 and a stator 6, which is supported by a bearing 8 and rotates the grinding plate 1. a to rotation drive #2? A 7-wave vibration generator is installed.
この超音波振動発生装置として回転軸4に超音波振動子
9か付設されており、スリップリングlOを介して給電
される。超音波振動子9は超音波振動を発生し、回転軸
4に超音波振動を与える。超音波振動子9は縦振動を発
生する装置でも回転振動を発生する装置でも何れも適用
することができる。超音波振動の振動数はほぼ20kH
zが適当である。上下の回転駆動部に附与する超音波振
動の振動数、または/および位相を変えることも任意で
ある。As this ultrasonic vibration generator, an ultrasonic vibrator 9 is attached to the rotating shaft 4, and is supplied with power via a slip ring IO. The ultrasonic vibrator 9 generates ultrasonic vibrations and applies the ultrasonic vibrations to the rotating shaft 4. The ultrasonic transducer 9 may be a device that generates longitudinal vibrations or a device that generates rotational vibrations. The frequency of ultrasonic vibration is approximately 20kHz
z is appropriate. It is also optional to change the frequency and/or phase of the ultrasonic vibrations imparted to the upper and lower rotation drive units.
ワーク21は保持口g122に取付けられて2枚の研削
板lの間に供給されて研削される。保持円盤22は回転
自在にフレーム23に保持されており、軸24を中心と
してモータ25により回転することができるようになっ
ている。The workpiece 21 is attached to the holding port g122 and fed between the two grinding plates l, where it is ground. The holding disk 22 is rotatably held by a frame 23 and can be rotated by a motor 25 about a shaft 24 .
フレーム23は垂直なピン継手27により水平に回動自
在な腕26によって支持されている。第3図に実施例の
全体を説明する平面図を示したように、ワーク取付位R
30においてワーク21をワーク保持円板23に取付け
、ピン27を中心にしてこれを矢印32に示すように回
動して研削位5!3Iに示す保持位置に移動する。この
ようにして保持しているワーク21を2枚の研削板lの
間に供給する。必要に応じて保持口g122を回転する
。研削加工か終了すればフレーム23をワーク取付位置
30に戻して新しいワーク21を保持円盤22に取付け
る。The frame 23 is supported by a horizontally rotatable arm 26 by means of a vertical pin joint 27. As shown in FIG. 3, which is a plan view explaining the entire embodiment, the workpiece mounting position R
At 30, the workpiece 21 is attached to the workpiece holding disc 23, and is rotated about the pin 27 as shown by the arrow 32 to move to the holding position shown at the grinding position 5!3I. The workpiece 21 thus held is fed between the two grinding plates l. Rotate the holding port g122 as necessary. When the grinding process is completed, the frame 23 is returned to the workpiece mounting position 30 and a new workpiece 21 is mounted on the holding disk 22.
実施例の両頭超音波振動研削盤は、上下2枚の研削板に
超音波振動を付与することによって高脆性加工物の平行
2面の研削加工において従来に比べ加工効率が3〜5倍
に上昇した。The double-headed ultrasonic vibration grinding machine of this example increases processing efficiency by 3 to 5 times compared to conventional methods when grinding two parallel surfaces of highly brittle workpieces by applying ultrasonic vibration to the two upper and lower grinding plates. did.
〔発明の効果)
本発明は上記のように構成されているので、高脆性材料
の研削能率が飛跡的に向上し、材料に微細なりラック等
が生しることがなく、セラミックス等の平行両面の研削
加工が極めて容易になった。[Effects of the Invention] Since the present invention is configured as described above, the grinding efficiency of highly brittle materials is dramatically improved, and the grinding efficiency of grinding highly brittle materials is improved dramatically, and the grinding of parallel surfaces of ceramics, etc. Grinding has become extremely easy.
第1図は本発明の実施例の研削盤の正面縦断面図、第2
図はその回転駆動部の縦断面図、第3図はその全体平面
図である
l・・・研削板 2・・・回転駆動部3・・・
ケーシング 4・・・駆動軸5・・・回転子
6・・・固定子7・・・回転モータ 8・・・
軸受9・・・超音波振動子 21・・・ワーク22・
・・保持円盤 23・・・フレーム24・・・軸
25・・・モータ26・・・腕
27・・・ピン30・・・ワーク取付位置Fig. 1 is a front vertical cross-sectional view of a grinding machine according to an embodiment of the present invention;
The figure is a longitudinal cross-sectional view of the rotary drive section, and FIG. 3 is its overall plan view.
Casing 4... Drive shaft 5... Rotor
6... Stator 7... Rotating motor 8...
Bearing 9...Ultrasonic vibrator 21...Work 22.
・・Holding disk 23 ・Frame 24 ・・shaft
25...Motor 26...Arm
27...Pin 30...Workpiece mounting position
Claims (1)
削板回転駆動部にそれぞれ超音波振動発生装置を取付け
たことを特徴とする両頭超音波振動研削盤。1. A double-headed ultrasonic vibration grinding machine that simultaneously grinds both the upper and lower surfaces of a workpiece, and is characterized in that an ultrasonic vibration generator is attached to each of the grinding plate rotation drive parts of the double-headed grinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62260792A JP2625769B2 (en) | 1987-10-17 | 1987-10-17 | Double head ultrasonic vibration grinder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62260792A JP2625769B2 (en) | 1987-10-17 | 1987-10-17 | Double head ultrasonic vibration grinder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01103254A true JPH01103254A (en) | 1989-04-20 |
| JP2625769B2 JP2625769B2 (en) | 1997-07-02 |
Family
ID=17352801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62260792A Expired - Lifetime JP2625769B2 (en) | 1987-10-17 | 1987-10-17 | Double head ultrasonic vibration grinder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2625769B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61252056A (en) * | 1985-04-30 | 1986-11-10 | Canon Inc | Method of vibration polishing |
| JPS6239167A (en) * | 1985-08-12 | 1987-02-20 | Hitachi Zosen Corp | Mirror finishing method for disc-shaped workpieces |
-
1987
- 1987-10-17 JP JP62260792A patent/JP2625769B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61252056A (en) * | 1985-04-30 | 1986-11-10 | Canon Inc | Method of vibration polishing |
| JPS6239167A (en) * | 1985-08-12 | 1987-02-20 | Hitachi Zosen Corp | Mirror finishing method for disc-shaped workpieces |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2625769B2 (en) | 1997-07-02 |
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