JPH01104096U - - Google Patents
Info
- Publication number
- JPH01104096U JPH01104096U JP19693187U JP19693187U JPH01104096U JP H01104096 U JPH01104096 U JP H01104096U JP 19693187 U JP19693187 U JP 19693187U JP 19693187 U JP19693187 U JP 19693187U JP H01104096 U JPH01104096 U JP H01104096U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- component storage
- storage container
- arrangement
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000003068 static effect Effects 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の実施例のテンプレートの一部
を示す断面図、第２図は部品収納容器を示す正面
図、第３図は部品収納容器の平面図、第４図は部
品収納容器の底面図、第５図は第３図の―線
断面図、第６図は配置板の断面図、第７図はテン
プレートの一部切欠正面図、第８図は回路基板と
テンプレートとを重ね合せた状態を示す正面図、
第９図は回路基板装置の正面図である。
１……テンプレート、２……配置板、３……部
品収納容器、４……部品収納凹部、５……電子部
品、６……回路基板、７，８……貫通孔、９，１
０……突出部、１１……貫通孔、１２……底面。
Fig. 1 is a sectional view showing a part of the template of the embodiment of the present invention, Fig. 2 is a front view showing the parts storage container, Fig. 3 is a plan view of the parts storage container, and Fig. 4 is a diagram of the parts storage container. The bottom view, Figure 5 is a cross-sectional view taken along the line - - of Figure 3, Figure 6 is a cross-sectional view of the placement plate, Figure 7 is a partially cutaway front view of the template, and Figure 8 is a superimposed circuit board and template. A front view showing the state
FIG. 9 is a front view of the circuit board device. DESCRIPTION OF SYMBOLS 1...Template, 2...Arrangement board, 3...Component storage container, 4...Component storage recess, 5...Electronic component, 6...Circuit board, 7, 8...Through hole, 9, 1
0...Protrusion, 11...Through hole, 12...Bottom surface.
Claims (1)
電子部品の配置に対応するようにチツプ状電子部
品を配置板上に配置するための装置であつて、 前記電子回路基板における前記チツプ状電子部
品の配置に対応するように前記配置板の一方の主
面側に配置された部品収納容器を有し、 前記配置板の一方の主面から他方の主面に至る
貫通孔が設けられており、 前記部品収納容器は前記配置板の前記貫通孔に
挿入するための突出部を有し、 前記配置板に対する前記部品収納容器の位置決
めが前記配置板の前記貫通孔に対する前記突出部
の挿入によつて達成されており、 前記突出部には前記部品収納容器の部品収納凹
部に通じる貫通孔が設けられていることを特徴と
するチツプ状電子部品配置装置。 (2) 前記部品収納凹部の底面が傾斜するように
形成されていることを特徴とする実用新案登録請
求の範囲第１項記載のチツプ状電子部品配置装置
。 (3) 前記部品収納容器は亜鉛容器である実用新
案登録請求の範囲第１項記載のチツプ状電子部品
配置装置。 (4) 前記部品収納容器は合成樹脂容器の表面に
静電気防止の導電膜を有するものである実用新案
登録請求の範囲第１項記載のチツプ状電子部品配
置装置。[Claims for Utility Model Registration] (1) A device for arranging chip-like electronic components on a placement board so as to correspond to the arrangement of the chip-like electronic components on an electronic circuit board to be manufactured, the electronic circuit A component storage container is arranged on one main surface side of the arrangement plate so as to correspond to the arrangement of the chip-shaped electronic components on the board, and a through hole is provided from one main surface to the other main surface of the arrangement plate. a hole is provided, the component storage container has a protrusion for insertion into the through hole of the placement plate, and positioning of the component storage container with respect to the placement plate is performed through the through hole of the placement plate. A chip-shaped electronic component arrangement device, which is achieved by inserting a protrusion, and the protrusion is provided with a through hole communicating with a component storage recess of the component storage container. (2) The chip-shaped electronic component arrangement device according to claim 1, wherein the bottom surface of the component storage recess is formed to be inclined. (3) The chip-shaped electronic component placement device according to claim 1, wherein the component storage container is a zinc container. (4) The chip-shaped electronic component arrangement device according to claim 1, wherein the component storage container is a synthetic resin container having a conductive film for preventing static electricity on the surface thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19693187U JPH0244555Y2 (en) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19693187U JPH0244555Y2 (en) | 1987-12-25 | 1987-12-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01104096U true JPH01104096U (en) | 1989-07-13 |
| JPH0244555Y2 JPH0244555Y2 (en) | 1990-11-27 |
Family
ID=31487518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19693187U Expired JPH0244555Y2 (en) | 1987-12-25 | 1987-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244555Y2 (en) |
-
1987
- 1987-12-25 JP JP19693187U patent/JPH0244555Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0244555Y2 (en) | 1990-11-27 |
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