JPS6441168U - - Google Patents
Info
- Publication number
- JPS6441168U JPS6441168U JP13626987U JP13626987U JPS6441168U JP S6441168 U JPS6441168 U JP S6441168U JP 13626987 U JP13626987 U JP 13626987U JP 13626987 U JP13626987 U JP 13626987U JP S6441168 U JPS6441168 U JP S6441168U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit film
- type component
- mounting
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例に係るモールド成形
回路基板の要部の断面図、第２図は同回路基板を
製造する方法の説明図、第３図は同回路基板に電
子部品を実装した状態を示す断面図、第４図は本
考案の他の実施例を示す断面図である。
１１〜回路フイルム、１２〜樹脂基板、１３〜
絶縁フイルム、１４〜回路パターン、１５〜パツ
ド部、１６〜スルーホール、１７〜ソルダーレジ
スト、１８〜絶縁レジスト、１９〜接着剤、２０
〜穴、２４〜表面実装型部品、２５〜挿入実装型
部品、３０〜凹部。
Fig. 1 is a sectional view of the main parts of a molded circuit board according to an embodiment of the present invention, Fig. 2 is an explanatory diagram of a method for manufacturing the circuit board, and Fig. 3 is an illustration of electronic components mounted on the circuit board. FIG. 4 is a sectional view showing another embodiment of the present invention. 11-circuit film, 12-resin substrate, 13-
Insulating film, 14-circuit pattern, 15-pad portion, 16-through hole, 17-solder resist, 18-insulating resist, 19-adhesive, 20
~hole, 24~surface mount type component, 25~insertion mount type component, 30~recess.
Claims (1)
してなる回路フイルムの片面に樹脂基板を一体に
モールド成形してなり、上記回路フイルムには、
上記樹脂基板と反対側の面に表面実装型部品を実
装するためのパツド部が形成されると共に、挿入
実装型部品を実装する位置にスルーホールが形成
されており、また上記樹脂基板には、上記回路フ
イルムのスルーホールに対応する位置に挿入実装
型部品のリード部を挿入する穴がモールド成形に
より形成されていることを特徴とするモールド成
形回路基板。 (2) 実用新案登録請求の範囲第１項記載の回路
基板であつて、樹脂基板には回路フイルム側の面
に、その回路フイルムを底部とする封止材充填用
の凹部が形成されているもの。[Claims for Utility Model Registration] (1) A circuit film is formed by forming a desired circuit pattern on an insulating film, and a resin substrate is integrally molded on one side of the circuit film, and the circuit film includes:
A pad portion for mounting a surface mount type component is formed on the surface opposite to the resin substrate, and a through hole is formed at a position for mounting an insertion mount type component, and the resin substrate also has a pad portion for mounting a surface mount type component. A molded circuit board characterized in that a hole into which a lead portion of an insertion mounting type component is inserted is formed by molding at a position corresponding to the through hole of the circuit film. (2) The circuit board according to claim 1 of the utility model registration claim, wherein the resin board has a recess formed on the circuit film side surface for filling with a sealing material, with the circuit film as the bottom. thing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13626987U JPS6441168U (en) | 1987-09-08 | 1987-09-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13626987U JPS6441168U (en) | 1987-09-08 | 1987-09-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6441168U true JPS6441168U (en) | 1989-03-13 |
Family
ID=31396618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13626987U Pending JPS6441168U (en) | 1987-09-08 | 1987-09-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6441168U (en) |
-
1987
- 1987-09-08 JP JP13626987U patent/JPS6441168U/ja active Pending
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