JPH01104730U - - Google Patents
Info
- Publication number
- JPH01104730U JPH01104730U JP1987201351U JP20135187U JPH01104730U JP H01104730 U JPH01104730 U JP H01104730U JP 1987201351 U JP1987201351 U JP 1987201351U JP 20135187 U JP20135187 U JP 20135187U JP H01104730 U JPH01104730 U JP H01104730U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- antistatic
- semiconductor device
- sealed semiconductor
- antistatic member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の樹脂封止半導体装置の斜視図
、第２図は本考案の帯電防止部材の構成図、第３
図は従来の樹脂封止半導体装置の構成図、第４図
は本考案の第２実施例を示す樹脂封止半導体装置
の製造状態を示す図である。 １０……半導体素子パツケージ、１１……リー
ド、１２……捺印用開口部、１３……上部帯電防
止部材、１４……下部帯電防止部材、１５，１６
……短手方向の側面部、１７……封止樹脂、２０
……金型、２１……上部帯電防止部材の成形部、
２２……下部帯電防止部材の成形部、２３，２４
……ゲート、２５，２６……ランナ。
、第２図は本考案の帯電防止部材の構成図、第３
図は従来の樹脂封止半導体装置の構成図、第４図
は本考案の第２実施例を示す樹脂封止半導体装置
の製造状態を示す図である。 １０……半導体素子パツケージ、１１……リー
ド、１２……捺印用開口部、１３……上部帯電防
止部材、１４……下部帯電防止部材、１５，１６
……短手方向の側面部、１７……封止樹脂、２０
……金型、２１……上部帯電防止部材の成形部、
２２……下部帯電防止部材の成形部、２３，２４
……ゲート、２５，２６……ランナ。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 半導体素子パツケージの少なくとも上部面
及び下部面に帯電防止手段を施してなる樹脂封止
半導体装置において、 前記帯電防止手段は繊維状導電体を含む帯電防
止部材からなり、該帯電防止部材の上部面には捺
印用開孔部を具備することを特徴とする樹脂封止
半導体装置。 (2) 前記帯電防止部材は半導体素子パツケージ
に接着により形成してなる実用新案登録請求の範
囲第１項記載の樹脂封止半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987201351U JPH01104730U (ja) | 1987-12-28 | 1987-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987201351U JPH01104730U (ja) | 1987-12-28 | 1987-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104730U true JPH01104730U (ja) | 1989-07-14 |
Family
ID=31491715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987201351U Pending JPH01104730U (ja) | 1987-12-28 | 1987-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104730U (ja) |
-
1987
- 1987-12-28 JP JP1987201351U patent/JPH01104730U/ja active Pending