JPH0252357U - - Google Patents

Info

Publication number
JPH0252357U
JPH0252357U JP1989110021U JP11002189U JPH0252357U JP H0252357 U JPH0252357 U JP H0252357U JP 1989110021 U JP1989110021 U JP 1989110021U JP 11002189 U JP11002189 U JP 11002189U JP H0252357 U JPH0252357 U JP H0252357U
Authority
JP
Japan
Prior art keywords
plastic
semiconductor device
hole
metal frame
corners
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989110021U
Other languages
English (en)
Other versions
JPH0810208Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989110021U priority Critical patent/JPH0810208Y2/ja
Publication of JPH0252357U publication Critical patent/JPH0252357U/ja
Application granted granted Critical
Publication of JPH0810208Y2 publication Critical patent/JPH0810208Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図ａ，ｂはそれぞれＤＩＰタイプ、ＦＰタ
イプの加工したアイランドの平面図、第２図はプ
ラスチツク封止ＩＣの断面図、第３図は素子を搭
載したリードフレームの要部平面図、第４図はテ
スト素子を搭載したアイランドの平面図、第５図
は耐湿性の試験結果を示すグラフである。 符号の説明、１……アイランド、２……半導体
素子、３……金線、４……リードピン、５……封
止材料、６……貫通孔。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 半導体素子を金属フレームに搭載して封止用
    成形材料で成形するプラスチツク封止型半導体装
    置において、素子を搭載するアイランドの対角線
    上の４ケ所のコーナー部に、前記対角線に対して
    直角に交差する少なくとも巾が０．３mmで長さが
    ０．５mmの横長の貫通孔を設けた金属フレームを
    用いていることを特徴とするプラスチツク封止型
    半導体装置。 ２ 半導体素子の四隅の角部が各貫通孔の外形線
    の上にかかるように配置してなる請求項１に記載
    のプラスチツク封止型半導体装置。
JP1989110021U 1989-09-20 1989-09-20 プラスチック封止型半導体装置 Expired - Lifetime JPH0810208Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989110021U JPH0810208Y2 (ja) 1989-09-20 1989-09-20 プラスチック封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989110021U JPH0810208Y2 (ja) 1989-09-20 1989-09-20 プラスチック封止型半導体装置

Publications (2)

Publication Number Publication Date
JPH0252357U true JPH0252357U (ja) 1990-04-16
JPH0810208Y2 JPH0810208Y2 (ja) 1996-03-27

Family

ID=31346798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989110021U Expired - Lifetime JPH0810208Y2 (ja) 1989-09-20 1989-09-20 プラスチック封止型半導体装置

Country Status (1)

Country Link
JP (1) JPH0810208Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192930A (ja) * 2010-04-30 2010-09-02 Rohm Co Ltd アイランド露出型半導体装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7041068B2 (en) 2001-06-12 2006-05-09 Pelikan Technologies, Inc. Sampling module device and method
US9226699B2 (en) 2002-04-19 2016-01-05 Sanofi-Aventis Deutschland Gmbh Body fluid sampling module with a continuous compression tissue interface surface
US9795334B2 (en) 2002-04-19 2017-10-24 Sanofi-Aventis Deutschland Gmbh Method and apparatus for penetrating tissue
US9314194B2 (en) 2002-04-19 2016-04-19 Sanofi-Aventis Deutschland Gmbh Tissue penetration device
US7547287B2 (en) 2002-04-19 2009-06-16 Pelikan Technologies, Inc. Method and apparatus for penetrating tissue
US8579831B2 (en) 2002-04-19 2013-11-12 Sanofi-Aventis Deutschland Gmbh Method and apparatus for penetrating tissue
US7226461B2 (en) 2002-04-19 2007-06-05 Pelikan Technologies, Inc. Method and apparatus for a multi-use body fluid sampling device with sterility barrier release
US8574895B2 (en) 2002-12-30 2013-11-05 Sanofi-Aventis Deutschland Gmbh Method and apparatus using optical techniques to measure analyte levels
WO2006001797A1 (en) 2004-06-14 2006-01-05 Pelikan Technologies, Inc. Low pain penetrating
EP1671096A4 (en) 2003-09-29 2009-09-16 Pelikan Technologies Inc METHOD AND APPARATUS FOR PROVIDING IMPROVED SAMPLE CAPTURING DEVICE
EP1680014A4 (en) 2003-10-14 2009-01-21 Pelikan Technologies Inc METHOD AND DEVICE FOR A VARIABLE USER INTERFACE
US9775553B2 (en) 2004-06-03 2017-10-03 Sanofi-Aventis Deutschland Gmbh Method and apparatus for a fluid sampling device
EP2265324B1 (en) 2008-04-11 2015-01-28 Sanofi-Aventis Deutschland GmbH Integrated analyte measurement system
US9375169B2 (en) 2009-01-30 2016-06-28 Sanofi-Aventis Deutschland Gmbh Cam drive for managing disposable penetrating member actions with a single motor and motor and control system
US8965476B2 (en) 2010-04-16 2015-02-24 Sanofi-Aventis Deutschland Gmbh Tissue penetration device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5676542A (en) * 1979-11-28 1981-06-24 Hitachi Ltd Resin-sealed semiconductor device
JPS56104459A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5676542A (en) * 1979-11-28 1981-06-24 Hitachi Ltd Resin-sealed semiconductor device
JPS56104459A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192930A (ja) * 2010-04-30 2010-09-02 Rohm Co Ltd アイランド露出型半導体装置

Also Published As

Publication number Publication date
JPH0810208Y2 (ja) 1996-03-27

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