JPH01107155U - - Google Patents
Info
- Publication number
- JPH01107155U JPH01107155U JP1988000921U JP92188U JPH01107155U JP H01107155 U JPH01107155 U JP H01107155U JP 1988000921 U JP1988000921 U JP 1988000921U JP 92188 U JP92188 U JP 92188U JP H01107155 U JPH01107155 U JP H01107155U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit chip
- island
- insulator
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の上面図、第２図は
第１図のＡ―Ａ′断面図、第３図ａ，ｂは他の実
施例を示す平面図、断面図である。
１……集積回路チツプ、２……パツド、３……
導電体、４……絶縁体、５……アイランド、６…
…リード、７，７ａ，７ｂ……ボンデイング線。
FIG. 1 is a top view of one embodiment of the present invention, FIG. 2 is a sectional view taken along the line AA' in FIG. 1, and FIGS. 3a and 3b are a plan view and a sectional view showing another embodiment. 1... integrated circuit chip, 2... pad, 3...
Conductor, 4... Insulator, 5... Island, 6...
...Lead, 7, 7a, 7b...bonding wire.
Claims (1)
部分（以下アイランドと称す）との間に導電体及
び絶縁体を配置することを特徴とする集積回路。 An integrated circuit characterized in that a conductor and an insulator are arranged between an integrated circuit chip and a part (hereinafter referred to as an island) on which the integrated circuit chip is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988000921U JPH01107155U (en) | 1988-01-07 | 1988-01-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988000921U JPH01107155U (en) | 1988-01-07 | 1988-01-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107155U true JPH01107155U (en) | 1989-07-19 |
Family
ID=31200356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988000921U Pending JPH01107155U (en) | 1988-01-07 | 1988-01-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107155U (en) |
-
1988
- 1988-01-07 JP JP1988000921U patent/JPH01107155U/ja active Pending