JPH01109794A - Terminal connection of electronic components - Google Patents

Terminal connection of electronic components

Info

Publication number
JPH01109794A
JPH01109794A JP26751587A JP26751587A JPH01109794A JP H01109794 A JPH01109794 A JP H01109794A JP 26751587 A JP26751587 A JP 26751587A JP 26751587 A JP26751587 A JP 26751587A JP H01109794 A JPH01109794 A JP H01109794A
Authority
JP
Japan
Prior art keywords
terminal
lead
solder
electronic components
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26751587A
Other languages
Japanese (ja)
Inventor
Kazuhiko Kawachi
和彦 河地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP26751587A priority Critical patent/JPH01109794A/en
Publication of JPH01109794A publication Critical patent/JPH01109794A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To prevent shorts with neighboring conductors by using a conductive material in either one of a lead terminal or a connection terminal to be engaged with such lead terminal on the side of a printed wiring board, applying a resin thereupon, and causing the lead terminal and the connecting terminal to conduct by heating and pressuring. CONSTITUTION:A preliminary solder 5 is applied to a connecting terminal 3 to be engaged with a lead terminal 1 formed on a substrate 2, a thermoset or thermoplastic resin 6 being applied to such preliminary solder 5. Then the preliminary solder 5 is applied to the connecting terminal 3 along the direction of arrow A from the top of the printed wiring board 4, the part to which the resin 6 has been applied is pressured while heating the lead terminal 1 at a solder melting temperature. By solder bonding both the connecting terminal 3 and the lead terminal 1 with the preliminary solder 5 and thermosetting the resin 6 simultaneously, the connection terminal 3 and the lead terminal 1 are bonded and fixed. According to the constitution, the preliminary solder 5 is applied only to the connecting terminal 3, whereby there is no squeeze-out of superfluous solder when connecting both terminals 1, 3 and shorts with the neighboring conductors can be prevented.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子部品１例えばＥＬ素子の端子をプリント配
線板の接続端子と主として半田を用いて接続する方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for connecting terminals of an electronic component 1, such as an EL element, to connection terminals of a printed wiring board, mainly using solder.

〔発明の背景〕[Background of the invention]

従来より、この種の端子接続方法としては種々のものが
知られており、そのうち電流を多く流す必要のあるＥＬ
やＰＯＰｉには半田付が多く用いられている。従来、こ
の半田付けによる電子部品の端子接続方法は、電子部品
の引出し端子と、プリント配線板側の接続端子の両方に
予備半田を施すものであった。A variety of terminal connection methods have been known in the past, including EL, which requires a large amount of current to flow.
Soldering is often used for POPi and POPi. Conventionally, the method for connecting terminals of electronic components by soldering involves applying preliminary solder to both the lead terminals of the electronic components and the connection terminals on the printed wiring board side.

そのため、使用する半田量が多くなり、端子を接続した
状態においてその余分の半田がはみ出し、隣接する端子
その他の導体とショートしてしまう事態が生じてしまう
、又、電子部品の引出し端子がアルミニウム箔等の半田
付ができない材料の場合、この方法が実施し得ないか、
無理に実施しても非常に導通安定性の悪いものとなって
いた。As a result, a large amount of solder is used, and when the terminals are connected, the excess solder protrudes, resulting in a short circuit with adjacent terminals or other conductors.Furthermore, the lead-out terminals of electronic components are made of aluminum foil. In the case of materials that cannot be soldered, such as
Even if this was done forcibly, the conduction stability would be extremely poor.

〔発明の目的〕[Purpose of the invention]

そこで、本発明は上記した従来の問題点に着目してなさ
れたもので、かかる問題点を解消して、隣接する導体と
のショートを防！ヒし、半田付けが不可とされる材料に
よる端子の場合でも確実な導通を得ることができるよう
にした電子部品の端子接続方法を提供することを目的と
している。Therefore, the present invention has been made by focusing on the above-mentioned conventional problems, and solves these problems and prevents short circuits with adjacent conductors! It is an object of the present invention to provide a method for connecting terminals of electronic components, which allows reliable conduction to be obtained even in the case of terminals made of materials that cannot be soldered.

〔問題点を解決するための手段〕[Means for solving problems]

この目的を達成するために１本発明に係る電子部品の端
子接続方法は、電子部品に形成された引出し端子と、こ
の引出し端子に適合するプリント配線板側の接続端子と
のいずれか一方に導電材を施し、その導電材のヒに熱硬
化性樹脂、または熱可塑性樹脂を塗布した後、前記引出
し端子と接続端子曲を加熱加圧して導通させることを特
徴としている。In order to achieve this object, the method for connecting terminals of electronic components according to the present invention provides electrical conductivity between either a lead-out terminal formed on an electronic component or a connecting terminal on a printed wiring board that is compatible with the lead-out terminal. After applying a thermosetting resin or a thermoplastic resin to the conductive material, the lead terminal and the connecting terminal curve are heated and pressurized to bring them into electrical continuity.

〔作用〕[Effect]

上記したように、’ｉ電子部品引出し端子かプリント配
線板側の接続端子のいずれか一方に導電材、特に予備半
田を施すので、その寸が少なくなって、隣接する導体と
のショートが防ＩＦでき。As mentioned above, since conductive material, especially preliminary solder, is applied to either the electronic component lead-out terminal or the connection terminal on the printed wiring board side, the size of the conductive material is reduced and short circuits with adjacent conductors are prevented. I can do it.

樹脂によって接続状態を固化するので導通性も安定する
。又、導電材として予備半田を使用するときに、引出し
端子が半田付は不可の場合でも樹脂の硬化と圧着力でそ
の接続状態が安定するのである。Since the connection state is solidified by the resin, conductivity is also stabilized. Furthermore, when preliminary solder is used as a conductive material, even if the lead terminal cannot be soldered, the connection state is stabilized by the hardening of the resin and the pressure bonding force.

〔実施例〕〔Example〕

次に本発明の実施の一例を第１図及び第２図を参照して
詳細に説明する。Next, an example of the implementation of the present invention will be described in detail with reference to FIGS. 1 and 2.

第１図は本発明に係る電子部品の端子接続方法を表わす
要部正面図、第２図はモ面図である。FIG. 1 is a front view of a main part showing a terminal connection method for an electronic component according to the present invention, and FIG. 2 is a top view.

これらの図において１はＥＬ素子等の電子部品の引出し
端子であり、この引出し端子ｌはガラス基板２上に形成
されている。又、３はこの引出し端子ｌと適合する接続
端子で、この接続端子３はフレキシブルなプリント配線
板（以下、ＦＰＣと称する）４に形成されている。In these figures, reference numeral 1 denotes a lead-out terminal for an electronic component such as an EL element, and this lead-out terminal 1 is formed on a glass substrate 2. Further, reference numeral 3 denotes a connecting terminal compatible with this lead-out terminal 1, and this connecting terminal 3 is formed on a flexible printed wiring board (hereinafter referred to as FPC) 4.

前記した接続端子３に予備半田５を施し、その予備半田
５ヒに熱硬化性、または熱可塑性の樹脂６を塗布した後
に、ＦＰＣ４の上方から図中の矢印Ａの方向に沿って接
続端子３に予備半田５を施し、樹脂６を塗布した部分を
引出し端子ｌに対し半田溶融温度で加熱しつつ加圧する
。引出し端子ｌが半田付は可能な材料である場合には、
この加熱加圧によって予備半田５による接続端子３と引
出し端子ｌとの半田接着と樹脂６の硬化を同時に行ない
、接着状態を固定する。又、引出し端子ｌがアルミニウ
ム箔等の半田付は不可の材料である場合には、前記した
加熱温度を予備半田５の融点より低くし、引出し端子ｌ
に対して圧着をしながら樹脂６の硬化を行なう、即ち、
この場合引出し端子ｌと接続端子３との電気的な接続は
圧着力による接触となる。After applying preliminary solder 5 to the connection terminal 3 described above and applying thermosetting or thermoplastic resin 6 to the preliminary solder 5, connect the connection terminal 3 from above the FPC 4 in the direction of arrow A in the figure. Preliminary solder 5 is applied to the lead terminal 1, and the part coated with resin 6 is pressed against the lead terminal 1 while being heated at the solder melting temperature. If the lead terminal l is made of a material that can be soldered,
By this heating and pressurization, solder bonding between the connection terminal 3 and the lead-out terminal 1 by the preliminary solder 5 and hardening of the resin 6 are performed at the same time, and the bonded state is fixed. In addition, if the lead terminal l is made of a material that cannot be soldered, such as aluminum foil, the heating temperature described above is lower than the melting point of the preliminary solder 5, and the lead terminal l is
The resin 6 is cured while being crimped against the
In this case, the electrical connection between the extraction terminal 1 and the connection terminal 3 is made by contacting with crimp force.

上記した実施例によると、予備半田５は接続端子３のみ
に施されるために、端子間の接続時に余分な半田量のは
み出しはなく隣接導体とのショートが防げ、引出し端子
ｌが半田付は不可の材料であっても確実な導電が得られ
る。According to the embodiment described above, since the preliminary solder 5 is applied only to the connection terminal 3, there is no excess solder protruding when connecting between the terminals, and short circuits with adjacent conductors can be prevented, and the lead-out terminal l is not soldered. Reliable conductivity can be obtained even with materials that cannot be used.

尚、本実施例は導電材として予備半田５を使用したがこ
れにこだわるものではなく、例えば半田メッキ、ニッケ
ルメッキ、錫メッキ等でも代任することもできる。Although the preliminary solder 5 is used as the conductive material in this embodiment, the present invention is not limited to this, and for example, solder plating, nickel plating, tin plating, etc. may be used instead.

〔発明の効果〕〔Effect of the invention〕

上述したように本発明に係る電子部品の端子接続方法に
よると、隣接導体とのショートが防止でき、又、引出し
端子が半田付は不可の材料の場合でも確実な導通を得る
ことができる。As described above, according to the terminal connection method for electronic components according to the present invention, short circuits with adjacent conductors can be prevented, and reliable continuity can be obtained even when the lead terminal is made of a material that cannot be soldered.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明に係る電子部品の端子接続方法を示す要
部正面図、第２図は平面図である。 ｌ・・・引出し端子　　　　２・・・ガラス基板３・・
・接続端子　　　　　４・・・ＦＰＣ５・・・予備半１
）　　　　６・・・樹脂第１図 第２図FIG. 1 is a front view of a main part showing a terminal connection method for an electronic component according to the present invention, and FIG. 2 is a plan view. l...Output terminal 2...Glass substrate 3...
・Connection terminal 4...FPC5...Spare half 1
) 6...Resin Figure 1 Figure 2

Claims (5)

【特許請求の範囲】[Claims] （１）電子部品に形成された引出し端子と、この引出し
端子に適合するプリント配線板側の接続端子とのいずれ
か一方に導電材を施し、その導電材の上に熱硬化性樹脂
、又は、熱可塑性樹脂を塗布した後、前記引出し端子と
接続端子間を加熱加圧して導通させることを特徴とする
電子部品の端子接続方法。(1) A conductive material is applied to either the lead-out terminal formed on the electronic component or the connection terminal on the printed wiring board side that is compatible with the lead-out terminal, and a thermosetting resin is applied on the conductive material, or 1. A method for connecting terminals of electronic components, characterized in that after applying a thermoplastic resin, heating and pressurizing the lead-out terminal and the connection terminal to establish continuity. （２）前記導電材は予備半田としたことを特徴とする特
許請求の範囲第１項に記載の電子部品の端子接続方法。(2) The method for connecting terminals of electronic components according to claim 1, wherein the conductive material is preliminary solder. （３）前記導電材は金属メッキとしたことを特徴とする
特許請求の範囲第１項に記載の電子部品の端子接続方法
。(3) The method for connecting terminals of electronic components according to claim 1, wherein the conductive material is metal plated. （４）前記引出し端子が半田付可能な材料の場合、前記
接続端子側に予備半田を施し、加熱加圧によって引出し
端子との半田接着と樹脂硬化とを同時に行なうことを特
徴とする特許請求の範囲第２項に記載の電子部品の端子
接続方法。(4) If the lead-out terminal is made of a solderable material, preliminary soldering is applied to the connection terminal side, and solder bonding to the lead-out terminal and resin curing are performed simultaneously by applying heat and pressure. A method for connecting terminals of electronic components according to scope 2. （５）前記引出し端子が半田付不可能な材料の場合、前
記接続端子側に予備半田を施し、加熱温度を半田融点よ
り低くして加圧しながら樹脂硬化を行ない、端子間の接
続は圧着力によることを特徴とする特許請求の範囲第２
項に記載の電子部品の端子接続方法。(5) If the lead terminal is made of a material that cannot be soldered, apply preliminary solder to the connection terminal side, and cure the resin while applying pressure at a heating temperature lower than the melting point of the solder. Claim 2 characterized in that
Terminal connection method for electronic components described in section.
JP26751587A 1987-10-22 1987-10-22 Terminal connection of electronic components Pending JPH01109794A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26751587A JPH01109794A (en) 1987-10-22 1987-10-22 Terminal connection of electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26751587A JPH01109794A (en) 1987-10-22 1987-10-22 Terminal connection of electronic components

Publications (1)

Publication Number Publication Date
JPH01109794A true JPH01109794A (en) 1989-04-26

Family

ID=17445912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26751587A Pending JPH01109794A (en) 1987-10-22 1987-10-22 Terminal connection of electronic components

Country Status (1)

Country Link
JP (1) JPH01109794A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040009164A (en) * 2002-07-22 2004-01-31 (주) 청송상공 Method and apparatus for connection of electric element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040009164A (en) * 2002-07-22 2004-01-31 (주) 청송상공 Method and apparatus for connection of electric element

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