JPH01112793A - Circuit substrate - Google Patents
Circuit substrateInfo
- Publication number
- JPH01112793A JPH01112793A JP27062087A JP27062087A JPH01112793A JP H01112793 A JPH01112793 A JP H01112793A JP 27062087 A JP27062087 A JP 27062087A JP 27062087 A JP27062087 A JP 27062087A JP H01112793 A JPH01112793 A JP H01112793A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- pattern
- insulating
- circuit substrate
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、プリント基板上に素子を配置した回路基板に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a circuit board in which elements are arranged on a printed circuit board.
［従来の技術］
従来の回路基板では、１枚のプリント基板上にアースを
含めた回路のパターンを写真エツチング方法等により形
成し、そのパターンに素子をはんだ付けして回路を構成
していた。[Prior Art] In a conventional circuit board, a circuit pattern including a ground is formed on a single printed circuit board using a photo-etching method or the like, and elements are soldered to the pattern to form a circuit.
［発明が解決しようとする問題点］
前記従来の構成では、高密度な回路を設計する場合に、
パターン設計が困難となるばかりでなく、充分なアース
の面積がとれなくなり、アース不良を起こし、雑音特性
が悪化するという問題があった。特に、高周波領域では
前記問題が顕著となっていた。[Problems to be solved by the invention] In the conventional configuration, when designing a high-density circuit,
This not only makes pattern design difficult, but also makes it impossible to secure a sufficient grounding area, causing grounding defects and deteriorating noise characteristics. In particular, the above-mentioned problem has become remarkable in the high frequency range.
本発明の目的は、アースをとり易くして、パターン設計
の自由度を増しかつパターンの高密度化を図ることを可
能とし、しかも雑音特性や高周波特性の良い表面実装型
の回路基板を提供することにある。An object of the present invention is to provide a surface-mounted circuit board that facilitates grounding, increases the degree of freedom in pattern design, and enables higher pattern density, and also has good noise characteristics and high frequency characteristics. There is a particular thing.
［問題点を解決するための手段］
本発明に係る回路基板は、
表面に形成された所定のプリントパターンと所定の孔と
を有する絶縁薄板と、
絶縁薄板の裏面に張付けられた金属板と、絶縁薄板の表
面側に配置され、プリントパターンと孔から露出する金
属板とにまたがるように接続された素子とを含んでいる
。[Means for Solving the Problems] A circuit board according to the present invention includes: a thin insulating plate having a predetermined printed pattern and a predetermined hole formed on its surface; a metal plate attached to the back side of the thin insulating plate; It includes an element arranged on the surface side of the insulating thin plate and connected so as to span the printed pattern and the metal plate exposed from the hole.
［作用］
本発明に係る回路基板では、絶縁薄板の裏面に貼り付け
られた金属板をアースとして使用することが可能となる
。このため、充分なアース面積がとれるようになって、
アース不良が問題となることはなくなる。[Function] In the circuit board according to the present invention, the metal plate attached to the back surface of the insulating thin plate can be used as a ground. For this reason, a sufficient ground area can be obtained,
Poor grounding will no longer be a problem.
また、素子は、絶縁薄板の表面側において、プリントパ
ターンと孔から露出する金属板とにまたがるように接続
される。すなわち、アースパターンを基板上にプリント
する必要がなくなることから、パターン設計の自由度が
増す。Further, the element is connected on the front side of the insulating thin plate so as to straddle the printed pattern and the metal plate exposed through the hole. That is, since there is no need to print a ground pattern on the board, the degree of freedom in pattern design increases.
［実施例］
本発明に係る一実施例を示す第１図において、絶縁薄板
１は、非常に薄いフレキシブルプリント基板から構成さ
れている、概ね長方形状の薄板状部材である。絶縁薄板
１の表面には、写真エツチング方法等によって形成され
た所定形状のプリントパターン２が設けられている。ま
た、絶縁薄板１には、アースの必要な所定位置において
、孔３が設けられている。[Embodiment] In FIG. 1 showing an embodiment of the present invention, an insulating thin plate 1 is a generally rectangular thin plate member made of a very thin flexible printed circuit board. A printed pattern 2 having a predetermined shape is formed on the surface of the thin insulating plate 1 by a photo-etching method or the like. Further, holes 3 are provided in the insulating thin plate 1 at predetermined positions where grounding is required.
絶縁薄板１の裏面には、アースとなる金属板４が接着剤
などによって張り付けられている。金属板４は絶縁薄板
１と同様の長方形状の板状部材である。金属板４のうち
孔３から露出した部分とプリントパターン２との間には
、所定位置に、索子５が接続されている。第２図に示す
ように、素子５は絶縁薄板１の表面側に配置されており
、その電極５ａ、５ｂがはんだ６によって、それぞれプ
リントパターン２と孔３から露出する金属板４とに接続
されている。A metal plate 4 serving as a ground is attached to the back surface of the thin insulating plate 1 with an adhesive or the like. The metal plate 4 is a rectangular plate-like member similar to the insulating thin plate 1. A cord 5 is connected at a predetermined position between the portion of the metal plate 4 exposed from the hole 3 and the printed pattern 2. As shown in FIG. 2, the element 5 is arranged on the surface side of the thin insulating plate 1, and its electrodes 5a and 5b are connected to the printed pattern 2 and the metal plate 4 exposed through the hole 3 by solder 6, respectively. ing.
第１図および第２図の構成では、アースとして用いられ
る金属板４が大面積であることから、充分なアース面積
を確保することができ、アース不良の問題が解消する。In the configurations shown in FIGS. 1 and 2, since the metal plate 4 used as the ground has a large area, a sufficient ground area can be ensured, and the problem of poor grounding can be solved.
このため、雑音特性および高周波特性の改善が図れるよ
うになる。また、アース用のプリントパターン２を設け
る必要がないことから、パターン設計の自由度が増して
パターンの高密度化が図れるようになる。Therefore, the noise characteristics and high frequency characteristics can be improved. Furthermore, since there is no need to provide the printed pattern 2 for grounding, the degree of freedom in pattern design increases and the density of the pattern can be increased.
第１図および第２図の回路基板を作製する場合には、ま
ず、プリントパターン２を絶縁薄板１の表面に形成する
。次に、アースが必要となる絶縁薄板１の部分をくり抜
き、孔３を形成する。次に、第３図に示すように、絶縁
薄板１の裏面に金属板４を接着する。さらに、索子５を
、プリントパターン２と孔３から露出する金属板４とに
またがるようにはんだ６によって接続すれば、第１図お
よび第２図に示す回路基板が得られる。When producing the circuit boards shown in FIGS. 1 and 2, first, a printed pattern 2 is formed on the surface of an insulating thin plate 1. As shown in FIG. Next, a hole 3 is formed by hollowing out a portion of the thin insulating plate 1 that requires grounding. Next, as shown in FIG. 3, a metal plate 4 is bonded to the back surface of the thin insulating plate 1. Furthermore, by connecting the cable 5 with solder 6 so as to span the printed pattern 2 and the metal plate 4 exposed from the hole 3, the circuit board shown in FIGS. 1 and 2 is obtained.
なお、第２図では絶縁薄板１の厚みが便宜上強調されて
おり、実際には絶縁薄板１は非常に薄いので、素子がわ
ずかに傾いたとしても、回路基板の特性上問題となるこ
とはない。Note that in Figure 2, the thickness of the thin insulating plate 1 is emphasized for convenience; in reality, the thin insulating plate 1 is very thin, so even if the element is slightly tilted, it will not cause any problems in terms of the characteristics of the circuit board. .
［発明の効果コ
本発明に係る回路基板によれば、表面に形成された所定
のプリントパターンと所定の孔とを有する絶縁薄板と、
金属薄板とを張り合わせることによって、回路基板を構
成したことから、充分なアース面積がとれるようになっ
て、アース不良の問題が解消される。このため、雑音特
性および高周波特性の改善が図れるようになる。また、
アースをプリントパターンとして形成する必要がなくな
ることから、パターン設計の自由度が増し、パターンの
高密度化が図れるようになる。[Effects of the Invention] According to the circuit board according to the present invention, an insulating thin plate having a predetermined printed pattern and a predetermined hole formed on the surface;
Since the circuit board is constructed by pasting together thin metal plates, a sufficient grounding area can be secured, and the problem of grounding defects can be solved. Therefore, the noise characteristics and high frequency characteristics can be improved. Also,
Since it is no longer necessary to form the ground as a printed pattern, the degree of freedom in pattern design increases and it becomes possible to increase the density of the pattern.
第１図は、本発明に係る一実施例の斜視図である。第２
図は、第１図の■−■断面部分図である。
第３図は、前記実施例の製造過程を示す斜視図である。
１は絶縁薄板、２はプリントパターン、３は穴、４は金
属板、５は素子である。FIG. 1 is a perspective view of one embodiment of the present invention. Second
The figure is a partial cross-sectional view taken along the line ■-■ in FIG. FIG. 3 is a perspective view showing the manufacturing process of the embodiment. 1 is an insulating thin plate, 2 is a printed pattern, 3 is a hole, 4 is a metal plate, and 5 is an element.
Claims (1)
とを有する絶縁薄板と、 前記絶縁薄板の裏面に張付けられた金属板と、前記絶縁
薄板の表面側に配置され、前記プリントパターンと前記
孔から露出する金属板とにまたがるように接続された素
子とを含む回路基板。[Scope of Claims] A thin insulating plate having a predetermined printed pattern and a predetermined hole formed on its surface; a metal plate attached to the back side of the thin insulating plate; and a metal plate disposed on the front side of the thin insulating plate, A circuit board including an element connected to span a printed pattern and a metal plate exposed from the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27062087A JPH01112793A (en) | 1987-10-27 | 1987-10-27 | Circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27062087A JPH01112793A (en) | 1987-10-27 | 1987-10-27 | Circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01112793A true JPH01112793A (en) | 1989-05-01 |
Family
ID=17488624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27062087A Pending JPH01112793A (en) | 1987-10-27 | 1987-10-27 | Circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01112793A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013163664A1 (en) * | 2012-05-04 | 2013-11-07 | A.B. Mikroelektronik Gesellschaft Mit Beschränkter Haftung | Circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate |
| FR2995496A1 (en) * | 2012-09-10 | 2014-03-14 | Valeo Sys Controle Moteur Sas | Electrical circuit for use in inverter in electric compressor, has metal substrate, and metal base plate presenting barb that is inserted in perforation, where barb is allowed to come into contact with metal substrate |
| FR2995494A1 (en) * | 2012-09-10 | 2014-03-14 | Valeo Sys Controle Moteur Sas | Electric circuit for use in inverter of electric compressor, has metal substrate comprising non-embedded part on which dielectric material layer is absent, where part is connected to terminal of electric component by fusion of material |
-
1987
- 1987-10-27 JP JP27062087A patent/JPH01112793A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013163664A1 (en) * | 2012-05-04 | 2013-11-07 | A.B. Mikroelektronik Gesellschaft Mit Beschränkter Haftung | Circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate |
| US9648736B2 (en) | 2012-05-04 | 2017-05-09 | A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate |
| US10091874B2 (en) | 2012-05-04 | 2018-10-02 | Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Circuit board, particulary for a power-electronic module, comprising an electrically-conductive substrate |
| FR2995496A1 (en) * | 2012-09-10 | 2014-03-14 | Valeo Sys Controle Moteur Sas | Electrical circuit for use in inverter in electric compressor, has metal substrate, and metal base plate presenting barb that is inserted in perforation, where barb is allowed to come into contact with metal substrate |
| FR2995494A1 (en) * | 2012-09-10 | 2014-03-14 | Valeo Sys Controle Moteur Sas | Electric circuit for use in inverter of electric compressor, has metal substrate comprising non-embedded part on which dielectric material layer is absent, where part is connected to terminal of electric component by fusion of material |
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