JPH01113345U - - Google Patents
Info
- Publication number
- JPH01113345U JPH01113345U JP1988008160U JP816088U JPH01113345U JP H01113345 U JPH01113345 U JP H01113345U JP 1988008160 U JP1988008160 U JP 1988008160U JP 816088 U JP816088 U JP 816088U JP H01113345 U JPH01113345 U JP H01113345U
- Authority
- JP
- Japan
- Prior art keywords
- frame material
- semiconductor element
- island
- semiconductor device
- around
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
第１図ａはこの考案の半導体装置の一実施例の
断面図、第１図ｂはこの考案の半導体装置の他の
実施例の断面図、第２図ａ、第２図ｂはそれぞれ
従来の半導体装置の断面図である。
１３……半導体素子、１４……樹脂パツケージ
、１５……アイランド部、１６……フレーム材、
１７……樹脂、１８……突起部、１９……ワイヤ
、２０……蓋材。
FIG. 1a is a sectional view of one embodiment of the semiconductor device of this invention, FIG. 1b is a sectional view of another embodiment of the semiconductor device of this invention, and FIGS. FIG. 2 is a cross-sectional view of a semiconductor device. 13...Semiconductor element, 14...Resin package, 15...Island part, 16...Frame material,
17...Resin, 18...Protrusion, 19...Wire, 20...Lid material.
Claims (1)
部に接続固定された半導体素子と、 (b) フレーム材と上記半導体素子とを接続する
ワイヤと、 (c) 上記フレーム材の周囲を成型するとともに
上記アイランド部の周辺に突起部を有する樹脂と
、よりなる半導体装置。[Claims for Utility Model Registration] (a) A semiconductor element connected and fixed to the island portion of a hermetically sealed resin package; (b) A wire connecting the frame material and the semiconductor element; (c) The above. A semiconductor device comprising a resin molded around a frame material and having a protrusion around the island section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988008160U JPH01113345U (en) | 1988-01-27 | 1988-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988008160U JPH01113345U (en) | 1988-01-27 | 1988-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113345U true JPH01113345U (en) | 1989-07-31 |
Family
ID=31213792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988008160U Pending JPH01113345U (en) | 1988-01-27 | 1988-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113345U (en) |
-
1988
- 1988-01-27 JP JP1988008160U patent/JPH01113345U/ja active Pending