JPH0470752U - - Google Patents

Info

Publication number
JPH0470752U
JPH0470752U JP1990113810U JP11381090U JPH0470752U JP H0470752 U JPH0470752 U JP H0470752U JP 1990113810 U JP1990113810 U JP 1990113810U JP 11381090 U JP11381090 U JP 11381090U JP H0470752 U JPH0470752 U JP H0470752U
Authority
JP
Japan
Prior art keywords
semiconductor device
package structure
case
metal base
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990113810U
Other languages
Japanese (ja)
Other versions
JP2505068Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990113810U priority Critical patent/JP2505068Y2/en
Publication of JPH0470752U publication Critical patent/JPH0470752U/ja
Application granted granted Critical
Publication of JP2505068Y2 publication Critical patent/JP2505068Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図はそれぞれ本考案の異なる実施
例の要部構造を示す断面図、第３図は従来におけ
る半導体装置全体の構成断面図、第４図は第３図
と異なる従来のパツケージ構造の部分断面図であ
る。 １……半導体素子、４……パツケージ、５……
ゲル状封止樹脂、７……金属ベース、８……ケー
ス枠、９……ケース蓋、１０……接着剤、１１…
…凹溝。 1 and 2 are cross-sectional views showing the main structure of different embodiments of the present invention, FIG. 3 is a cross-sectional view of the overall structure of a conventional semiconductor device, and FIG. 4 is a conventional package different from that shown in FIG. 3. FIG. 3 is a partial cross-sectional view of the structure. 1...Semiconductor element, 4...Package, 5...
Gel sealing resin, 7... Metal base, 8... Case frame, 9... Case lid, 10... Adhesive, 11...
...concave groove.

Claims (1)

【実用新案登録請求の範囲】 １ 半導体素子を搭載した金属ベースの上に絶縁
物で作られたケースを被せ、接着剤により両者間
を接合して組立てた半導体装置のパツケージにお
いて、金属ベースとケースとの間の接合面に接着
剤溜となる凹部を形成したことを特徴とする半導
体装置のパツケージ構造。 ２ 請求項１に記載のパツケージ構造において、
凹部がケースの接合面の全周に亙り凹溝として形
成されていることを特徴とする半導体装置のパツ
ケージ構造。 ３ 請求項１に記載のパツケージ構造において、
ケース内にゲル状の封止樹脂が封入されているこ
とを特徴とする半導体装置のパツケージ構造。[Scope of Claim for Utility Model Registration] 1. In a package of a semiconductor device assembled by covering a metal base on which a semiconductor element is mounted with a case made of an insulating material and bonding the two with adhesive, the metal base and the case A package structure for a semiconductor device, characterized in that a recessed portion serving as an adhesive reservoir is formed on the bonding surface between the semiconductor device and the bonding surface. 2. The package structure according to claim 1,
A package structure for a semiconductor device, characterized in that a concave portion is formed as a concave groove over the entire circumference of a joint surface of a case. 3. In the package structure according to claim 1,
A package structure for a semiconductor device characterized by a gel-like sealing resin sealed inside the case.
JP1990113810U 1990-10-30 1990-10-30 Package structure of semiconductor device Expired - Lifetime JP2505068Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990113810U JP2505068Y2 (en) 1990-10-30 1990-10-30 Package structure of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990113810U JP2505068Y2 (en) 1990-10-30 1990-10-30 Package structure of semiconductor device

Publications (2)

Publication Number Publication Date
JPH0470752U true JPH0470752U (en) 1992-06-23
JP2505068Y2 JP2505068Y2 (en) 1996-07-24

Family

ID=31861426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990113810U Expired - Lifetime JP2505068Y2 (en) 1990-10-30 1990-10-30 Package structure of semiconductor device

Country Status (1)

Country Link
JP (1) JP2505068Y2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051560A (en) * 2001-08-03 2003-02-21 Fuji Electric Co Ltd Semiconductor device package
JP2008147234A (en) * 2006-12-06 2008-06-26 Denso Corp Cap fixing method of semiconductor substrate
JP2011096750A (en) * 2009-10-28 2011-05-12 Shizuki Electric Co Inc Capacitor
JP2011205270A (en) * 2010-03-25 2011-10-13 Nippon Dempa Kogyo Co Ltd Piezoelectric device
WO2018055667A1 (en) * 2016-09-20 2018-03-29 三菱電機株式会社 Semiconductor device
JP2019096797A (en) * 2017-11-27 2019-06-20 三菱電機株式会社 Semiconductor device and power conversion apparatus
JP2020088141A (en) * 2018-11-26 2020-06-04 京セラ株式会社 Package for housing semiconductor element and semiconductor device
JP2023061442A (en) * 2021-10-20 2023-05-02 富士電機株式会社 Semiconductor device and method for manufacturing semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553617A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit
JPS63100842U (en) * 1986-12-19 1988-06-30
JPH01165145A (en) * 1987-12-21 1989-06-29 Mitsubishi Electric Corp Semiconductor device
JPH02109418A (en) * 1988-10-19 1990-04-23 Toshiba Corp Time count circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553617A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit
JPS63100842U (en) * 1986-12-19 1988-06-30
JPH01165145A (en) * 1987-12-21 1989-06-29 Mitsubishi Electric Corp Semiconductor device
JPH02109418A (en) * 1988-10-19 1990-04-23 Toshiba Corp Time count circuit

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051560A (en) * 2001-08-03 2003-02-21 Fuji Electric Co Ltd Semiconductor device package
JP2008147234A (en) * 2006-12-06 2008-06-26 Denso Corp Cap fixing method of semiconductor substrate
JP2011096750A (en) * 2009-10-28 2011-05-12 Shizuki Electric Co Inc Capacitor
JP2011205270A (en) * 2010-03-25 2011-10-13 Nippon Dempa Kogyo Co Ltd Piezoelectric device
WO2018055667A1 (en) * 2016-09-20 2018-03-29 三菱電機株式会社 Semiconductor device
JPWO2018055667A1 (en) * 2016-09-20 2019-02-28 三菱電機株式会社 Semiconductor device
CN109716516A (en) * 2016-09-20 2019-05-03 三菱电机株式会社 semiconductor device
US10748830B2 (en) 2016-09-20 2020-08-18 Mitsubishi Electric Corporation Semiconductor device
CN109716516B (en) * 2016-09-20 2023-05-23 三菱电机株式会社 Semiconductor device
JP2019096797A (en) * 2017-11-27 2019-06-20 三菱電機株式会社 Semiconductor device and power conversion apparatus
JP2020088141A (en) * 2018-11-26 2020-06-04 京セラ株式会社 Package for housing semiconductor element and semiconductor device
JP2023061442A (en) * 2021-10-20 2023-05-02 富士電機株式会社 Semiconductor device and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
JP2505068Y2 (en) 1996-07-24

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