JPH01113354U - - Google Patents
Info
- Publication number
- JPH01113354U JPH01113354U JP1988009351U JP935188U JPH01113354U JP H01113354 U JPH01113354 U JP H01113354U JP 1988009351 U JP1988009351 U JP 1988009351U JP 935188 U JP935188 U JP 935188U JP H01113354 U JPH01113354 U JP H01113354U
- Authority
- JP
- Japan
- Prior art keywords
- container
- metal
- center
- metal column
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
Description
第１図ａ，ｂは本考案の第１の実施例の平面図
及びＡ―Ａ′線断面図、第２図は本考案の第２の
実施例の断面図、第３図は従来の半導体集積回路
用パツケージの一例の断面図である。 １……容器、２……メタライズ部、３……金属
柱、４……ピン、５……台座、６……ステイツチ
部、７……ねじ穴。
及びＡ―Ａ′線断面図、第２図は本考案の第２の
実施例の断面図、第３図は従来の半導体集積回路
用パツケージの一例の断面図である。 １……容器、２……メタライズ部、３……金属
柱、４……ピン、５……台座、６……ステイツチ
部、７……ねじ穴。
Claims (1)
- セラミツク製の容器と、前記容器の中央部に形
成された貫通孔に埋設された金属柱と、前記容器
底面中央部に形成された半導体チツプ固着用のメ
タライズ部と、前記容器裏面に固着され、かつ金
属柱と接続された金属製の台座とを含むことを特
徴とする半導体集積回路用パツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988009351U JPH01113354U (ja) | 1988-01-26 | 1988-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988009351U JPH01113354U (ja) | 1988-01-26 | 1988-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113354U true JPH01113354U (ja) | 1989-07-31 |
Family
ID=31216025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988009351U Pending JPH01113354U (ja) | 1988-01-26 | 1988-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113354U (ja) |
-
1988
- 1988-01-26 JP JP1988009351U patent/JPH01113354U/ja active Pending