JPH01113387U - - Google Patents
Info
- Publication number
- JPH01113387U JPH01113387U JP865188U JP865188U JPH01113387U JP H01113387 U JPH01113387 U JP H01113387U JP 865188 U JP865188 U JP 865188U JP 865188 U JP865188 U JP 865188U JP H01113387 U JPH01113387 U JP H01113387U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- wiring board
- multilayer wiring
- ceramic substrate
- density multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の高密度多層配線基板の一実施
例の縦断面図、第２図は高密度多層配線基板の従
来例の縦断面図、第３図は第２図の１部の拡大図
である。
１……セラミツク基板、２……第１導体層、３
……第１絶縁層、４……第２導体層、５……第２
絶縁層、６……第３導体層、７……第３絶縁層、
８……第４導体層。
Fig. 1 is a longitudinal cross-sectional view of an embodiment of the high-density multilayer wiring board of the present invention, Fig. 2 is a longitudinal cross-sectional view of a conventional example of the high-density multilayer wiring board, and Fig. 3 is an enlarged portion of Fig. 2. It is a diagram. 1... Ceramic substrate, 2... First conductor layer, 3
...first insulating layer, 4...second conductor layer, 5...second
Insulating layer, 6... Third conductor layer, 7... Third insulating layer,
8... Fourth conductor layer.
Claims (1)
れている高密度多層配線基板において、 下層の絶縁層の端部をセラミツク基板の上面に
達するまで覆う絶縁層を有することを特徴とする
高密度多層配線基板。[Claim for Utility Model Registration] A high-density multilayer wiring board in which a polyimide insulating layer is used on a ceramic substrate, characterized by having an insulating layer that covers the edge of the lower insulating layer up to the top surface of the ceramic substrate. High-density multilayer wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP865188U JPH01113387U (en) | 1988-01-25 | 1988-01-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP865188U JPH01113387U (en) | 1988-01-25 | 1988-01-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113387U true JPH01113387U (en) | 1989-07-31 |
Family
ID=31214719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP865188U Pending JPH01113387U (en) | 1988-01-25 | 1988-01-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113387U (en) |
-
1988
- 1988-01-25 JP JP865188U patent/JPH01113387U/ja active Pending
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