JPH01115253U - - Google Patents
Info
- Publication number
- JPH01115253U JPH01115253U JP1988011002U JP1100288U JPH01115253U JP H01115253 U JPH01115253 U JP H01115253U JP 1988011002 U JP1988011002 U JP 1988011002U JP 1100288 U JP1100288 U JP 1100288U JP H01115253 U JPH01115253 U JP H01115253U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- element mounting
- mounting portion
- lead frame
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/331—Shapes of die-attach connectors
- H10W72/334—Cross-sectional shape, i.e. in side view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリードフレームの半導体素子
載置部の平面図、第２図は本考案のリードフレー
ムの半導体素子載置部のＸ１―Ｘ１断面図、第３
図は、従来のリードフレームの半導体素子載置部
の平面図、第４図は、従来のリードフレームの半
導体素子載置部のＸ２―Ｘ２断面図、第５図は、
ダイボンド用接着剤の一配置例図、第６図は異常
なダイボンデイング図である。
１……正常なダイボンド用接着剤位置、２……
異常なダイボンド用接着剤位置、３……半導体素
子、４……半導体素子によつて押し出されたダイ
ボンド用接着剤、５……半導体素子載置部、６…
…ダイボンド用接着剤未充填部分、７……半導体
素子載置部の窪み。
FIG. 1 is a plan view of the semiconductor element mounting portion of the lead frame of the present invention, FIG. 2 is a cross-sectional view along X 1 -
The figure is a plan view of a semiconductor element mounting portion of a conventional lead frame, FIG. 4 is a cross - sectional view along X 2 -
FIG. 6, which is an example of the layout of die bonding adhesive, is an abnormal die bonding diagram. 1... Normal die bonding adhesive position, 2...
Abnormal die-bonding adhesive position, 3... semiconductor element, 4... die-bonding adhesive pushed out by the semiconductor element, 5... semiconductor element mounting part, 6...
...A portion not filled with adhesive for die bonding, 7...A recess in the semiconductor element mounting portion.
Claims (1)
特徴とする半導体装置用リードフレーム。 A lead frame for a semiconductor device, characterized in that a recess is formed in a semiconductor element mounting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011002U JPH01115253U (en) | 1988-01-28 | 1988-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011002U JPH01115253U (en) | 1988-01-28 | 1988-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115253U true JPH01115253U (en) | 1989-08-03 |
Family
ID=31219170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988011002U Pending JPH01115253U (en) | 1988-01-28 | 1988-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115253U (en) |
-
1988
- 1988-01-28 JP JP1988011002U patent/JPH01115253U/ja active Pending