JPH024258U - - Google Patents
Info
- Publication number
- JPH024258U JPH024258U JP8181288U JP8181288U JPH024258U JP H024258 U JPH024258 U JP H024258U JP 8181288 U JP8181288 U JP 8181288U JP 8181288 U JP8181288 U JP 8181288U JP H024258 U JPH024258 U JP H024258U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- semiconductor device
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のリードフレームの一実施例の
縦断面図、第２図は従来のリードフレームの縦断
面図。
１……リードフレーム構成部品１、２……リー
ドフレーム構成部品２、３……樹脂封止形半導体
装置、４……アイランド、５……チツプ、７……
ワイヤ、８……従来のリードフレーム。
FIG. 1 is a longitudinal sectional view of an embodiment of the lead frame of the present invention, and FIG. 2 is a longitudinal sectional view of a conventional lead frame. 1... Lead frame components 1, 2... Lead frame components 2, 3... Resin-sealed semiconductor device, 4... Island, 5... Chip, 7...
Wire, 8... Conventional lead frame.
Claims (1)
た個片を線伏に連結されてなることを特徴とする
樹脂封止形半導体装置。 A resin-sealed semiconductor device characterized in that a lead frame contained within a resin is formed by connecting independent pieces in a line-shaped manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8181288U JPH024258U (en) | 1988-06-20 | 1988-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8181288U JPH024258U (en) | 1988-06-20 | 1988-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH024258U true JPH024258U (en) | 1990-01-11 |
Family
ID=31306582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8181288U Pending JPH024258U (en) | 1988-06-20 | 1988-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024258U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5271826U (en) * | 1975-11-25 | 1977-05-28 | ||
| JP3011222U (en) * | 1994-11-16 | 1995-05-23 | 株式会社ビブサカモト | apron |
-
1988
- 1988-06-20 JP JP8181288U patent/JPH024258U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5271826U (en) * | 1975-11-25 | 1977-05-28 | ||
| JP3011222U (en) * | 1994-11-16 | 1995-05-23 | 株式会社ビブサカモト | apron |