JPH01116477U - - Google Patents
Info
- Publication number
- JPH01116477U JPH01116477U JP1102088U JP1102088U JPH01116477U JP H01116477 U JPH01116477 U JP H01116477U JP 1102088 U JP1102088 U JP 1102088U JP 1102088 U JP1102088 U JP 1102088U JP H01116477 U JPH01116477 U JP H01116477U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flux
- prevention film
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 claims description 7
- 230000002265 prevention Effects 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 238000007689 inspection Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図Ａは本考案に係るプリント配線板の平面
図、第１図Ｂは同正面図である。
図中、１…プリント配線板、２…基体、３…導
体パターン、４…フラツクスの這い上がり防止膜
、５…透孔、６…這い上がり防止膜の存在しない
箇所、７…検印。
FIG. 1A is a plan view of a printed wiring board according to the present invention, and FIG. 1B is a front view thereof. In the figure, 1...Printed wiring board, 2...Substrate, 3...Conductor pattern, 4...Flux creep-up prevention film, 5...Through hole, 6...Point where creep-up prevention film does not exist, 7...Inspection mark.
Claims (1)
面にフラツクスの這い上がり防止膜を形成したプ
リント配線板において、スタンプの押印箇所には
フラツクスの這い上がり防止膜を有しないことを
特徴としたプリント配線板。 (2) 一方の面に導体パターンを形成し、他方の
面にフラツクスの這い上がり防止膜を形成したプ
リント配線板において、スタンプの押印箇所以外
の全面にフラツクスの這い上がり防止膜を形成し
たことを特徴とするプリント配線板。 (3) 一方の面に導体パターンを形成し、他方の
面にフラツクスの這い上がり防止膜を形成したプ
リント配線板において、他方の面にフラツクスの
這い上がり防止膜が存在しない箇所を設け、当該
箇所にスタンプを押印したことを特徴とするプリ
ント配線板。[Scope of Claim for Utility Model Registration] (1) In a printed wiring board in which a conductive pattern is formed on one surface and a film to prevent flux from creeping up is formed on the other surface, the part where the stamp is affixed prevents flux from creeping up. A printed wiring board characterized by not having a film. (2) In a printed wiring board that has a conductor pattern formed on one side and a flux creep prevention film formed on the other side, it is confirmed that the flux creep prevention film is formed on the entire surface other than the stamped area. Features printed wiring board. (3) In a printed wiring board in which a conductor pattern is formed on one surface and a flux creep-up prevention film is formed on the other surface, a portion is provided on the other surface where no flux creep-up prevention film is present, and the A printed wiring board characterized by having a stamp affixed to it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1102088U JPH01116477U (en) | 1988-01-29 | 1988-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1102088U JPH01116477U (en) | 1988-01-29 | 1988-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01116477U true JPH01116477U (en) | 1989-08-07 |
Family
ID=31219202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1102088U Pending JPH01116477U (en) | 1988-01-29 | 1988-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01116477U (en) |
-
1988
- 1988-01-29 JP JP1102088U patent/JPH01116477U/ja active Pending