JPH02132969U - - Google Patents
Info
- Publication number
- JPH02132969U JPH02132969U JP4165189U JP4165189U JPH02132969U JP H02132969 U JPH02132969 U JP H02132969U JP 4165189 U JP4165189 U JP 4165189U JP 4165189 U JP4165189 U JP 4165189U JP H02132969 U JPH02132969 U JP H02132969U
- Authority
- JP
- Japan
- Prior art keywords
- resist
- circuit board
- terminal portion
- conductive pattern
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図はこの考案の回路基板を示す要部平面図
、第２図は第１図のＡ−Ａ断面図、第３図は従来
の回路基板の要部平面図である。
１０……基板、１１……金属パターン、１２…
…レジスト、１４……カーボンインク、１５……
導電パターン。
FIG. 1 is a plan view of the main parts of the circuit board of this invention, FIG. 2 is a sectional view taken along the line AA in FIG. 1, and FIG. 3 is a plan view of the main parts of the conventional circuit board. 10...Substrate, 11...Metal pattern, 12...
...Resist, 14...Carbon ink, 15...
conductive pattern.
Claims (1)
け、前記端子部から前記レジストに亘り導電性イ
ンクを印刷して導電パターンを形成する回路基板
において、 前記各端子部に対する前記レジストの境界位置
を、隣り合う端子部に対して前記導電パターンの
長手方向においてずらしたことを特徴とする回路
基板。[Claims for Utility Model Registration] A circuit board in which a resist is provided on a metal pattern leaving terminal portions, and conductive ink is printed from the terminal portion to the resist to form a conductive pattern, comprising: A circuit board characterized in that a boundary position of the resist is shifted in a longitudinal direction of the conductive pattern with respect to an adjacent terminal portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4165189U JPH02132969U (en) | 1989-04-11 | 1989-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4165189U JPH02132969U (en) | 1989-04-11 | 1989-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132969U true JPH02132969U (en) | 1990-11-05 |
Family
ID=31552502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4165189U Pending JPH02132969U (en) | 1989-04-11 | 1989-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132969U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007123475A (en) * | 2005-10-27 | 2007-05-17 | Nippon Seiki Co Ltd | Circuit board |
| JP2011166073A (en) * | 2010-02-15 | 2011-08-25 | Fujikura Ltd | Method of manufacturing printed wiring board and the printed wiring board |
-
1989
- 1989-04-11 JP JP4165189U patent/JPH02132969U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007123475A (en) * | 2005-10-27 | 2007-05-17 | Nippon Seiki Co Ltd | Circuit board |
| JP2011166073A (en) * | 2010-02-15 | 2011-08-25 | Fujikura Ltd | Method of manufacturing printed wiring board and the printed wiring board |