JPH01118445U - - Google Patents
Info
- Publication number
- JPH01118445U JPH01118445U JP1348888U JP1348888U JPH01118445U JP H01118445 U JPH01118445 U JP H01118445U JP 1348888 U JP1348888 U JP 1348888U JP 1348888 U JP1348888 U JP 1348888U JP H01118445 U JPH01118445 U JP H01118445U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- conductor
- groove
- conductor paste
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
図面はこの考案の実施例を示すもので、第１図
はこの考案の第一実施例を示す面実装型電子部品
パツケージの製造工程を表す断面図、第２図はこ
の考案の第一実施例を示す一部拡大断面図、第３
図この考案の第一実施例を示す平面図、第４図は
第３図Ａ―Ａ線断面図、第５図は第３図Ｂ―Ｂ線
断面図、第６図は第二実施例を示す断面図、第７
図は第二実施例を示す平面図、第８図は第７図Ｃ
―Ｃ線断面図である。
１…電極引き出し用溝部、２…エツチング溝内
導体、３…ガラス絶縁体、４…環状の気密封止用
電極導体、５…フアインセラミツクスの焼結基板
、６…凹み、７…電極接続部、８…外部電極接続
端子、２１…内縁上面、２２…外縁上面、２３…
外端面。
The drawings show embodiments of this invention. Fig. 1 is a sectional view showing the manufacturing process of a surface-mounted electronic component package showing the first embodiment of this invention, and Fig. 2 shows the first embodiment of this invention. Partially enlarged sectional view showing 3rd
Figure 4 is a plan view showing the first embodiment of this invention; Figure 4 is a sectional view taken along line AA in Figure 3; Figure 5 is a sectional view taken along line B-B in Figure 3; Figure 6 is a sectional view showing the second embodiment. Sectional view shown, No. 7
The figure is a plan view showing the second embodiment, and Figure 8 is Figure 7C.
-C line sectional view. DESCRIPTION OF SYMBOLS 1...Groove for electrode extraction, 2...Conductor in the etching groove, 3...Glass insulator, 4...Annular electrode conductor for airtight sealing, 5...Sintered substrate of fine ceramics, 6...Recess, 7...Electrode connection part , 8... External electrode connection terminal, 21... Inner edge upper surface, 22... Outer edge upper surface, 23...
Outer end surface.
Claims (1)
インセラミツクスの焼結基板上表面の一部にエツ
チング等により素子と外部電極に接続する端子と
するための電極線の引き出し用として加工した電
極引き出し用溝部と、この電極引き出し用溝部内
に銀導体ペーストまたは銅導体ペーストを用いて
厚膜導体印刷してなる電極導体と、該電極導体表
面上に絶縁体としてクロスオーバーガラスにて該
溝を埋めてパツケージ表面を平らとなるように印
刷されたガラス絶縁体と、更に該ガラス絶縁体上
に銀導体ペーストまたは銅導体ペーストを用いて
厚膜導体印刷してなる環状の気密封止用電極導体
とからなることを特徴とする面実装型電子部品パ
ツケージ。 A sintered substrate of fine ceramics, and a groove for drawing out an electrode, which is formed by etching or the like on a part of the upper surface of the sintered substrate of fine ceramics, for drawing out an electrode wire to be used as a terminal to connect to an element and an external electrode. Then, an electrode conductor is formed by printing a thick film conductor using silver conductor paste or copper conductor paste in the groove for leading out the electrode, and a package is formed by filling the groove with crossover glass as an insulator on the surface of the electrode conductor. Consists of a glass insulator printed with a flat surface, and a ring-shaped electrode conductor for airtight sealing made by printing a thick film conductor on the glass insulator using silver conductor paste or copper conductor paste. A surface-mounted electronic component package characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1348888U JPH0540582Y2 (en) | 1988-02-02 | 1988-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1348888U JPH0540582Y2 (en) | 1988-02-02 | 1988-02-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01118445U true JPH01118445U (en) | 1989-08-10 |
| JPH0540582Y2 JPH0540582Y2 (en) | 1993-10-14 |
Family
ID=31516902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1348888U Expired - Lifetime JPH0540582Y2 (en) | 1988-02-02 | 1988-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0540582Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087928A (en) * | 2008-09-30 | 2010-04-15 | Citizen Finetech Miyota Co Ltd | Piezoelectric device |
| JP2011193291A (en) * | 2010-03-15 | 2011-09-29 | Seiko Instruments Inc | Package, and method of manufacturing package |
-
1988
- 1988-02-02 JP JP1348888U patent/JPH0540582Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087928A (en) * | 2008-09-30 | 2010-04-15 | Citizen Finetech Miyota Co Ltd | Piezoelectric device |
| JP2011193291A (en) * | 2010-03-15 | 2011-09-29 | Seiko Instruments Inc | Package, and method of manufacturing package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0540582Y2 (en) | 1993-10-14 |
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