JPH01121864U - - Google Patents

Info

Publication number
JPH01121864U
JPH01121864U JP1988017653U JP1765388U JPH01121864U JP H01121864 U JPH01121864 U JP H01121864U JP 1988017653 U JP1988017653 U JP 1988017653U JP 1765388 U JP1765388 U JP 1765388U JP H01121864 U JPH01121864 U JP H01121864U
Authority
JP
Japan
Prior art keywords
solderable
chip
box
outer surfaces
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988017653U
Other languages
English (en)
Other versions
JPH065637Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988017653U priority Critical patent/JPH065637Y2/ja
Priority to US07/301,782 priority patent/US4903830A/en
Publication of JPH01121864U publication Critical patent/JPH01121864U/ja
Application granted granted Critical
Publication of JPH065637Y2 publication Critical patent/JPH065637Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図イ〜ハは本考案の実施例の斜視図、第１
図ニは第１図イの断面図、第２図イ〜ハは本考案
のマウンタによるマウントの説明図、第３図イは
従来例のマウンタによる検出の説明図、第３図ロ
従来例の断面図、第４図イ〜ハは従来例の実施例
の斜視図、第４図ニは従来例の実施例の断面図、
第５図イ、ロは従来例のマウンタによるマウント
の説明図、第６図は従来例の使用説明図。 １１，３４，４１……はんだ付不可能な金属、
１２，３５，４２……はんだ付可能な金属、５，
８，９，５４……吸着面。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一面がはんだ付可能で他の一面がはんだ付不可
    能な金属板よりなり、はんだ付不可能な面を内側
    にして断面箱型の筒体となし、外側面の少なくと
    も一面に吸着面としたチツプ部品において、前記
    吸着面を金属板を重ねて形成したことを特徴とす
    るチツプ部品。
JP1988017653U 1988-02-12 1988-02-12 チップ部品 Expired - Lifetime JPH065637Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988017653U JPH065637Y2 (ja) 1988-02-12 1988-02-12 チップ部品
US07/301,782 US4903830A (en) 1988-02-12 1989-01-25 Automatic mounting chip component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988017653U JPH065637Y2 (ja) 1988-02-12 1988-02-12 チップ部品

Publications (2)

Publication Number Publication Date
JPH01121864U true JPH01121864U (ja) 1989-08-18
JPH065637Y2 JPH065637Y2 (ja) 1994-02-09

Family

ID=11949812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988017653U Expired - Lifetime JPH065637Y2 (ja) 1988-02-12 1988-02-12 チップ部品

Country Status (2)

Country Link
US (1) US4903830A (ja)
JP (1) JPH065637Y2 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5182851A (en) * 1986-12-03 1993-02-02 Sgs-Thomson Microelectronics, Inc. Method for holding a strip of conductive lead frames
JPH11204171A (ja) * 1998-01-16 1999-07-30 Kyoshin Kogyo Kk チップ部品
US20200078400A1 (en) 2016-12-03 2020-03-12 Juno Therapeutics, Inc. Methods for determining car-t cells dosing
WO2021113770A1 (en) 2019-12-06 2021-06-10 Juno Therapeutics, Inc. Methods related to toxicity and response associated with cell therapy for treating b cell malignancies
WO2025147545A1 (en) 2024-01-03 2025-07-10 Juno Therapeutics, Inc. Lipid nanoparticles for delivery of nucleic acids and related methods and uses

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121671U (ja) * 1984-01-25 1985-08-16 三洋電機株式会社 電子部品の自動装着装置
JPS62222649A (ja) * 1986-03-25 1987-09-30 Mitsubishi Electric Corp チツプ吸着装置
JPS62192266U (ja) * 1986-05-26 1987-12-07

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164778A (en) * 1976-07-20 1979-08-14 Matsushita Electric Industrial Co., Ltd. Printed circuit board
DE2711848C2 (de) * 1977-03-18 1979-03-22 Kernforschungsanlage Juelich Gmbh, 5170 Juelich Röntgenröhrendrehanode
US4118595A (en) * 1977-06-06 1978-10-03 Bell Telephone Laboratories, Incorporated Crossovers and method of fabrication
US4709297A (en) * 1984-06-29 1987-11-24 Siemens Aktiengesellschaft Guiding device for semiconductor components with DIL casings
US4762606A (en) * 1985-04-12 1988-08-09 Hughes Aircraft Company Mini chip carrier slotted array
US4814943A (en) * 1986-06-04 1989-03-21 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
US4837184A (en) * 1988-01-04 1989-06-06 Motorola Inc. Process of making an electronic device package with peripheral carrier structure of low-cost plastic

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121671U (ja) * 1984-01-25 1985-08-16 三洋電機株式会社 電子部品の自動装着装置
JPS62222649A (ja) * 1986-03-25 1987-09-30 Mitsubishi Electric Corp チツプ吸着装置
JPS62192266U (ja) * 1986-05-26 1987-12-07

Also Published As

Publication number Publication date
JPH065637Y2 (ja) 1994-02-09
US4903830A (en) 1990-02-27

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