JPH011223A - Chip type solid electrolytic capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a homogeneous electrolytic capacitor element in which an oxide film, a semiconductor layer, a cathode layer, etc. are sequentially formed on one anode body made of a sintered body of valve-acting group R powder. A chip-shaped solid with a cathode side external terminal connected to r via a 4-electrode contacting agent on both sides, an anode side external terminal r- fixed to an anode lead wire implanted in the anode body, and a resin exterior applied. This is about electrolytic capacitors.

[Prior art] A general dip-type solid-state 'π solution capacitor is
4 as shown in the figure. This chip-type solid electrolytic capacitor 1 has a tank i, an anode body 2 made by press-molding metal powder such as aluminum or niobium into a cylindrical shape and sintering it. The same type of metal wire is planted as the anode lead wire 3, and the surface of the anode body 2 is sequentially coated with an oxide film layer 21 as a dielectric layer, an f-conductor layer 22 such as a manganese dioxide layer or a lead oxide layer, and a rough conductor layer 22. A national electrolytic capacitor element 4 is constructed by forming a cathode layer 23 consisting of a graphite layer, a silver paste layer, etc.
The structure is such that the cathode side external terminal 6 is firmly fixed via the anode side external terminal 6, the anode side external end (-7) is welded to the anode lead wire 3, and a resin outer device is applied.

[Intermediate point of trying to invent or solve] Next, as the external end F6.7, there are two cases: ■ Use a piece of nickel silver board etc. that has been treated with a semi-f-metal rome finish.
(2) There are cases in which a final finish of f-iH plating is used and I'-rH plating is applied after applying a resin outer device.

When the chip-knob type solid electrolytic capacitor 1 is mounted on a printed wiring board etc., the cathode side external terminal 6 is plated in response to external heat such as a melted single ITJ. There is a problem in that this melts and creates a gap between the external terminal 6 and the isoelectrolytic capacitor element r4, resulting in new wire defects and loss angle tangent defects.

■The chip type integral electrolytic capacitor 1 has external terminals 6.
7. During the process of plating, cyanide, sulfuric acid, nitric acid, etc. penetrate into the resin outer bag 8, which has a negative effect on reliability, and also causes poor workability, resulting in poor product quality. It has the disadvantage of being expensive.

[Means for Solving the Problems] However, the present invention provides a chip-shaped solid according to the above-mentioned (2):
In order to solve the problems of broken wires and loss angle tangent defects in L-type capacitors, a chip type is used in which there is no semi-11 plating on the bonding part of the external end f on the cathode side to the solid electrolytic capacitor element. The present invention provides solid electrolytic capacitors.

[Example] Hereinafter, based on FIG. 1, a chip type 1^I according to the present invention
The body electrolytic capacitor IA will be explained.

As in the prior art, the solid electrolytic capacitor element f4 is constructed by sequentially forming an oxide film 21, a conductor layer 22, a cathode layer 23, etc. on the surface of the anode body 2 on which the anode lead wire 3 is implanted.

direction,? Mef-ITJ plating 61, 71 Kasole Sore! The cathode side external terminal 6 and the anode side external end T-7 are connected to each other. In this case, the solid body '1 of the cathode side external terminal 6;
At the adhesive part 62 with the TE solution capacitor Soryo 4: t'-[
Does not form JI plating. As this adhesive part 62,
There are two methods: one is to apply a mask to prevent the formation of 1fZII plating, and the other is to remove the solder plated material by mechanical processing such as router processing or laser processing, or optical processing. .

Next, the adhesive part 62 between the solid electrolytic capacitor finish 4 and the cathode outer end f6 is bonded with a conductive adhesive 5, and the anode lead wire 3 and the anode side outer end L7 are welded, and the resin outer end f6 is welded.
A8 is formed.

[Effect] According to such a chip type solid electrolytic capacitor 1A,
Since the bonding part 62 of the cathode side external end -r6 with the solid electrolytic capacitor element f4 is not plated with V-plating, the cathode side external end 'f-6' is not plated even when the component is mounted with *11J. Since the solid electrolytic capacitor element and the solid electrolytic capacitor element are firmly attached, it is possible to significantly reduce the number of defects such as disconnection and loss angle tangent defects as in the past.

4. Explanation of Portion of Port Ia' FIG. 1 is a cross-sectional view of a chip-type solid-state electrolytic capacitor according to the present invention, and FIG. 2 is a cross-sectional view of a conventional chip-type solid-state electrolytic capacitor.

During 1st year, 1. IA...Chip-carved solid electrolytic capacitor, 2...i anode body, 3...Anode lead wire, 4,...
・Solid electrolytic capacitor #f, 5...J, da"
1i, 'sexual adhesion/fi1, 6.7...external end failure, 8
...Resin exterior, 61...1 plating.

62...Adhesive part.

Claims (1)

[Claims] (1) A solid electrolytic capacitor element in which an oxide film, a semiconductor layer, a cathode layer, etc. are sequentially formed on an anode body made of a sintered body of valve action metal powder, and solder plating is formed on the cathode side exterior using a conductive adhesive. In a chip type solid electrolytic capacitor in which the terminal is fixed, the anode side external end T is fixed to the anode lead wire implanted in the anode body, and the resin exterior is applied, the adhesive part of the cathode side external terminal with the solid electrolytic capacitor element. This is a chip-type solid electrolytic capacitor characterized by the fact that no solder plating is formed on it.