JPH01123343U - - Google Patents

Info

Publication number
JPH01123343U
JPH01123343U JP1988019143U JP1914388U JPH01123343U JP H01123343 U JPH01123343 U JP H01123343U JP 1988019143 U JP1988019143 U JP 1988019143U JP 1914388 U JP1914388 U JP 1914388U JP H01123343 U JPH01123343 U JP H01123343U
Authority
JP
Japan
Prior art keywords
heater block
metal foil
window hole
tape guide
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988019143U
Other languages
Japanese (ja)
Other versions
JPH0526751Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988019143U priority Critical patent/JPH0526751Y2/ja
Publication of JPH01123343U publication Critical patent/JPH01123343U/ja
Application granted granted Critical
Publication of JPH0526751Y2 publication Critical patent/JPH0526751Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導体製造装着の一実施
例を示す断面図、第２図及び第３図は第１図装置
の各動作説明図である。第４図はＴＡＢリード型
半導体装置を示す斜視図、第５図は半導体製造装
置の従来例を示す断面図、第６図及び第７図は第
５図装置の各動作説明図である。 １……半導体ペレツト、２……ＴＡＢテープ、
４……絶縁フイルム、５……金属箔リード、６…
…窓孔、７……テープガイド、９……ヒータブロ
ツク、１０……ヒータチツプ、１１……シヤツタ
ー。 FIG. 1 is a cross-sectional view showing an embodiment of the semiconductor manufacturing and mounting apparatus according to the present invention, and FIGS. 2 and 3 are explanatory views of each operation of the apparatus shown in FIG. 1. FIG. 4 is a perspective view showing a TAB lead type semiconductor device, FIG. 5 is a sectional view showing a conventional example of a semiconductor manufacturing device, and FIGS. 6 and 7 are explanatory views of each operation of the device shown in FIG. 1... Semiconductor pellet, 2... TAB tape,
4...Insulating film, 5...Metal foil lead, 6...
... Window hole, 7 ... Tape guide, 9 ... Heater block, 10 ... Heater chip, 11 ... Shutter.

Claims (1)

【実用新案登録請求の範囲】 窓孔を有する絶縁フイルム上に窓孔内に一端を
延在させて金属箔リードを被着形成したＴＡＢテ
ープをテープガイドにて半導体ペレツトが載置さ
れたヒータブロツク上にガイドし、金属箔リード
の一端部と半導体ペレツト上の電極とをヒータチ
ツプにて熱圧着するものにおいて、 上記テープガイドとヒータブロツク間にヒータ
ブロツクからの熱を遮蔽するシヤツターを退入自
在に配置したことを特徴とする半導体製造装置。[Claims for Utility Model Registration] A heater block on which a semiconductor pellet is placed using a TAB tape, which is made of an insulating film having a window hole and a metal foil lead attached thereto with one end extending into the window hole, using a tape guide. In the case where one end of the metal foil lead and the electrode on the semiconductor pellet are bonded by thermocompression using a heater chip, a shutter that shields the heat from the heater block can be inserted and retracted between the tape guide and the heater block. A semiconductor manufacturing device characterized by the following arrangement.
JP1988019143U 1988-02-15 1988-02-15 Expired - Lifetime JPH0526751Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988019143U JPH0526751Y2 (en) 1988-02-15 1988-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988019143U JPH0526751Y2 (en) 1988-02-15 1988-02-15

Publications (2)

Publication Number Publication Date
JPH01123343U true JPH01123343U (en) 1989-08-22
JPH0526751Y2 JPH0526751Y2 (en) 1993-07-07

Family

ID=31234392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988019143U Expired - Lifetime JPH0526751Y2 (en) 1988-02-15 1988-02-15

Country Status (1)

Country Link
JP (1) JPH0526751Y2 (en)

Also Published As

Publication number Publication date
JPH0526751Y2 (en) 1993-07-07

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