JPH01123732A - Manufacture of laminated sheet - Google Patents
Manufacture of laminated sheetInfo
- Publication number
- JPH01123732A JPH01123732A JP62282755A JP28275587A JPH01123732A JP H01123732 A JPH01123732 A JP H01123732A JP 62282755 A JP62282755 A JP 62282755A JP 28275587 A JP28275587 A JP 28275587A JP H01123732 A JPH01123732 A JP H01123732A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- long
- laminate
- impregnated
- bases
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000011888 foil Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 12
- 239000010409 thin film Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000007872 degassing Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 10
- 239000004744 fabric Substances 0.000 abstract description 7
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000004342 Benzoyl peroxide Substances 0.000 abstract description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 abstract description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 238000005470 impregnation Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000012209 synthetic fiber Substances 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000009965 tatting Methods 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電子機器、電気機器、コンピューター、通信機
器等に用すられる積層板の製造方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a laminate used in electronic equipment, electrical equipment, computers, communication equipment, etc.
従来、電気機器等にポーられる積層板は樹脂含浸基材と
金属箔とからなる積層体を多段プレスを用い長時間(1
〜2時間)加熱加圧成形して得られるため、樹脂中に包
含されていた気泡が樹脂含浸基材内に残留気泡となって
存在していても長時間の加熱加圧成形で積層体外に排出
されるので、硬化物である積層板には気泡が残留せず緻
密な積層板が得られていた。しかるに積層板を連続的和
製造しようとする場合は硬化工程で長時間を資すことは
設備が長大なものとなり実際不可能である。Conventionally, laminates used in electrical equipment, etc., are made of a resin-impregnated base material and metal foil, and are pressed for a long period of time (1
(~2 hours) Because it is obtained by heat-pressing molding, even if the air bubbles contained in the resin remain as residual bubbles in the resin-impregnated base material, they will not be removed from the laminate by long-term heat-pressing molding. Since the resin was discharged, no air bubbles remained in the cured laminate, and a dense laminate was obtained. However, if laminates are to be produced continuously, it is actually impossible to spend a long time in the curing process because the equipment would be too long.
このため硬化時間の極度に短か匹樹脂を用いたり、一応
切断可能な硬度が得られる程度に硬化させた後、所要寸
法に切断後、積層板を更にアフターキュアーして硬化を
完全ならしめることが行なわれてbる。しかし各れの方
法であっても樹脂中に包含されて論だ気泡による樹脂含
浸基材内の残留気泡を積層板外に排出することは不可能
であ・λだ。For this reason, it is necessary to use a resin with an extremely short curing time, or to cure it to a degree that allows it to be cut, then cut it to the required size, and then further after-cure the laminate to ensure complete curing. is carried out. However, no matter which method is used, it is impossible to discharge the residual air bubbles in the resin-impregnated base material to the outside of the laminate due to the air bubbles contained in the resin.
積層板内の気泡は耐湿性を憾度に低下させ%積層板を印
刷配線板に加工する際に用りられる水、鍍金液、洗浄液
による悪影響が大きく、更に電気機器等に組み込まれ、
使用に際しても信頼性を低下させるため大きな問題であ
る。Air bubbles within the laminate will severely reduce its moisture resistance and will have a significant negative impact on the water, plating solution, and cleaning fluid used when processing the laminate into printed wiring boards.
This is a big problem since it reduces reliability during use.
本発明の目的とするところは気泡を内蔵しな−積層板の
製造方法を提供することにある。An object of the present invention is to provide a method for manufacturing a laminate without incorporating air bubbles.
本発明は長尺帯状基材I/c高速回転式薄膜説泡装置に
よって減圧脱泡された樹脂を含浸させた樹脂含浸基材を
所要枚数重ね、更にその上面及び又は下面に長尺帯状金
属箔を配設した長尺積層体を移行させつつ連続的に硬化
させた後、所要寸法和切斬することを特徴とする積層板
の製造方法のため、樹脂中には気泡が存在しなく、従っ
て樹脂含浸基材内にも気泡が存在しなりので、従来の多
段プレス方式くよる製造方法より硬化時間が短縮されて
いても気泡を内蔵しな一積層板を得ることができたもの
で、以下本発明の詳細な説明する。The present invention consists of stacking a required number of resin-impregnated base materials impregnated with resin that has been degassed under reduced pressure using a high-speed rotating thin film foaming device, and further covering the upper and/or lower surfaces with long strip-shaped metal foils. Because the method for manufacturing laminates is characterized by continuously curing the long laminate with the particles transferred and then cutting it to the required size, there are no air bubbles in the resin. Since air bubbles also exist within the resin-impregnated base material, we were able to obtain a single laminate with no built-in air bubbles even though the curing time was shorter than that of the conventional multi-stage press method. The present invention will be described in detail.
本発明に用−る長尺帯状基材としては、ガラス布、ガラ
スペーパー、ガラス不織−布等のガラス系基材に加え紙
1合成繊維布、合成繊維不織布、アスベストベーパー、
木綿布等が用すられるが、好ましくは厚み調整効果の太
き一ガラス布、ガラスペーパー、ガラス不織布等を用−
ることが望まし一0樹脂としては不飽和ポリエステル系
樹脂%VアリルフタV−)系樹脂、ビニルエステル系樹
脂、エボaP−Vアクリレート系樹脂、エボキV系樹脂
、フェノール系樹脂、メラミン系樹脂等の単独。Long strip-shaped substrates used in the present invention include glass-based substrates such as glass cloth, glass paper, and glass nonwoven fabric, as well as paper 1 synthetic fiber cloth, synthetic fiber nonwoven fabric, asbestos vapor,
Cotton cloth etc. are used, but preferably thick glass cloth, glass paper, glass non-woven fabric etc. with thickness adjustment effect are used.
Desirably, the 10 resins include unsaturated polyester resins (%V), vinyl ester resins, Evo aP-V acrylate resins, Evoki V resins, phenolic resins, melamine resins, etc. Alone.
混合物、変性物等が用−られる、又、樹脂は同一樹脂の
みによる含浸でもよ−が、同系樹脂又は異系樹FIIV
Cより1次含浸は低粘度樹脂%2次含浸は1次含浸より
高粘度樹脂による含浸と云うように含浸を複数にし、よ
り均一な含浸ができるようにしてもよ−、勿論樹脂には
硬化剤、架橋剤、重合開始剤%七ツマー希釈剤等を加え
、更に必要に応じて無機粉末充填剤や短縁、維充填剤等
の添加剤を加えることもできるものである。上記樹脂は
そのまま用−るのではなく、必らず高速回転式薄膜脱泡
装置によって減圧脱泡してから周込ることが必要である
。高速回転式薄膜脱泡装置の回転板は一段でもよ−が、
必要に応じて複数段とし、多段にすることもできる。金
属箔としては・銅、アルミニラふ、鉄、ステンレス鋼、
二1ケル、亜鉛、真鍮等の単独、複合箔が用−られ必要
に応じて金属箔の片ff1Jc接着剤層を設けておき、
より接着性を向上させることもできる。硬化時間、硬化
温度は樹脂の種類によ鴫で異なり使用する樹脂によって
選択することができる。硬化く際しての加圧は無圧乃至
4oKtv’d−が好ましく、これ又使用する樹脂によ
って選択することができるものである。Mixtures, modified products, etc. can be used, and the resin may be impregnated with only the same resin, but similar resins or different resins can be used.
From C, the primary impregnation is done with a resin that has a lower viscosity.The secondary impregnation is done with a resin that has a higher viscosity than the primary impregnation, so that more uniform impregnation can be achieved. A crosslinking agent, a polymerization initiator, a crosslinking agent, a polymerization initiator, a diluent, etc. can be added thereto, and if necessary, additives such as an inorganic powder filler, a short edge filler, a fiber filler, etc. can also be added. The above-mentioned resin is not used as it is, but must be defoamed under reduced pressure using a high-speed rotating thin film defoaming device before being incorporated. The rotating plate of a high-speed rotating thin film defoaming device may have only one stage, but
If necessary, it can be made into multiple stages. Metal foils include copper, aluminum rough, iron, stainless steel,
A single or composite foil of 21 Kel, zinc, brass, etc. is used, and if necessary, a piece of metal foil ff1Jc adhesive layer is provided.
It is also possible to further improve adhesiveness. Curing time and curing temperature vary depending on the type of resin and can be selected depending on the resin used. The pressure applied during curing is preferably from no pressure to 40Ktv'd-, and can be selected depending on the resin used.
以下本発明の一実施例を図示実施例尤もとづ層て説明す
れば次のようである。An embodiment of the present invention will be explained below based on the illustrated embodiment.
実施例
IF1図は本発明の積層板のm*方法の一実施例を示す
簡略工程図、IF5図は本発明に用−る高速回転式薄膜
脱泡装置め一実施例を示す簡略断面図である。Example IF1 Figure is a simplified process diagram showing an example of the m* method for laminated plates of the present invention, and Figure IF5 is a simplified sectional view showing an example of the high-speed rotary thin film defoaming device used in the present invention. be.
第1図に示すように巾111m、厚さ0.2鱈の長尺ガ
ラス布lの上面からドラム式薄膜脱泡装置によりて減圧
脱泡された過酸化ベンゾイル含有不飽和ポリエステル樹
脂2を流延含浸させた樹脂含浸基材301枚を重ね、更
くその上下面と巾1m、厚さo、oss mの長尺接着
剤付銅箔4の接着剤側を樹脂含浸基材3と対向させて配
設した長尺積層体5をスクイズロール6で過剰の含浸樹
脂をしぼりつつ連続的に重ね合わせ、硬化炉7に送る。As shown in Fig. 1, benzoyl peroxide-containing unsaturated polyester resin 2, which has been defoamed under reduced pressure using a drum-type thin film degassing device, is cast from the top surface of a long glass cloth l with a width of 111 m and a thickness of 0.2 mm. 301 sheets of impregnated resin-impregnated base materials were stacked, and the upper and lower surfaces and the adhesive side of a long length of adhesive-coated copper foil 4 having a width of 1 m and a thickness of o and oss m were made to face the resin-impregnated base material 3. The arranged long laminates 5 are continuously stacked one on top of the other while squeezing out excess impregnated resin with a squeeze roll 6, and sent to a curing furnace 7.
硬化炉7の出口には長尺積層体5を移行させる上下一対
の引出しロール8が設けられて−る。この引出しロール
8で長尺積層体5を移行させて硬化炉7を通過させ1通
過中に硬化炉7で無圧下で加熱して連続的に硬化させる
。硬化した長尺積層体を引出しロール8で硬化炉7から
引出した後、1m毎に力啼夕9で切断して厚さ1.6m
1.1lll×lswの両面鋼張ガラス布基材不飽和ポ
リエステル樹脂積層板を得た0本発明で用いた減圧脱泡
樹脂は高速回転式薄膜脱泡装置を用い、次のようにして
得られた。第2図に示すように内部に高速回転円盤10
を収納する高速回転薄膜脱泡装置の供給口11に過酸化
ぺシゾイル含有不飽和ポリエステル樹脂を供給すると樹
脂は高速回転円盤IOの中央部12に滴下し、遠心力で
高速回転円盤10の周縁部塾に向って薄膜化され1周縁
部Uから飛散し容器内壁14に付着し、容器内壁14表
面で再度薄膜化され排出0迅に送られる。装置内は減圧
下にあり%爽に高速tat転円盤lOは必要に応じて加
熱することもできるものである。At the outlet of the curing furnace 7, a pair of upper and lower pull-out rolls 8 for transferring the elongated laminate 5 are provided. The elongated laminate 5 is transferred by this pull-out roll 8 and passed through a curing furnace 7, and during one pass, it is heated in the curing furnace 7 under no pressure to be continuously cured. After pulling out the cured long laminate from the curing furnace 7 with a pull-out roll 8, it is cut into 1.6 m thick pieces by a force cutter 9 every 1 m.
1. A double-sided steel-clad glass cloth base unsaturated polyester resin laminate of 1llxlsw was obtained. The vacuum degassing resin used in the present invention was obtained in the following manner using a high-speed rotary thin film defoaming device. Ta. As shown in Figure 2, there is a high-speed rotating disk 10 inside.
When the unsaturated polyester resin containing pecizoyl peroxide is supplied to the supply port 11 of the high-speed rotating thin film defoaming device that houses the oscilloscope, the resin drips onto the center 12 of the high-speed rotating disk IO, and the peripheral edge of the high-speed rotating disk 10 is exposed to the centrifugal force. It becomes a thin film toward the cram school, scatters from the first periphery U, adheres to the inner wall 14 of the container, becomes thin again on the surface of the inner wall 14 of the container, and is quickly sent to the outlet. The inside of the apparatus is under reduced pressure, and the high-speed tatting disk 10 can be heated if necessary.
比較例
実施例のa脂を減圧脱泡することなく用すた以外は実施
例と同様に処理して積層板を得た。Comparative Example A laminate was obtained in the same manner as in the Example except that the A fat of the Example was used without degassing under reduced pressure.
実施例及び比較例の積層板の気泡内蔵状態は第1表で明
白なように本発明の方法で得られたものの性能はよく、
本発明の積層板の製造方法の優れて−ることを確認した
。As is clear from Table 1, the performance of the laminates of Examples and Comparative Examples obtained by the method of the present invention was good;
It was confirmed that the method for producing a laminate according to the present invention is superior.
第1図は本発明の積層板の製造方法の一実施例を示す簡
略工程図、第2図は本発明に用−る高速回転式簿膜脱泡
装置の一実施例を示す簡略断面図である。
1は長尺基材%2は樹脂、3は樹脂含浸基材、4は金f
144* sは長尺積層体、6はスクイズロール、7は
硬化炉、8は引出しロール、9はカッタ、鵜は高速回転
円盤、Uは樹脂供給口、L2は円盤中央部、口は円盤周
縁部、14は容器内壁、15は樹脂排出口である。Fig. 1 is a simplified process diagram showing an embodiment of the method for producing a laminate according to the present invention, and Fig. 2 is a simplified sectional view showing an embodiment of the high-speed rotary film defoaming device used in the present invention. be. 1 is long base material % 2 is resin, 3 is resin-impregnated base material, 4 is gold f
144* s is a long laminate, 6 is a squeeze roll, 7 is a curing furnace, 8 is a pull-out roll, 9 is a cutter, U is a high-speed rotating disk, U is a resin supply port, L2 is the center of the disk, and the mouth is the disk periphery 14 is the inner wall of the container, and 15 is a resin discharge port.
Claims (2)
減圧脱泡された樹脂を含浸させた樹脂含浸基材を所要枚
数重ね、更にその上面及び又は下面に長尺帯状金属箔を
配設した長尺積層体を移行させつつ連続的に硬化させた
後、所要寸法に切断することを特徴とする積層板の製造
方法。(1) A required number of resin-impregnated base materials impregnated with resin defoamed under reduced pressure using a high-speed rotary thin film degassing device are stacked on a long strip-shaped base material, and a long strip-shaped metal foil is further placed on the upper and/or lower surfaces of the resin-impregnated base materials. A method for manufacturing a laminate, which comprises curing the long laminate continuously while moving the laminate, and then cutting the laminate into required dimensions.
2であることを特徴とする特許請求の範囲第1項記載の
積層板の製造方法。(2) Pressure applied during curing ranges from no pressure to 40 kg/cm^
2. The method for manufacturing a laminate according to claim 1, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62282755A JPH01123732A (en) | 1987-11-09 | 1987-11-09 | Manufacture of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62282755A JPH01123732A (en) | 1987-11-09 | 1987-11-09 | Manufacture of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123732A true JPH01123732A (en) | 1989-05-16 |
Family
ID=17656640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62282755A Pending JPH01123732A (en) | 1987-11-09 | 1987-11-09 | Manufacture of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123732A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014224201A (en) * | 2013-05-17 | 2014-12-04 | 住友ベークライト株式会社 | Method for producing prepreg |
-
1987
- 1987-11-09 JP JP62282755A patent/JPH01123732A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014224201A (en) * | 2013-05-17 | 2014-12-04 | 住友ベークライト株式会社 | Method for producing prepreg |
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